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TWI368464B - Flexible print circuit board - Google Patents

Flexible print circuit board

Info

Publication number
TWI368464B
TWI368464B TW094121553A TW94121553A TWI368464B TW I368464 B TWI368464 B TW I368464B TW 094121553 A TW094121553 A TW 094121553A TW 94121553 A TW94121553 A TW 94121553A TW I368464 B TWI368464 B TW I368464B
Authority
TW
Taiwan
Prior art keywords
circuit board
print circuit
flexible print
flexible
board
Prior art date
Application number
TW094121553A
Other languages
English (en)
Other versions
TW200614884A (en
Inventor
Shingo Ueda
Original Assignee
Sumitomo Elec Printed Circuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Elec Printed Circuits filed Critical Sumitomo Elec Printed Circuits
Publication of TW200614884A publication Critical patent/TW200614884A/zh
Application granted granted Critical
Publication of TWI368464B publication Critical patent/TWI368464B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Combinations Of Printed Boards (AREA)
TW094121553A 2004-07-06 2005-06-28 Flexible print circuit board TWI368464B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004198734A JP4398311B2 (ja) 2004-07-06 2004-07-06 フレキシブルプリント基板

Publications (2)

Publication Number Publication Date
TW200614884A TW200614884A (en) 2006-05-01
TWI368464B true TWI368464B (en) 2012-07-11

Family

ID=35797675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121553A TWI368464B (en) 2004-07-06 2005-06-28 Flexible print circuit board

Country Status (4)

Country Link
JP (1) JP4398311B2 (zh)
KR (1) KR101098132B1 (zh)
CN (1) CN1725931B (zh)
TW (1) TWI368464B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299623A (ja) * 2006-04-28 2007-11-15 Optrex Corp 折り畳み式電気機器の接続基板
JP4845705B2 (ja) * 2006-12-19 2011-12-28 日東電工株式会社 プリント配線基板、その製造方法および電子機器
JP2009075365A (ja) * 2007-09-20 2009-04-09 Omron Corp 光配線、及び光伝送モジュール
JP5515171B2 (ja) * 2009-12-18 2014-06-11 住友電工プリントサーキット株式会社 フレキシブルプリント配線板、筐体構造、電子機器
KR101676747B1 (ko) * 2015-04-13 2016-11-16 (주) 액트 연성접합부를 포함한 연성인쇄회로기판의 접합구조
CN108400180B (zh) * 2018-01-25 2020-06-16 北京工业大学 纹理衬底增强柔性器件在机械应力下的电学稳定性

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3515490B2 (ja) * 2000-06-30 2004-04-05 三洋電機株式会社 フレキシブルプリント基板及びフレキシブルプリント基板を有する折畳式携帯電話端末
JP2002368440A (ja) * 2001-06-06 2002-12-20 Toshiba Corp 折り畳み型電子機器とそのフレキシブル基板
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP2004079730A (ja) 2002-08-15 2004-03-11 Nippon Mektron Ltd 可撓性回路基板

Also Published As

Publication number Publication date
TW200614884A (en) 2006-05-01
JP2006024584A (ja) 2006-01-26
CN1725931B (zh) 2011-05-11
JP4398311B2 (ja) 2010-01-13
KR20060048487A (ko) 2006-05-18
KR101098132B1 (ko) 2011-12-26
CN1725931A (zh) 2006-01-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees