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TWI828702B - 樹脂模製裝置及樹脂模製方法 - Google Patents

樹脂模製裝置及樹脂模製方法 Download PDF

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Publication number
TWI828702B
TWI828702B TW108120048A TW108120048A TWI828702B TW I828702 B TWI828702 B TW I828702B TW 108120048 A TW108120048 A TW 108120048A TW 108120048 A TW108120048 A TW 108120048A TW I828702 B TWI828702 B TW I828702B
Authority
TW
Taiwan
Prior art keywords
workpiece
resin
mold
molding
holding part
Prior art date
Application number
TW108120048A
Other languages
English (en)
Chinese (zh)
Other versions
TW202012138A (zh
Inventor
中村一雄
西澤義晃
北島德幸
伊藤幸雄
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW202012138A publication Critical patent/TW202012138A/zh
Application granted granted Critical
Publication of TWI828702B publication Critical patent/TWI828702B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/20—Opening, closing or clamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW108120048A 2018-08-10 2019-06-11 樹脂模製裝置及樹脂模製方法 TWI828702B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-151906 2018-08-10
JP2018151906A JP7068094B2 (ja) 2018-08-10 2018-08-10 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法

Publications (2)

Publication Number Publication Date
TW202012138A TW202012138A (zh) 2020-04-01
TWI828702B true TWI828702B (zh) 2024-01-11

Family

ID=69547792

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108120048A TWI828702B (zh) 2018-08-10 2019-06-11 樹脂模製裝置及樹脂模製方法

Country Status (4)

Country Link
JP (1) JP7068094B2 (ja)
KR (1) KR102706847B1 (ja)
CN (1) CN110815707B (ja)
TW (1) TWI828702B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7430125B2 (ja) * 2020-08-28 2024-02-09 Ｔｏｗａ株式会社 成形型、樹脂成形装置、及び樹脂成形品の製造方法
JP7341105B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341106B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7444452B2 (ja) 2020-10-26 2024-03-06 アピックヤマダ株式会社 樹脂封止装置及びワーク搬送方法
JP7394798B2 (ja) 2021-02-09 2023-12-08 Ｔｏｗａ株式会社 搬送機構、樹脂成形装置及び樹脂成形品の製造方法
CN113977820B (zh) * 2021-11-04 2023-06-23 株洲时代瑞唯减振装备有限公司 一种硫化机模具的开合模方法和便于脱模的硫化机模具
JP7579829B2 (ja) * 2022-07-20 2024-11-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5987737A (en) * 1995-07-25 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Gate break device and gate break method
CN101167172A (zh) * 2005-04-29 2008-04-23 飞科公司 用于提供和卸除具有电子元件的承载器的方法和设备
CN104576475A (zh) * 2013-10-17 2015-04-29 东和株式会社 半导体基板供给方法及半导体基板供给装置
TW201801882A (zh) * 2016-04-28 2018-01-16 Ｔｏｗａ股份有限公司 樹脂密封裝置及樹脂密封方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06830A (ja) * 1992-06-22 1994-01-11 Toshiba Corp モールドシステム
JP3473149B2 (ja) * 1995-02-16 2003-12-02 三菱化学株式会社 樹脂製ディスク基板の製造方法
JP3642637B2 (ja) * 1996-08-20 2005-04-27 アピックヤマダ株式会社 樹脂モールド装置
JP3517770B2 (ja) * 1997-09-11 2004-04-12 株式会社名機製作所 ディスク成形方法
JP3825161B2 (ja) * 1997-12-02 2006-09-20 株式会社サイネックス 半導体モールド装置
JP3609824B1 (ja) * 2003-10-30 2005-01-12 第一精工株式会社 樹脂封止成形装置
JP2011116063A (ja) * 2009-12-04 2011-06-16 Nippon Densan Corp 樹脂成型品の製造方法および装置並びにターンテーブルの製造方法
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法
SG11201508166RA (en) * 2013-05-29 2015-12-30 Apic Yamada Corp Resin molding apparatus and resin molding method
JP6062810B2 (ja) * 2013-06-14 2017-01-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP6151610B2 (ja) 2013-09-06 2017-06-21 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置並びに樹脂モールド方法
JP5947331B2 (ja) * 2014-04-30 2016-07-06 エムテックスマツムラ株式会社 樹脂成形装置およびそれを用いたチップオンテープ型半導体装置の製造装置
JP6744780B2 (ja) * 2016-08-09 2020-08-19 アピックヤマダ株式会社 樹脂モールド装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5987737A (en) * 1995-07-25 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Gate break device and gate break method
CN101167172A (zh) * 2005-04-29 2008-04-23 飞科公司 用于提供和卸除具有电子元件的承载器的方法和设备
CN104576475A (zh) * 2013-10-17 2015-04-29 东和株式会社 半导体基板供给方法及半导体基板供给装置
TW201801882A (zh) * 2016-04-28 2018-01-16 Ｔｏｗａ股份有限公司 樹脂密封裝置及樹脂密封方法

Also Published As

Publication number Publication date
JP7068094B2 (ja) 2022-05-16
JP2020026088A (ja) 2020-02-20
KR102706847B1 (ko) 2024-09-19
KR20200018314A (ko) 2020-02-19
CN110815707A (zh) 2020-02-21
TW202012138A (zh) 2020-04-01
CN110815707B (zh) 2024-03-26

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