TW329052B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TW329052B TW329052B TW086110485A TW86110485A TW329052B TW 329052 B TW329052 B TW 329052B TW 086110485 A TW086110485 A TW 086110485A TW 86110485 A TW86110485 A TW 86110485A TW 329052 B TW329052 B TW 329052B
- Authority
- TW
- Taiwan
- Prior art keywords
- diffusion layers
- insulating film
- semiconductor substrate
- gate electrodes
- interlayer insulating
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000009792 diffusion process Methods 0.000 abstract 5
- 239000010410 layer Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 4
- 239000011229 interlayer Substances 0.000 abstract 3
- 239000012535 impurity Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 230000006870 function Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/08—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements
- G11C17/10—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM
- G11C17/12—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM using field-effect devices
- G11C17/123—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM using field-effect devices comprising cells having several storage transistors connected in series
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
Abstract
A semiconductor memory includes a plurality of diffusion layers a plurality of gate electrodes , a plurality of MOS transistors , an interlayer insulating film , and a plurality of metal lines . The diffusion layers are arrayed parallel to each other in the major surface of a semiconductor substrate . The gate electrodes are arrayed parallel to each other on the semiconductor substrate via a gate insulating film in a direction perpendicular to the diffusion layers . The MOS transistors are formed in cross regions including the intersections between the diffusion layers in the major surface of the semiconductor substrate , and the gate electrodes to constitute memory cells . The cross regions include channels through which a channel current flows . Data is written in the memory cells by selectively ion-implanting an impurity in the channels . The interlayer insulating film is formed on the semiconductor substrate including the gate electrodes . The metal lines are formed on the interlayer insulating film in correspondence with the diffusion layers to function as a mask in ion-implanting the impurity .
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19752996A JP3191689B2 (en) | 1996-07-26 | 1996-07-26 | Semiconductor memory device and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW329052B true TW329052B (en) | 1998-04-01 |
Family
ID=16375992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086110485A TW329052B (en) | 1996-07-26 | 1997-07-23 | Semiconductor device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3191689B2 (en) |
KR (1) | KR100286732B1 (en) |
TW (1) | TW329052B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI674661B (en) * | 2015-04-09 | 2019-10-11 | 南韓商三星電子股份有限公司 | Semiconductor device and method of fabricating the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3137077B2 (en) | 1998-06-16 | 2001-02-19 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
JP2000114400A (en) | 1998-10-08 | 2000-04-21 | Nec Corp | Semiconductor memory device and its manufacture |
KR100546360B1 (en) | 2003-08-06 | 2006-01-26 | 삼성전자주식회사 | NOR mask ROM element and method of manufacturing a semiconductor element comprising the same |
-
1996
- 1996-07-26 JP JP19752996A patent/JP3191689B2/en not_active Expired - Fee Related
-
1997
- 1997-07-23 TW TW086110485A patent/TW329052B/en active
- 1997-07-25 KR KR1019970034878A patent/KR100286732B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI674661B (en) * | 2015-04-09 | 2019-10-11 | 南韓商三星電子股份有限公司 | Semiconductor device and method of fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
JP3191689B2 (en) | 2001-07-23 |
KR980012618A (en) | 1998-04-30 |
KR100286732B1 (en) | 2001-07-12 |
JPH1041411A (en) | 1998-02-13 |
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