TWI694895B - Polishing apparatus - Google Patents

Abstract

A grinding device includes: more than one first grinding unit, including at least one first spindle, arranged in a row along a first direction; more than one first platform unit, arranged to a position corresponding to the first grinding unit, A grinding object is installed; and a first transfer unit is provided with a first gripper, the first gripper extends along a first track in the first direction, moves along the first track, and moves along with the A second rail extending in a second direction crossing the first direction, and connected to the second rail to move toward the first direction by movement of the second rail or toward the second along the second rail The direction moves to convey the object to be polished to the first stage unit.

Description

Grinding device

The invention relates to a grinding device.

Recently, with the development of various electronic devices such as mobile phones (Mobile Phones), personal digital assistants (PDAs), computers, and large televisions (Televisions, TVs), the application of these electronic devices The requirements for flat display devices are gradually increasing. Currently, liquid crystal display (LCD), plasma display panel (PDP), field emission display (FED), and vacuum fluorescent display (Vacuum Fluorescent Display, VFD) are being actively researched ), organic light emitting diodes (Organic Light Emitting Diodes, OLED) and other flat display devices, but due to mass production technology, the ease of driving elements, and the realization of high image quality, liquid crystal display devices are currently the most widely used ( LCD), but recently due to technological developments, the use of various devices has further increased.

The substrates used in these flat display devices are generally in the form of a lower panel on which various elements are mounted and a composite substrate in which an upper panel is additionally joined to the upper part of these lower panels. The composite substrate is formed in such a way that the size of the lower panel is larger than the size of the upper panel, and the lower panel protrudes to one side of the upper panel. On the side of the lower panel protruding as described above, it is additionally arranged for powering with external devices Connection terminal for connection.

The composite substrate as described above is usually made of tempered glass material to increase its strength. However, in the cutting process of the composite substrate, there are the following problems: due to the mechanical cutting process achieved by the wheel (wheel) Minor cracks or the like occur on the machined surface, and its hardness deteriorates. In particular, these minute cracks mainly occur along the edge line of the composite substrate. Recently, in order to prevent this, a chamfering operation is performed on the edge line portion of the composite substrate.

The chamfering operation of such edge lines is usually performed by grinding the edge lines with a grinder. Conventionally, the composite substrates are loaded on the grinding device one by one, and then unloaded again after grinding. However, the chamfering operation of this polishing method has a problem that it is necessary to continuously load and unload the composite substrate and the work is complicated, and the productivity is degraded.

[Problems to be solved by the invention]

Embodiments of the present invention provide a grinding device that can improve productivity.

[Means for solving the problem]

An embodiment of the present invention provides a grinding apparatus including a first transfer unit including a first rail extending in a first direction, a second rail extending in a second direction crossing the first direction, and The first rail and the second rail transport a first gripper (gripper) of the object to be polished; a first platform unit that installs and fixes the object to be polished that is transferred by the first gripper; and the first polishing The unit, configured to a position corresponding to the first platform unit, includes at least one first spindle (spindle), and is movable toward the first platform unit for polishing the object to be polished.

In an embodiment of the present invention, when two or more second rails are provided, the second rails may be arranged parallel to each other.

In an embodiment of the present invention, the first gripper can raise or lower the object to be polished in a third direction that intersects the first direction and the second direction.

In an embodiment of the present invention, the grinding device may further include a first camera unit, the first camera unit is disposed adjacent to the first track, and senses the gripping by the first gripper The alignment state of the object to be polished.

In an embodiment of the present invention, the grinding apparatus may further include: a second transfer unit including a third track extending in the first direction and parallel to the first track, and extending in the second direction A fourth rail, and a second gripper that transfers the object to be polished along the third and fourth rails; a second platform unit that installs and fixes the object to be transferred that is transferred by the second gripper Body; and a second grinding unit, configured to correspond to the position of the second platform unit, including at least one second spindle (spindle), in order to grind the object to be polished and movable toward the second platform unit .

In an embodiment of the present invention, the second polishing unit can be arranged symmetrically with the first polishing unit with reference to an imaginary extension line parallel to the first direction.

In an embodiment of the invention, the first grinding unit and the second grinding unit are the same grinding unit

In an embodiment of the invention, the first camera unit can adjust the position according to the size of the object to be polished.

In an embodiment of the invention, the number of the second rails may be different from the number of the first platform units.

In an embodiment of the present invention, the first gripper can be provided with a plurality of gripper portions corresponding to the plurality of first platform units.

In an embodiment of the present invention, the first gripper includes a plurality of gripper portions corresponding to the plurality of first platform units.

In an embodiment of the present invention, after the object to be polished is transferred in the first direction through the first track, the object to be polished may be transferred in the second direction through the second track and toward the third Installed to the first platform unit in a downward direction.

Another embodiment of the present invention provides a grinding apparatus, including: more than one first grinding unit, including at least one first spindle (spindle), configured along a first direction; more than one first platform unit, configured to The object to be polished is installed at a position corresponding to the first polishing unit; and the first transfer unit is provided with a first gripper, and the first gripper extends along the first track along the first direction The first track moves and extends in a second direction that crosses the first direction, and a second track connected to the second track moves toward or along the first direction by movement of the second track The second rail moves in the second direction to transport the object to be polished to the first platform unit.

In an embodiment of the present invention, the grinding device may further include a first camera unit, the first camera unit is configured to a path where the first gripper moves in a first direction, The alignment state of the object to be polished held by the first gripper generates alignment information of the object to be polished.

In an embodiment of the invention, the grinding device may further include a first adjustment unit that receives the alignment information from the first camera unit and corrects the position of the grinding target body according to the alignment information. At this time, the first gripper may attach the object to be polished whose position is corrected by the first adjustment unit to the first platform unit.

Based on the drawings, claims, and detailed description of the invention, other viewpoints, features, and advantages than the above are made clear.

[Effect of the invention]

The polishing apparatus of the embodiment of the present invention can efficiently transfer the polishing object to a plurality of fixed platform units by moving the gripper along the first rail and the second rail. Thus, the polishing apparatus of the embodiment of the present invention can set an optimal moving path for carrying in and out the object to be polished, thereby improving process efficiency. In addition, the polishing apparatus of the embodiment of the present invention can be configured with multiple spindles in one polishing unit to perform processing simultaneously, thereby enabling mass production. In addition, in the polishing apparatus of the embodiment of the present invention, the fixed platform unit provided with the object to be polished does not need to move toward the side where the polishing unit is located, so there is no risk of the position of the object to be polished being changed during the movement, so that more Stable and accurate grinding.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

Hereinafter, the following embodiments will be described in detail with reference to the drawings. In the description with reference to the drawings, the same or corresponding constituent elements are given the same symbols, and their repeated descriptions are omitted.

Various changes can be implemented in this embodiment, and specific embodiments are illustrated in the drawings and explained in detail in the detailed description. The effects and features of the present embodiment and the method of achieving the above-mentioned effects and features will become clear with reference to the contents described in detail below together with the drawings. However, this embodiment can be implemented in various forms, and is not limited to the embodiments shown below.

In the following embodiments, terms such as first and second are used for the purpose of distinguishing one constituent element from other constituent elements, and have no limiting meaning.

In the following embodiments, expressions in the singular include expressions in the plural as long as they do not express other meanings explicitly in the text.

In the following embodiments, the terms including or having indicate that there are features or constituent elements described in the description, and do not preclude the additional possibility of more than one other feature or constituent element.

In the following embodiments, when a part described as a unit, a region, a component, etc. is located above or above another part, it includes not only the case directly above the other part, but also includes another unit interposed between the other part , Areas, components, etc.

In the following embodiments, as long as other meanings are not expressly expressed in the text, terms such as connection or combination do not necessarily indicate direct and/or fixed connection or combination of the two components, and do not exclude the interposition between the two components. The situation of other parts.

It means that there are features or constituent elements described in the specification, and it does not exclude more than one other features or constituent elements in advance.

For ease of explanation, the size of the component elements can be enlarged or reduced in the figures. For example, the size and thickness of each structure shown in the drawings are arbitrarily shown for convenience of description, so the following embodiments are not necessarily limited to the contents shown in the drawings.

1 is a plan view schematically showing a polishing device 10 according to a first embodiment of the present invention, FIG. 2 is a conceptual diagram for explaining the operation of the polishing device 10 at the first position A1 of FIG. 1, and FIG. 3 is a A conceptual diagram illustrating the operation of the polishing device 10 at the second position A2 in FIG. 1.

Referring to FIGS. 1 to 3, the grinding apparatus 10 of the first embodiment of the present invention may include a first grinding unit 110, a first platform unit 120 and a first transfer unit 130.

The first grinding unit 110 may include at least one first spindle 111. The first main shaft 111 can perform the function of polishing the object M to be polished, and a polishing tool for polishing the object M to be polished is attached to the end of the rotating shaft member. The first spindle 111 can rotate the polishing tool as described above to polish the object M, for example, the side surface of the object M can be polished. Alternatively, the first spindle 111 may polish the polishing object M so that a region of the polishing object M before polishing is formed into a fixed shape like the polishing object M'after polishing in FIG. 1.

On the other hand, the first grinding unit 110 may include a plurality of first spindles 111 that are configured to one first body portion 112. As shown in FIG. 1, the first grinding unit 110 may include two first spindles 111, but the technical idea of the present invention is not limited thereto, and of course more than two first spindles 111 may be provided. At this time, the plurality of first spindles 111 may be arranged in a row at the lower portion of the first body portion 112 as described above with respect to the first direction, which may coincide with the direction in which the first polishing units 110 are arranged.

The first polishing unit 110 may further include a first direction transfer portion (not shown) that moves the first body portion 112 in the first direction, and a second direction transfer portion (not shown) that moves the first body portion 112 in the second direction (Illustration)), and a third direction transfer unit (not shown) that moves the first body portion 112 in the third direction. The first direction transfer unit (not shown), the second direction transfer unit (not shown), and the third direction transfer unit (not shown) can use the first direction, the second direction, and the third direction to make the first A motor, a hydraulic cylinder, an air cylinder, or a linear actuator that moves the body portion 112 is configured. Here, the first direction to the third direction may be directions perpendicular to each other. The first grinding unit 110 may move away from or approach the first platform unit 120 by moving in the second direction. In other words, the vertical distance between the first body portion 112 and the first platform unit 120 can be adjusted by the second direction transfer portion (not shown).

The first polishing unit 110 can be arranged in a row at a lower portion of the first body portion 112 by moving the first body portion 112 using the first direction transferring portion (not shown) and the second direction transferring portion (not shown) The position of more than one first spindle 111 is adjusted. In the case where one first body portion 112 includes a plurality of first spindles 111, the first polishing unit 110 can use the plurality of first spindles 111 to simultaneously treat a plurality of objects to be polished M attached to the plurality of first stage units 120. Perform grinding. In addition, the first polishing unit 110 controls the movement of one first body portion 112, so that the movement of the plurality of first spindles 111 can be controlled at one time, thereby improving the process efficiency.

As another embodiment, the first grinding unit 110 may further include a first adjustment element (not shown) that can adjust the positions of the plurality of first spindles 111. The first adjustment element (not shown) can independently adjust the movement of each first main shaft 111 up, down, left, and right.

On the other hand, when a plurality of first polishing units 110 are provided, they may be arranged in a row along the first direction. In this case, the plurality of first polishing units 110 can be arranged so that the first main shaft 111 of each first polishing unit 110 faces the same direction. In addition, it is possible to arrange a plurality of first polishing units 110 so that each zero point position of the first spindle 111 is on the same straight line.

The first stage unit 120 may be disposed at a position corresponding to the first main shaft 111, and the object M to be polished is installed on the upper portion. The first platform unit 120 may correspond to the number of first spindles 111, and the object M to be polished may be installed on the first platform unit, respectively. However, the technical idea of the present invention is not limited to this. As another embodiment, the first platform unit 120 is provided in a manner corresponding to the number of the first polishing units 110, or may be provided in plurality on the first platform unit 120 The installation area where the object to be polished M is mounted. At this time, the number of installation areas provided to the first stage unit 120 may correspond to the number of first spindles 111 provided to one first polishing unit 110.

The first platform unit 120 serves as a fixing unit, and the first gripper 133 described below can be moved toward the first platform unit 120 for loading or unloading the polishing object M, or for The body M is ground and only the first spindle 111 moves toward the first stage unit 120 and the first stage unit 120 does not move.

On the other hand, the first transfer unit 130 may include a first rail 131, a second rail 132, and a first gripper 133.

The first rail 131 may extend in the first direction. The first rail 131 may be arranged along the first grinding unit 110, specifically, may be arranged so as to face the first spindle 111 along the arrangement direction of the plurality of first spindles 111.

The second rail 132 may be disposed between the first rail 131 and the first platform unit 120. The second rail 132 may extend in a second direction crossing the first direction. As shown, the second rail 132 may extend from the first rail 131 in a vertical direction. The number of second rails 132 corresponds to the number of first platform units 120, and when two or more second rails 132 are provided, they can be arranged in parallel along the first direction.

The structure described above is an embodiment in the case where the first stage unit 120 corresponds to the number of first spindles 111. As another embodiment, as described above, when the first platform unit 120 is provided in a manner corresponding to the number of first polishing units 110, the number of second rails 132 may be the same as that provided to the first platform unit 120 Corresponds to the number of installation areas. The second rail 132 may extend from the first rail 131 to a position where the object M to be polished can be installed on the first stage unit 120. The first gripper 133 can move along the first rail 131 and the second rail 132 to transfer the object M to the first stage unit 120 or out.

After grasping the object M to be polished introduced into the polishing device 10, the first gripper 133 can move along the first rail 131 and the second rail 132 to transfer the object M to the first platform unit 120, or After grasping the polishing target object M′ after the polishing, it moves along the second rail 132 and the first rail 131 and is carried out from the first stage unit 120. The first gripper 133 may be equipped with a transfer function and a transfer function for one, or two, namely, a transfer gripper and a transfer-out gripper. Alternatively, more than two grippers may be provided. However, when more than two first grippers 133 are provided, the first gripper 133 can move along the first rail 131 and the second rail 132 by a preset program so as not to interfere with each other's movement.

As yet another embodiment, the second rail 132 can be provided so as to extend from the first rail 131 toward the first platform unit 120. At this time, the number of second rails 132 may not correspond to the number of first platform units 120 or the number of installation areas. For example, one second rail 132 can be provided corresponding to the two first platform units 120. When a second rail 132 is provided between the two first platform units 120, the first gripper 133 described below can be provided with two grips in a manner corresponding to the two first platform units 120 described above Device (not shown). The interval between the two gripper parts (not shown) may correspond to the interval between the two first platform units 120. Thereby, the first gripper 133 can simultaneously move the two polishing objects M, and then move along the second rail 132 to transport the polishing objects M to each first stage unit 120 or out.

2 and 3, the first gripper 133 may raise or lower the object M to be polished in a third direction crossing the first direction and the second direction. In other words, the first gripper 133 can grip the object M to be polished and move in the height direction relative to the ground. The first gripper 133 may further include a height adjustment unit 135. The height adjustment unit 135 may be composed of a motor, a hydraulic cylinder, an air cylinder, a linear actuator, or the like.

On the other hand, the polishing apparatus 10 of the first embodiment of the present invention may further include a first camera unit 140 and a first conveyor belt unit C1.

The first camera unit 140 may be adjacently arranged to the first rail 131 and sense the alignment state of the object to be polished M held by the first gripper 133. Specifically, as shown in FIGS. 1 and 2, the first gripper 133 can grip the introduced object M at the first position A1. The object to be polished M can be introduced from a position other than the first rail 131, and the polishing device 10 can move the object to be polished M from the introduced position toward the first position A1 that is below the first rail 131 through the first conveyor belt unit C1 . Therefore, the first position A1 may be a position where the first conveyor belt unit C1 crosses the first rail 131.

The first camera unit 140 is located at the first position A1 where the first gripper 133 grips the polishing object M, so that the alignment state of the polishing object M in the first gripper 133 can be confirmed. The first camera unit 140 is symmetrically arranged with the first rail 131 as a reference to photograph the polishing object M grasped by the first gripper 133, whereby the alignment state of the polishing object M can be accurately sensed.

On the other hand, the polishing apparatus 10 of the first embodiment of the present invention may further include a second polishing unit 210, a second platform unit 220, and a second transfer unit 230. Here, the second polishing unit 210, the second platform unit 220, and the second transfer unit 230 have the same configuration as the first polishing unit 110, the first platform unit 120, and the first transfer unit 130, respectively. instruction of.

The second grinding unit 210 may include a second body portion 212 and at least one second spindle 211 disposed on the second body portion 212, arranged in a row along the first direction, and arranged parallel to the first grinding unit 110. The number of second grinding units 210 may be the same as the number of first grinding units 110, but this is not necessarily the case. As an embodiment, the second polishing unit 210 can be arranged symmetrically with the first polishing unit 110 with reference to an imaginary extension line L parallel to the first direction. Therefore, the second main shaft 211 of the second polishing unit 210 and the first main shaft 111 of the first polishing unit 110 can be arranged so as to face the outline with the virtual extension line L as the center. The number of second spindles 211 may correspond to the number of first spindles 111.

The second stage unit 220 may be arranged at a position corresponding to the second spindle 211, and the object M to be polished may be installed. Like the first stage unit 120, the second stage unit 220 may be configured to correspond to the number of second spindles 211 or the number of second grinding units 210.

The second transfer unit 230 may include a third rail 231, a fourth rail 232, and a second gripper 233.

The third track 231 may extend in the first direction and be parallel to the first track 131. The third rail 231 may be arranged along the second grinding unit 210, specifically, may be arranged so as to face the second spindle 211 along the arrangement direction of the plurality of second spindles 211.

The fourth rail 232 may be provided between the third rail 231 and the second platform unit 220. The fourth rail 232 may extend in a second direction crossing the first direction. As shown, the fourth rail 232 may extend from the third rail 231 in a vertical direction. The number of fourth rails 232 corresponds to the number of second platform units 220, and when there are more than two fourth rails 232, they can be arranged in parallel along the first direction.

The second gripper 233 can move along the third rail 231 and the fourth rail 232 to transfer the object to be polished M to the second stage unit 220 or out. After grasping the object to be polished M introduced into the polishing device 10, the second gripper 233 can move along the third rail 231 and the fourth rail 232 to transport the object to be polished M to the second platform unit 220, or to grip After holding the object M'to be polished, it moves along the fourth rail 232 and the third rail 231 and is carried out from the second stage unit 220. The second gripper 233 can raise or lower the grinding target body M in the third direction in the same manner as the first gripper 133.

As another embodiment, the fourth rail 232 can be provided so as to extend from the third rail 231 toward the second platform unit 220. At this time, the number of fourth rails 232 may not correspond to the number of second platform units 220 or the number of installation areas. For example, one fourth rail 232 can be provided corresponding to the two second platform units 220. When a fourth rail 232 is provided between the two second platform units 220, the second gripper 233 described below can be provided with two grips in a manner corresponding to the two second platform units 220 described above Device (not shown). The interval between the two gripper parts (not shown) may correspond to the interval between the two second platform units 220. As a result, the second gripper 233 can simultaneously move the two objects M to be polished, and then move along the fourth rail 232 to transport the objects M to or from each second stage unit 220.

In addition, the polishing apparatus 10 of the first embodiment of the present invention may further include a second camera unit 240 and a second conveyor unit C2.

The second camera unit 240 may be adjacently arranged to the third rail 231 to sense the alignment state of the object to be polished M held by the second gripper 233. The second camera unit 240 can be arranged symmetrically with the first camera unit 140 with reference to the virtual extension line L. Therefore, the position where the second camera unit 240 is arranged may be a position where the second conveyor belt unit C2 crosses the third rail 231.

The polishing apparatus 10 of the first embodiment of the present invention having the configuration as described above can use the first transfer unit 130 or the second transfer unit 230 to transfer the introduced polishing object M to the first platform unit 120 or the second platform unit 220 or move out. In addition, the carried-out object to be polished M′ can be discharged to the outside after being transferred to the fixed area by the third conveyor unit C3 or the fourth conveyor unit C4.

The polishing apparatus 10 of the first embodiment described above can have two polishing units 110 and 210 centering on the imaginary extension line L, but the present invention is not limited to this, and may include one polishing unit (not shown) . More specifically, one grinding unit is positioned between the first platform unit 120 and the second platform unit 220 and is moved toward the side of the first platform unit 120 or the second platform unit 220 to which the one grinding unit is fixed, as appropriate. By polishing the object M to be polished, the polishing device 10 can be operated more efficiently.

4 and 5 are plan views schematically showing polishing apparatuses 10' and 10'' according to another embodiment of the present invention.

Referring to FIG. 4, a polishing apparatus 10 ′ according to another embodiment of the present invention includes the same constituent elements as the polishing apparatus 10 of FIG. 1. Unlike the polishing apparatus 10 of FIG. 1, the polishing apparatus 10 of FIG. The first spindle 111 and the second spindle 211 are configured in a manner. At this time, the first rail 131 and the third rail 231 can be arranged in parallel so as to pass between the first polishing unit 110 and the second polishing unit 210.

Referring to FIG. 5, a polishing device 10 ″ according to still another embodiment of the present invention is different from the polishing device 10 of FIG. 1 and the polishing device 10 ′ of FIG. 4 and the first polishing unit 110 and the second polishing unit 210 may be configured asymmetrically. Configured staggered from each other. With this configuration, the polishing device 10 ″ of FIG. 5 may not include the third rail 231 but only include the first rail 131 extending in the first direction between the first polishing unit 110 and the second polishing unit 210. At this time, the first rail 131 may be connected to the 2-1 rail 132-1 and the 2-2 rail 132-2 extending in the second direction crossing the first direction. The 2-1 rail 132-1 and the 2-2 rail 132-2 extend from the first rail 131 toward the first main shaft 111 and the second main shaft 211, respectively, and thus can extend in opposite directions to each other. In addition, the 2-1th track 132-1 and the 2-2nd track 132-2 may be alternately arranged along the first track 131.

FIG. 6 is a perspective view showing the polishing device 20 of the second embodiment of the present invention, and FIG. 7 is a plan view of the polishing device 20 of FIG. 6. FIG. 8 is a schematic perspective view of the first transfer unit 130 of FIG. 6. 9 is a schematic diagram of the first gripper 133 and the first adjustment unit 150 of FIG. 8, and FIG. 10 is a schematic diagram of the first camera unit 140 of FIG. 7.

Referring to FIGS. 6 to 8, the second embodiment of the present invention has the same technical idea as the first embodiment of the polishing device 10, as a specific embodiment, in which two polishing objects M1, M2 are held simultaneously Move in or move out.

The grinding device 20 of the second embodiment of the present invention may include a first grinding unit 110, a first stage unit 120 (refer to FIG. 11b), a first transfer unit 130, a first camera unit 140, and a first adjustment unit 150 (refer to FIG. 9). In addition, the polishing apparatus 20 of the second embodiment is the same as the first embodiment, and may further include a second polishing unit 210, a second stage unit 220, a second transfer unit 230, and a second symmetrically arranged as described above The camera unit 240 and the second adjustment unit (not shown). In the following, for convenience of description, the same constituent elements are given the same reference numerals, and the description will be centered on the first transfer unit 130, and repeated description will be omitted.

The first grinding unit 110 may include at least two first spindles 111. The first main shaft 111 can perform the function of polishing the object M to be polished, and a polishing tool for polishing the object M to be polished is attached to the end of the rotating shaft member. The first spindle 111 can rotate the polishing tool as described above to polish the object M, for example, the side surface of the object M can be polished. Alternatively, the first spindle 111 may polish the polishing object M so that a region of the polishing object M before polishing is formed into a fixed shape like the polishing object M'after polishing in FIG. 7.

As an embodiment, the first grinding unit 110 may include two first spindles 111 configured to one first body portion 112. The first polishing unit 110 can control the positions of the two first spindles 111 at a time using a first direction transfer unit (not shown) and a second direction transfer unit (not shown) connected to the first body 112. In addition, the first grinding unit 110 may further include a first adjustment element (not shown) that can adjust the positions of the two first spindles 111. The first adjustment element (not shown) can independently adjust the movement of each first main shaft 111 up, down, left, and right.

The first stage unit 120 (refer to FIG. 11 b) may be provided with a number corresponding to the number of first spindles 111 of the first polishing unit 110. As described above, since the first polishing unit 110 of the second embodiment includes two first spindles 111, the number of first stage units 120 can be two. The first stage unit 120 is disposed at a position corresponding to the first main shaft 111, and the polishing object M is mounted on the upper portion. More specifically, the first polishing object M1 and the second polishing object M2 can be installed to two respectively The upper part of the first platform unit 120.

On the other hand, the first transfer unit 130 may include a first rail 131, a second rail 132, and a first gripper 133. The first transfer unit 130 may include a first rail 131 extending in the first direction and a second rail 132 extending in the vertical direction from the first rail 131 like the polishing apparatus 10 of the first embodiment. At this time, in the first embodiment, the case where the second rail 132 is provided so that the number of the second rails 132 corresponds to the number of the first platform units 120 has been mainly described, but in the second embodiment The description will be centered on the case where one second rail 132 is connected between the first gripper 133 and the first rail 131 to move the first gripper 133 in the first direction or the second direction.

The first rail 131 may extend in the first direction. The first rail 131 may be arranged along the arrangement direction of the first grinding unit 110, specifically, may be arranged so as to face the first spindle 111 along the arrangement direction of the plurality of first spindles 111.

The first gripper 133 can simultaneously move the first polishing object M1 and the second polishing object M2 introduced through the loading unit 300 of the polishing device 10, and then move along the first rail 131 to move the first polishing object M1 The second object to be polished M2 is transferred to the first stage unit 120. The first gripper 133 includes a first grip portion 1331 and a second grip portion 1332 that are symmetrically arranged in the first direction with respect to the second rail 132 as a reference, so that the first polishing object M1 and Second polishing object M2. As an embodiment, the first gripper 133 may be connected to the first rail 131 via the second rail 132. At this time, the second rail 132 may extend in a second direction crossing the first direction in which the first rail 131 extends.

Specifically, as shown in FIG. 8, one side of the second rail 132 may be connected to the first rail 131 to move in a first direction guided by the first rail 131. At this time, the first gripper 133 may be connected to the other side of the second rail 132 facing the one side so as to be movable in the second direction. The first gripper 133 moves along the first rail 131 by the second rail 132 and moves in the first direction together, and may also move in the second direction along the second rail 132.

On the other hand, the first rail 131 can extend a first length in the first direction, so that the first gripper 133 can transport the polishing objects M1 and M2 to the plurality of aligned first polishing units 110. In addition, the second rail 132 may extend a second length in the second direction, so that the first gripper 133 moving along the first rail 131 may move toward the first platform unit 120. As an embodiment, the first transfer unit 130 not only performs the function of transporting the polishing objects M1 and M2 using the first gripper 133 as described above, but also performs the function of transporting out the polishing objects M1' and M2' that have been polished . However, the present invention is not limited thereto. As another embodiment, the first transfer unit 130 may further include a first transfer gripper 137 to separate the transfer in and out.

Specifically, the first conveying gripper 137 may be connected to the first rail 131 in the same manner as the first gripper 133 and move in the first direction along the first rail 131. At this time, the first transport gripper 137 may be connected to the first rail 131 via the sixth rail 136. The sixth rail 136 may perform the function of guiding in such a manner that the first transport gripper 137 can move in the second direction, similar to the second rail 132.

The first conveying gripper 137 includes a first conveying grip 1371 and a second conveying grip 1372 that are symmetrically arranged in the first direction with respect to the sixth rail 136 as a reference, and can simultaneously grip the first A polishing object M1' and a second polishing object M2'. The first transport gripper 137 moves toward the first stage unit 120 to grip the first polishing object M1' and the second polishing object M2' after the polishing, and then moves in the second direction along the sixth rail 136, and then Stay near the first track 131. Thereafter, the first polishing object M1' and the second polishing object M2' are carried out to the outside through the unloading part 400 by moving along the first rail 131 in the first direction.

Referring to FIG. 9, the first gripper 133 may be connected to the second rail 132 and raise or lower the first abrasive object M1 and the second by the height adjustment unit 135 in a third direction crossing the first direction and the second direction Grind the object M2. In other words, the first gripper 133 can grip the first polishing object M1 and the second polishing object M2 and move in the height direction relative to the ground.

At this time, the first adjustment unit 150 may be connected to the first gripper 133 to rotate the first gripper 133 relative to the first rotation axis Ax1 parallel to the third direction. Specifically, the first adjustment unit 150 may be disposed between the first gripping portion 1331 and the second gripping portion 1332 to simultaneously rotate the first gripping portion 1331 and the first gripping portion 1331 through the rotational movement relative to the first rotation axis Ax1. The second grip 1332 rotates.

Referring again to FIGS. 7 and 10, the first camera unit 140 may be configured on a movement path that moves after the first gripper 133 grips the first polishing object M1 and the second polishing object M2. The first camera unit 140 may sense the alignment state (align) of the first polishing object M1 and the second polishing object M2 gripped by the first gripper 133 to generate first alignment information and second alignment News. In addition, the pair of cameras constituting the first camera unit 140 can be configured so that the position can be adjusted according to the size of the object to be polished.

Specifically, as shown in FIG. 10, the first camera unit 140 may include a pair of cameras provided symmetrically with respect to the first direction, and respectively align the first polishing object M1 and the second polishing object M2 with respect to the first direction The degree of deviation from the second direction is generated as the first alignment information and the second alignment information. The first camera unit 140 may provide the first alignment information and the second alignment information generated in this way to the first adjustment unit 150. After that, the first adjusting unit 150 can correct the offset of the first polishing object M1 and the second polishing object M2 according to the provided information, and mount each polishing object on the first platform unit 120.

Hereinafter, referring to the drawings, a method for aligning the first polishing object M1 and the second polishing object M2 to the first stage unit 120 by using the first camera unit 140 and the first adjustment unit 150 and the first gripper 133 Be explained.

FIGS. 11 a to 11 c are diagrams sequentially showing a process in which the first gripper 133 attaches the first polishing object M1 and the second polishing object M2 to the first stage unit 120.

Referring to FIG. 11A, the first gripper 133 may use the first gripping portion 1331 and the second gripping portion 1332 to grip the first polishing object M1 and the second polishing object M2, respectively. At this time, it is most desirable to hold the first polishing target body M1 and the second polishing target body M2 in such a state that they can be immediately attached to the first stage unit 120.

However, in the actual gripping process, the first polishing object body M1 and the second polishing object body M2 will be shifted and gripped, and in the case of being immediately attached to the first stage unit 120 in a shifted state, there are There is a problem of process errors during the grinding process. Therefore, in order to minimize such process errors, the polishing device 20 uses the first camera unit 140 to measure the alignment state of the first polishing object M1 and the second polishing object M2 moving in the first direction. The first camera unit 140 may be arranged symmetrically with respect to the first direction as described above to sequentially measure the degree of deviation of the first grinding object M1 and the second grinding object M2 to generate first alignment information including the degree of deviation And second alignment information.

Referring to FIG. 11B, the first gripper 133 can move toward the first platform unit 120 through the first rail 131 and the second rail 132. At this time, the first adjustment unit 150 may receive the first alignment information and the second alignment information from the first camera unit 140 in advance, and first use the first alignment information to correct the position of the first polishing object M1 (P1→P1' ). That is, the first adjustment unit 150 can rotate the first gripper 133 so that the first object to be polished M1 can be attached to the first stage unit from the offset initial position P1 to the aligned alignment position P1′. 120. In addition, the first gripper 133 can also perform a translational movement in the first direction or the second direction as needed to adjust the position during the process described above.

Referring to FIG. 11c, after the first gripper 133 attaches the first object to be polished M1 to the first stage unit 120, the second object to be polished M2 can be attached through the same alignment process. In other words, the first adjustment unit 150 may use the second alignment information received from the first camera unit 140 to correct the position of the second polishing object M2 (P2→P2'). That is, the first adjustment unit 150 can rotate the first gripper 133 so that the second object to be polished M2 can be attached to the first stage unit from the offset initial position P2 to the aligned alignment position P2' 120. In addition, the first gripper 133 can also perform a translational movement in the first direction or the second direction as needed to adjust the position during the process described above.

As described above, the polishing device of the embodiment of the present invention can efficiently transfer the polishing object to a plurality of fixed platform units by moving the gripper along the first rail and the second rail. Thus, the polishing apparatus of the embodiment of the present invention can set an optimal moving path for carrying in and out the object to be polished, thereby improving process efficiency. In addition, the polishing apparatus of the embodiment of the present invention can be configured with multiple spindles in one polishing unit to perform processing simultaneously, thereby enabling mass production.

In addition, the polishing device of the embodiment of the present invention can be installed on the first platform unit after correcting the polishing object body shifted by the gripper by the first adjustment unit, thereby achieving accurate polishing Processing. In addition, it is not necessary to form a camera unit for measuring the degree of deviation of the object to be polished on each fixed platform, and to constitute a camera unit to measure and correct the degree of deviation of the object to be polished, which has the effect of saving costs. Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

10, 10', 10``, 20‧‧‧ grinding device 110‧‧‧First grinding unit 111‧‧‧The first spindle 112‧‧‧The first body 120‧‧‧ First platform unit 130‧‧‧ First transfer unit 131‧‧‧ First Track 132‧‧‧The second track 132-1‧‧‧ track 2-1 132-2‧‧‧ track 2-2 133‧‧‧First gripper 135‧‧‧ Height adjustment unit 136‧‧‧Sixth track 137‧‧‧ First transport gripper 140‧‧‧ First camera unit 150‧‧‧ First adjustment unit 210‧‧‧Second grinding unit 211‧‧‧Second spindle 212‧‧‧Second body 220‧‧‧Second platform unit 230‧‧‧Second transfer unit 231‧‧‧ third track 232‧‧‧The fourth track 233‧‧‧Second gripper 240‧‧‧Second camera unit 300‧‧‧ Loading Department 400‧‧‧Unloading Department 1331‧‧‧First grasping department 1332‧‧‧Second grip 1371‧‧‧The first conveying and grasping department 1372‧‧‧Second conveying and grasping department A1‧‧‧First position A2‧‧‧Second position Ax1‧‧‧First rotation axis C1‧‧‧The first conveyor belt unit C2‧‧‧Second conveyor belt unit C3‧‧‧The third conveyor unit C4‧‧‧The fourth conveyor belt unit L‧‧‧Imaginary extension cord M, M'‧‧‧Object to be polished M1, M1'‧‧‧First object to be polished M2, M2'‧‧‧Second grinding object P1, P2‧‧‧ initial position P1', P2'‧‧‧Alignment position

FIG. 1 is a plan view schematically showing a polishing device according to a first embodiment of the present invention. FIG. 2 is a conceptual diagram for explaining the operation of the polishing device at the first position in FIG. 1. FIG. 3 is a conceptual diagram for explaining the operation of the polishing device at the second position in FIG. 1. 4 and 5 are plan views schematically showing a polishing device according to another embodiment of the present invention. 6 is a perspective view showing a polishing device according to a second embodiment of the present invention. 7 is a plan view of the polishing device of FIG. 6. 8 is a schematic perspective view of the first transfer unit of FIG. 6. 9 is a schematic diagram of the first gripper and the first adjustment unit of FIG. 8. FIG. 10 is a schematic diagram of the first camera unit of FIG. 7. 11a to 11c are diagrams sequentially showing a process in which the first gripper attaches the first object to be polished and the second object to be polished to the first stage unit.

10‧‧‧Grinding device

110‧‧‧First grinding unit

111‧‧‧The first spindle

112‧‧‧The first body

120‧‧‧ First platform unit

130‧‧‧ First transfer unit

131‧‧‧ First Track

132‧‧‧The second track

133‧‧‧First gripper

140‧‧‧ First camera unit

210‧‧‧Second grinding unit

211‧‧‧Second spindle

212‧‧‧Second body

220‧‧‧Second platform unit

230‧‧‧Second transfer unit

231‧‧‧ third track

232‧‧‧The fourth track

233‧‧‧Second gripper

240‧‧‧Second camera unit

A1‧‧‧First position

A2‧‧‧Second position

C1‧‧‧The first conveyor belt unit

C2‧‧‧Second conveyor belt unit

C3‧‧‧The third conveyor unit

C4‧‧‧The fourth conveyor belt unit

L‧‧‧Imaginary extension cord

M, M'‧‧‧Object to be polished

Claims (11)

A polishing device includes a first transfer unit including a first track extending in a first direction, a second track extending in a second direction crossing the first direction, and the first track and the A first gripper for transferring the object to be polished by the second track; a plurality of first platform units that install and fix the object to be transferred transferred by the first gripper; and a plurality of first polishing units To a position corresponding to the first platform unit, including at least one first main shaft, which can move toward the first platform unit for polishing the object to be polished; a first camera unit, configured to the first On the path of the gripper moving in the first direction, sensing the alignment state of the polishing target body gripped by the first gripper to generate the alignment information of the polishing target body; and An adjustment unit that receives the alignment information from the first camera unit and corrects the position of the object to be polished according to the alignment information, the first adjustment unit is connected to the first gripper, Rotating the first gripper to correct the position of the polishing object in a state where the polishing object is gripped by the first gripper, the first gripper will be controlled by the first gripper An object to be polished whose position is corrected by an adjustment unit is attached to the first platform unit. The polishing device according to item 1 of the patent application range, wherein when there are two or more second rails, a plurality of second rails are arranged parallel to each other. The polishing device according to item 1 of the patent application range, wherein the first gripper raises or lowers the polishing object in a third direction crossing the first direction and the second direction. The polishing device according to item 1 of the patent application scope further includes: a second transfer unit including a third track extending in the first direction and parallel to the first track, and extending in the second direction A fourth rail and a second gripper for transferring the object to be polished along the third rail and the fourth rail; a plurality of second platform units installed and fixed for transfer by the second gripper The object to be polished; and a plurality of second polishing units, arranged at positions corresponding to the second platform unit, including at least one second spindle, and capable of facing the first object in order to polish the object to be polished Two platform units move. The polishing device according to item 4 of the patent application range, wherein the second polishing unit is arranged symmetrically with the first polishing unit with reference to an imaginary extension line parallel to the first direction. The polishing device according to item 4 of the patent application scope, wherein the first polishing unit and the second polishing unit are the same polishing unit. The polishing device according to item 1 of the patent application range, wherein the first camera unit can adjust the position according to the size of the object to be polished. The grinding device according to item 1 of the patent application scope, wherein the number of the second rails is different from the number of the first platform units. The polishing device according to item 1 of the patent application range, wherein the first gripper includes a plurality of gripper portions corresponding to the plurality of first stage units. The polishing device according to item 3 of the patent application scope, wherein the object to be polished is transferred to the second direction through the second track after being transferred to the first direction through the first track, toward The third direction descends and is attached to the first platform unit. A grinding device, comprising: a plurality of first grinding units, including at least one first spindle, arranged along a first direction; a plurality of first platform units, arranged to a position corresponding to the first grinding unit, equipped with grinding objects Body; a first transfer unit, provided with a first gripper, the first gripper extends along the first direction of the first track, moves along the first track and crosses the first direction A second rail extending in the second direction and connected to the second rail to move the second rail toward the first direction or along the second rail toward the second direction The object to be polished is transported to the first platform unit; a first camera unit is arranged on a path of the first gripper moving in the first direction, sensing gripping by the first gripper The alignment state of the object to be polished generates alignment information of the object to be polished; and a first adjustment unit that receives the alignment information from the first camera unit and according to the pair Quasi-information corrects the position of the object to be polished, the first adjustment unit is connected to the first gripper to rotate the first gripper, so that The gripper corrects the position of the object to be polished while being gripped, and the first gripper attaches the object to be polished whose position is corrected by the first adjustment unit to the first platform unit.

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