KR20190092264A - Polishing apparatus - Google Patents

Abstract

According to an embodiment of the present invention, provided is a polishing apparatus which comprises: at least one first polishing unit having at least one first spindle, and arranged in a line along a first direction; at least one first table unit arranged in a position corresponding to the first spindle, wherein an object to be polished is mounted thereon; and a first transfer unit having a first rail extending along the first direction, at least one second rail installed between the first rail and the first table unit, and a first gripper moving along the first rail and the second rail to enable the object to be polished to be returned to or taken out of the first table unit.

Description

 Polishing Device {POLISHING APPARATUS}

Embodiments of the present invention relate to a polishing apparatus.

Recently, with the development of various electronic devices such as mobile phones, PDAs, computers, and large TVs, the demand for flat display devices that can be applied thereto is gradually increasing. Such flat display devices are being actively researched on liquid crystal display (LCD), plasma display panel (PDP), field emission display (FED), vacuum fluorescent display (VFD), organic light emitting diodes (OLED), etc. Liquid crystal display (LCD) is the most widely used due to the ease of driving means and high quality, but recently, the use of various devices is increasing due to the development of technology.

A substrate used in such a flat panel display device is generally configured in the form of a lower panel on which various elements and the like are mounted, and a composite substrate in which a separate upper panel is coupled to an upper portion of the lower panel. The composite substrate has a shape in which the lower panel is larger in size than the upper panel so that the lower panel protrudes on one side of the upper panel, and separates for electrical connection with an external device on one side of the protruding lower panel. Connection terminals are arranged.

Such a composite substrate is generally made of tempered glass material is configured to increase the strength, nevertheless, due to the mechanical cutting process by the wheel (wheel) in the cutting process of the composite substrate, such as a crack occurs in the processing surface There was a problem of falling strength. In particular, such fine cracks are mainly generated along the edge lines of the composite substrate. In order to prevent this, recently, an operation of chamfering the edge line portion of the composite substrate is performed.

Chamfering of the edge line is generally performed by grinding the edge line using a grinder. In the conventional art, a composite substrate is loaded on a polishing apparatus one by one, polished, and then unloaded. It was. However, the grinding method of the chamfering operation has a problem such that productivity is reduced because the operation is complicated, such as continuously loading / unloading the composite substrate.

Embodiment of the present invention is to provide a polishing apparatus that can improve the productivity.

According to an embodiment of the present invention, a first rail extending along a first direction, a second rail extending along a second direction crossing the first direction, and polishing along the first rail and the second rail A first conveying unit having a first gripper for conveying an object, a first table unit on which a polishing object conveyed by the first gripper is seated and fixed, and disposed at a position corresponding to the first table unit. And a first polishing unit including at least one first spindle and movable to the first table unit for polishing the polishing object.

In one embodiment of the present invention, when two or more second rails are provided, the second rails may be arranged in parallel to each other.

In one embodiment of the present invention, the first gripper may lift or lower the polishing object in a third direction crossing the first direction and the second direction.

In one embodiment of the present invention, it may further include a first camera unit disposed adjacent to the first rail, the first camera unit for detecting the alignment state of the polishing object gripped by the first gripper.

In one embodiment of the present invention, a third rail extending along the first direction and parallel to the first rail, a fourth rail extending along the second direction, the third rail and the fourth A second conveying unit having a second gripper for conveying the object to be polished along the rail, a second table unit on which the object to be transported by the second gripper is seated and fixed, and a position corresponding to the second table unit The apparatus may further include a second polishing unit disposed and including at least one second spindle and movable to the second table unit to polish the polishing object.

In one embodiment of the present invention, the second polishing unit may be disposed symmetrically with the first polishing unit on the basis of an imaginary extension line parallel to the first direction.

In one embodiment of the present invention, the number of the second spindle may correspond to the number of the first spindle.

In one embodiment of the present invention, when two or more of the fourth rails are provided, the fourth rails may be arranged in parallel to each other.

In one embodiment of the present invention, the number of the second rail may be different from the number of the first table unit.

In one embodiment of the present invention, the first gripper may include a plurality of grippers to correspond to the plurality of first table units.

In one embodiment of the present invention, the object to be polished is transferred in the second direction through the second rail after the transfer in the first direction through the first rail, the first direction is lowered in the third direction Can be seated on the table unit. .

Another embodiment of the invention, at least one first spindle (spindle), at least one first polishing unit disposed along the first direction, disposed in a position corresponding to the first spindle, the polishing object is At least one first table unit seated and a first rail extending along the first direction, a second rail moving along the first rail and extending in a second direction crossing the first direction, and the first rail 2. A polishing apparatus comprising: a first conveying unit connected to a rail, the first conveying unit having a first gripper moving along the first direction and the second direction to carry or unload the object to be polished into the first table unit; do.

In an embodiment of the present invention, the first gripper is disposed on a path moving in the first direction, and detects the alignment state of the polishing object held by the first gripper, and detects alignment data of the polishing object. It may further include a first camera unit for generating.

In one embodiment of the present invention, the first camera unit is provided with the alignment data, and further comprising a first adjustment unit for correcting the position of the polishing object based on the alignment data. In this case, the first gripper may seat the polishing object whose position is corrected by the first adjusting unit, as the first table unit.

In one embodiment of the present invention, the first camera unit may be configured to be able to adjust the distance in order to detect the alignment of the polishing object of various sizes.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

In the polishing apparatus according to the embodiments of the present invention, the grippers move along the first rail and the second rail to efficiently transfer the polishing objects to the plurality of fixed table units. Through this, the polishing apparatus according to the embodiments of the present invention can set the optimum movement path for the import and export of the polishing object, it is possible to improve the process efficiency. In addition, the polishing apparatus according to the embodiments of the present invention can be processed simultaneously by placing a plurality of spindles in one polishing unit, it is possible to mass production. In addition, the polishing apparatus according to the embodiments of the present invention does not need to move the fixed table unit on which the polishing object is seated toward the polishing unit, and thus there is no risk of changing the position of the polishing object during the movement, thereby making it more stable and accurate polishing. Can be enabled.

1 is a plan view schematically showing a polishing apparatus according to an embodiment of the present invention.
FIG. 2 is a conceptual diagram for describing an operation of the polishing apparatus in the first region of FIG. 1.
FIG. 3 is a conceptual diagram for describing an operation of the polishing apparatus in the second region of FIG. 1.
4 and 5 are plan views schematically showing a polishing apparatus according to another embodiment of the present invention.
6 is a perspective view showing a polishing apparatus according to a second embodiment of the present invention.
7 is a plan view of the polishing apparatus of FIG.
8 is a perspective view showing an extract of the first transfer unit of FIG.
9 is a diagram illustrating an extract of the first gripper and the first adjustment unit of FIG. 8.
FIG. 10 is a diagram illustrating an extract of the first camera unit of FIG. 7.
11A to 11C are diagrams sequentially illustrating a process in which the first gripper seats the first polishing object and the second polishing object with the first table unit.

Hereinafter, the following embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be denoted by the same reference numerals, and redundant description thereof will be omitted.

The embodiments are capable of various transformations, and specific embodiments will be illustrated in the drawings and described in detail in the written description. Effects and features of the embodiments and a method of achieving them will be apparent with reference to the following description in detail in conjunction with the drawings. However, the present embodiments are not limited to the embodiments disclosed below but may be implemented in various forms.

In the following embodiments, the terms "first" and "second" are used for the purpose of distinguishing one component from other components rather than a restrictive meaning.

In the following examples, the singular forms “a”, “an” and “the” include plural forms unless the context clearly indicates otherwise.

In the following embodiments, the term "include" or "having" means that a feature or component described in the specification is present and does not preclude the possibility of adding one or more other features or components.

In the following embodiments, when a part such as a unit, an area, a component, or the like is located on or on another part, as well as being directly above another part, other units, areas, components, etc. are interposed therebetween. It also includes the case.

In the following embodiments, the terms connect or combine, and the like, do not necessarily mean direct and / or fixed connection or coupling of two members, unless the context clearly indicates otherwise. It is not excluded.

It means that there is a feature or component described in the specification and does not preclude the possibility of adding one or more other features or components.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and therefore the following embodiments are not necessarily limited to those shown.

FIG. 1 is a plan view schematically showing a polishing apparatus 10 according to a first embodiment of the present invention, and FIG. 2 is a conceptual diagram for explaining an operation of the polishing apparatus 10 in the first position A1 of FIG. 3 is a conceptual diagram for explaining the operation of the polishing apparatus 10 in the second position A2 of FIG. 1.

1 to 3, the polishing apparatus 10 according to the first embodiment of the present invention may include a first polishing unit 110, a first table unit 120, and a first transfer unit 130. Can be.

The first polishing unit 110 may include at least one first spindle 111. The first spindle 111 performs a function of polishing the polishing object M, and a polishing tool for polishing the polishing object M may be mounted at the distal end of the rotating shaft member. The first spindle 111 may rotate the above-described polishing tool to polish the polishing object M. For example, the first spindle 111 may polish the side surface of the polishing object M. FIG. Alternatively, the first spindle 111 may polish the polishing object M such that one region of the polishing object M before the polishing process is formed in a predetermined shape, as in the polishing object M ′ after the polishing process in FIG. 1. .

Meanwhile, the first polishing unit 110 may include a plurality of first spindles 111, and the plurality of first spindles 111 may be disposed in one body part 112. As shown in FIG. 1, the first polishing unit 110 may include two first spindles 111, but the technical spirit of the present disclosure is not limited thereto, and more first spindles 111 may be provided. Of course it can be provided. In this case, the plurality of first spindles 111 may be arranged in a line below the first body part 112 with respect to the first direction, which may coincide with the direction in which the first polishing unit 110 is arranged. Can be.

The first polishing unit 110 includes a first direction transfer part (not shown) for moving the first body part 112 in a first direction, and a second direction transfer part for moving the first body part 112 in a second direction. (Not shown) and a third direction transfer part (not shown) for moving the first body part 112 in a third direction. The first direction transfer unit (not shown), the second direction transfer unit (not shown), and the third direction transfer unit (not shown) move the first body part 112 with respect to the first direction, the second direction, and the third direction, respectively. It can be configured using a motor, a hydraulic cylinder, a pneumatic cylinder or a linear actuator, and the like. Here, the first to third directions may be directions perpendicular to each other. The first polishing unit 110 may move away from or close to the first table unit 120 by moving in the second direction. In other words, the vertical distance from the first body unit 112 to the first table unit 120 may be adjusted by the second direction transfer part (not shown).

The first polishing unit 110 moves the first body part 112 by using the first direction conveying part (not shown) and the second direction conveying part (not shown), thereby lowering the first body part 112. The positions of the one or more first spindles 111 arranged in a line may be adjusted at a time. When the first polishing unit 110 includes a plurality of first spindles 111 in one first body part 112, a plurality of first table units 120 using the plurality of first spindles 111. A plurality of polishing objects M seated on the s) can be polished at the same time. In addition, the first polishing unit 110 may control the movement of the first body part 112, thereby controlling the movement of the plurality of first spindles 111 at once, thereby improving process efficiency.

In another embodiment, the first polishing unit 110 may further include first position adjusting means (not shown) capable of adjusting the respective positions of the plurality of first spindles 111. The first position adjusting means (not shown) may independently adjust the up, down, left, and right movements of the respective first spindles 111.

Meanwhile, when a plurality of first polishing units 110 are provided, they may be arranged in a line along the first direction. In this case, the plurality of first polishing units 110 may be disposed such that the first spindles 111 provided in the first polishing units 110 face the same direction. In addition, the plurality of first polishing units 110 may be disposed such that zero positions of each of the first spindles 111 are positioned on the same straight line.

The first table unit 120 may be disposed at a position corresponding to the first spindle 111, and the polishing object M may be seated thereon. The first table unit 120 may correspond to the number of first spindles 111, and the polishing object M may be seated on each of the first table units 120. However, the technical spirit of the present invention is not limited thereto, and as another embodiment, the first table unit 120 is provided to correspond to the number of the first polishing units 110, and on the first table unit 120. A plurality of mounting areas on which the polishing object M is mounted may be provided. In this case, the number of seating areas provided in the first table unit 120 may correspond to the number of first spindles 111 provided in one first polishing unit 110.

The first table unit 120 is a fix unit. In order to load or unload the polishing object M, a first gripper 133, which will be described later, is moved to the first table unit 120. In order to move or grind the object to be polished (M), only the first spindle 111 is moved to the first table unit 120, the first table unit 120 may not move.

Meanwhile, the first transfer unit 130 may include a first rail 131, a second rail 132, and a first gripper 133.

The first rail 131 may extend along the first direction. The first rail 131 may be disposed along the first polishing units 110, and specifically, may be disposed to face the first spindle 111 along the arrangement direction of the plurality of first spindles 111. .

The second rail 132 may be installed between the first rail 131 and the first table unit 120. The second rail 132 may extend in a second direction crossing the first direction, and as shown, the second rail 132 may extend in a direction perpendicular to the first rail 131. The number of the second rails 132 corresponds to the number of the first table units 120, and when two or more second rails 132 are provided, they may be arranged in parallel in the first direction.

The above structure is an embodiment where the first table unit 120 corresponds to the number of first spindles 111. As another embodiment, as described above, when the first table unit 120 is provided to correspond to the number of the first polishing units 110, the number of the second rails 132 is the first table unit 120. It may correspond to the number of seating areas provided in the. The second rail 132 may extend from the first rail 131 to a position at which the polishing object M may be seated on the first table unit 120. The first gripper 133 may move along the first rail 131 and the second rail 132 to convey or carry the polishing object M to the first table unit 120.

The first gripper 133 grips the polishing object M introduced into the polishing apparatus 10, and then moves along the first rail 131 and the second rail 132 to remove the polishing object M. 1 After conveying to the table unit 120, or holding the polishing object (M ') is completed to move along the second rail 132 and the first rail 131 to be taken out of the first table unit 120. Can be. The first gripper 133 may be provided as one to perform both the transport and the carry-out function, or may be provided as two of the transport gripper and the transport gripper. Alternatively, a larger number of grippers may be provided. However, when two or more first grippers 133 are provided, the first grippers 133 may be arranged along the first rail 131 and the second rail 132 by a preset program so as not to interfere with each other. I can move it.

In another embodiment, the second rail 132 may be provided to extend between the first table units 120 from the first rail 131. In this case, the number of second rails 132 may not correspond to the number of first table units 120 or the number of seating areas. For example, one second rail 132 may be provided to correspond to two first table units 120. When one second rail 132 is installed between the two first table units 120, the first gripper 133 described later may have two grippers to correspond to the two first table units 120. A part (not shown) may be provided. An interval between two gripper units (not shown) may correspond to an interval between two first table units 120. Accordingly, the first gripper 133 simultaneously holds the two polishing objects M and moves along the second rail 132 to convey or carry the polishing objects M to each of the first table units 120. can do.

2 and 3, the first gripper 133 may lift or lower the polishing object M in a third direction crossing both the first direction and the second direction. In other words, the first gripper 133 may grip the object M to move in the height direction with respect to the ground. The first gripper 133 may further include a height adjusting unit 135, and the height adjusting unit 135 may be configured by using a motor, a hydraulic cylinder, a pneumatic cylinder, or a linear actuator.

Meanwhile, the polishing apparatus 10 according to the first embodiment of the present invention may further include a first camera unit 140 and a first conveyor unit C1.

The first camera unit 140 may be disposed adjacent to the first rail 131 and detect an alignment of the polishing object M gripped by the first gripper 133. In detail, as illustrated in FIGS. 1 and 2, the first gripper 133 may grip the polishing object M introduced at the first position A1. The object to be polished (M) may be drawn at a position other than the first rail (131), the polishing apparatus 10 is made of a first under the first rail 131 at the position to be drawn through the first conveyor unit (C1) The polishing object M can be moved to one position A1. Therefore, the first position A1 may be a position where the first conveyor unit C1 and the first rail 131 cross each other.

The first camera unit 140 is located at a first position A1 in which the polishing object M is gripped by the first gripper 133, so that the polishing object M is aligned in the first gripper 133. You can check. The first camera unit 140 photographs the polishing object M symmetrically disposed with respect to the first rail 131 to be gripped by the first gripper 133 to accurately determine the alignment state of the polishing object M. It can be detected.

Meanwhile, the polishing apparatus 10 according to the first embodiment of the present invention may further include a second polishing unit 210, a second table unit 220, and a second transfer unit 230. Here, the second polishing unit 210, the second table unit 220, and the second transfer unit 230 may be the first polishing unit 210, the first table unit 120, and the first transfer unit 130, respectively. As the same configuration as, a duplicate description will be omitted for convenience of description.

The second polishing unit 210 includes a second body portion 212 and at least one second spindle 211 disposed in the second body portion 212, and are arranged in a line along the first direction, but the first It may be disposed in parallel with the polishing unit 110. The second polishing unit 210 may be the same as the number of the first polishing units 110, but is not necessarily so. In an embodiment, the second polishing unit 210 may be symmetrically disposed with the first polishing unit 110 based on a virtual extension line L parallel to the first direction. Therefore, the second spindle 211 of the second polishing unit 210 and the first spindle 111 of the first polishing unit 110 may be arranged to look outward with respect to the virtual extension line L. FIG. The number of second spindles 211 may correspond to the number of first spindles 111.

The second table unit 220 may be disposed at a position corresponding to the second spindle 211, and the polishing object M may be seated. Like the first table unit 120, the second table unit 220 may correspond to the number of the second spindles 211 or may correspond to the number of the second polishing units 210.

The second transfer unit 230 may include a third rail 231, a fourth rail 232, and a second gripper 233.

The third rail 231 may extend in the first direction and may be parallel to the first rail 131. The third rail 231 may be disposed along the second polishing unit 210, and specifically, may be disposed to face the second spindle 211 along the arrangement direction of the plurality of second spindles 211.

The fourth rail 232 may be installed between the third rail 231 and the second table unit 220. The fourth rail 232 may extend in a second direction crossing the first direction, and as shown, the fourth rail 232 may extend in a direction perpendicular to the third rail 231. The number of the fourth rails 232 corresponds to the number of the second table units 220, and when two or more fourth rails 232 are provided, they may be arranged in parallel in the first direction.

The second gripper 233 may move along the third rail 231 and the fourth rail 232 to convey or carry the polishing object M to the second table unit 220. The second gripper 233 grips the polishing object M introduced into the polishing apparatus 10 and then moves along the third rail 231 and the fourth rail 232 to move the polishing object M to the second. After conveying to the table unit 220 or holding the polished object M 'which has been polished, it may be moved along the fourth rail 232 and the third rail 231 to be taken out of the second table unit 220. have. Like the first gripper 133, the second gripper 233 may lift or lower the polishing object M in a third direction.

In another embodiment, the fourth rail 232 may be provided to extend between the second table units 220 from the third rail 231. In this case, the number of fourth rails 232 may not correspond to the number of second table units 220 or the number of seating areas. For example, one fourth rail 432 may be provided to correspond to two second table units 220. When one fourth rail 232 is installed between the two second table units 220, the second grippers 233 to be described later are two grippers so as to correspond to the two second table units 220 described above. A part (not shown) may be provided. An interval between two gripper units (not shown) may correspond to an interval between two second table units 220. Through this, the second gripper 233 simultaneously grips the two polishing objects M and then moves along the fourth rail 232 to convey or carry the polishing objects M to each of the second table units 220. can do.

In addition, the polishing apparatus 10 according to the first embodiment of the present invention may further include a second camera unit 240 and a second conveyor unit C2.

The second camera unit 240 is disposed adjacent to the third rail 231, and may detect an alignment state of the polishing object M gripped by the second gripper 233. The second camera unit 240 may be symmetrically disposed with the first camera unit 140 based on the virtual extension line L. FIG. Therefore, the position where the second camera unit 240 is disposed may be a position at which the second conveyor unit C2 and the third rail 231 cross each other.

In the polishing apparatus 10 according to the first embodiment of the present invention having the above-described structure, a first table unit is used for the polishing object M to be introduced using the first conveying unit 130 or the second conveying unit 230. It can convey to the 120 or the 2nd table unit 220, or can carry out. In addition, the carried object M 'may be discharged to the outside after being moved to a predetermined region by using the third conveyor unit C3 or the fourth conveyor unit C4.

The polishing apparatus 10 according to the first embodiment described above is composed of two polishing units 110 and 210 around the imaginary extension line L, but the present invention is not limited thereto and one polishing unit ( Not shown). More specifically, one polishing unit is positioned between the first table unit 120 and the second table unit 220 and moved toward the first table or the second table where the polishing unit is fixed, depending on the situation. By polishing the object to be polished (M), the polishing apparatus 10 can be operated more efficiently.

4 and 5 are plan views schematically showing a polishing apparatus 10 ′, 10 ″ according to another embodiment of the present invention.

Referring to FIG. 4, the polishing apparatus 10 ′ according to another embodiment of the present invention has the same components as the polishing apparatus 10 of FIG. 1, but differs from the polishing apparatus 10 of FIG. 1. The 111 and the second spindle 211 may be disposed to face each other with respect to the virtual extension line. In this case, the first rail 131 and the third rail 231 may be disposed in parallel to pass between the first polishing unit 110 and the second polishing unit 210.

Referring to FIG. 5, the polishing apparatus 10 ″ according to another embodiment of the present invention is different from the polishing apparatus 10 of FIG. 1 and the polishing apparatus 10 ′ of FIG. 4. The second polishing unit 210 may not be disposed symmetrically but may be disposed to be offset from each other. Through this structure, the polishing apparatus 10 ″ of FIG. 5 does not include the third rail 231, and only the first rail 131 extending in the first direction is the first polishing unit 110 and the second. It may be provided between the polishing unit 210. In this case, the first rail 131 may be connected to the second-first rail 132-1 and the second-second rail 132-2 extending in the second direction crossing the first direction. Since the second-first rail 132-1 and the second-second rail 132-2 extend from the first rail 131 toward the first spindle 111 and the second spindle 211, respectively, the second rail 132-1 and the second rail 132-2 are opposite to each other. Can extend in a direction. In addition, the 2-1 th rail 132-1 and the 2-2 rail 132-2 may be alternately disposed along the first rail 131.

FIG. 6 is a perspective view showing a polishing apparatus 20 according to a second embodiment of the present invention, and FIG. 7 is a plan view of the polishing apparatus 20 of FIG. FIG. 8 is a perspective view illustrating the first transfer unit 130 of FIG. 6. 9 is a view showing an extract of the first gripper 133 and the first adjustment unit 150 of FIG. 8, and FIG. 10 is a view showing an extract of the first camera unit 140 of FIG. 7.

6 to 8, the polishing apparatus 20 according to the second embodiment of the present invention has the same technical concept as the polishing apparatus 10 according to the first embodiment, and two polishing objects as specific embodiments. Characterized in that the (M1, M2) is simultaneously held and brought in or taken out.

The polishing apparatus 20 according to the second embodiment of the present invention includes a first polishing unit 110, a first table unit 120 (see FIG. 11B), a first transfer unit 130, and a first camera unit 140. And a first adjustment unit 150 (see FIG. 9). In addition, the polishing apparatus 20 according to the second embodiment, like the first embodiment, the second polishing unit 210, the second table unit 220, the second conveyance is arranged symmetrically to the above-described configuration The unit 230 may further include a second camera unit 240 and a second adjustment unit (not shown). Hereinafter, for the convenience of description, the same reference numerals are assigned to the same components, and the description will be made with reference to the first transfer unit 130, but overlapping description will be omitted.

The first polishing unit 110 may include at least two first spindles 111. The first spindle 111 performs a function of polishing the polishing object M, and a polishing tool for polishing the polishing object M may be mounted at the distal end of the rotating shaft member. The first spindle 111 may rotate the above-described polishing tool to polish the polishing object M. For example, the first spindle 111 may polish the side surface of the polishing object M. FIG. Alternatively, as shown in FIG. 7, the first spindle 111 may polish the polishing object M such that one region of the polishing object M before the polishing process is formed in a predetermined shape, as in the polishing object M ′ after the polishing process. .

In one embodiment, the first polishing unit 110 includes two first spindles 111 and may be disposed in one body portion 112. The first polishing unit 110 uses the first direction conveying part (not shown) and the second direction conveying part (not shown) connected to the first body part 112 to position two first spindles 111 at once. Can be controlled. In addition, the first polishing unit 110 may further include a first position adjusting means (not shown) capable of adjusting the positions of each of the two first spindles 111. The first position adjusting means (not shown) may independently adjust the up, down, left, and right movements of the respective first spindles 111.

The first table units 120 and 11b may be provided in a number corresponding to the number of the first spindles 111 of the first polishing unit 110. As described above, since the first polishing unit 110 according to the second embodiment includes two first spindles 111, two first table units 120 may be provided. The first table unit 120 is disposed at a position corresponding to the first spindle 111, the polishing object M is seated on the upper portion, and more specifically, the first polishing object M1 and the second polishing object. M2 may be mounted on the two first table units 120, respectively.

Meanwhile, the first transfer unit 130 may include a first rail 131, a second rail 132, and a first gripper 133. The first transfer unit 130, like the polishing apparatus 10 of the first embodiment, has a first rail 131 extending in a first direction and a second rail extending in a direction perpendicular to the first rail 131 ( 132 may be provided. In this case, in the first embodiment, the second rail 132 is provided such that the number of the second rails 132 corresponds to the number of the first table units 120, but in the second embodiment, A case where one second rail 132 is connected between the first gripper 133 and the first rail 131 to move the first gripper 133 in the first direction or the second direction will be described. do.

The first rail 131 may extend along the first direction. The first rail 131 may be disposed along the arrangement direction of the first polishing units 110, and specifically, the first rail 131 may be disposed to face the first spindle 111 along the arrangement direction of the plurality of first spindles 111. Can be.

The first gripper 133 simultaneously grips the first polishing object M1 and the second polishing object M2 introduced through the loading part 300 of the polishing apparatus 10, and then holds the first rail 131. It moves along and can convey the 1st grinding | polishing object M1 and the 2nd grinding | polishing object M2 to the 1st table unit 120. FIG. The first gripper 133 includes a first grip part 1331 and a second grip part 1332 disposed symmetrically in a first direction with respect to the second rail 132, respectively, and each first grinding object The M1 and the second polishing object M2 can be gripped. In an embodiment, the first gripper 133 may be connected to the first rail 131 with the second rail 132 interposed therebetween. In this case, the second rail 132 may extend in a second direction crossing the first direction in which the first rail 131 extends.

In detail, as illustrated in FIG. 8, one side of the second rail 132 may be connected to the first rail 131 to move along the first direction guided by the first rail 131. In this case, the second rail 132 may be connected to the other side opposite to the one side such that the first gripper 133 is movable in the second direction. The first gripper 133 may move together in the first direction by moving the second rail 132 along the first rail 131, and may also move in the second direction along the second rail 132. .

On the other hand, the first rail 131 has a first length along the first direction so that the first gripper 133 can convey the polishing objects M1 and M2 to the plurality of arranged first polishing units 110. May be extended to. In addition, the second rail 132 may extend in a second length along the second direction so that the first gripper 133 moved along the first rail 131 may move to the first table unit 120. . In an embodiment, the first transfer unit 130 may not only carry the polishing objects M1 and M2 using the first gripper 133, but also carry out the polishing objects M1 and M2 that have been polished. To perform the function. However, the present invention is not limited thereto, and as another embodiment, the first transfer unit 130 may further include a first transfer gripper 137 to separately carry in and unload.

In detail, like the first gripper 133, the first transport gripper 137 may be connected to the first rail 131 to move in the first direction along the first rail 131. In this case, the first transport gripper 137 may be connected to the first rail 131 with the sixth rail 136 interposed therebetween. Like the second rail 132, the sixth rail 136 may perform a function of guiding the first transport gripper 137 to move along the second direction.

The first conveying gripper 137 is provided with a first conveying grip part 1372 and a second conveying grip part 1372 arranged symmetrically in the first direction with respect to the sixth rail 13 to finish polishing. The first polishing object M1 and the second polishing object M2 can be gripped at the same time. The first conveying gripper 137 moves to the first table unit 120 to hold the first polishing object M1 and the second polishing object M2 that have been polished and then along the sixth rail 136. After moving in two directions, the vehicle stops near the first rail 131. Thereafter, the first polishing object M1 and the second polishing object M2 are moved to the outside through the unloading part 400 by moving in the first direction along the first rail 131.

Referring to FIG. 9, the first gripper 133 is connected to the second rail 132, and the first polishing object in a third direction intersecting both the first direction and the second direction through the height adjusting unit 135. It is possible to lift or lower the M1 and the second polishing object M2. In other words, the first gripper 133 may grip the first polishing object M1 and the second polishing object M2 to move in the height direction with respect to the ground.

In this case, the first adjustment unit 150 may be connected to the first gripper 133 and may rotate the first gripper 133 about the first rotation axis Ax1 parallel to the third direction. Specifically, the first adjusting unit 150 is disposed between the first gripping portion 1331 and the second gripping portion 1332, and the first gripping portion 1331 is rotated about the first rotation axis Ax1. ) And the second gripping portion 1332 can be rotated at the same time.

Referring to FIGS. 7 and 10 again, the first camera unit 140 is disposed in a moving path in which the first gripper 133 moves after holding the first polishing object M1 and the second polishing object M2. Can be. The first camera unit 140 detects an alignment of the first polishing object M1 and the second polishing object M2 held by the first gripper 133, and detects the first alignment data and the second alignment data. You can create sorted data. In addition, the pair of cameras constituting the first camera unit 140 may be configured to be able to adjust the position according to the size of the object to be polished.

Specifically, as shown in FIG. 10, the first camera unit 140 includes a pair provided symmetrically with respect to the first direction, so that the first polishing object M1 and the second polishing object M2 are The degree of distortion with respect to the first direction and the second direction can be generated as the first alignment data and the second alignment data, respectively. The first camera unit 140 may provide the generated first alignment data and second alignment data to the first adjustment unit 150. Subsequently, the first adjustment unit 150 may allow each polishing object to be seated on the first table unit 120 by correcting the misalignment between the first polishing object M1 and the second polishing object M2 through the provided data. have.

Hereinafter, with reference to the drawings, the first gripper 133 may use the first camera unit 140 and the first adjustment unit 150 to form the first polishing object M1 and the second polishing object M2 in a first manner. A method of aligning to the table unit 120 will be described.

11A to 11C are diagrams sequentially illustrating a process in which the first gripper 133 seats the first polishing object M1 and the second polishing object M2 on the first table unit 120.

Referring to FIG. 11A, the first gripper 133 may grip the first polishing object M1 and the second polishing object M2 by using the first gripper 1331 and the second gripper 1332, respectively. Can be. In this case, it is most ideal to grip the first polishing object M1 and the second polishing object M2 in an aligned state such that they can be directly seated on the first table unit 120.

However, during the actual gripping process, the first polishing object M1 and the second polishing object M2 may be misaligned and gripped. In the case of directly mounting the first polishing object M1 and the second polishing object M2 in the misaligned state, a process error may occur during polishing. There is a problem that occurs. Therefore, in order to minimize such a process error, the polishing apparatus 20 is in an alignment state of the first polishing object M1 and the second polishing object M2 moving in the first direction using the first camera unit 140. Will be measured. As described above, the first camera unit 140 is disposed symmetrically with respect to the first direction to sequentially measure the degree of distortion of the first polishing object M1 and the second polishing object M2, and includes a degree of distortion. The first alignment data and the second alignment data can be generated.

Referring to FIG. 11B, the first gripper 133 may move on the first table unit 120 through the first rail 131 and the second rail 132. In this case, the first adjustment unit 150 is provided with the first alignment data and the second alignment data in advance from the first camera unit 140, and first, the position of the first polishing object M1 is determined using the first alignment data. Can be corrected (P1 → P1 '). That is, the first adjusting unit 150 may include the first gripper so that the first polishing object M1 may be seated on the first table unit 120 at the alignment position P1 ′ aligned at the twisted initial position P1. 133 may be rotated. In addition, the first gripper 133 may adjust the position by translating in the first direction or the second direction as necessary in the above process.

Referring to FIG. 11C, the first gripper 133 may seat the first polishing object M1 on the first table unit 120, and then seat the second polishing object M2 through the same alignment process. . In other words, the first adjustment unit 150 may correct the position of the second polishing object M2 using the second alignment data provided from the first camera unit 140 (P2 → P2 '). That is, the first adjustment unit 150 may include the first gripper so that the second polishing object M2 may be seated on the first table unit 120 at the alignment position P2 ′ aligned at the displaced initial position P2. 133 may be rotated. In addition, the first gripper 133 may adjust the position by translating in the first direction or the second direction as necessary in the above process.

As described above, the polishing apparatus according to the embodiments of the present invention can efficiently transfer the polishing objects to the plurality of fixed table units by the gripper moving along the first rail and the second rail. Through this, the polishing apparatus according to the embodiments of the present invention can set the optimum movement path for the import and export of the polishing object, it is possible to improve the process efficiency. In addition, the polishing apparatus according to the embodiments of the present invention can be processed simultaneously by placing a plurality of spindles in one polishing unit, it is possible to mass production.

In addition, the polishing apparatus according to the embodiments of the present invention may correct the twisted object to be gripped by the first adjusting unit in the process of holding the gripper, and then mount it to the first table unit, thereby implementing accurate polishing. In addition, there is no need to configure a camera unit for measuring the twisting degree of the polishing object for each of the plurality of fixed tables by configuring one camera unit to measure and correct the twisting degree of the polishing object, thereby reducing the cost.

As described above, the present invention has been described with reference to one embodiment shown in the drawings, which is merely exemplary, and it will be understood by those skilled in the art that various modifications and embodiments may be made therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10: polishing device
110: first polishing unit
111: spindle
112: body part
120: table unit
130: first transfer unit
131: first rail
132: second rail
133: first gripper
140: first camera unit
150: first adjusting unit

Claims (14)

A first rail extending along a first direction, a second rail extending along a second direction crossing the first direction, and a first gripper for transporting an object to be polished along the first rail and the second rail ( a first transfer unit having a gripper;
A first table unit on which the polishing object conveyed by the first gripper is seated and fixed; And
And a first polishing unit disposed at a position corresponding to the first table unit and including at least one first spindle and movable to the first table unit to polish the polishing object. . According to claim 1,
If more than one second rail is provided, the second rails are disposed parallel to each other. According to claim 1,
And the first gripper lifts or lowers the polishing object in a third direction intersecting the first direction and the second direction. According to claim 1,
And a first camera unit disposed adjacent to the first rail and configured to detect an alignment state of the polishing object held by the first gripper. According to claim 1,
A third rail extending along the first direction and parallel to the first rail, a fourth rail extending along the second direction, and transferring the polishing object along the third rail and the fourth rail; A second transfer unit having two grippers;
A second table unit on which the polishing object conveyed by the second gripper is seated and fixed; And
And a second polishing unit disposed at a position corresponding to the second table unit and including at least one second spindle and movable to the second table unit to polish the object to be polished. Device. The method of claim 5,
And the second polishing unit is disposed symmetrically with the first polishing unit with respect to an imaginary extension line parallel to the first direction. The method of claim 5,
And the first polishing unit and the second polishing unit are the same polishing unit. The method of claim 4, wherein
And the first camera unit can adjust the position according to the size of the polishing object. According to claim 1,
And the number of the second rails is different from the number of the first table units. The method of claim 9,
And the first gripper includes a plurality of grippers so as to correspond to the plurality of first table units. The method of claim 3, wherein
And the polishing object is conveyed in the first direction through the first rail and then conveyed in the second direction through the second rail, and lowered in the third direction to be seated on the first table unit. At least one first polishing unit comprising at least one first spindle, the at least one first polishing unit disposed along a first direction;
At least one first table unit disposed at a position corresponding to the first polishing unit and on which the polishing object is seated; And
A first rail extending along the first direction, a second rail moving along the first rail and extending in a second direction crossing the first direction, and connected to the second rail; And a first conveying unit having a first gripper for moving the polishing object to the first table unit by moving in the first direction or by moving in the second direction along the second rail by the movement of. Polishing device. The method of claim 12,
A first camera unit disposed on a path along which the first gripper moves in a first direction, the first camera unit detecting an alignment state of the polishing object held by the first gripper and generating alignment data of the polishing object; Including, the polishing apparatus. The method of claim 13,
A first adjustment unit receiving the alignment data from the first camera unit and correcting the position of the polishing object based on the alignment data;
And the first gripper seats the polishing object whose position is corrected by the first adjustment unit in the first table unit.

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