TW202209294A - Pixel array - Google Patents
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Description
本發明是有關於一種畫素陣列,且特別是有關於一種具有橫向圖案的畫素陣列。The present invention relates to a pixel array, and more particularly, to a pixel array having a lateral pattern.
隨著科技的進步,大尺寸面板多朝向窄邊框設計的型態發展。目前多採用TGP(Tracking Gate-line in Pixel)窄邊框技術,使在水平方向上延伸的閘極線透過在垂直方向上延伸的轉接元件電性連接至閘極驅動電路,以進一步減少面板邊框的寬度。With the advancement of science and technology, large-size panels are mostly developed towards the design of narrow bezels. At present, TGP (Tracking Gate-line in Pixel) narrow frame technology is mostly used, so that the gate line extending in the horizontal direction is electrically connected to the gate driving circuit through the switching element extending in the vertical direction, so as to further reduce the panel frame. width.
然而,當轉接元件設置於主動區時,轉接元件勢必會與資料線相鄰,易發生與相鄰資料線耦合或產生閘極/汲極電容(gate-drain capacitance,Cgd)等問題,往往影響訊號傳遞的品質,而導致最終呈現的功能不符預期。舉例來說,轉接元件與資料線之間的耦合作用容易使畫素的電壓高於規定值,而於顯示畫面中呈現出一斜線的亮點,影響使用者觀賞體驗。因此如何解決上述問題,已成為目前研發人員所關注的議題。However, when the switching element is arranged in the active area, the switching element is bound to be adjacent to the data line, which is prone to problems such as coupling with the adjacent data line or generating gate-drain capacitance (Cgd). It often affects the quality of signal transmission, resulting in the final function not meeting expectations. For example, the coupling between the switching element and the data line tends to cause the voltage of the pixel to be higher than a predetermined value, and a bright spot with a diagonal line appears on the display screen, which affects the user's viewing experience. Therefore, how to solve the above problems has become a topic that researchers are concerned about at present.
本發明提供一種畫素陣列,其設計可有助於達成窄邊框設計的需求,且可降低線路之間的耦合進而改善畫素陣列的品質。The present invention provides a pixel array, the design of which can help meet the requirements of narrow frame design, and can reduce the coupling between lines and improve the quality of the pixel array.
本發明的至少一實施例提供一種畫素陣列,包括基板、多條橫向訊號線、多條第一縱向訊號線、多條第二縱向訊號線以及多個畫素結構。基板具有主動區及位於主動區外的周邊區。橫向訊號線配置於主動區。第一縱向訊號線自周邊區延伸進主動區,且與橫向訊號線相交。第二縱向訊號線與多條橫向訊號線的其中一者電性連接,且相鄰於至少一條第一縱向訊號線,多條第二縱向訊號線的其中一者包含橫向圖案,其中橫向圖案相鄰於多條橫向訊號線的另一者。畫素結構配置於主動區,且與橫向訊號線及第一縱向訊號線電性連接,多個畫素結構的其中一者被相鄰兩條橫向訊號線以及相鄰兩條第一縱向訊號線圍繞。At least one embodiment of the present invention provides a pixel array including a substrate, a plurality of horizontal signal lines, a plurality of first vertical signal lines, a plurality of second vertical signal lines, and a plurality of pixel structures. The substrate has an active area and a peripheral area outside the active area. The horizontal signal line is arranged in the active area. The first vertical signal line extends from the peripheral area into the active area and intersects with the horizontal signal line. The second vertical signal line is electrically connected to one of the plurality of horizontal signal lines, and is adjacent to the at least one first vertical signal line, and one of the plurality of second vertical signal lines includes a horizontal pattern, wherein the horizontal pattern is the same as the one of the horizontal pattern. adjacent to the other of the plurality of lateral signal lines. The pixel structure is arranged in the active area and is electrically connected with the horizontal signal line and the first vertical signal line. One of the plurality of pixel structures is connected by two adjacent horizontal signal lines and two adjacent first vertical signal lines. around.
在本發明的一實施例中,上述橫向圖案的長度大於或等於多個畫素結構的其中一者的橫向寬度。In an embodiment of the present invention, the length of the lateral pattern is greater than or equal to the lateral width of one of the plurality of pixel structures.
在本發明的一實施例中,上述多條第二縱向訊號線的至少一者包含橫向圖案,且多條第二縱向訊號線的至少一者不包含橫向圖案。In an embodiment of the present invention, at least one of the plurality of second vertical signal lines includes a horizontal pattern, and at least one of the plurality of second vertical signal lines does not include a horizontal pattern.
在本發明的一實施例中,每一上述多條第二縱向訊號線包含橫向圖案。In an embodiment of the present invention, each of the plurality of second vertical signal lines includes a horizontal pattern.
在本發明的一實施例中,上述包含橫向圖案的第二縱向訊號線更包含第一縱向圖案及第二縱向圖案,其中第一縱向圖案及第二縱向圖案分別鄰接於橫向圖案的兩端,且分別相鄰於兩條第一縱向訊號線。並且,第一縱向圖案、橫向圖案以及第二縱向圖案依序電性連接。In an embodiment of the present invention, the second vertical signal line including the horizontal pattern further includes a first vertical pattern and a second vertical pattern, wherein the first vertical pattern and the second vertical pattern are respectively adjacent to both ends of the horizontal pattern, and are respectively adjacent to the two first vertical signal lines. Moreover, the first vertical pattern, the horizontal pattern and the second vertical pattern are electrically connected in sequence.
在本發明的一實施例中,上述第一縱向圖案與第二縱向圖案位於相同膜層中,且橫向圖案所在的膜層不同於第一縱向圖案與第二縱向圖案所在的膜層。In an embodiment of the present invention, the first longitudinal pattern and the second longitudinal pattern are located in the same film layer, and the film layer where the transverse pattern is located is different from the film layer where the first longitudinal pattern and the second longitudinal pattern are located.
在本發明的一實施例中,上述畫素陣列更包括第一轉接結構及第二轉接結構,其中第一轉接結構配置於主動區,且在畫素陣列的俯視圖中,第一轉接結構設置於第一縱向圖案與橫向圖案的相交處;第二轉接結構配置於主動區,且在畫素陣列的俯視圖中,第二轉接結構設置於第二縱向圖案與橫向圖案的相交處。並且,第一縱向圖案透過第一轉接結構連接橫向圖案,橫向圖案透過第二轉接結構連接第二縱向圖案。In an embodiment of the present invention, the pixel array further includes a first switching structure and a second switching structure, wherein the first switching structure is disposed in the active area, and in a top view of the pixel array, the first switching structure is The connection structure is arranged at the intersection of the first longitudinal pattern and the horizontal pattern; the second connection structure is arranged in the active area, and in the top view of the pixel array, the second connection structure is arranged at the intersection of the second longitudinal pattern and the transverse pattern place. In addition, the first vertical pattern is connected to the horizontal pattern through the first transfer structure, and the horizontal pattern is connected to the second vertical pattern through the second transfer structure.
在本發明的一實施例中,上述第一縱向圖案的沿縱向方向上的長度大於或等於a個畫素結構,上述第二縱向圖案的沿縱向方向上的長度大於或等於b個畫素結構,其中a、b為正整數。In an embodiment of the present invention, the length of the first longitudinal pattern in the longitudinal direction is greater than or equal to a pixel structure, and the length of the second longitudinal pattern in the longitudinal direction is greater than or equal to b pixel structures , where a and b are positive integers.
在本發明的一實施例中,上述b為1。In an embodiment of the present invention, the above-mentioned b is 1.
在本發明的一實施例中,上述畫素陣列更包括多個閘極驅動墊,其中多個閘極驅動墊橫向依序排列於周邊區,且每一閘極驅動墊分別電性連接對應的第二縱向訊號線。In an embodiment of the present invention, the above-mentioned pixel array further includes a plurality of gate driving pads, wherein the plurality of gate driving pads are arranged in a lateral order in the peripheral region, and each gate driving pad is electrically connected to a corresponding The second vertical signal line.
在本發明的一實施例中,上述畫素陣列更包括定電壓線,其中定電壓線配置於周邊區,且具有主線段及支線段。主線段與橫向訊號線平行,支線段自主線段沿多條第一縱向訊號線的其中一者延伸,且跨越c個畫素結構,其中c為正整數。在畫素陣列的俯視圖中,支線段相對於主線段的一端與第二縱向訊號線及橫向訊號線的電性連接處相隔一距離,所述距離小於多個畫素結構的其中一者的縱向長度。In an embodiment of the present invention, the above-mentioned pixel array further includes constant voltage lines, wherein the constant voltage lines are arranged in the peripheral region and have main line segments and branch line segments. The main line segment is parallel to the horizontal signal line, and the branch line segment extends along one of the plurality of first vertical signal lines from the main line segment and spans c pixel structures, wherein c is a positive integer. In the top view of the pixel array, one end of the branch line segment relative to the main line segment is separated by a distance from the electrical connection between the second vertical signal line and the horizontal signal line, and the distance is smaller than the longitudinal direction of one of the plurality of pixel structures length.
在本發明的一實施例中,上述距離為3 μm~5 μm。In an embodiment of the present invention, the above distance is 3 μm˜5 μm.
在本發明的一實施例中,上述畫素陣列更包括絕緣層,其中絕緣層覆蓋第一縱向訊號線與第二縱向訊號線,且具有溝槽。溝槽沿著第一縱向訊號線與第二縱向訊號線延伸,且溝槽在基板的投影位於第一縱向訊號線在基板的投影與第二縱向訊號線在基板的投影之間。In an embodiment of the present invention, the pixel array further includes an insulating layer, wherein the insulating layer covers the first vertical signal line and the second vertical signal line and has grooves. The groove extends along the first longitudinal signal line and the second longitudinal signal line, and the projection of the groove on the substrate is located between the projection of the first longitudinal signal line on the substrate and the projection of the second longitudinal signal line on the substrate.
基於上述,本發明藉由其中一條第二縱向訊號線包含橫向圖案,能夠將第二縱向訊號線在縱向方向適度地分段,可降低第二縱向訊號線對相鄰第一縱向訊號線傳遞訊號時所產生的耦合現象,有助於在達成窄邊框設計需求的同時,還可降低線路之間的耦合進而改善畫素陣列的品質。Based on the above, in the present invention, one of the second longitudinal signal lines includes a horizontal pattern, so that the second longitudinal signal lines can be appropriately segmented in the longitudinal direction, thereby reducing the transmission of signals from the second longitudinal signal lines to the adjacent first longitudinal signal lines. The coupling phenomenon generated during the process helps to reduce the coupling between the lines and improve the quality of the pixel array while meeting the requirements of the narrow frame design.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在「另一元件上」、或「連接到另一元件」、「重疊於另一元件」時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」或「耦合」係可為二元件間存在其它元件。In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on," "connected to," "overlying" another element, it can be directly on the other element on or connected to another element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may refer to the existence of other elements between the two elements.
應當理解,儘管術語「第一」、「第二」、「第三」等在本文中可以用於描述各種元件、部件、區域、層及/或部分,但是這些元件、部件、區域、及/或部分不應受這些術語的限制。這些術語僅用於將一個元件、部件、區域、層或部分與另一個元件、部件、區域、層或部分區分開。因此,下面討論的「第一元件」、「部件」、「區域」、「層」、或「部分」可以被稱為第二元件、部件、區域、層或部分而不脫離本文的教導。It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or or parts shall not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, "a first element," "component," "region," "layer," or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.
這裡使用的術語僅僅是為了描述特定實施例的目的,而不是限制性的。如本文所使用的,除非內容清楚地指示,否則單數形式「一」、「一個」和「該」旨在包括複數形式,包括「至少一個」。「或」表示「及/或」。如本文所使用的,術語「及/或」包括一個或多個相關所列項目的任何和所有組合。還應當理解,當在本說明書中使用時,術語「包括」及/或「包括」指定所述特徵、區域、整體、步驟、操作、元件的存在及/或部件,但不排除一個或多個其它特徵、區域整體、步驟、操作、元件、部件及/或其組合的存在或添加。The terminology used herein is for the purpose of describing particular embodiments only and is not limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms including "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will also be understood that, when used in this specification, the terms "comprising" and/or "comprising" designate the stated feature, region, integer, step, operation, presence of an element and/or part, but do not exclude one or more The presence or addition of other features, entireties of regions, steps, operations, elements, components, and/or combinations thereof.
此外,諸如「下」或「底部」和「上」或「頂部」的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其他元件的「下」側的元件將被定向在其他元件的「上」側。因此,示例性術語「下」可以包括「下」和「上」的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件「下方」或「下方」的元件將被定向為在其它元件「上方」。因此,示例性術語「下面」或「上面」可以包括上方和下方的取向。Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the figures. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "above" can encompass both an orientation of above and below.
本文使用的「約」、或「大致上」包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,「約」可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的「約」、或「大致上」可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about", or "substantially" includes the stated value and the average value within an acceptable deviation of the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the error associated with the measurement a specific amount (i.e., the limits of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", or "substantially" may be used to select a more acceptable range of variation or standard deviation depending on optical properties, etching properties, or other properties, and not one standard deviation may apply to all properties.
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.
本文參考作為理想化實施例的示意圖的截面圖來描述示例性實施例。因此,可以預期到作為例如製造技術及/或公差的結果的圖示的形狀變化。因此,本文所述的實施例不應被解釋為限於如本文所示的區域的特定形狀,而是包括例如由製造導致的形狀偏差。例如,示出或描述為平坦的區域通常可以具有粗糙及/或非線性特徵。此外,所示的銳角可以是圓的。因此,圖中所示的區域本質上是示意性的,並且它們的形狀不是旨在示出區域的精確形狀,並且不是旨在限制權利要求的範圍。Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Thus, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and/or tolerances, are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions as shown herein, but rather include deviations in shapes resulting from, for example, manufacturing. For example, regions illustrated or described as flat may typically have rough and/or nonlinear features. Additionally, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
圖1A是依照本發明的第一實施例的一種畫素陣列的俯視示意圖;圖1B是圖1A的畫素陣列中沿剖線A-A’的剖面示意圖。為方便說明,圖1A中省略繪示絕緣層的位置及部分畫素結構PX。FIG. 1A is a schematic top view of a pixel array according to a first embodiment of the present invention; FIG. 1B is a schematic cross-sectional view of the pixel array of FIG. 1A along the line A-A'. For the convenience of description, the position of the insulating layer and part of the pixel structure PX are omitted in FIG. 1A .
請同時參照圖1A及圖1B,畫素陣列10包括基板100、多條橫向訊號線GL、多條第一縱向訊號線DL、多條第二縱向訊號線110以及多個畫素結構PX。基板100可具有主動區AA以及位於主動區AA外的周邊區BA。在本實施例中,基板100的材料可包括玻璃或其他適宜的材料等,但本發明不以此為限。1A and 1B, the
橫向訊號線GL配置於基板100的主動區AA上,且沿著橫向方向X延伸。在本實施例中,多條橫向訊號線GL可包括橫向訊號線GL1、橫向訊號線GL2、…、橫向訊號線GLn,其中n為正整數。橫向訊號線GL1、橫向訊號線GL2、…、橫向訊號線GLn例如依序沿縱向方向Y排列,如圖1A所示,橫向訊號線GL1、橫向訊號線GL2、…、橫向訊號線GLn例如是由基板100的上側至基板100的下側依序排列於基板100上。橫向方向X與縱向方向Y交錯。舉例而言,在本實施例中,橫向方向X與縱向方向Y可垂直,但本發明不以此為限。以下實施例描述的橫向與縱向可分別視為圖1A中的橫向方向X與縱向方向Y。在本實施例中,橫向訊號線GL可為閘極線。The lateral signal line GL is disposed on the active area AA of the
第一縱向訊號線DL配置於基板100上,並自周邊區BA延伸進主動區AA,且與多條橫向訊號線GL相交。在本實施例中,多條第一縱向訊號線DL可包括第一縱向訊號線DL1、第一縱向訊號線DL2、…、第一縱向訊號線DLm+1,其中m為正整數。第一縱向訊號線DL1、第一縱向訊號線DL2、…、第一縱向訊號線DLm+1例如依序沿橫向方向X排列,如圖1A所示,第一縱向訊號線DL1、第一縱向訊號線DL2、…、第一縱向訊號線DLm+1例如是由基板100的左側至基板100的右側依序排列於基板100上。在本實施例中,第一縱向訊號線DL可為資料線。The first vertical signal line DL is disposed on the
第二縱向訊號線110配置於基板100上。在本實施例中,在橫向方向X上,第二縱向訊號線110與至少一條第一縱向訊號線DL相鄰。在本實施例中,第二縱向訊號線110的延伸方向大體上可平行於第一縱向訊號線DL。舉例來說,第二縱向訊號線110與第一縱向訊號線DL可以是相互平行的線型圖案,也可以具有相互平行的曲折圖案,但本發明不以此為限。在本實施例中,第二縱向訊號線110可作為閘極轉接線,而與其中一條橫向訊號線GL電性連接。另外,為了避免橫向訊號線GL與第二縱向訊號線110之間的短路,橫向訊號線GL與第二縱向訊號線110可由不同膜層構成,且橫向訊號線GL與第二縱向訊號線110之間可夾有一或多層絕緣層。在一些實施例中,第一縱向訊號線DL及第二縱向訊號線110可位於相同的膜層,且橫向訊號線GL可位於與第一縱向訊號線DL及第二縱向訊號線110不同的膜層中。在一些實施例中,第二縱向訊號線110可包括透過對應的導通結構CS連接於對應的該橫向訊號線GL。在一些實施例中,其中一條第二縱向訊號線110包含橫向圖案114,其中橫向圖案114相鄰於未與所述第二縱向訊號線110電性連接的另一條橫向訊號線GL,但本發明不以此為限。舉例來說,如圖1A所示,圖1A中最左側的第二縱向訊號線110-1可透過位於最上列但非位於自左方起算第一行的導通結構CS1而電性連接至最上列的橫向訊號線GL1。更具體而言,位於第一行的第二縱向訊號線110-1是於相鄰於橫向訊號線GL2處藉由長度至少橫跨六個畫素結構PX的橫向寬度Wx的橫向圖案114-1以及相鄰於第一縱向訊號線DL7且長度至少跨越一個畫素結構PX的縱向長度Wy的第二縱向圖案116而與橫向訊號線GL1連接。The second
多個畫素結構PX以陣列排列的方式配置於基板100的主動區AA上。換句話說,畫素結構PX沿著橫向方向X以及縱向方向Y呈現陣列排列。在本實施例中,每一畫素結構PX與其中一條橫向訊號線GL以及其中一條第一縱向訊號線DL電性連接。另外,第二縱向訊號線110沒有直接連接畫素結構PX。舉例來說,每一畫素結構PX可包括薄膜電晶體(未繪示)及畫素電極(未繪示),其中所述薄膜電晶體的源極與閘極可分別電性連接至對應的一條第一縱向訊號線DL及對應的一條橫向訊號線GL,而所述畫素電極電性連接至所述薄膜電晶體的汲極。A plurality of pixel structures PX are arranged in an array on the active area AA of the
多個畫素結構PX可沿橫向方向X依序排列成畫素列R1~畫素列Rn(以下有時略稱為多個畫素列R),且可沿縱向方向Y依序排列成畫素行C1~畫素行Cm(以下有時略稱為多個畫素行C),其中n及m可與上述多條橫向訊號線GL的n及多條第一縱向訊號線DL的m同義。舉例來說,多個畫素列R在縱向方向Y上依序排列;每一畫素列R的多個畫素結構PX在橫向方向X上依序排列。多個畫素行C在橫向方向X上依序排列;每一畫素行C的多個畫素結構PX在縱向方向Y上依序排列,但本發明不以此為限。在本實施例中,位於畫素行Cx及畫素列Ry的一畫素結構PX的座標為(x, y),以下表示為畫素結構PXxy,其中x及y為正整數,且1≦x≦m,1≦y≦n。舉例來說,位於畫素行C1及畫素列R1的一畫素結構PX的座標為(1, 1),以下表示為畫素結構PX11;位於畫素行C1及畫素列Rn的一畫素結構PX的座標為(1, n),以下表示為畫素結構PX1n;位於畫素行Cm及畫素列Rn的一畫素結構PX的座標為(m, n),以下表示為畫素結構PXmn。The plurality of pixel structures PX can be sequentially arranged in the horizontal direction X to form pixel rows R1 to Rn (hereinafter sometimes abbreviated as a plurality of pixel rows R), and can be sequentially arranged in the vertical direction Y to form a pixel row Rn. Pixel row C1 to pixel row Cm (hereinafter sometimes abbreviated as a plurality of pixel rows C), wherein n and m may be synonymous with n of the plurality of horizontal signal lines GL and m of the plurality of first vertical signal lines DL. For example, the plurality of pixel rows R are sequentially arranged in the longitudinal direction Y; the plurality of pixel structures PX of each pixel row R are sequentially arranged in the lateral direction X. The plurality of pixel rows C are sequentially arranged in the lateral direction X; the plurality of pixel structures PX of each pixel row C are sequentially arranged in the longitudinal direction Y, but the invention is not limited to this. In this embodiment, the coordinates of a pixel structure PX located in the pixel row Cx and the pixel row Ry are (x, y), and the following is represented as a pixel structure PXxy, where x and y are positive integers, and 1≦x ≦m, 1≦y≦n. For example, the coordinates of a pixel structure PX located in pixel row C1 and pixel row R1 are (1, 1), and the following is denoted as pixel structure PX11; a pixel structure located in pixel row C1 and pixel row Rn The coordinates of PX are (1, n), and the following is denoted as the pixel structure PX1n; the coordinates of a pixel structure PX located in the pixel row Cm and the pixel row Rn are (m, n), and the following is denoted as the pixel structure PXmn.
在本實施例中,其中一畫素結構PX被相鄰兩條橫向訊號線GL以及相鄰兩條第一縱向訊號線DL圍繞。舉例來說,以畫素結構PX11為例,畫素結構PX11被橫向訊號線GL1、橫向訊號線GL2、第一縱向訊號線DL1及第一縱向訊號線DL2圍繞。在本實施例中,同一畫素行C的多個畫素結構PX可選擇性地電性連接至同一條第一縱向訊號線DL,且相鄰之兩畫素列R的多個畫素結構PX可分別電性連接至不同的多個橫向訊號線GL。簡言之,在本實施例中,畫素陣列10可採一條閘極線一條資料線(one gate line and one data line,1G1D)的驅動方式,但本發明不以此為限。在一些實施例中,同一畫素行C的多個畫素結構PX可選擇性地依序與不同側的第一縱向訊號線DL電性連接。舉例來說,在畫素行C1中,如畫素結構PX11等位於單數列的畫素結構PX可電性連接位於第一側(如圖1A的左側)的第一縱向訊號線DL1,另一方面,如畫素結構PX12等位於雙數列的畫素結構PX可電性連接位於第二側(如圖1A的右側)的第一縱向訊號線DL2,但本發明不限於此。In this embodiment, a pixel structure PX is surrounded by two adjacent horizontal signal lines GL and two adjacent first vertical signal lines DL. For example, taking the pixel structure PX11 as an example, the pixel structure PX11 is surrounded by the horizontal signal line GL1 , the horizontal signal line GL2 , the first vertical signal line DL1 and the first vertical signal line DL2 . In this embodiment, a plurality of pixel structures PX in the same pixel row C can be selectively electrically connected to the same first vertical signal line DL, and a plurality of pixel structures PX in two adjacent pixel rows R They can be respectively electrically connected to a plurality of different lateral signal lines GL. In short, in this embodiment, the
在本實施例中,畫素陣列10於周邊區BA還可具有多個閘極驅動墊GD。多個閘極驅動墊GD可橫向依序排列於基板100的周邊區BA,且每一閘極驅動墊GD電性連接其中一條第二縱向訊號線110。舉例來說,多個閘極驅動墊GD可包括閘極驅動墊GD1、閘極驅動墊GD2、…、閘極驅動墊GDp,其中p為正整數,閘極驅動墊GD1、閘極驅動墊GD2、…、閘極驅動墊GDp可依序分別與對應的第二縱向訊號線110-1、第二縱向訊號線110-2、…、第二縱向訊號線110-p電性連接。在一些實施例中,在第二縱向訊號線110-1、第二縱向訊號線110-2、…、第二縱向訊號線110-p分別與不同的多個橫向訊號線GL電性連接處可設置有對應的導通結構CS1、導通結構CS2、…、導通結構CSp,但本發明不以此為限。舉例來說,如圖1A所示,第二縱向訊號線110-1的一端連接於閘極驅動墊GD1,第二縱向訊號線110-1的另一端透過導通結構CS1而與橫向訊號線GL1電性連接。In this embodiment, the
請參照圖1A,值得注意的是,本實施例之畫素陣列10中的至少一條第二縱向訊號線110包含橫向圖案114,藉由橫向圖案114能夠將第二縱向訊號線110在縱向方向適度地分段,可降低第二縱向訊號線110對相鄰第一縱向訊號線DL傳遞訊號時所產生的耦合現象,進而改善畫素陣列的品質。在本實施例之畫素陣列10中,至少一條第二縱向訊號線110不包含橫向圖案114。舉例來說,如圖1A所示,第二縱向訊號線110-1、第二縱向訊號線110-3包含橫向圖案114,第二縱向訊號線110-2、第二縱向訊號線110-4不包含橫向圖案114,但本發明不限於此。Please refer to FIG. 1A , it is worth noting that at least one second
在一些實施例中,橫向圖案114沿橫向方向X延伸的長度L大於等於一個畫素結構PX的橫向寬度Wx。舉例來說,第二縱向訊號線110-3的橫向圖案114-3大致上自第一縱向訊號線DL7延伸至第一縱向訊號線DL13,換言之,橫向圖案114-3大致上跨越了六個畫素結構PX。也就是說,橫向圖案114-3的長度L例如相當於六個畫素結構PX的橫向寬度Wx的總和。在一些實施例中,橫向圖案114的長度L可相當於一個畫素結構PX的橫向寬度Wx,所屬領域中具有通常知識者可依據設計需求調整橫向圖案的長度,本發明並不以此為限。In some embodiments, the length L of the
在本實施例中,包含有橫向圖案114的第二縱向訊號線110還可包含第一縱向圖案112以及第二縱向圖案116。第一縱向圖案112及第二縱向圖案116例如分別鄰接於橫向圖案114的兩端,且第一縱向圖案112及第二縱向圖案116分別相鄰於不同的第一縱向訊號線DL。在一些實施例中,第一縱向圖案112可電性連接對應的閘極驅動墊GD;第二縱向圖案116可電性連接對應的橫向訊號線GL。藉此,來自閘極驅動源(未繪示)的訊號經由對應的閘極驅動墊GD傳遞至對應的第二縱向訊號線110,再經由第二縱向訊號線110將訊號經由橫向圖案114或直接傳遞給橫向訊號線GL,再由橫向訊號線GL輸入給位於同一列畫素結構PX的閘極,藉此開啟或關閉該列畫素結構PX的薄膜電晶體。舉例來說,第二縱向訊號線110-1的第一縱向圖案112-1自閘極驅動墊GD1沿第一縱向訊號線DL1延伸至橫向圖案114-1,橫向圖案114-1沿橫向訊號線GL2延伸至第二縱向圖案116-1,第二縱向圖案116-1再沿著第一縱向訊號線DL7延伸至橫向訊號線GL1,並且第一縱向圖案112、橫向圖案114及第二縱向圖案116依序電性連接。In this embodiment, the second
請參照圖1B,圖1B是圖1A的畫素陣列中沿剖線A-A’的剖面示意圖。第一縱向圖案112與第二縱向圖案116位於相同膜層中,且橫向圖案114所在的膜層不同於第一縱向圖案112與第二縱向圖案116所在的膜層。舉例來說,橫向圖案114可與橫向訊號線GL位於第一導體層M1,第一縱向圖案112與第二縱向圖案116可與第一縱向訊號線DL位於第一導體層M1上方的第二導體層M2,但本發明不以此為限。在一些實施例中,第一導體層M1及第二導體層M2之間還夾設有第一絕緣層I1,在第二導體層M2上還覆蓋有第二絕緣層I2。絕緣層I1具有第一通孔V1及第二通孔V2,在基板100的俯視方向上,第一通孔V1及第二通孔V2例如分別與第一縱向圖案112及第二縱向圖案116重疊,且第一通孔V1及第二通孔V2例如暴露出橫向圖案114的一部分。另外,第一轉接結構120可設置於第一通孔V1內,第二轉接結構122可設置於第二通孔V2內,換句話說,如圖1A所示,第一轉接結構120可設置於第一縱向圖案112與橫向圖案114的相交處,第二轉接結構122可設置於第二縱向圖案116與橫向圖案114的相交處。藉此,第一縱向圖案112可透過第一轉接結構120連接橫向圖案114,橫向圖案114可透過第二轉接結構122連接第二縱向圖案116。如此,閘極需要的訊號可藉由第二縱向訊號線110的橫向圖案114在不同膜層之間傳遞,以跨越多條第一縱向訊號線DL,使得第二縱向訊號線110的佈線設計較不受限,且可用於調整第二縱向訊號線110與對應的橫向訊號線GL的電性連接處(例如導通結構CS的位置)。Please refer to FIG. 1B . FIG. 1B is a schematic cross-sectional view of the pixel array of FIG. 1A along the line A-A'. The first
在本實施例中,不包含橫向圖案114的第二縱向訊號線110可散亂地穿插於同一第二縱向訊號線110所具有的第一縱向圖案112及第二縱向圖案116之間。舉例來說,如圖1A所示,在基板100的俯視方向上,第二縱向訊號線110-2例如位於第二縱向訊號線110-1的第一縱向圖案112-1及第二縱向圖案116-1之間;第二縱向訊號線110-4例如位於第二縱向訊號線110-3的第一縱向圖案112-3及第二縱向圖案116-3之間。如此一來,多個導通結構CS可散亂地分佈在畫素陣列10上(例如圖1A所示),使得由第一縱向訊號線DL與第二縱向訊號線110之耦合效應所引起的亮度異常(例如:偏亮)的多個畫素結構PX也會散亂地分佈在畫素陣列10上。由於亮度異常(例如:偏亮)的多個畫素結構PX是散亂地分佈在畫素陣列10上,因此人眼不易察覺由第一縱向訊號線DL與第二縱向訊號線110之耦合效應所引起的顯示畫面異常(例如呈現一對應於基板對角線的亮線)。此外,本實施例之畫素陣列10藉由有意地使導通結構CS散亂分佈的布局設計,可以減少需於周邊區BA額外設置周邊電路走線來使第二縱向訊號線110與橫向訊號線GL的導通結構CS亂序化的空間,實現窄邊框的設計。In this embodiment, the second
圖2是依照本發明的第二實施例的一種畫素陣列的俯視示意圖。為方便說明,圖2中省略繪示絕緣層的位置及部分畫素結構PX。在此必須說明的是,圖2沿用圖1A及圖1B的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參照前述實施例,在此不贅述。FIG. 2 is a schematic top view of a pixel array according to a second embodiment of the present invention. For the convenience of description, the position of the insulating layer and part of the pixel structure PX are omitted from illustration in FIG. 2 . It must be noted here that FIG. 2 uses the element numbers and part of the content of the embodiment in FIGS. 1A and 1B , wherein the same or similar numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.
請參照圖2,第二實施例的畫素陣列20與第一實施例的畫素陣列10的不同處為本實施例之畫素陣列20還具有定電壓線200。定電壓線200可提供一固定電壓。在本實施例中,定電壓線200可提供例如源自驅動元件的低準位電壓Vgl(例如相較於第二縱向訊號線110所傳遞的高準位電壓Vgh),但本發明不以此為限。在一些實施例中,定電壓線200可具有橫向延伸的主線段202及縱向延伸的支線段204。主線段202例如與橫向訊號線GL平行。支線段204例如自主線段202沿多條第一縱向訊號線DL的其中一者延伸,且跨越c個畫素結構PX,其中c為正整數。在一些實施例中,在基板100的主動區AA中,以圖2中標示為110-p的第二縱向訊號線為例,基板100的主動區AA沿縱向方向Y的長度D1相當於第二縱向訊號線110沿縱向方向Y的長度D2與支線段204沿縱向方向Y的長度D3的總和,但本發明不以此為限。Referring to FIG. 2 , the difference between the
在本實施例中,在縱向方向Y上,第二縱向訊號線110例如僅延伸至導通結構CS處,支線段204可重疊於第二縱向訊號線110的延伸方向上。在基板100的俯視方向上,支線段204的相對於主線段202的一端與第二縱向訊號線110及橫向訊號線GL的電性連接處(例如導通結構CS)可相隔一距離D4,使得位於同一延伸線上的主線段202與第二縱向訊號線110彼此電性分離,分別傳送不同的訊號。主線段202與第二縱向訊號線110之間的距離D4例如小於一個畫素結構PX的縱向長度Wy。舉例來說,距離D4約為3 μm~5 μm,距離D4只要能使主線段202與第二縱向訊號線110的訊號不彼此干擾即可,本發明不以此為限。In this embodiment, in the longitudinal direction Y, for example, the second
藉此,同一第一縱向訊號線DL在緊鄰於定電壓線200的支線段204處例如感受到低準位電壓Vgl,在緊鄰於第二縱向訊號線110處例如感受到高準位電壓Vgh,如此可減少第一縱向訊號線DL感受到高準位電壓Vgh的範圍,而可避免第一縱向訊號線DL與第二縱向訊號線110之間耦合效應的產生,且可確保第一縱向訊號線DL維持一定準位的輸出電壓,進而改善畫素陣列的品質。Thereby, the same first vertical signal line DL experiences, for example, a low-level voltage Vgl at the
圖3A是依照本發明的第三實施例的一種畫素陣列的俯視示意圖;圖3B是圖3A的畫素陣列中沿剖線A-A’的剖面示意圖;圖4是依照本發明的第三實施例的另一種畫素陣列的俯視示意圖。為方便說明,圖3A及圖4中省略繪示絕緣層的位置及部分畫素結構PX。在此必須說明的是,圖3A、圖3B及圖4沿用圖2的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參照前述實施例,在此不贅述。3A is a schematic top view of a pixel array according to a third embodiment of the present invention; FIG. 3B is a schematic cross-sectional view of the pixel array in FIG. 3A along the line AA'; A schematic top view of another pixel array of the embodiment. For convenience of description, the position of the insulating layer and part of the pixel structure PX are omitted in FIGS. 3A and 4 . It must be noted here that FIGS. 3A , 3B and 4 follow the element numbers and part of the content of the embodiment in FIG. 2 , wherein the same or similar numbers are used to represent the same or similar elements, and the same technical content is omitted. illustrate. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.
請參照圖3A及圖4,第三實施例的畫素陣列30A及畫素陣列30B相較於第二實施例的畫素陣列20的不同處為每一第二縱向訊號線310包含橫向圖案314。亦即,前述實施例之畫素陣列10與畫素陣列20中的導通結構CS在綜觀上呈散亂分佈,相對於此,第三實施例的畫素陣列30A及畫素陣列30B中的導通結構CS並非是散亂排列的,而是大致上排列於一直線上。在本實施例中,每一第二縱向訊號線310的橫向圖案314可跨越同等數量的畫素結構PX。舉例來說,如圖3A及圖4所示,每一第二縱向訊號線310的橫向圖案314跨越相當於三個畫素結構PX的寬度。換言之,如圖3B所示,第二縱向訊號線310的橫向圖案314可跨越三條第一縱向訊號線DL,但本發明不以此為限。在其他實施例中,每一第二縱向訊號線310的橫向圖案314也可跨越不同數量的畫素結構PX,可依據設計需求調整第二縱向訊號線310的橫向圖案314所跨越的畫素結構PX的數量。Referring to FIGS. 3A and 4 , the difference between the
在一些實施例中,每一第二縱向訊號線310的第一縱向圖案312在縱向方向Y上可跨越a個畫素結構PX,第二縱向圖案316在縱向方向Y上可跨越b個畫素結構PX,其中a、b為正整數。換言之,在基板100的主動區AA中,第一縱向圖案312在縱向方向Y上的長度La可大於或等於a個畫素結構PX的縱向長度Wy的總和,第二縱向圖案316在縱向方向Y上的長度Lb可大於或等於b個畫素結構PX的縱向長度Wy的總和。In some embodiments, the first
在一些實施例中,每一第二縱向訊號線310的第一縱向圖案312在縱向方向Y上的長度La可彼此不相同,但本發明不以此為限。在其他實施例中,每一第二縱向訊號線310的第一縱向圖案312在縱向方向Y上的長度La也可彼此相同,可依據設計需求調整第一縱向圖案312在縱向方向Y上的長度La。In some embodiments, the lengths La of the first
在一些實施例中,第二縱向圖案316在縱向方向Y上的長度Lb可彼此相同。在一些實施例中,第二縱向圖案316在縱向方向Y上的長度Lb可小於第一縱向圖案312在縱向方向Y上的長度La。由於第二縱向訊號線310的第二縱向圖案316連接導通結構CS,當訊號寫入至緊鄰於該導通結構CS的畫素結構PX時容易因第二縱向訊號線310與第一縱向訊號線DL之間產生的耦合效應影響畫素結構的閘極/汲極電容,因此第二縱向圖案316的長度Lb小於第一縱向圖案312的長度La可進一步避免第二縱向訊號線310與第一縱向訊號線DL之間產生耦合效應。舉例來說,如圖4所示,每一第二縱向訊號線310的第二縱向圖案316在縱向方向Y上可相當於跨越一個畫素結構PX,即b可為1,換言之,第二縱向圖案316在縱向方向Y上的長度Lb可相當於一個畫素結構PX的縱向長度Wy,但本發明不以此為限。以圖中第二縱向訊號線310-2為例,第二縱向訊號線310-2於預定時序中經由導通結構CS2開啟圖中畫素列R1的畫素結構PX,被開啟的畫素列R1的畫素結構PX分別經由對應的第一縱向訊號線DL7被輸入對應的訊號,此時,由於靠近正在訊號寫入之畫素列R1畫素結構PX的第二縱向圖案316的長度Lb較短,使得第二縱向圖案316的訊號對與其相鄰之第一縱向訊號線DL7的訊號耦合影響較為有限,故能有效降低第二縱向訊號線310-2與第一縱向訊號線DL7之耦合效應所引起的顯示畫面異常。In some embodiments, lengths Lb of the second
如此一來,藉由每一第二縱向訊號線310包含橫向圖案314,可減少第二縱向訊號線310於第二縱向圖案316的長度,而可避免第二縱向訊號線310與第一縱向訊號線DL之間產生耦合效應,而可減少閘極/汲極電容。另外,即使因第一縱向訊號線DL與第二縱向訊號線110之耦合效應造成多個畫素結構PX的亮度異常,由於所產生的亮度變化量並不明顯,因此人眼仍不易察覺由第一縱向訊號線DL與第二縱向訊號線110之耦合效應所引起的顯示畫面異常。In this way, because each second
圖5是依照本發明的第四實施例的一種畫素陣列的局部俯視示意圖。為方便說明,圖5中省略繪示絕緣層的位置。在此必須說明的是,圖5沿用圖1A的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參照前述實施例,在此不贅述。FIG. 5 is a partial top plan view of a pixel array according to a fourth embodiment of the present invention. For the convenience of description, the position of the insulating layer is omitted in FIG. 5 . It must be noted here that FIG. 5 uses the element numbers and part of the content of the embodiment in FIG. 1A , wherein the same or similar numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.
