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TWI857938B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI857938B
TWI857938B TW107130793A TW107130793A TWI857938B TW I857938 B TWI857938 B TW I857938B TW 107130793 A TW107130793 A TW 107130793A TW 107130793 A TW107130793 A TW 107130793A TW I857938 B TWI857938 B TW I857938B
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
mass
layer
manufactured
Prior art date
Application number
TW107130793A
Other languages
English (en)
Chinese (zh)
Other versions
TW201920414A (zh
Inventor
川合賢司
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201920414A publication Critical patent/TW201920414A/zh
Application granted granted Critical
Publication of TWI857938B publication Critical patent/TWI857938B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW107130793A 2017-09-04 2018-09-03 樹脂組成物 TWI857938B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-169817 2017-09-04
JP2017169817A JP6870544B2 (ja) 2017-09-04 2017-09-04 樹脂組成物

Publications (2)

Publication Number Publication Date
TW201920414A TW201920414A (zh) 2019-06-01
TWI857938B true TWI857938B (zh) 2024-10-11

Family

ID=65514820

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107130793A TWI857938B (zh) 2017-09-04 2018-09-03 樹脂組成物

Country Status (4)

Country Link
JP (2) JP6870544B2 (ja)
KR (1) KR102558059B1 (ja)
CN (1) CN109423015B (ja)
TW (1) TWI857938B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021014546A (ja) * 2019-07-12 2021-02-12 味の素株式会社 樹脂組成物
JP7298450B2 (ja) * 2019-11-20 2023-06-27 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、フレキシブル基板及び半導体装置
JP7494715B2 (ja) * 2020-12-02 2024-06-04 味の素株式会社 樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201708401A (zh) * 2015-05-22 2017-03-01 住友電木股份有限公司 熱硬化性樹脂組成物、附有載體之樹脂膜、印刷佈線基板及半導體裝置
CN107118515A (zh) * 2016-02-25 2017-09-01 味之素株式会社 带支撑体的树脂片

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY142518A (en) * 2001-01-10 2010-12-15 Hitachi Chemical Co Ltd Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin
TWI433887B (zh) * 2007-09-21 2014-04-11 Ajinomoto Kk Epoxy resin composition
JP5627196B2 (ja) * 2009-04-28 2014-11-19 国立大学法人横浜国立大学 エポキシ樹脂組成物及びその硬化物
JP5707052B2 (ja) * 2010-04-27 2015-04-22 電気化学工業株式会社 樹脂複合組成物及びその用途
JP2012087192A (ja) * 2010-10-18 2012-05-10 Yokohama Rubber Co Ltd:The 熱硬化性エポキシ樹脂組成物
TWI445727B (zh) * 2010-10-21 2014-07-21 Taiwan Union Technology Corp 樹脂組合物及由其製成之預浸材與印刷電路板
JP5750004B2 (ja) * 2010-10-26 2015-07-15 Ｊｆｅケミカル株式会社 熱硬化性組成物、そのワニスおよびその熱硬化物
JP5552074B2 (ja) * 2011-02-17 2014-07-16 Ｊｆｅケミカル株式会社 熱硬化性樹脂組成物およびその硬化物
TWI657730B (zh) * 2012-05-31 2019-04-21 日商味之素股份有限公司 多層印刷配線板之製造方法
JP2014148562A (ja) * 2013-01-31 2014-08-21 Nippon Zeon Co Ltd 硬化性樹脂組成物、フィルム、プリプレグ、及び硬化物
CN103965624B (zh) * 2014-05-28 2016-08-31 苏州生益科技有限公司 一种无卤树脂组合物、由其制备的预浸料及层压板
TWI668269B (zh) * 2014-06-30 2019-08-11 日商味之素股份有限公司 Resin composition
JP6459279B2 (ja) * 2014-07-31 2019-01-30 味の素株式会社 樹脂シート
WO2016099988A1 (en) * 2014-12-18 2016-06-23 3M Innovative Properties Company Curable benzoxazine compositions with improved thermal stability
JP6690121B2 (ja) * 2014-12-25 2020-04-28 Dic株式会社 ポリアリーレンエーテル樹脂、ポリアリーレンエーテル樹脂の製造方法、硬化性樹脂材料、その硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、及び繊維強化成形品
EP3279261B1 (en) * 2015-03-31 2023-11-01 Namics Corporation Resin composition, electroconductive resin composition, adhesive, electroconductive adhesive, paste for forming electrodes, and semiconductor device
KR20160118962A (ko) * 2015-04-03 2016-10-12 스미토모 베이클리트 컴퍼니 리미티드 프리프레그, 수지 기판, 금속 부착 적층판, 프린트 배선 기판, 및 반도체 장치
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
CN106700548B (zh) * 2016-12-30 2019-04-30 广东生益科技股份有限公司 一种含有苯并噁嗪树脂组合物的制备方法及由其制成的预浸料和层压板
JP7279319B2 (ja) * 2017-09-04 2023-05-23 味の素株式会社 樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201708401A (zh) * 2015-05-22 2017-03-01 住友電木股份有限公司 熱硬化性樹脂組成物、附有載體之樹脂膜、印刷佈線基板及半導體裝置
CN107118515A (zh) * 2016-02-25 2017-09-01 味之素株式会社 带支撑体的树脂片

Also Published As

Publication number Publication date
TW201920414A (zh) 2019-06-01
JP2019044097A (ja) 2019-03-22
CN109423015B (zh) 2024-04-02
KR20190026612A (ko) 2019-03-13
CN109423015A (zh) 2019-03-05
JP7156433B2 (ja) 2022-10-19
JP2021113324A (ja) 2021-08-05
JP6870544B2 (ja) 2021-05-12
KR102558059B1 (ko) 2023-07-24

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