KR101098132B1 - 플렉시블 프린트 기판 - Google Patents
플렉시블 프린트 기판 Download PDFInfo
- Publication number
- KR101098132B1 KR101098132B1 KR1020050054288A KR20050054288A KR101098132B1 KR 101098132 B1 KR101098132 B1 KR 101098132B1 KR 1020050054288 A KR1020050054288 A KR 1020050054288A KR 20050054288 A KR20050054288 A KR 20050054288A KR 101098132 B1 KR101098132 B1 KR 101098132B1
- Authority
- KR
- South Korea
- Prior art keywords
- flexible printed
- printed circuit
- circuit board
- substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
처리방법 | 표면 거칠기(凹凸) | 마찰음의 유무 | 굴곡성 | |
실시예 1 | 표면 연마 | 2㎛ | 없음 | 32만회 |
실시예 2 | 엠보스가공 | 2㎛ | 없음 | 30만회 |
비교예 | 없음 | - | 있음 | 14만회 |
Claims (4)
- 회로부재 간을 접속하기 위한 도선부를 구비하고, 복수매의 기판을 중첩해서 이루어진 플렉시블 프린트 기판으로서, 서로 접촉하는 쪽의 기판의 베이스 필름 표면에 0.5 내지 6.0㎛ 크기의 요철(凹凸)을 형성한 것을 특징으로 하는 플렉시블 프린트 기판.
- 삭제
- 제1항에 있어서,기판의 베이스 필름 표면의 凹凸이, 기판 표면을 연마하는 방법에 의해 형성된 것을 특징으로 하는 플렉시블 프린트 기판.
- 제1항에 있어서,기판의 베이스 필름 표면의 凹凸이, 기판 표면을 엠보스가공하는 방법에 의해 형성된 것을 특징으로 하는 플렉시블 프린트 기판.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004198734A JP4398311B2 (ja) | 2004-07-06 | 2004-07-06 | フレキシブルプリント基板 |
JPJP-P-2004-00198734 | 2004-07-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060048487A KR20060048487A (ko) | 2006-05-18 |
KR101098132B1 true KR101098132B1 (ko) | 2011-12-26 |
Family
ID=35797675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050054288A Expired - Lifetime KR101098132B1 (ko) | 2004-07-06 | 2005-06-23 | 플렉시블 프린트 기판 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4398311B2 (ko) |
KR (1) | KR101098132B1 (ko) |
CN (1) | CN1725931B (ko) |
TW (1) | TWI368464B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007299623A (ja) * | 2006-04-28 | 2007-11-15 | Optrex Corp | 折り畳み式電気機器の接続基板 |
JP4845705B2 (ja) * | 2006-12-19 | 2011-12-28 | 日東電工株式会社 | プリント配線基板、その製造方法および電子機器 |
JP2009075365A (ja) * | 2007-09-20 | 2009-04-09 | Omron Corp | 光配線、及び光伝送モジュール |
JP5515171B2 (ja) * | 2009-12-18 | 2014-06-11 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板、筐体構造、電子機器 |
KR101676747B1 (ko) * | 2015-04-13 | 2016-11-16 | (주) 액트 | 연성접합부를 포함한 연성인쇄회로기판의 접합구조 |
CN108400180B (zh) * | 2018-01-25 | 2020-06-16 | 北京工业大学 | 纹理衬底增强柔性器件在机械应力下的电学稳定性 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016323A (ja) * | 2000-06-30 | 2002-01-18 | Sanyo Electric Co Ltd | フレキシブルプリント基板及びフレキシブルプリント基板を有する折畳式携帯電話端末 |
JP2004079730A (ja) | 2002-08-15 | 2004-03-11 | Nippon Mektron Ltd | 可撓性回路基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002368440A (ja) * | 2001-06-06 | 2002-12-20 | Toshiba Corp | 折り畳み型電子機器とそのフレキシブル基板 |
TW591671B (en) * | 2001-06-27 | 2004-06-11 | Shinetsu Chemical Co | Substrate for flexible printed wiring |
-
2004
- 2004-07-06 JP JP2004198734A patent/JP4398311B2/ja not_active Expired - Lifetime
-
2005
- 2005-06-23 KR KR1020050054288A patent/KR101098132B1/ko not_active Expired - Lifetime
- 2005-06-28 TW TW094121553A patent/TWI368464B/zh not_active IP Right Cessation
- 2005-06-30 CN CN2005100814015A patent/CN1725931B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016323A (ja) * | 2000-06-30 | 2002-01-18 | Sanyo Electric Co Ltd | フレキシブルプリント基板及びフレキシブルプリント基板を有する折畳式携帯電話端末 |
JP2004079730A (ja) | 2002-08-15 | 2004-03-11 | Nippon Mektron Ltd | 可撓性回路基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20060048487A (ko) | 2006-05-18 |
TWI368464B (en) | 2012-07-11 |
JP2006024584A (ja) | 2006-01-26 |
CN1725931B (zh) | 2011-05-11 |
JP4398311B2 (ja) | 2010-01-13 |
CN1725931A (zh) | 2006-01-25 |
TW200614884A (en) | 2006-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100750019B1 (ko) | 가요성 프린트 배선판 및 다층 가요성 프린트 배선판, 상기다층 가요성 프린트 배선판을 이용한 휴대 전화 단말 | |
TWI397351B (zh) | 反覆彎曲用雙面可撓性電路基板 | |
US20120146467A1 (en) | Housing of electronic device and method for making the same | |
JP2013187380A (ja) | 伸縮性フレキシブル回路基板およびその製造方法 | |
JPWO2008146448A1 (ja) | ピーラブル性を有する積層体およびその製造方法 | |
KR101098132B1 (ko) | 플렉시블 프린트 기판 | |
TW201406229A (zh) | 印刷電路板及應用其之製造方法 | |
TWI633006B (zh) | 撓性覆銅積層板及撓性電路基板 | |
JP2009280855A (ja) | 圧延銅箔及びその製造方法 | |
JP2005116745A (ja) | 導体被覆ポリイミドフィルムの製造方法及び導体被覆ポリイミドフィルム | |
JP4301924B2 (ja) | 多角形状の剛性フレームと、該フレームに接着されて広がっている誘電体材料で作られた可撓性フィルムとを備える組立体 | |
KR20090039643A (ko) | 연성 편면 폴리이미드 동장 적층판의 제조 방법 | |
JP2006059865A (ja) | 基板及びその製造方法 | |
JP2008016603A (ja) | フレキシブルプリント配線板用基板及びその製造方法 | |
JP2012006200A (ja) | ポリイミド金属積層体、及びそれを用いたプリント配線板 | |
JP4371234B2 (ja) | フレキシブル金属箔ポリイミド積層板 | |
JP4954111B2 (ja) | フレキシブルプリント配線板及び金属張積層板、前記フレキシブルプリント配線板に使用されるカバーレイ | |
JP2005340382A (ja) | フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法 | |
JPH10209583A (ja) | フレキシブル金属箔ポリイミド積層板 | |
KR102598317B1 (ko) | 3층 연성적층판, 그 제조방법 및 이를 적용한 전기접촉단자 | |
JP2021170603A (ja) | 金属貼積層板および回路基板 | |
CN102422729A (zh) | 电路基板及其制造方法 | |
JPH053228A (ja) | Tabおよびその製造方法 | |
JP2007069617A (ja) | フレキシブル金属箔積層板の製造方法 | |
JP2004259731A (ja) | 回路基板製作方法及び回路基板製作用治具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20050623 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20100419 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20050623 Comment text: Patent Application |
|
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110524 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20111122 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20111216 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20111216 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
FPAY | Annual fee payment |
Payment date: 20141120 Year of fee payment: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20141120 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20151118 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20151118 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20161122 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20161122 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20171120 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20171120 Start annual number: 7 End annual number: 7 |
|
LAPS | Lapse due to unpaid annual fee |