TW334631B - Semiconductor IC apparatus - Google Patents
Semiconductor IC apparatusInfo
- Publication number
- TW334631B TW334631B TW086110643A TW86110643A TW334631B TW 334631 B TW334631 B TW 334631B TW 086110643 A TW086110643 A TW 086110643A TW 86110643 A TW86110643 A TW 86110643A TW 334631 B TW334631 B TW 334631B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor
- circulation
- vss
- vnbh
- vnbl
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/145—Applications of charge pumps; Boosted voltage circuits; Clamp circuits therefor
- G11C5/146—Substrate bias generators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Dram (AREA)
- Logic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Static Random-Access Memory (AREA)
- Semiconductor Memories (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08271097A JP4046383B2 (ja) | 1997-04-01 | 1997-04-01 | 半導体集積回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW334631B true TW334631B (en) | 1998-06-21 |
Family
ID=13781971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086110643A TW334631B (en) | 1997-04-01 | 1997-07-23 | Semiconductor IC apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US5900665A (zh) |
JP (1) | JP4046383B2 (zh) |
KR (1) | KR100261013B1 (zh) |
CN (1) | CN1113414C (zh) |
TW (1) | TW334631B (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6750527B1 (en) * | 1996-05-30 | 2004-06-15 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device having a plurality of wells, test method of testing the semiconductor integrated circuit device, and test device which executes the test method |
US6593799B2 (en) | 1997-06-20 | 2003-07-15 | Intel Corporation | Circuit including forward body bias from supply voltage and ground nodes |
US6232827B1 (en) | 1997-06-20 | 2001-05-15 | Intel Corporation | Transistors providing desired threshold voltage and reduced short channel effects with forward body bias |
US6218895B1 (en) * | 1997-06-20 | 2001-04-17 | Intel Corporation | Multiple well transistor circuits having forward body bias |
US6100751A (en) * | 1997-06-20 | 2000-08-08 | Intel Corporation | Forward body biased field effect transistor providing decoupling capacitance |
US6300819B1 (en) | 1997-06-20 | 2001-10-09 | Intel Corporation | Circuit including forward body bias from supply voltage and ground nodes |
JP3185730B2 (ja) * | 1997-11-14 | 2001-07-11 | 日本電気株式会社 | 相補型mos半導体装置 |
US6307233B1 (en) * | 1998-07-31 | 2001-10-23 | Texas Instruments Incorporated | Electrically isolated double gated transistor |
FR2783941B1 (fr) * | 1998-09-30 | 2004-03-12 | St Microelectronics Sa | Circuit de regulation d'une tension de sortie d'un dispositif a pompe de charges positives |
JP2000243085A (ja) | 1999-02-22 | 2000-09-08 | Hitachi Ltd | 半導体装置 |
US6535415B2 (en) * | 1999-02-22 | 2003-03-18 | Hitachi, Ltd. | Semiconductor device |
DE19911463C1 (de) * | 1999-03-15 | 2001-02-08 | Siemens Ag | Leseverstärkeranordnung mit Feldeffekttransistor mit kurzer Kanallänge und einstellbarer Einsatzspannung |
US6301146B1 (en) * | 1999-12-23 | 2001-10-09 | Michael Anthony Ang | Static random access memory (RAM) systems and storage cell for same |
TW501278B (en) * | 2000-06-12 | 2002-09-01 | Intel Corp | Apparatus and circuit having reduced leakage current and method therefor |
JP2002015565A (ja) * | 2000-06-29 | 2002-01-18 | Mitsubishi Electric Corp | 半導体記憶装置 |
US6507523B2 (en) | 2000-12-20 | 2003-01-14 | Micron Technology, Inc. | Non-volatile memory with power standby |
US6510088B2 (en) * | 2001-03-22 | 2003-01-21 | Winbond Electronics Corporation | Semiconductor device having reduced leakage and method of operating the same |
US6751152B2 (en) * | 2001-10-31 | 2004-06-15 | International Business Machines Corporation | Method and configuration to allow a lower wordline boosted voltage operation while increasing a sensing signal with access transistor threshold voltage |
JP3520283B2 (ja) * | 2002-04-16 | 2004-04-19 | 沖電気工業株式会社 | 半導体記憶装置 |
JP4290457B2 (ja) * | 2003-03-31 | 2009-07-08 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
US7248988B2 (en) * | 2004-03-01 | 2007-07-24 | Transmeta Corporation | System and method for reducing temperature variation during burn in |
DE102004037087A1 (de) * | 2004-07-30 | 2006-03-23 | Advanced Micro Devices, Inc., Sunnyvale | Selbstvorspannende Transistorstruktur und SRAM-Zellen mit weniger als sechs Transistoren |
US7285827B1 (en) * | 2005-08-02 | 2007-10-23 | Spansion Llc | Back-to-back NPN/PNP protection diodes |
US20080135827A1 (en) * | 2006-09-25 | 2008-06-12 | Stmicroelectronics Crolles 2 Sas | MIM transistor |
DE102008007029B4 (de) * | 2008-01-31 | 2014-07-03 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Betrieb einer elektronischen Schaltung mit körpergesteuertem Doppelkanaltransistor und SRAM-Zelle mit körpergesteuertem Doppelkanaltransistor |
JP2009259972A (ja) * | 2008-04-15 | 2009-11-05 | Panasonic Corp | 半導体装置、及び該半導体装置を用いたエネルギー伝達装置 |
US8194370B2 (en) * | 2008-11-25 | 2012-06-05 | Nuvoton Technology Corporation | Electrostatic discharge protection circuit and device |
US9489989B2 (en) | 2010-06-22 | 2016-11-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Voltage regulators, memory circuits, and operating methods thereof |
US9024317B2 (en) | 2010-12-24 | 2015-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor circuit, method for driving the same, storage device, register circuit, display device, and electronic device |
CN102323529B (zh) * | 2011-08-08 | 2016-04-20 | 上海华虹宏力半导体制造有限公司 | Mos晶体管的寄生双极型晶体管的特性表征方法 |
US8705282B2 (en) * | 2011-11-01 | 2014-04-22 | Silicon Storage Technology, Inc. | Mixed voltage non-volatile memory integrated circuit with power saving |
JP6610223B2 (ja) * | 2015-12-04 | 2019-11-27 | 凸版印刷株式会社 | 半導体集積回路 |
FR3068187B1 (fr) * | 2017-06-23 | 2019-08-09 | Stmicroelectronics Sa | Circuit a pompe de charges negative |
KR20230140036A (ko) * | 2022-03-29 | 2023-10-06 | 삼성전자주식회사 | 바디 바이어스 전압 생성기 및 이를 포함하는 반도체 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621443A (ja) * | 1992-04-17 | 1994-01-28 | Nec Corp | 半導体集積回路 |
US5461338A (en) * | 1992-04-17 | 1995-10-24 | Nec Corporation | Semiconductor integrated circuit incorporated with substrate bias control circuit |
JP4067582B2 (ja) * | 1993-11-29 | 2008-03-26 | 株式会社ルネサステクノロジ | 半導体回路 |
JPH08186180A (ja) * | 1994-12-28 | 1996-07-16 | Oki Electric Ind Co Ltd | Cmis型集積回路装置及びその製造方法 |
-
1997
- 1997-04-01 JP JP08271097A patent/JP4046383B2/ja not_active Expired - Fee Related
- 1997-07-23 TW TW086110643A patent/TW334631B/zh not_active IP Right Cessation
- 1997-09-25 KR KR1019970048700A patent/KR100261013B1/ko not_active IP Right Cessation
- 1997-09-26 US US08/938,605 patent/US5900665A/en not_active Expired - Lifetime
- 1997-11-26 CN CN97122652A patent/CN1113414C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH10275466A (ja) | 1998-10-13 |
JP4046383B2 (ja) | 2008-02-13 |
US5900665A (en) | 1999-05-04 |
KR100261013B1 (ko) | 2000-07-01 |
KR19980079381A (ko) | 1998-11-25 |
CN1113414C (zh) | 2003-07-02 |
CN1195196A (zh) | 1998-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |