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TWI365691B - Insulated pattern and its forming method - Google Patents

Insulated pattern and its forming method

Info

Publication number
TWI365691B
TWI365691B TW093127303A TW93127303A TWI365691B TW I365691 B TWI365691 B TW I365691B TW 093127303 A TW093127303 A TW 093127303A TW 93127303 A TW93127303 A TW 93127303A TW I365691 B TWI365691 B TW I365691B
Authority
TW
Taiwan
Prior art keywords
forming method
insulated pattern
insulated
pattern
forming
Prior art date
Application number
TW093127303A
Other languages
English (en)
Other versions
TW200513161A (en
Inventor
Hideaki Kojima
Gen Itokawa
Masahisa Kakinuma
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200513161A publication Critical patent/TW200513161A/zh
Application granted granted Critical
Publication of TWI365691B publication Critical patent/TWI365691B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW093127303A 2003-09-11 2004-09-09 Insulated pattern and its forming method TWI365691B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003319451 2003-09-11

Publications (2)

Publication Number Publication Date
TW200513161A TW200513161A (en) 2005-04-01
TWI365691B true TWI365691B (en) 2012-06-01

Family

ID=34308568

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093127303A TWI365691B (en) 2003-09-11 2004-09-09 Insulated pattern and its forming method

Country Status (4)

Country Link
JP (1) JP4563939B2 (zh)
CN (1) CN100525587C (zh)
TW (1) TWI365691B (zh)
WO (1) WO2005027601A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009071239A (ja) * 2007-09-18 2009-04-02 Seiko Epson Corp プリント配線基板の製造方法及びプリント配線基板
JP5082706B2 (ja) * 2007-09-18 2012-11-28 セイコーエプソン株式会社 プリント配線基板の製造方法
FR2925222B1 (fr) * 2007-12-17 2010-04-16 Commissariat Energie Atomique Procede de realisation d'une interconnexion electrique entre deux couches conductrices
JP2010016097A (ja) * 2008-07-02 2010-01-21 Fujikura Ltd プリント配線板の製造方法
CA2748245A1 (en) * 2008-12-26 2010-07-01 Sumitomo Bakelite Co., Ltd. Flexible substrate and electronic device
CN101534612B (zh) * 2009-04-10 2011-03-16 深圳市博敏电子有限公司 Pcb板厚铜线路阻焊叠印工艺
DE102009050703B3 (de) * 2009-10-26 2011-04-21 Evonik Goldschmidt Gmbh Verfahren zur Selbstassemblierung elektrischer, elektronischer oder mikromechanischer Bauelemente auf einem Substrat und damit hergestelltes Erzeugnis
JP5581249B2 (ja) * 2011-03-10 2014-08-27 新日鉄住金化学株式会社 インクジェット印刷装置による直線描画方法
JP5768574B2 (ja) * 2011-08-05 2015-08-26 三菱電機株式会社 プリント配線板の製造方法
JPWO2013039080A1 (ja) * 2011-09-16 2015-03-26 住友重機械工業株式会社 基板製造装置
WO2015002316A1 (ja) * 2013-07-05 2015-01-08 コニカミノルタ株式会社 絶縁パターンの形成方法
JP7150232B2 (ja) 2017-07-03 2022-10-11 株式会社弘輝 フラックス、やに入りはんだ及びソルダペースト

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952559B2 (ja) * 1981-07-27 1984-12-20 大日本スクリ−ン製造株式会社 プリント配線基板の製造方法
JPH05251855A (ja) * 1992-03-04 1993-09-28 Nec Corp 印刷配線板の製造方法
JPH06237063A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
US6403894B1 (en) * 1998-05-26 2002-06-11 Matsushita Electric Industrial Co., Ltd. Printed wiring board with insect repellant
JP2001332840A (ja) * 2000-05-24 2001-11-30 Rohm Co Ltd プリント配線基板の製造方法

Also Published As

Publication number Publication date
TW200513161A (en) 2005-04-01
JP4563939B2 (ja) 2010-10-20
JPWO2005027601A1 (ja) 2006-11-24
WO2005027601A1 (ja) 2005-03-24
CN1849854A (zh) 2006-10-18
CN100525587C (zh) 2009-08-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees