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TW200513161A - Insulated pattern and its forming method - Google Patents

Insulated pattern and its forming method

Info

Publication number
TW200513161A
TW200513161A TW093127303A TW93127303A TW200513161A TW 200513161 A TW200513161 A TW 200513161A TW 093127303 A TW093127303 A TW 093127303A TW 93127303 A TW93127303 A TW 93127303A TW 200513161 A TW200513161 A TW 200513161A
Authority
TW
Taiwan
Prior art keywords
pattern
substrate
resin composition
bonding
forming method
Prior art date
Application number
TW093127303A
Other languages
Chinese (zh)
Other versions
TWI365691B (en
Inventor
Hideaki Kojima
Gen Itokawa
Masahisa Kakinuma
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200513161A publication Critical patent/TW200513161A/en
Application granted granted Critical
Publication of TWI365691B publication Critical patent/TWI365691B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A method of forming an insulating pattern and its forming method are disclosed, comprising the steps of (1) on a substrate with a circuit formed thereon, effecting application and bonding of cissing agent (A) to a pattern being in negative relationship reverse to a pattern of insulating layer, (2) coating the whole surface of substrate obtained in step (1) with liquid insulating resin composition (B) having a surface tension that is higher than that of the bonded cissing agent (A) but lower than that of the substrate and (3) by irradiation with active energy rays and/or heat curing, or heat drying, effecting bonding of the coating film of liquid insulating resin composition (B) obtained in the step (2) onto the substrate to thereby provide an insulating layer, characterized in that through the steps (2) to (3), the liquid insulating resin composition (B) is repelled by the matter resulting from bonding of the cissing agent (A), thereby enabling to obtain an insulating pattern.
TW093127303A 2003-09-11 2004-09-09 Insulated pattern and its forming method TWI365691B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003319451 2003-09-11

Publications (2)

Publication Number Publication Date
TW200513161A true TW200513161A (en) 2005-04-01
TWI365691B TWI365691B (en) 2012-06-01

Family

ID=34308568

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093127303A TWI365691B (en) 2003-09-11 2004-09-09 Insulated pattern and its forming method

Country Status (4)

Country Link
JP (1) JP4563939B2 (en)
CN (1) CN100525587C (en)
TW (1) TWI365691B (en)
WO (1) WO2005027601A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5082706B2 (en) * 2007-09-18 2012-11-28 セイコーエプソン株式会社 Method for manufacturing printed wiring board
JP2009071239A (en) * 2007-09-18 2009-04-02 Seiko Epson Corp Printed wiring board manufacturing method and printed wiring board
FR2925222B1 (en) * 2007-12-17 2010-04-16 Commissariat Energie Atomique METHOD FOR PRODUCING AN ELECTRIC INTERCONNECTION BETWEEN TWO CONDUCTIVE LAYERS
JP2010016097A (en) * 2008-07-02 2010-01-21 Fujikura Ltd Method of manufacturing printed wiring board
CN102265715B (en) * 2008-12-26 2014-05-28 住友电木株式会社 Flexible substrate and electronic device
CN101534612B (en) * 2009-04-10 2011-03-16 深圳市博敏电子有限公司 Resistance welding superposition technology for PCB thick copper lines
DE102009050703B3 (en) * 2009-10-26 2011-04-21 Evonik Goldschmidt Gmbh Method for self-assembly of electrical, electronic or micromechanical components on a substrate and product produced therewith
JP5581249B2 (en) * 2011-03-10 2014-08-27 新日鉄住金化学株式会社 Line drawing method by ink jet printing apparatus
JP5768574B2 (en) * 2011-08-05 2015-08-26 三菱電機株式会社 Method for manufacturing printed wiring board
JPWO2013039080A1 (en) * 2011-09-16 2015-03-26 住友重機械工業株式会社 Board manufacturing equipment
JP6361659B2 (en) * 2013-07-05 2018-07-25 コニカミノルタ株式会社 Insulation pattern forming method
JP7150232B2 (en) 2017-07-03 2022-10-11 株式会社弘輝 Flux, flux cored solder and solder paste

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952559B2 (en) * 1981-07-27 1984-12-20 大日本スクリ−ン製造株式会社 Printed wiring board manufacturing method
JPH05251855A (en) * 1992-03-04 1993-09-28 Nec Corp Method for manufacturing printed-circuit board
JPH06237063A (en) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd Manufacture of printed wiring board
US6403894B1 (en) * 1998-05-26 2002-06-11 Matsushita Electric Industrial Co., Ltd. Printed wiring board with insect repellant
JP2001332840A (en) * 2000-05-24 2001-11-30 Rohm Co Ltd Manufacturing method of printed-wiring board

Also Published As

Publication number Publication date
JPWO2005027601A1 (en) 2006-11-24
CN100525587C (en) 2009-08-05
CN1849854A (en) 2006-10-18
TWI365691B (en) 2012-06-01
WO2005027601A1 (en) 2005-03-24
JP4563939B2 (en) 2010-10-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees