JP2019130661A - Polishing device - Google Patents

Abstract

A polishing apparatus is provided. A first rail extends along a first direction, a second rail extends along a second direction intersecting the first direction, and a first rail extends along the first rail and the second rail. A first transfer unit having a first gripper for transferring the object to be polished by the first gripper; a first table unit on which the object to be polished transferred by the first gripper is mounted and fixed; A polishing apparatus, comprising: a first polishing unit disposed at a position corresponding to a table unit, including at least one first spindle, and movable to the first table unit to polish the object to be polished. [Selection diagram] Fig. 1

Description

  The present invention relates to a polishing apparatus.

  Recently, with the development of various electronic devices such as mobile phones, PDAs (personal digital assistants), computers, and large TVs (television), the demand for flat display devices that can be applied to them has increased. ing. As such a flat display device, LCD (liquid crystal display), PDP (plasma display panel), FED (field emission display), VFD (vacuum fluorescent display), OLED (organic light emitting diode), etc. are actively studied. However, liquid crystal display devices (LCDs) are currently the most widely used because of mass production technology, easy drive means, and high image quality. Recently, with the development of technological capabilities, various devices have been developed. The use of is further increasing.

A substrate used in such a flat display device is generally a composite substrate in which a lower panel on which various elements are mounted and a separate upper panel are coupled to the upper portion of the lower panel. Consists of forms. The composite substrate is configured such that the lower panel is formed to be larger in size than the upper panel, and the lower panel protrudes from one side of the upper panel. A separate connection terminal for electrical connection with an external device is disposed.
Such a composite substrate is generally made of a tempered glass material and configured to increase its strength, but nevertheless, mechanical cutting by a wheel during the cutting process of the composite substrate. Depending on the process, there is a problem in that fine cracks and the like are generated on the processed surface and the strength thereof is lowered. In particular, such fine cracks are mainly generated along the edge line of the composite substrate. In order to prevent such cracks, recently, an operation of chamfering the edge line portion of the composite substrate has been performed. Yes.

  Such edge line chamfering work is generally carried out by using a grinder to grind the edge line. Conventionally, one composite substrate is placed on a polishing apparatus. After loading and polishing one by one, the work was further unloaded. However, such a chamfering work of the grinding method has a problem that the work of having to continuously load / unload the composite substrate is complicated and productivity is lowered.

Korean Published Patent No. 10-2009-0115934

  The problem to be solved by the present invention is to provide a polishing apparatus capable of improving productivity.

  An embodiment of the present invention includes a first rail extending along a first direction, a second rail extending along a second direction intersecting the first direction, the first rail, and the first rail. A first gripper for transferring a polishing object along two rails; a first table on which the polishing object transferred by the first gripper is placed and fixed A first polishing unit disposed at a position corresponding to the first table unit and including at least one first spindle and movable to the first table unit to polish the object to be polished. A polishing apparatus is provided.

  In an embodiment of the present invention, when two or more second rails are provided, the second rails are also arranged in parallel to each other.

  In one embodiment of the present invention, the first gripper can lift or lower the object to be polished in a third direction intersecting the first direction and the second direction.

  In one embodiment of the present invention, the image processing apparatus may further include a first camera unit that is disposed adjacent to the first rail and senses an alignment state of the object to be polished held by the first gripper.

  In one embodiment of the present invention, a third rail that extends along the first direction but is parallel to the first rail, a fourth rail that extends along the second direction, and the third rail. A second transfer unit comprising: a rail and a second gripper that transfers the object to be polished along the fourth rail; a second object on which the object to be polished transferred by the second gripper is placed and fixed A second polishing unit disposed at a position corresponding to the second table unit and including at least one second spindle and movable to the second table unit to polish the object to be polished; May further be included.

  In one embodiment of the present invention, the second polishing unit is also arranged symmetrically with the first polishing unit with reference to a virtual extension line parallel to the first direction.

  In one embodiment of the present invention, the number of the second spindles corresponds to the number of the first spindles.

  In one embodiment of the present invention, when two or more fourth rails are provided, the fourth rails are also arranged in parallel to each other.

  In one embodiment of the present invention, the number of the second rails may be different from the number of the first table units.

  In one embodiment of the present invention, the first gripper may include a plurality of gripper portions so as to correspond to the plurality of first table units.

  In one embodiment of the present invention, the object to be polished is transferred in the first direction via the first rail, and then transferred in the second direction via the second rail. It descends in three directions and is also placed on the first table unit.

  Another embodiment of the present invention includes at least one first spindle and one or more first polishing units disposed along a first direction; disposed at a position corresponding to the first spindle, and an object to be polished. And a first rail extending along the first direction, and a second rail that moves along the first rail and intersects the first direction. A second rail that is extended, and a first rail that is connected to the second rail, moves along the first direction and the second direction, and carries the polishing object into / out of the first table unit. And a first transfer unit comprising a gripper.

  In one embodiment of the present invention, the first gripper is arranged on a path moving in a first direction, senses an alignment state of the polishing object held by the first gripper, and aligns the polishing object. A first camera unit that generates data may be further included.

  In one embodiment of the present invention, the apparatus may further include a first adjustment unit that is provided with the alignment data from the first camera unit and corrects the position of the object to be polished based on the alignment data. At this time, the first gripper can place the polishing object whose position has been corrected by the first adjustment unit on the first table unit.

  In an embodiment of the present invention, the first camera unit may be configured to perform distance adjustment in order to sense the alignment state of various sizes of polishing objects.

  Other aspects, features, and advantages other than those previously described will be apparent from the following drawings, claims, and detailed description of the invention.

  The polishing apparatus according to the present invention can efficiently transfer the object to be polished to a plurality of fixed table units by moving the gripper along the first rail and the second rail. Through this, the polishing apparatus according to the embodiment of the present invention can set an optimal movement path for carrying in and carrying out the object to be polished, and can improve the process efficiency. Also, the polishing apparatus according to the embodiment of the present invention can arrange a plurality of spindles in one polishing unit and process them at the same time, enabling mass production. Further, in the polishing apparatus according to the embodiment of the present invention, the fixed table unit on which the object to be polished is placed does not need to move to the side where the polishing unit is located. Therefore, the position of the object to be polished is changed during the movement. This makes it possible to perform more stable and accurate polishing.

1 is a plan view schematically illustrating a polishing apparatus according to an embodiment of the present invention. It is a conceptual diagram for demonstrating operation | movement of the grinding | polishing apparatus in the 1st area | region of FIG. It is a conceptual diagram for demonstrating operation | movement of the grinding | polishing apparatus in the 2nd area | region of FIG. FIG. 5 is a plan view schematically illustrating a polishing apparatus according to another embodiment of the present invention. FIG. 5 is a plan view schematically illustrating a polishing apparatus according to another embodiment of the present invention. FIG. 5 is a perspective view illustrating a polishing apparatus according to a second embodiment of the present invention. FIG. 7 is a plan view of the polishing apparatus of FIG. 6. It is the perspective view which extracted and illustrated the 1st transfer unit of FIG. FIG. 9 is a diagram illustrating the first gripper and the first adjustment unit extracted from FIG. 8. FIG. 8 is a diagram illustrating an extracted first camera unit of FIG. 7. 4 is a diagram illustrating a process in which a first gripper places a first polishing object and a second polishing object on a first table unit in order. 4 is a diagram illustrating a process in which a first gripper places a first polishing object and a second polishing object on a first table unit in order. 4 is a diagram illustrating a process in which a first gripper places a first polishing object and a second polishing object on a first table unit in order.

  Hereinafter, the following embodiments will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, the same or corresponding components are denoted by the same reference numerals, and The overlapping explanation is omitted.

  The present embodiment can be subjected to various transformations, and the specific embodiment is illustrated in the drawings and will be described in detail by the detailed description. The effects, features, and methods of achieving them according to the present embodiment will be clarified by referring to the details described later in conjunction with the drawings. However, the present embodiment is not limited to the embodiment disclosed below, and can be embodied in various forms.

  In the following embodiments, terms such as “first” and “second” are not limited, and are used for the purpose of distinguishing one component from other components.

  In the following embodiments, the singular forms include the plural forms unless the context clearly indicates otherwise.

  In the following embodiments, terms such as “comprising” or “having” mean that a feature or component described in the specification is present, and one or more other features or configurations It does not exclude the possibility of adding an element in advance.

  In the following embodiments, when a part, a region, a component, or the like is above or above another part, not only when it is directly above the other part, but also between the other unit, area, This includes cases where components are interposed.

  In the following embodiments, terms such as “couple” or “couple” do not necessarily imply a direct and / or fixed coupling or coupling of two members, unless the context clearly indicates otherwise. However, it is not excluded that another member is interposed between the two members.

  In the drawings, the size of components is exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component illustrated in the drawings are arbitrarily illustrated for convenience of description, and the following embodiments are not necessarily limited to the illustrated examples.

  FIG. 1 is a plan view schematically showing a polishing apparatus 10 according to a first embodiment of the present invention, and FIG. 2 is a concept for explaining the operation of the polishing apparatus 10 at a first position A1 in FIG. FIG. 3 is a conceptual diagram for explaining the operation of the polishing apparatus 10 at the second position A2 in FIG.

  1 to 3, the polishing apparatus 10 according to the first embodiment of the present invention may include a first polishing unit 110, a first table unit 120, and a first transfer unit 130.

  The first polishing unit 110 may include at least one first spindle 111. The first spindle 111 performs a function of polishing the object to be polished M, and a polishing tool for polishing the object to be polished M is attached to the end of the rotating shaft member. The first spindle 111 can rotate the above-described polishing tool to polish the object to be polished M. For example, the side surface of the object to be polished M can be polished. Alternatively, in FIG. 1, the first spindle 111 is an object to be polished such that one region of the object to be polished M before the polishing process is formed in a certain shape like the object to be polished M ′ after the polishing process. M can be polished.

  On the other hand, the first polishing unit 110 includes a plurality of first spindles 111, and the plurality of first spindles 111 are disposed on one body portion 112. The first polishing unit 110 may include two first spindles 111 as illustrated in FIG. 1, but the technical idea of the present invention is not limited thereto, and more than that. It goes without saying that the first spindle 111 can be provided. At this time, the plurality of first spindles 111 are also arranged in a row along the first direction below the first body part 112 described above, which matches the direction in which the first polishing units 110 are arranged. be able to.

  The first polishing unit 110 includes a first direction transfer unit (not shown) that moves the first body part 112 in the first direction, and a second direction transfer part (shown in the figure) that moves the first body part 112 in the second direction. And a third direction transfer part (not shown) for moving the first body part 112 in the third direction. The first direction transfer unit (not shown), the second direction transfer unit (not shown) and the third direction transfer unit (not shown) are respectively along the first direction, the second direction and the third direction, A motor, a hydraulic cylinder, a pneumatic cylinder, a linear actuator, or the like that can move the first body portion 112 is also used. Here, the first direction to the third direction are also directions perpendicular to each other. The first polishing unit 110 moves away from or closer to the first table unit 120 by moving in the second direction. In other words, the vertical distance between the first body unit 112 and the first table unit 120 is adjusted by a second direction transfer unit (not shown).

  The first polishing unit 110 uses a first direction transfer part (not shown) and a second direction transfer part (not shown) to move the first body part 112, thereby lowering the lower part of the first body part 112. The positions of one or more first spindles 111 arranged in a row can be adjusted at a time. When the first polishing unit 110 includes a plurality of first spindles 111 in one first body portion 112, the plurality of first polishing units 110 are mounted on the plurality of first table units 120 using the plurality of first spindles 111. Can be polished simultaneously. In addition, the first polishing unit 110 can control the movement of the plurality of first spindles 111 at a time by controlling the movement of the first body part 112, thereby improving the process efficiency.

  As another embodiment, the first polishing unit 110 may further include first position adjusting means (not shown) that can adjust the position of each of the plurality of first spindles 111. First position adjusting means (not shown) can independently adjust the vertical and horizontal movements of the first spindles 111.

  On the other hand, when a plurality of the first polishing units 110 are provided, they are also arranged in a line along the first direction. At this time, the plurality of first polishing units 110 are also arranged such that the first spindles 111 provided in the respective first polishing units 110 face the same direction. The plurality of first polishing units 110 are also arranged such that the zero point positions of the first spindles 111 are located on the same straight line.

  The first table unit 120 is disposed at a position corresponding to the first spindle 111, and the polishing object M is placed on the top. The first table unit 120 corresponds to the number of the first spindles 111, and the polishing object M is placed on each of the first table units 120. However, the technical idea of the present invention is not limited thereto, and as another embodiment, the first table unit 120 is provided to correspond to the number of the first polishing units 110, and the first table unit is provided. A plurality of placement areas on which the polishing object M is placed may be provided on 120. At this time, the number of placement areas provided in the first table unit 120 corresponds to the number of first spindles 111 provided in one first polishing unit 110.

  The first table unit 120 is a fixed unit, and a first gripper 133 (to be described later) moves to the first table unit 120 in order to load or unload the polishing object M. In order to polish the polishing object M, the first spindle 111 only moves to the first table unit 120, and the first table unit 120 does not move.

  Meanwhile, the first transfer unit 130 may include a first rail 131, a second rail 132, and a first gripper 133.

  The first rail 131 is also extended along the first direction. The first rail 131 is also arranged along the first polishing unit 110, and specifically, arranged so as to face the first spindle 111 along the arrangement direction of the plurality of first spindles 111.

  The second rail 132 is also provided between the first rail 131 and the first table unit 120. The second rail 132 extends in a second direction that intersects the first direction, and the second rail 132 extends in a direction perpendicular to the first rail 131 as illustrated. The number of the second rails 132 corresponds to the number of the first table units 120, and when two or more second rails 132 are provided, they are also arranged in parallel along the first direction.

  The above-described structure is an embodiment when the first table unit 120 corresponds to the number of the first spindles 111. As another embodiment, as described above, when the first table unit 120 is provided so as to correspond to the number of the first polishing units 110, the number of the second rails 132 is the same as that of the first table unit 120. This corresponds to the number of mounting areas provided. The second rail 132 extends from the first rail 131 to a position where the object to be polished M can be placed on the first table unit 120. The first gripper 133 moves along the first rail 131 and the second rail 132, and can convey / carry the polishing object M to / from the first table unit 120.

  The first gripper 133 holds the object to be polished M drawn into the polishing apparatus 10 and then moves it along the first rail 131 and the second rail 132 to convey the object to be polished M to the first table unit 120. Alternatively, after the polishing object M ′ having been polished is gripped, it can be moved along the second rail 132 and the first rail 131 and carried out of the first table unit 120. The first gripper 133 is provided as a single unit, and can perform both the transfer function and the carry-out function, or can include two transfer grippers and a carry-out gripper. Alternatively, a larger number of grippers can be provided. However, when two or more first grippers 133 are provided, the first grippers 133 move along the first rail 131 and the second rail 132 according to a preset program so as not to interfere with each other's movement. Can do.

  In still another embodiment, the second rail 132 may be extended from the first rail 131 to the first table unit 120. At this time, the number of second rails 132 does not correspond to the number of first table units 120 or the number of placement areas. For example, one second rail 132 is also provided to correspond to the two first table units 120. When one second rail 132 is provided between the two first table units 120, the first gripper 133 described later has two gripper portions so as to correspond to the two first table units 120 described above. (Not shown). The interval between the two gripper portions (not shown) corresponds to the interval between the two first table units 120. Through this, the first gripper 133 simultaneously grips the two objects to be polished M, moves them along the second rail 132, and transports / unloads the objects to be polished M to / from each of the first table units 120. can do.

  Referring to FIGS. 2 and 3, the first gripper 133 can lift or lower the polishing object M in a third direction that intersects both the first direction and the second direction. In other words, the first gripper 133 can hold the polishing object M and move it in the height direction relative to the ground. The first gripper 133 may further include a height adjustment unit 135, and the height adjustment unit 135 may be configured using a motor, a hydraulic cylinder, a pneumatic cylinder, a linear actuator, or the like.

  Meanwhile, the polishing apparatus 10 according to the first embodiment of the present invention may further include a first camera unit 140 and a first conveyor unit C1.

  The first camera unit 140 is disposed adjacent to the first rail 131 and can sense the alignment state of the polishing object M held by the first gripper 133. Specifically, as illustrated in FIGS. 1 and 2, the first gripper 133 can grip the polishing object M that is pulled in at the first position A1. Although the object to be polished M is pulled in at a position other than the first rail 131, the polishing apparatus 10 is moved to the first position A1 below the first rail 131 at the position pulled through the first conveyor unit C1. The polishing object M can be moved. Accordingly, the first position A1 is also a position where the first conveyor unit C1 and the first rail 131 intersect.

  The first camera unit 140 is located at the first position A1 where the polishing object M is gripped by the first gripper 133, and the alignment state of the polishing object M with the first gripper 133 can be confirmed. The first camera unit 140 is arranged symmetrically with respect to the first rail 131, and accurately senses the alignment state of the polishing object M by imaging the polishing object M held by the first gripper 133. can do.

  Meanwhile, the polishing apparatus 10 according to the first embodiment of the present invention may further include a second polishing unit 210, a second table unit 220, and a second transfer unit 230. Here, the second polishing unit 210, the second table unit 220, and the second transfer unit 230 have the same configuration as the first polishing unit 210, the first table unit 120, and the first transfer unit 130, respectively. Therefore, the duplicate description is omitted.

  The second polishing unit 210 includes a second body part 212 and at least one second spindle 211 arranged in the second body part 212, and is arranged in a line along the first direction. 110 is also arranged in parallel. The number of the second polishing units 210 is the same as the number of the first polishing units 110, but this is not necessarily the case. As an embodiment, the second polishing unit 210 is also arranged symmetrically with the first polishing unit 110 with reference to a virtual extension line L parallel to the first direction. Therefore, the second spindle 211 of the second polishing unit 210 and the first spindle 111 of the first polishing unit 110 are also arranged so as to face the outline with the virtual extension line L as the center. The number of second spindles 211 corresponds to the number of first spindles 111.

  The second table unit 220 is disposed at a position corresponding to the second spindle 211, and the polishing object M is placed thereon. Similar to the first table unit 120, the second table unit 220 is arranged to correspond to the number of second spindles 211 or the number of second polishing units 210.

  The second transfer unit 230 may include a third rail 231, a fourth rail 232, and a second gripper 233.

  The third rail 231 extends along the first direction, but is parallel to the first rail 131. The third rail 231 is arranged along the second polishing unit 210, and specifically, arranged so as to face the second spindle 211 along the arrangement direction of the plurality of second spindles 211.

  The fourth rail 232 is also provided between the third rail 231 and the second table unit 220. The fourth rail 232 extends in a second direction intersecting the first direction, and the fourth rail 232 extends in a direction perpendicular to the third rail 231 as illustrated. The number of the fourth rails 232 corresponds to the number of the second table units 220, and when two or more fourth rails 232 are provided, they are also arranged in parallel along the first direction.

  The second gripper 233 moves along the third rail 231 and the fourth rail 232, and can transport / carry the polishing object M to / from the second table unit 220. The second gripper 233 moves along the third rail 231 and the fourth rail 232 after gripping the polishing object M drawn into the polishing apparatus 10, and conveys the polishing object M to the second table unit 220. Alternatively, after the polishing object M ′ having been polished is gripped, it can be moved along the fourth rail 232 and the third rail 231 and carried out of the second table unit 220. Similar to the first gripper 133, the second gripper 233 can lift or lower the polishing object M in the third direction.

  In another exemplary embodiment, the fourth rail 232 may be extended from the third rail 231 to the second table unit 220. At this time, the number of fourth rails 232 does not correspond to the number of second table units 220 or the number of placement areas. For example, one fourth rail 232 is also provided to correspond to the two second table units 220. When one fourth rail 232 is provided between the two second table units 220, the second gripper 233 described later has two gripper portions so as to correspond to the two second table units 220 described above. (Not shown). The interval between the two gripper portions (not shown) corresponds to the interval between the two second table units 220. Through this, the second gripper 233 simultaneously grips the two objects to be polished M, moves them along the fourth rail 232, and conveys / unloads the objects to be polished M to / from each of the second table units 220. can do.

  In addition, the polishing apparatus 10 according to the first embodiment of the present invention may further include a second camera unit 240 and a second conveyor unit C2.

  The second camera unit 240 is disposed adjacent to the third rail 231 and can sense the alignment state of the object to be polished M held by the second gripper 233. The second camera unit 240 is also arranged symmetrically with the first camera unit 140 with the virtual extension line L as a reference. Therefore, the position where the second camera unit 240 is disposed is also a position where the second conveyor unit C2 and the third rail 231 intersect.

  The polishing apparatus 10 according to the first embodiment of the present invention having the above-described structure uses the first transfer unit 130 or the second transfer unit 230 as the polishing object M to be pulled in, and the first table unit 120 or the second table. It can be transferred to / from the unit 220. The unloaded polishing object M ′ is transferred to a predetermined area using the third conveyor unit C3 or the fourth conveyor unit C4 and then discharged to the outside.

  The polishing apparatus 10 according to the first embodiment is configured so that there are two polishing units 110 and 210 around the virtual extension line L, but the present invention is not limited thereto, It can also be constituted by one polishing unit (not shown). More specifically, one polishing unit is positioned between the first table unit 120 and the second table unit 220, and depending on the situation, the first table or the second table to which the one polishing unit is fixed, respectively. By moving toward the two tables and polishing the polishing object M, the polishing apparatus 10 can be operated more efficiently.

  4 and 5 are plan views schematically showing polishing apparatuses 10 'and 10 "according to another embodiment of the present invention.

  Referring to FIG. 4, a polishing apparatus 10 ′ according to another embodiment of the present invention includes the same components as the polishing apparatus 10 of FIG. 1, but unlike the polishing apparatus 10 of FIG. The second spindles 211 are also arranged so as to face each other around a virtual extension line. At this time, the first rail 131 and the third rail 231 are also arranged in parallel so as to pass between the first polishing unit 110 and the second polishing unit 210.

  Referring to FIG. 5, a polishing apparatus 10 ″ according to another embodiment of the present invention is different from the polishing apparatus 10 of FIG. 1 and the polishing apparatus 10 ′ of FIG. 210 is not symmetrically arranged, and is also arranged in a staggered manner. Through such a structure, the polishing apparatus 10 ″ of FIG. 5 does not include the third rail 231 and is arranged in the first direction. Only the extended first rail 131 may be provided between the first polishing unit 110 and the second polishing unit 210. At this time, the first rail 131 is also connected to the 2-1 rail 132-1 and the 2-2 rail 132-2 that extend in the second direction intersecting the first direction. Since the 2-1 rail 132-1 and the 2-2 rail 132-2 are extended from the first rail 131 toward the first spindle 111 and the second spindle 211, respectively, they are also extended in directions opposite to each other. . Further, the 2-1 rail 132-1 and the 2-2 rail 132-2 are alternately arranged along the first rail 131.

  FIG. 6 is a perspective view illustrating a polishing apparatus 20 according to a second embodiment of the present invention, and FIG. 7 is a plan view of the polishing apparatus 20 of FIG. FIG. 8 is a perspective view illustrating the first transfer unit 130 of FIG. FIG. 9 is an excerpt of the first gripper 133 and the first adjustment unit 150 of FIG. 8, and FIG. 10 is an excerpt of the first camera unit 140 of FIG.

  Referring to FIGS. 6 to 8, the polishing apparatus 20 according to the second embodiment of the present invention has the same technical idea as the polishing apparatus 10 according to the first embodiment. The polishing objects M1 and M2 are grasped at the same time and carried in or out.

