TW200903744A - Die package structure and the fabricating method thereof - Google Patents

Abstract

The present invention discloses a die package structure, it comprises: a substrate; plural dies, said plural dies set upon a upper surface of said substrate; an encapsulant used to cover said plural dies and said upper surface; a heat spreader disposed over said encapsulant; and a supporting unit located between said substrate and said heat spreader to prevent said heat spreader from collapse.

Description

200903744 IX. Description of the invention: [Technical field to which the invention belongs] The invention of the present invention is a kind of prevention of heat dissipation, and enters the company to _ in the seal of the secret [previous technology] the operation of the body components and the life, is no heat sink There is a heat-dissipating 7 towel in front of it - the most important skill (four). _ The hotter, the hotter is also the coffee = the = half = the piece is getting r::=r efficiency == quantity, easy to produce the collapse of the piece itself in the center position = to the extent of collapse if the deformation is too large __ grain or ; Line::= In view of this, the inventor of the present invention developed a point-filling method to fill the Zina part at the point of the packaging process: or she eats its supporting heat sink [invention]

P070005-TW ASEI898 200903744 = The purpose of the invention was to solve the problem of heat sinking that collapsed into the center surface during the packaging process. The body is heavy on the upper surface of the summer..._Materials===Substrate-on: One thing&: is located between the edge substrate and the heat sink to prevent the heat sink: Table: better collapser' where the support unit It is made of the same material as the heat sink. The material element and the heat sink are in a body-forming structure. The person, the towel and the money unit are preferably the heat sink, and the center of the support unit supports the heat sink. a dummy sheet placed on the upper surface of the substrate, wherein the width of the tangent unit is approximately the distance between the crystal grain and the crystal grain, wherein the maximum allowable distance of the central surface of the heat sink collapses is the heat release of the crystal The material of the film is Ming, copper or other high-conductivity = system-type grain package structure, including: - substrate; the number of turns (a) is set on the upper surface of the substrate; a molding compound for covering the plurality of crystal grains and the upper surface; and a heat sink of a concave structure covering the molding material, the concave structure resisting

P070005-TW ASBJ898 200903744 The substrate is placed to prevent the surface of the scatter from collapsing. The bottom end of the = structure is a flat surface against the substrate. ~ Lai's material f is secret, and other high material coefficients are shells. (10) The present invention further provides a method for manufacturing a grain package structure, comprising: (3^ a plate having an upper surface having a plurality of grain regions thereon; (8) a plurality of grains in the grain regions; (8) electrically connecting the dies to the substrate sheet; _ having a fulcrum element--distributing (4) on the substrate sheet, and (8) filling an encapsulating material between the substrate sheet and the heat sink, covering the substrate a die-forming package; and a (c) difficult-to-package; an individual die-package structure is produced. The invention provides a method for manufacturing another seed crystal, including: (8) Substrate>;'--the upper surface, which has a plurality of crystal grains disposed thereon, and a plurality of (4) grains are disposed in the _grain region; (6) electrically connecting the secret crystal grains to the substrate sheet" (d) Connected to the substrate piece; (4) a heat sink is fixed on the substrate piece and the supporting unit; _ charging material between the substrate piece and the scatter, covering the die-forming package; In order to cut the package and the dispersion (four), a day-to-day solar package structure is obtained.

P070005-TW ASE1898 7 200903744 [Embodiment] Although the invention may be embodied in different forms, the foregoing and other technical contents, features and effects of the present invention are in accordance with the possible and preferred embodiments of the following reference drawings. In the detailed description, it will be clearly presented. Referring to the first figure, the figure is a schematic cross-sectional view of the first embodiment of the present invention. As shown in the figure, a chip package structure having a supporting heat sink according to the present invention is first provided with a plurality of crystal grains 14' in a wafer region on the upper surface 15 of the substrate 10, and then a dummy wafer 11 is disposed above the substrate 10 and the crystal grains 14. The heat sink 12 is supported, and a molding material 13 is filled between the substrate 10 and the heat sink 12 to cover the crystal grains 14 to form a package. Referring to the second figure, the figure is a schematic cross-sectional view of a second embodiment of the present invention. As shown in the figure, a die package structure having a supporting heat sink according to the present invention is first provided with a plurality of crystal grains 24 in a wafer region on the upper surface 25 of the substrate 20, and then disposed above the substrate 20 and the die 24. The heat sink 22 of the concave structure 21, wherein the concave structure 21 and the heat sink 22 can be integrally formed. Finally, a molding material 23 is filled between the substrate 20 and the heat sink 22 to cover the crystal grains 24 to form a package. body.

P070005-TW ASE1898 200903744 Please refer to the third figure, which is not intended to be a cross-section of the third embodiment of the present invention. It can be seen from the figure that ^ ^ μ ^ a μ ^ is a solar-encapsulated structure with a supporting effect of the invention. The first game « " ^ 1 has no surface area on the upper surface 35 of the substrate 30. A plurality of crystal grains 34, the inscription $, _ ^ < and then a t ^ <<<>> thermal sheet 32 having the building unit 31 above the substrate 30 and the die 34, and further between the substrate 30 and the heat sink 32 A plastic sheet 33 is filled to cover the crystal grains 34 to form a package. A method for fabricating a die package structure according to an embodiment of the present invention is described in detail below. The fourth figure shows the substrate used in the above manufacturing method as sub-gates 1Q() and heat sink 12A. The heat sink 12 〇 can be used, thieves and other high-material materials _ into. The substrate sheet (10) comprises a plurality of array rows of grain regions 1Q2, and a plurality of slabs are arranged between the plurality of grain regions (10). As shown in the fourth figure, the substrates are arranged. The grain region 1G2 is arranged in a matrix suitable for mass production of 2〇χ4, and the dicing streets 1〇4 form a square lattice on the substrate sheet. The per-grain region 1G2 of the substrate sheet 1 至少 includes at least two sets of Pads (not shown) are respectively disposed on the upper surface and the lower surface thereof, wherein the first set of pads is electrically connected to a die and the second set of pads is electrically connected to an external print The circuit board is electrically connected to the corresponding pads of the upper surface of the substrate sheet 100. The substrate sheet 100 may be made of glass fiber reinforced 'bismaleimide-triazine resin, or FR-4 glass fiber reinforced epoxy resin. Formed by a fiberglass reinforced epoxy resin. The substrate sheet 100 may also be a sauerium substrate or a roll.

P070005-TW ASE1898 9 200903744 Tape substrate. Referring to the fifth figure, each of the crystal grains 130 may be attached to the die region 102 of the substrate sheet 1 by an adhesive layer such as silver paste (not shown). Then, each of the dies can be electrically connected to the first set of pads of each of the die regions 102 by a plurality of connecting wires (e.g., gold wires not shown). In addition, each of the dies may be electrically connected to the first set of pads of each of the die regions 102 by flip chip bonding. After a unit 140 (for example, a rigid body (for example, a dummy die)) is fixed to the substrate sheet 100 by using a glue layer 150, the heat sink 12 is fixed to the substrate sheet 1 and The support unit 140 is on the support unit 140. In the present embodiment, the support unit 140 can support the fins 2 to avoid collapse in the center position. The support unit 14 is preferably disposed at a substantially central position on the substrate piece 100. In order to meet the needs of large-scale production, a MAP (m〇ld array package molding process) is generally used to fill the molding material 16 between the substrate sheet 100 and the heat sink 120, so that the molding material is used. The dies 130 are coated to form a package. Finally, the entire packaging process is completed by cutting into a single singulation step. In detail, the step of cutting into a single step generally uses a cutter such as a resin-bond saw blade to seal the seal along a predetermined cutting path 〇 4 (see the fourth figure). The subsequent molded product (comprising the aforementioned package and heat sink 120) is cut into individual units to produce the final product (ie, individual die package configurations).

P070005-TW ASE1898 200903744 According to another embodiment of the present invention, the method is attached to and electrically connected to the substrate piece 1GG^, with reference to the sixth and seventh figures. Each of the die 130 is attached to the substrate sheet 1 〇 = will have. A heat sink-body-formed-concave structure of a support unit can be formed in the form of a loose or a money. In addition, the two 21 (see the sixth figure) 'it can be stamped type-protrusion (see the first piece integrated structure 122a or protruding Qiu) in this example, the concave shape 1 is large, 卩122b# paste - The glue layer 15Q is fixed to the upper side, whereby the loose film piece 122 can be supported and the glutinous rice material is produced, and the moon I22 is prevented from being in the center position = raw 4 '! moon shape. Preferably, the concave structure i 22a or the projection i is disposed at a substantially central position on the heat sink 1GG. Next, the die 130 is coated with a molding material / : 16 而 to form a package. Finally, a single singulation step is performed to complete the entire packaging process. While the invention has been described in terms of the foregoing preferred embodiments, it is not intended to limit the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing a first embodiment of the present invention. Figure is a schematic cross-sectional view showing a second embodiment of the invention. The second drawing is a schematic cross-sectional view of a third embodiment of the invention.

P070005-TW _ ASE1898 200903744 The fourth and fifth figures are for explaining a method of fabricating a plurality of die package structures in accordance with an embodiment of the present invention. 6 and 7 are diagrams for explaining a method of fabricating a plurality of die package structures in accordance with another embodiment of the present invention. [Major component symbol description] 10: Substrate 11: Dummy die 12: Heat Sinks block 13: Compound 14: Die 15: Upper surface 20: Substrate Substrate 21: concave structure 22: heat sink block 2 3: plastic compound 24: die 25: upper surface 30: substrate 3h support unit 32: heat sink (Heat Sinks block) 3 3: Compounding material 34: die 35: upper surface 100: substrate piece 102: grain area 104: dicing street 120: heat sink

P070005-TW ASE1898 12 200903744 122: Heat sink 122a: Concave structure 122b: Projection 130: Die 140: Support unit 150: Adhesive layer 160: Molding material P070005-TW ASE1898 13

Claims (1)

200903744 X. Patent application scope: 1. A die package structure comprising: a substrate; a plurality of die disposed on an upper surface of the substrate; the material is used to cover the plurality of substrates a die on the upper surface of the upper surface of the heat sealing sheet over the molding material; and a substrate between the heat sink and the heat sink to prevent the scattering, the butterfly sheet 3. As in the patent scope The die seal described in the item 1 is a body-formed structure. 4. If the first item of the patent application scope is against the center of the substrate to support the sheet structure, the support sheet is 7. The width of the item of the patent item is about the width of the support sheet 8' For example, the material of the Japanese version mentioned in the first paragraph of the patent application is Ming, copper or other high pass ^^^. The heat sink 9. The die seal structure comprises: P070005-TW ASE1898 14 200903744 a substrate; a plurality of die disposed on an upper surface of the substrate; a molding material And covering the plurality of crystal grains and the upper surface; and a heat sink having a concave structure covering the concave structure of the molding material against the substrate to prevent the surface of the heat sink from collapsing. The die package structure of claim 9, wherein the bottom end of the concave structure is a flat surface that abuts the substrate. A method for manufacturing a die package structure, comprising: having an upper surface on which a plurality of die regions are mounted; and a plurality of die grains are disposed in the die regions; (C) electrical connection The die is on the substrate piece; the single S-heat sink is on the substrate piece; the die is formed between the plate and the heat sink, and the (f)=cutting the package and the heat sink are covered. And the method for manufacturing the die package structure according to the eleventh item of the middle 匕2 range, the support element of the 苴 放 放 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ TW ASE1898 15 200903744,: (10) The manufacturing method of the die package structure described in the following, the manufacturing method of the Π = grain package structure, comprising: the reverse film 'with the upper surface' having a plurality of crystal grains thereon a plurality of dies are disposed in the plurality of dies; cj connects the dies to the substrate; ί: the support unit is fixed on the substrate; a substrate piece and the support unit; a molding material between the substrate piece and the heat sink, covering the crystal shape a package body; and a (g) =] miscellaneous and the heat sink, and the method for manufacturing the die package structure described in Item 17 of the lion die package structure is prepared, and the The element is fixed to the substrate piece by a glue layer. VIII: The manufacturing method of the die package structure described in Item 17 of the present invention, wherein the τ °Heil heat release film is fixed to the support unit by a glue layer. The method for manufacturing a die package structure according to Item 17, wherein the rΜ support early element is a rigid body. 21. The method for manufacturing the crystal structure of the item i7, wherein the group is a dummy wafer (Dummy Die) 070 P070005-TW ASE 1898 16 200903744 22. The die package structure according to claim 17 The manufacturing method, wherein the supporting unit is disposed at a substantially central position on the heat sink. P070005-TW ASE1898 17