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KR101098132B1 - 플렉시블 프린트 기판 - Google Patents

플렉시블 프린트 기판 Download PDF

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Publication number
KR101098132B1
KR101098132B1 KR1020050054288A KR20050054288A KR101098132B1 KR 101098132 B1 KR101098132 B1 KR 101098132B1 KR 1020050054288 A KR1020050054288 A KR 1020050054288A KR 20050054288 A KR20050054288 A KR 20050054288A KR 101098132 B1 KR101098132 B1 KR 101098132B1
Authority
KR
South Korea
Prior art keywords
flexible printed
printed circuit
circuit board
substrate
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020050054288A
Other languages
English (en)
Korean (ko)
Other versions
KR20060048487A (ko
Inventor
신고 우에다
Original Assignee
스미토모 덴코 프린트 써키트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 덴코 프린트 써키트 가부시키가이샤 filed Critical 스미토모 덴코 프린트 써키트 가부시키가이샤
Publication of KR20060048487A publication Critical patent/KR20060048487A/ko
Application granted granted Critical
Publication of KR101098132B1 publication Critical patent/KR101098132B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020050054288A 2004-07-06 2005-06-23 플렉시블 프린트 기판 Expired - Lifetime KR101098132B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004198734A JP4398311B2 (ja) 2004-07-06 2004-07-06 フレキシブルプリント基板
JPJP-P-2004-00198734 2004-07-06

Publications (2)

Publication Number Publication Date
KR20060048487A KR20060048487A (ko) 2006-05-18
KR101098132B1 true KR101098132B1 (ko) 2011-12-26

Family

ID=35797675

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050054288A Expired - Lifetime KR101098132B1 (ko) 2004-07-06 2005-06-23 플렉시블 프린트 기판

Country Status (4)

Country Link
JP (1) JP4398311B2 (zh)
KR (1) KR101098132B1 (zh)
CN (1) CN1725931B (zh)
TW (1) TWI368464B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299623A (ja) * 2006-04-28 2007-11-15 Optrex Corp 折り畳み式電気機器の接続基板
JP4845705B2 (ja) * 2006-12-19 2011-12-28 日東電工株式会社 プリント配線基板、その製造方法および電子機器
JP2009075365A (ja) * 2007-09-20 2009-04-09 Omron Corp 光配線、及び光伝送モジュール
JP5515171B2 (ja) * 2009-12-18 2014-06-11 住友電工プリントサーキット株式会社 フレキシブルプリント配線板、筐体構造、電子機器
KR101676747B1 (ko) * 2015-04-13 2016-11-16 (주) 액트 연성접합부를 포함한 연성인쇄회로기판의 접합구조
CN108400180B (zh) * 2018-01-25 2020-06-16 北京工业大学 纹理衬底增强柔性器件在机械应力下的电学稳定性

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016323A (ja) * 2000-06-30 2002-01-18 Sanyo Electric Co Ltd フレキシブルプリント基板及びフレキシブルプリント基板を有する折畳式携帯電話端末
JP2004079730A (ja) 2002-08-15 2004-03-11 Nippon Mektron Ltd 可撓性回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368440A (ja) * 2001-06-06 2002-12-20 Toshiba Corp 折り畳み型電子機器とそのフレキシブル基板
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016323A (ja) * 2000-06-30 2002-01-18 Sanyo Electric Co Ltd フレキシブルプリント基板及びフレキシブルプリント基板を有する折畳式携帯電話端末
JP2004079730A (ja) 2002-08-15 2004-03-11 Nippon Mektron Ltd 可撓性回路基板

Also Published As

Publication number Publication date
KR20060048487A (ko) 2006-05-18
TWI368464B (en) 2012-07-11
JP2006024584A (ja) 2006-01-26
CN1725931B (zh) 2011-05-11
JP4398311B2 (ja) 2010-01-13
CN1725931A (zh) 2006-01-25
TW200614884A (en) 2006-05-01

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