  The polishing apparatus 20 according to the second embodiment of the present invention includes a first polishing unit 110, a first table unit 120 (FIG. 11B), a first transfer unit 130, a first camera unit 140, and a first adjustment unit 150 (FIG. 9). May be included. Further, the polishing apparatus 20 according to the second embodiment is similar to the first embodiment in that the second polishing unit 210, the second table unit 220, the second transfer unit 230, and the second are arranged symmetrically with the above-described configuration. A camera unit 240 and a second adjustment unit (not shown) may be further included. In the following, for convenience of explanation, the same components are denoted by the same reference numerals, and the first transfer unit 130 will be mainly described, but the duplicate description is omitted.

  The first polishing unit 110 may include at least two first spindles 111. The first spindle 111 performs a function of polishing the object to be polished M, and a polishing tool for polishing the object to be polished M is attached to the end of the rotating shaft member. The first spindle 111 can rotate the above-described polishing tool to polish the object to be polished M. For example, the side surface of the object to be polished M can be polished. Alternatively, in FIG. 7, the first spindle 111 is a polishing target body such that one region of the polishing target body M before polishing processing is formed in a certain shape like the polishing target body M ′ after polishing processing. M can be polished.

  In one embodiment, the first polishing unit 110 includes two first spindles 111 and is also disposed on one body portion 112. The first polishing unit 110 uses a first direction transfer unit (not shown) and a second direction transfer unit (not shown) connected to the first body part 112, and the two first spindles 111 are connected to each other. The position can be controlled at once. The first polishing unit 110 may further include first position adjusting means (not shown) that can adjust the positions of the two first spindles 111. The first position adjusting means (not shown) can independently adjust the vertical and horizontal movements of the first spindles 111.

  The number of first table units 120 (FIG. 11B) is also provided in a number corresponding to the number of first spindles 111 of the first polishing unit 110. As described above, since the first polishing unit 110 according to the second embodiment includes the two first spindles 111, the first table unit 120 is also included in two. The first table unit 120 is disposed at a position corresponding to the first spindle 111, and the polishing object M is placed on the top thereof. More specifically, the first polishing object M1 and the second polishing object M2 are placed. Are also placed on the tops of the two first table units 120, respectively.

  Meanwhile, the first transfer unit 130 may include a first rail 131, a second rail 132, and a first gripper 133. As in the polishing apparatus 10 of the first embodiment, the first transfer unit 130 includes a first rail 131 that extends in the first direction, a second rail 132 that extends in a direction perpendicular to the first rail 131, Can be provided. At this time, in the first embodiment, the case where the second rails 132 are provided so that the number of the second rails 132 corresponds to the number of the first table units 120 has been mainly described. In the explanation, a case where one second rail 132 is connected between the first gripper 133 and the first rail 131 and the first gripper 133 is moved in the first direction or the second direction will be mainly described.

  The first rail 131 is also extended along the first direction. The first rail 131 is arranged along the arrangement direction of the first polishing unit 110, and specifically, arranged so as to face the first spindle 111 along the arrangement direction of the plurality of first spindles 111. The

  The first gripper 133 holds the first polishing object M1 and the second polishing object M2 drawn through the loading unit 300 of the polishing apparatus 10 at the same time, and then moves the first gripper 133 along the first rail 131. The polishing object M1 and the second polishing object M2 can be transported to the first table unit 120. The first gripper 133 includes a first gripping portion 1331 and a second gripping portion 1332 that are arranged symmetrically with respect to the first direction with respect to the second rail 132, and each of the first gripper 133 and the first polishing object M1. 2 The object M2 to be polished can be gripped. In one embodiment, the first gripper 133 is connected to the first rail 131 with the second rail 132 interposed therebetween. At this time, the second rail 132 is also extended in a second direction that intersects the first direction in which the first rail 131 is extended.

  Specifically, as shown in FIG. 8, the second rail 132 is connected to the first rail 131 on one side and moves along a first direction guided by the first rail 131. Can do. At this time, the second rail 132 is also connected to the other side facing the one side so that the first gripper 133 is movable in the second direction. The first gripper 133 can be moved together in the first direction by moving the second rail 132 along the first rail 131, and can also move in the second direction along the second rail 132.

  Meanwhile, the first rail 131 extends to the first length along the first direction so that the first gripper 133 conveys the objects to be polished M1 and M2 to the plurality of first polishing units 110 arranged. Is done. The second rail 132 is also extended to the second length along the second direction so that the first gripper 133 moved along the first rail 131 moves to the first table unit 120. As an embodiment, the first transfer unit 130 uses the first gripper 133 described above and has a function of carrying out the polishing objects M1 and M2 that have been polished as well as a function of conveying the polishing objects M1 and M2. Can be carried out. However, the present invention is not limited thereto, and as another embodiment, the first transfer unit 130 may further include a first transport gripper 137, which can perform carry-in and carry-out separately.

  Specifically, the first transport gripper 137 is connected to the first rail 131 and can move in the first direction along the first rail 131, similarly to the first gripper 133. At this time, the first transport gripper 137 is connected to the first rail 131 with the sixth rail 136 interposed therebetween. Similar to the second rail 132, the sixth rail 136 can perform a function of guiding the first transport gripper 137 to move along the second direction.

  The first transport gripper 137 includes a first transport grip portion 1371 and a second transport grip portion 1372 that are arranged symmetrically with respect to the first direction with respect to the sixth rail 136, and the first transport gripper 137 has been polished. The object to be polished M1 and the second object to be polished M2 can be held simultaneously. The first transport gripper 137 moves to the first table unit 120, grips the first polishing object M1 and the second polishing object M2 that have been polished, and then moves along the sixth rail 136 in the second direction. After being moved to, it stops near the first rail 131. Thereafter, the first polishing target body M1 and the second polishing target body M2 are moved outside along the first rail 131 via the unloading unit 400.

  Referring to FIG. 9, the first gripper 133 is connected to the second rail 132, but in a third direction that intersects both the first direction and the second direction via the height adjustment unit 135. The first polishing object M1 and the second polishing object M2 can be lifted or lowered. In other words, the first gripper 133 can hold the first polishing object M1 and the second polishing object M2 and move them in the height direction with respect to the ground.

  At this time, the first adjustment unit 150 is connected to the first gripper 133 and can rotate the first gripper 133 with respect to the first rotation axis AX1 parallel to the third direction. Specifically, the first adjustment unit 150 is disposed between the first gripping portion 1331 and the second gripping portion 1332, and is rotated between the first gripping portion 1331 and the second gripping portion by the rotational movement with respect to the first rotation axis AX1. 1332 can be rotated simultaneously.

  Referring to FIGS. 7 and 10, the first camera unit 140 is in a moving path in which the first gripper 133 moves after holding the first polishing object M1 and the second polishing object M2. Also arranged. The first camera unit 140 may detect an alignment state between the first polishing object M1 and the second polishing object M2 held by the first gripper 133, and generate first alignment data and second alignment data. it can. The pair of cameras constituting the first camera unit 140 is also configured to be adjusted in position according to the size of the object to be polished.

  Specifically, as shown in FIG. 10, the first camera unit 140 includes a pair that is symmetrically provided along the first direction, and includes a first polishing object M1 and a second polishing object. The degree to which the body M2 is displaced along the first direction and the second direction can be generated as the first alignment data and the second alignment data. The first camera unit 140 may provide the first alignment data and the second alignment data thus generated to the first adjustment unit 150. Thereafter, the first adjustment unit 150 corrects the deviation between the first polishing object M1 and the second polishing object M2 through the provided data, and places each polishing object on the first table unit 120. Can be placed.

  In the following, referring to the drawings, the first camera unit 140 and the first adjustment unit 150 are used, and the first gripper 133 moves the first polishing object M1 and the second polishing object M2 to the first table unit 120. A method of aligning will be described.

  FIGS. 11A to 11C are diagrams illustrating a process in which the first gripper 133 places the first polishing object M1 and the second polishing object M2 on the first table unit 120 in order.

  Referring to FIG. 11A, the first gripper 133 can hold the first polishing object M1 and the second polishing object M2 using the first holding part 1331 and the second holding part 1332, respectively. At this time, it is most ideal to hold the first polishing object M1 and the second polishing object M2 so that they are aligned so that they are immediately placed on the first table unit 120.

  However, in the actual gripping process, the first polishing object M1 and the second polishing object M2 are gripped even if they are misaligned. In the process, there is a problem of generation of process errors. Therefore, in order to minimize such a process error, the polishing apparatus 20 uses the first camera unit 140 to connect the first polishing object M1 moving in the first direction and the second polishing object M2. Measure alignment. As described above, the first camera unit 140 is disposed symmetrically along the first direction, sequentially measures the degree of deviation between the first polishing object M1 and the second polishing object M2, and determines the degree of deviation. The first alignment data and the second alignment data can be generated.

  Referring to FIG. 11B, the first gripper 133 can move onto the first table unit 120 via the first rail 131 and the second rail 132. At this time, the first adjustment unit 150 is provided in advance with the first alignment data and the second alignment data from the first camera unit 140. First, the first alignment data is used to determine the position of the first polishing object M1. It can be corrected (P1 → P1 ′). In other words, the first adjustment unit 150 is arranged on the first gripper 133 so that the first polishing object M1 is also placed on the first table unit 120 at the alignment position P1 ′ aligned from the shifted initial position P1. Can be rotated. In addition, the first gripper 133 can adjust the position by translational movement in the first direction or the second direction, if necessary, in the above-described process.

  Referring to FIG. 11C, the first gripper 133 places the second polishing object M2 through the same alignment process after placing the first polishing object M1 on the first table unit 120. Can do. In other words, the first adjustment unit 150 can correct the position of the second polishing object M2 using the second alignment data provided from the first camera unit 140 (P2 → P2 '). That is, the first adjustment unit 150 is configured so that the first polishing unit M2 is placed on the first table unit 120 at the alignment position P2 ′ aligned from the shifted initial position P2. Can be rotated. In addition, the first gripper 133 can adjust the position by translational movement in the first direction or the second direction, if necessary, in the above-described process.

  As described above, the polishing apparatus according to the embodiment of the present invention efficiently transfers the object to be polished to the plurality of fixed table units by moving the gripper along the first rail and the second rail. Can be made. Through this, the polishing apparatus according to the embodiment of the present invention can set the optimum movement path for carrying in and carrying out the object to be polished, and can improve the process efficiency. Also, the polishing apparatus according to the embodiment of the present invention can arrange a plurality of spindles in one polishing unit and process them at the same time, enabling mass production.

  In addition, the polishing apparatus according to the embodiment of the present invention can correct the shifted polishing object through the first adjustment unit in the process of gripping the gripper, and then place the polishing object on the first table unit. A polishing process can be implemented. Also, it is not necessary to configure a camera unit for measuring the degree of deviation of the polishing object for each of the plurality of fixed tables, so that one camera unit is constructed and the degree of deviation of the object to be polished is measured and corrected. And cost savings.

  As such, the present invention has been described with reference to an embodiment illustrated in the drawings, which are merely exemplary and various modifications will occur to those of ordinary skill in the art. It will be understood that variations of the embodiments are possible. Therefore, the true technical protection scope of the present invention is determined by the technical idea of the claims.

  The polishing apparatus of the present invention can be effectively applied to, for example, technical fields related to substrate manufacturing.

DESCRIPTION OF SYMBOLS 10 Polishing apparatus 110 1st grinding | polishing unit 111 Spindle 112 Body part 120 Table unit 130 1st transfer unit 131 1st rail 132 2nd rail 133 1st gripper 140 1st camera unit 150 1st adjustment unit

Claims (14)

A first rail extended along a first direction, a second rail extended along a second direction intersecting the first direction, and an object to be polished along the first rail and the second rail A first gripper for transferring
A first table unit on which a polishing object transferred by the first gripper is placed and fixed;
A first polishing unit disposed at a position corresponding to the first table unit, including at least one first spindle, and movable to the first table unit to polish the object to be polished. apparatus.   The polishing apparatus according to claim 1, wherein when two or more second rails are provided, the second rails are arranged in parallel to each other.   The polishing apparatus according to claim 1, wherein the first gripper lifts or lowers the object to be polished in a third direction intersecting the first direction and the second direction.   2. The polishing apparatus according to claim 1, further comprising a first camera unit that is disposed adjacent to the first rail and senses an alignment state of the object to be polished held by the first gripper. . A third rail extending along the first direction but parallel to the first rail, a fourth rail extending along the second direction, and along the third rail and the fourth rail. A second gripper for transferring the object to be polished, and a second transfer unit comprising:
A second table unit on which the object to be polished transferred by the second gripper is placed and fixed;
A second polishing unit that is disposed at a position corresponding to the second table unit, includes at least one second spindle, and is movable to the second table unit to polish the object to be polished; The polishing apparatus according to claim 1.   The polishing apparatus according to claim 5, wherein the second polishing unit is disposed symmetrically with the first polishing unit with reference to a virtual extension line parallel to the first direction.   The polishing apparatus according to claim 5, wherein the first polishing unit and the second polishing unit are the same polishing unit.   The polishing apparatus according to claim 4, wherein the position of the first camera unit can be adjusted according to a size of an object to be polished.   The polishing apparatus according to claim 1, wherein the number of the second rails is different from the number of the first table units.   The polishing apparatus according to claim 9, wherein the first gripper includes a plurality of gripper portions so as to correspond to the plurality of first table units.   The object to be polished is transferred in the first direction via the first rail, then transferred in the second direction via the second rail, and lowered in the third direction. The polishing apparatus according to claim 3, wherein the polishing apparatus is placed on one table unit. One or more first polishing units including at least one first spindle and disposed along a first direction;
One or more first table units disposed at positions corresponding to the first polishing unit and on which a polishing object is placed;
A first rail extending along the first direction, a second rail moving along the first rail and extending in a second direction intersecting the first direction, and connected to the second rail The first gripper moves in the first direction by the movement of the second rail, or moves in the second direction along the second rail, and conveys the object to be polished to the first table unit. And a first transfer unit.   A first camera that is arranged on a path that moves in the first direction, senses an alignment state of the polishing object held by the first gripper, and generates alignment data of the polishing object The polishing apparatus according to claim 12, further comprising a unit. A first adjustment unit which is provided with the alignment data from the first camera unit and corrects the position of the object to be polished based on the alignment data;
The polishing apparatus according to claim 13, wherein the first gripper places the polishing object whose position is corrected by the first adjustment unit on the first table unit.