[go: up one dir, main page]

TWI416140B - 印刷基板之檢查裝置及檢查方法 - Google Patents

印刷基板之檢查裝置及檢查方法 Download PDF

Info

Publication number
TWI416140B
TWI416140B TW097121970A TW97121970A TWI416140B TW I416140 B TWI416140 B TW I416140B TW 097121970 A TW097121970 A TW 097121970A TW 97121970 A TW97121970 A TW 97121970A TW I416140 B TWI416140 B TW I416140B
Authority
TW
Taiwan
Prior art keywords
inspection
printed circuit
probe
circuit board
probes
Prior art date
Application number
TW097121970A
Other languages
English (en)
Chinese (zh)
Other versions
TW200918923A (en
Inventor
Toru Ishii
Keiichiro Sasamine
Tomokazu Saito
Kengo Tsuchida
Original Assignee
Yamaha Fine Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Fine Tech Co Ltd filed Critical Yamaha Fine Tech Co Ltd
Publication of TW200918923A publication Critical patent/TW200918923A/zh
Application granted granted Critical
Publication of TWI416140B publication Critical patent/TWI416140B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW097121970A 2007-06-14 2008-06-12 印刷基板之檢查裝置及檢查方法 TWI416140B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007157064A JP4461159B2 (ja) 2007-06-14 2007-06-14 プリント基板の検査装置および検査方法

Publications (2)

Publication Number Publication Date
TW200918923A TW200918923A (en) 2009-05-01
TWI416140B true TWI416140B (zh) 2013-11-21

Family

ID=40197166

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097121970A TWI416140B (zh) 2007-06-14 2008-06-12 印刷基板之檢查裝置及檢查方法

Country Status (4)

Country Link
JP (1) JP4461159B2 (ja)
KR (1) KR101036084B1 (ja)
CN (1) CN101334441B (ja)
TW (1) TWI416140B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412754B (zh) * 2009-05-15 2013-10-21 Hon Hai Prec Ind Co Ltd 特性阻抗測試系統及方法
CN105021938B (zh) * 2014-04-30 2018-11-09 佰欧特株式会社 检查装置
CN104793095B (zh) * 2015-04-01 2018-10-30 广东韦达尔科技有限公司 一种能自动补缺的银浆线检测机
CN104819986B (zh) * 2015-04-01 2018-05-18 广东韦达尔科技有限公司 一种全景式自动修补的银浆线检测机
TWI581035B (zh) * 2015-07-24 2017-05-01 惠特科技股份有限公司 液晶測試板定位方法
JP6534582B2 (ja) * 2015-08-25 2019-06-26 日置電機株式会社 判定装置、基板検査装置および判定方法
JP6534583B2 (ja) * 2015-08-25 2019-06-26 日置電機株式会社 判定装置、基板検査装置および判定方法
CN105427297B (zh) * 2015-11-12 2018-12-18 广州视源电子科技股份有限公司 一种图像校准方法及装置
CN106197279B (zh) * 2016-08-26 2019-04-16 苏州朗坤自动化设备有限公司 一种表面对焦位置检测机构
CN111562413A (zh) * 2019-02-14 2020-08-21 均豪精密工业股份有限公司 检测方法及检测系统
CN111580020B (zh) * 2020-05-27 2022-03-11 中国南方电网有限责任公司 一种三相分体式变压器ct极性校验方法及系统
CN114942381A (zh) * 2022-07-21 2022-08-26 深圳市东方宇之光科技股份有限公司 基于悬臂式结构测试电路板的飞针测试机及测试方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010050572A1 (en) * 1998-06-02 2001-12-13 Hideo Nishikawa Printed circuit board testing apparatus
US20070096763A1 (en) * 2005-10-18 2007-05-03 Gsi Group Corporation Methods and apparatus for utilizing an optical reference

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2783456B2 (ja) * 1990-11-16 1998-08-06 ファナック株式会社 ロボットの座標系設定方式
JPH04244973A (ja) * 1991-01-31 1992-09-01 Mitsui Eng & Shipbuild Co Ltd 導通検査装置
JPH04283672A (ja) * 1991-03-13 1992-10-08 Fujitsu Ltd 分割試験ヘッドの位置補正方法及び装置
JPH04340484A (ja) * 1991-05-17 1992-11-26 Fujitsu Ltd 多軸プローブ位置決め装置
JPH0511822A (ja) * 1991-07-03 1993-01-22 Fanuc Ltd ロボツトの協調作業方式
JPH05185384A (ja) * 1992-01-14 1993-07-27 Shimadzu Corp マイクロマニピュレータ
JPH0823572B2 (ja) * 1992-09-18 1996-03-06 オカノ電機株式会社 プローブ移動方式基板検査装置
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
JPH07209384A (ja) * 1994-01-24 1995-08-11 Okano Denki Kk プローブ移動式基板検査装置
JPH1034576A (ja) * 1996-07-24 1998-02-10 Tescon:Kk マルチロボットシステム
US6208375B1 (en) * 1999-05-21 2001-03-27 Elite Engineering Corporation Test probe positioning method and system for micro-sized devices
JP2002018750A (ja) * 2000-07-07 2002-01-22 Yaskawa Electric Corp ロボットのキャリブレーション方法及び装置
JP4721247B2 (ja) * 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
JP4798571B2 (ja) * 2001-05-14 2011-10-19 ヤマハファインテック株式会社 位置認識可能な処理装置および処理方法
DE10220343B4 (de) * 2002-05-07 2007-04-05 Atg Test Systems Gmbh & Co. Kg Reicholzheim Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde
US7026832B2 (en) * 2002-10-28 2006-04-11 Dainippon Screen Mfg. Co., Ltd. Probe mark reading device and probe mark reading method
BRPI0507053A (pt) * 2004-01-23 2007-06-12 Cornell Res Foundation Inc métodos para reduzir o dano oxidativo em um mamìfero em necessidade deste, em um órgão removido de um mamìfero e uma célula em necessidade deste
TW200537110A (en) * 2004-05-14 2005-11-16 Innolux Display Corp Testing apparatus
JP5334355B2 (ja) * 2005-05-27 2013-11-06 ヤマハファインテック株式会社 プリント基板の電気検査装置および電気検査方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010050572A1 (en) * 1998-06-02 2001-12-13 Hideo Nishikawa Printed circuit board testing apparatus
US20070096763A1 (en) * 2005-10-18 2007-05-03 Gsi Group Corporation Methods and apparatus for utilizing an optical reference

Also Published As

Publication number Publication date
KR20080110510A (ko) 2008-12-18
CN101334441B (zh) 2012-06-27
CN101334441A (zh) 2008-12-31
KR101036084B1 (ko) 2011-05-19
TW200918923A (en) 2009-05-01
JP4461159B2 (ja) 2010-05-12
JP2008309601A (ja) 2008-12-25

Similar Documents

Publication Publication Date Title
TWI416140B (zh) 印刷基板之檢查裝置及檢查方法
TWI239405B (en) Apparatus and method for the testing of circuit boards, and test probe for this apparatus and this method
JP5952875B2 (ja) レーザ加工機、レーザ加工機のワーク歪補正方法
JP2005210067A (ja) プローブナビゲーション方法及び装置並びに不良検査装置
CN106796263A (zh) 具有视觉引导对准的电气测试系统
JP2008078227A (ja) 位置合わせ対象物の再登録方法及びその方法を記録した記録媒体
JP2007225522A (ja) 基板の変形量測定方法
JP6084140B2 (ja) 電気検査装置
JP3819230B2 (ja) マルチプローブ型走査プローブ顕微鏡装置およびそれを用いた試料表面評価方法
JP3644846B2 (ja) 描画装置の移動誤差検出装置及びその方法
JP5334355B2 (ja) プリント基板の電気検査装置および電気検査方法
JP2009019907A (ja) 検査装置
JP2003098216A (ja) 回路基板検査装置
US20070224869A1 (en) Testing device
KR102536717B1 (ko) Pcba 검사장치
TW202300931A (zh) 探針裝置
JP6498564B2 (ja) 処理装置、基板検査装置、処理方法および基板検査方法
WO2019244264A1 (ja) 制御方法、電子部品装着装置、および補正用基板
JP3062255B2 (ja) 回路基板検査装置における被検査回路基板の基準位置検出方法
JPH0278970A (ja) 導体パターンの導通検査機及び導通検査機におけるプローブの座標設定方法
JP2005127886A (ja) 傾斜型ｘ線ｃｔ装置における回転中心軸の較正方法および傾斜型ｘ線ｃｔ装置
JP2008139260A (ja) 画像表示装置、外観検査装置、クリーム半田印刷機、及び画像表示方法
JP4484012B2 (ja) Ｘ線透視撮影装置
JPH0282172A (ja) 導体パターンの導通検査機
TW201935218A (zh) 電子半導體組件之光學表示方法及裝置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees