TWI420621B - Die package structure and the fabricating method thereof - Google Patents

Description

Die package structure and manufacturing method thereof

The invention of the present invention is a packaging technology for preventing the center position of the heat sink from collapsing due to its own weight, thereby causing the flow of the sealant to be blocked in the package body.

Aiming at the function and longevity of semiconductor components, whether it can effectively dissipate heat is a very important factor. From conventional heat sinks to heat sinks, heat sinks are a very important technical feature in packaging technology. . In practice, the current heat dissipation problem is still a challenge of packaging technology. It is conceivable that more and more transistors should be installed in a small area, which makes semiconductor components hotter and hotter. With the improvement of packaging technology, the waste heat can be effectively eliminated, and the semiconductor components can operate more efficiently, save more power and have a longer service life. However, when the heat sink is added, the weight of the heat sink itself is also easy to occur. The collapse occurs at the center position, causing the sealant to form an obstacle in the flow process, even if the collapse deformation is too large to contact the grain or gold wire, causing the collapse of the entire structure.

In view of this, the inventor of the present invention developed a support unit to support the heat sink during the packaging process, such as fixing the support object by dispensing in the defect, or selecting a fixed support position, thereby increasing the support point and strengthening the support. The problem of the internal heat sink collapse due to its own weight.

The object of the invention is to solve the problem that the heat sink is collapsed due to its own weight during the packaging process.

In order to effectively achieve the above object, the present invention is a die package structure comprising: a substrate; a plurality of die disposed on an upper surface of the substrate; a molding material for covering the substrate a plurality of dies and the upper surface; a heat sink covering the molding material; and a supporting unit between the substrate and the heat sink, and the plurality of adjacent ones Between the grains, to prevent the surface of the heat sink from collapsing.

Preferably, the supporting unit and the heat sink are made of the same material.

Preferably, the supporting unit and the heat sink are integrally formed.

Preferably, the supporting unit is placed against the center of the substrate to support the heat sink.

Preferably, the supporting unit is a virtual wafer disposed at a center of the upper surface of the substrate to support the heat sink.

Preferably, the width of the supporting unit is about one-half of the distance between the crystal grains and the crystal grains.

Preferably, the maximum allowable distance of the central surface collapse of the heat sink is the height of the die.

Preferably, the material of the heat sink is made of aluminum, copper or other high conductivity material.

The invention is a die package structure comprising: a substrate; a plurality of die disposed on an upper surface of the substrate; a molding material covering the plurality of crystal grains and Above the upper surface; and a heat sink having a concave structure covering the molding material, the concave structure The substrate is held to prevent the surface of the heat sink from collapsing.

Preferably, the bottom end of the concave structure is a plane for abutting against the substrate. Preferably, the material of the heat sink is made of aluminum, copper or other high conductivity material.

The invention further provides a method for fabricating a die package structure, comprising: (a) providing a substrate having an upper surface having a plurality of die regions thereon; and (b) respectively providing a plurality of die regions a die region; (c) electrically connecting the die to the substrate piece; (d) fixing a heat sink having a support unit to the substrate piece; (e) filling a molding material on the substrate piece and Between the heat sinks, the die is coated to form a package; and (f) the package and the heat sink are cut to form an individual die package structure.

The invention provides a method for fabricating another die package structure, comprising: (a) providing a substrate sheet having an upper surface having a plurality of die regions thereon; (b) separately providing a plurality of die regions (c) electrically connecting the dies to the substrate; (d) fixing a support unit to the substrate; (e) fixing a heat sink to the substrate and the support (f) filling a molding material between the substrate sheet and the heat sink, coating the crystal grains to form a package; and (g) cutting the package and the heat sink to obtain individual Die package construction.

While the present invention may be embodied in various forms, the foregoing and other aspects of the present invention, the features and advantages of the present invention will be apparent from the accompanying drawings.

Please refer to the first figure, which is a schematic cross-sectional view of the first embodiment of the present invention. As shown in the figure, a chip package structure having a supporting heat sink according to the present invention is first provided with a plurality of crystal grains 14 in a wafer region on the upper surface 15 of the substrate 10, and then a wafer 11 is disposed above the substrate 10 and the crystal grains 14. The heat sink 12 is supported, and a molding material 13 is filled between the substrate 10 and the heat sink 12 to cover the crystal grains 14 to form a package.

Please refer to the second figure, which is a schematic cross-sectional view of a second embodiment of the present invention. As shown in the figure, a die package structure having a supporting heat sink according to the present invention is first provided with a plurality of crystal grains 24 in a wafer region on the upper surface 25 of the substrate 20, and then disposed above the substrate 20 and the die 24. The heat sink 22 of the concave structure 21, wherein the concave structure 21 and the heat sink 22 can be integrally formed. Finally, a molding material 23 is filled between the substrate 20 and the heat sink 22 to cover the crystal grains 24 to form a package. body.

Please refer to the third figure, which is a schematic cross-sectional view of a third embodiment of the present invention. As shown in the figure, a chip package structure having a supporting heat sink according to the present invention is first provided with a plurality of crystal grains 34 in a wafer region of the upper surface 35 of the substrate 30, and then a support unit is disposed above the substrate 30 and the die 34. The heat sink 32 of the 31 is further filled with a molding material 33 between the substrate 30 and the heat sink 32 to cover the crystal grains 34 to form a package.

A method of fabricating a die package structure according to an embodiment of the present invention is described in detail below with reference to the fourth and fifth figures. The fourth figure shows a substrate strip 100 and a heat sink 120 used in the above manufacturing method. The heat sink 120 can be made of aluminum, copper or other materials having a high conductivity. The substrate sheet 100 includes a plurality of arrayed die regions 102, and a plurality of sawing streets 104 are disposed between the plurality of die regions 102. As shown in the fourth figure, the die areas 102 are arranged in a 20 x 4 matrix suitable for mass production, and the dicing streets 104 form square lattices on the substrate sheets. Each of the die regions 102 of the substrate sheet 100 includes at least two sets of pads (not shown) disposed on the upper surface and the lower surface thereof, wherein the first set of pads are electrically connected to a crystal The second set of pads is electrically connected to an external printed circuit board and electrically connected to the first set of pads corresponding to the upper surface of the substrate piece 100, respectively. The substrate sheet 100 may be formed of a glass fiber reinforced BT (bismaleimide-triazine) resin or a core layer made of FR-4 fiberglass reinforced epoxy resin. In addition, the substrate sheet 100 may also be an aluminum ceramic substrate or a roll. Tape substrate.

Referring to FIG. 5, each of the dies 130 may be attached to the die region 102 of the substrate sheet 100 by an adhesive layer such as silver paste (not shown). Then, each of the dies can be electrically connected to the first set of pads of each of the die regions 102 by a plurality of connecting wires (such as gold wires) (not shown). In addition, each of the dies may be electrically connected to the first set of pads of each of the die regions 102 by flip chip bonding. After a supporting unit 140 (for example, a rigid body (for example, a dummy die)) is fixed on the substrate sheet 100 by using a glue layer 150, the heat sink 120 is fixed to the substrate sheet 100 and the supporting unit 140. on. In the present embodiment, the support unit 140 can support the heat sink 120 to prevent it from collapsing at a central position. The support unit 140 is preferably disposed at a substantially central position on the substrate sheet 100. In order to meet the requirements of mass production, a molding material 160 is generally used to fill the molding material 160 between the substrate sheet 100 and the heat sink 120, so that the molding material 160 is coated. The dies 130 form a package. Finally, the entire packaging process is completed by cutting into a single singulation step. In detail, the step of cutting into a single step is generally performed by using a cutter such as a resin-bond saw blade along the predetermined cutting path 104 (see FIG. 4). The molded product (comprising the aforementioned package and heat sink 120) is cut into individual units to produce the final product (i.e., individual die package configurations).

A method of fabricating a plurality of die package structures in accordance with another embodiment of the present invention is described in detail below with reference to the sixth and seventh figures. After each die 130 is attached and electrically connected to the substrate sheet 100, the heat sink 122 having a supporting unit is fixed to the substrate sheet 100. The support unit may be a concave structure 122a (see FIG. 6) integrally formed with the heat sink, which may be formed by stamping or etching. Further, the supporting unit may be a protrusion 122b integrally formed with the heat sink (see the seventh drawing). In the present embodiment, the concave structure 122a or the protruding portion 122b is fixed to the substrate sheet 100 by a glue layer 150, whereby the heat sink 122 can be supported to avoid collapse at the center position. The concave structure 122a or the protruding portion 122b is preferably disposed at a substantially central position on the heat sink 100. Then, the die 130 is covered with a molding material 160 to form a package. Finally, the entire packaging process is completed by cutting into a single singulation step.

While the present invention has been described in its preferred embodiments, it is not intended to limit the scope of the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧Substrate

11‧‧‧Dummy die

12‧‧‧Heat Sinks block

13‧‧‧plastic material (compound)

14‧‧‧die

15‧‧‧Upper surface

20‧‧‧substrate

21‧‧‧ concave structure

22‧‧‧Heat Sinks block

23‧‧‧plastic materials (compound)

24‧‧‧die

25‧‧‧ upper surface

30‧‧‧substrate

31‧‧‧Support unit

32‧‧‧Heat Sinks block

33‧‧‧plastic materials (compound)

34‧‧‧die

35‧‧‧ upper surface

100‧‧‧Substrate film

102‧‧ ‧ grain area

104‧‧‧Cut Road

120‧‧‧ Heat sink

122‧‧‧ Heat sink

122a‧‧‧ concave structure

122b‧‧‧Protruding

130‧‧‧ grain

140‧‧‧Support unit

150‧‧‧ glue layer

160‧‧‧plastic materials

The first figure is a schematic cross-sectional view of a first embodiment of the invention.

The second drawing is a schematic cross-sectional view of a second embodiment of the invention.

The third drawing is a schematic cross-sectional view of a third embodiment of the invention.

The fourth and fifth figures are for explaining a method of fabricating a plurality of die package structures in accordance with an embodiment of the present invention.

6 and 7 are diagrams for explaining a method of fabricating a plurality of die package structures in accordance with another embodiment of the present invention.

10‧‧‧Substrate

11‧‧‧Dummy Die

12‧‧‧ Heat sink (HS block: Heat Sink block)

13‧‧‧plastic material (compound)

14‧‧‧Grain (Die)

15‧‧‧Upper surface

Claims (21)

A die package structure comprising: a substrate; a plurality of die disposed on an upper surface of the substrate; a molding material covering the plurality of crystal grains and the upper surface a heat sink is disposed over the molding material; and a supporting unit is disposed between the substrate and the heat sink and located between the two adjacent ones of the plurality of crystal grains to prevent the heat dissipation The center of the surface of the sheet collapses. The die package structure of claim 1, wherein the support unit and the heat sink are made of the same material. The die package structure of claim 1, wherein the support unit and the heat sink are integrally formed. The die package structure of claim 1, wherein the support unit is located at a center of the substrate to support the heat sink. The die package structure of claim 1, wherein the support unit is a dummy wafer disposed at a center of the upper surface of the substrate to support the heat sink. The die package structure of claim 1, wherein the support unit has a width of about one-half the distance between the die and the die. The die package structure of claim 1, wherein the heat sink is made of aluminum, copper or other high conductivity material. A die package structure comprising: a substrate; a plurality of die disposed on an upper surface of the substrate; a molding material covering the plurality of crystal grains and the upper surface And a heat sink having a concave structure covering the molding material; the concave structure being located between the two adjacent ones of the plurality of crystal grains and contacting the substrate to prevent the surface of the heat sink Collapse. The die package structure of claim 8, wherein the bottom end of the concave structure is a plane that abuts the substrate. A method for fabricating a die package structure, comprising: (a) providing a substrate having an upper surface having a plurality of die regions thereon; (b) respectively providing a plurality of crystal grains in the die region; c) electrically connecting the dies to the substrate sheet; (d) fixing a heat sink having a supporting unit to the substrate sheet, and the supporting unit is located between the two adjacent ones of the plurality of dies; (e) filling a molding material between the substrate sheet and the heat sink, coating the crystal grains to form a package; and (f) cutting the package and the heat sink to obtain an individual die package structure. The method for manufacturing a die package structure according to claim 10, wherein the support unit of the heat sink is fixed to the substrate piece by a glue layer. The method of manufacturing a die package structure according to claim 10, wherein the support unit is a protrusion integrally formed with the heat sink. The method of manufacturing a die package structure according to claim 10, wherein the support unit is a concave structure integrally formed with the heat sink. The method of manufacturing a die package structure according to claim 13, wherein the concave structure is formed by press forming. The method of fabricating a die package structure according to claim 13, wherein the concave structure is formed by etching. A method for fabricating a die package structure, comprising: (a) providing a substrate sheet having an upper surface having a plurality of die regions thereon; (b) respectively providing a plurality of die regions in the plurality of die regions (c) electrically connecting the dies to the substrate sheet; (d) fixing a support unit to the substrate piece, and the support unit is located between the two adjacent ones of the plurality of dies; (e) Fixing a heat sink on the substrate piece and the supporting unit; (f) filling a molding material between the substrate piece and the heat sink, coating the crystal grains to form a package; and (g) cutting The package and the heat sink form an individual die package structure. The method for manufacturing a die package structure according to claim 16, wherein the support unit is fixed to the substrate piece by a glue layer. The method of manufacturing a die package structure according to claim 16, wherein the heat sink is fixed to the support unit by a glue layer. The method of manufacturing a die package structure according to claim 16, wherein the support unit is a rigid body. The method of fabricating a die package structure according to claim 16, wherein the rigid system is a dummy die. The method of manufacturing a die package structure according to claim 16, wherein the support unit is disposed substantially at a center of the heat sink.