請參照圖5,第四實施例的畫素陣列40與第一實施例的畫素陣列10的不同處為畫素陣列40還具有絕緣層覆蓋第一縱向訊號線DL與第二縱向訊號線110,且所述絕緣層具有溝槽TR。在本實施例中,共用電極COM可覆蓋溝槽TR的表面。藉此,可用於屏蔽(shielding)第二縱向訊號線110與第一縱向訊號線DL彼此之間的干擾,以降低線路之間的耦合所造成的不良影響。舉例來說,藉由共用電極COM覆蓋溝槽TR的表面且溝槽TR位於第二縱向訊號線110與第一縱向訊號線DL之間,使得第二縱向訊號線110所產生的電場受到屏蔽,而不會耦合至第一縱向訊號線DL,如此可確保第一縱向訊號線DL維持一定準位的輸出電壓,進而改善畫素陣列的品質(例如畫面顯示等)。Referring to FIG. 5 , the difference between the
在本實施例中,溝槽TR沿第一縱向訊號線DL與第二縱向訊號線110的第二縱向圖案116延伸。並且,溝槽TR在基板100的投影例如位於第二縱向訊號線110的第二縱向圖案116在基板100的投影與第一縱向訊號線DL在基板100的投影之間。舉例來說,溝槽TR的側壁分別與第二縱向訊號線110的第二縱向圖案116的側面及第一縱向訊號線DL的側面例如相隔一距離,且所述距離的下限較佳為2.0 μm,更佳為3.0 μm。另外,所述距離的上限較佳為6.0 μm,更佳為5.0 μm。在一些實施例中,溝槽TR可分別與第二縱向訊號線110的第二縱向圖案116及第一縱向訊號線DL相距約2.0 μm~6.0 μm。值得說明的是,溝槽的實施型態可以依據設計需求而進行調整,本發明並不以此為限。In this embodiment, the trench TR extends along the second
舉例來說,以圖1B的實施例為例,溝槽TR可位於第二絕緣層I2內。在一些實施例中,溝槽TR的深度可相當於第二絕緣層I2的膜厚。在一些實施例中,溝槽TR可自第二絕緣層I2延伸至第一絕緣層I1中。舉例來說,溝槽TR的深度可大於第二絕緣層I2的膜厚,且小於第一絕緣層I1的膜厚。在其他實施例中,溝槽TR的深度可小於第二絕緣層I2的膜厚。另外,在一些實施例中,第二絕緣層I2可包括上部絕緣層及下部絕緣層(未繪示),且溝槽TR的深度可相當於上部絕緣層的膜厚。在一些實施例中,溝槽TR可自上部絕緣層延伸至下部絕緣層中。舉例來說,溝槽TR的深度可大於上部絕緣層的膜厚,且小於下部絕緣層的膜厚。在其他實施例中,溝槽TR的深度可小於上部絕緣層的膜厚。For example, taking the embodiment of FIG. 1B as an example, the trench TR may be located in the second insulating layer I2. In some embodiments, the depth of the trench TR may be equivalent to the film thickness of the second insulating layer I2. In some embodiments, the trench TR may extend from the second insulating layer I2 into the first insulating layer I1. For example, the depth of the trench TR may be larger than the film thickness of the second insulating layer I2 and smaller than the film thickness of the first insulating layer I1. In other embodiments, the depth of the trench TR may be smaller than the film thickness of the second insulating layer I2. In addition, in some embodiments, the second insulating layer I2 may include an upper insulating layer and a lower insulating layer (not shown), and the depth of the trench TR may be equivalent to the film thickness of the upper insulating layer. In some embodiments, the trench TR may extend from the upper insulating layer into the lower insulating layer. For example, the depth of the trench TR may be larger than the film thickness of the upper insulating layer and smaller than the film thickness of the lower insulating layer. In other embodiments, the depth of the trench TR may be smaller than the film thickness of the upper insulating layer.
綜上所述,本發明的畫素陣列藉由其中一條第二縱向訊號線包含橫向圖案,能夠將第二縱向訊號線在縱向方向上適度地分段,以減少第二縱向訊號線緊鄰於與橫向訊號線的電性連接處的長度,可降低第二縱向訊號線與相鄰的第一縱向訊號線之間所產生之耦合效應,有助於在達成窄邊框設計需求的同時,改善畫素陣列的品質。To sum up, in the pixel array of the present invention, one of the second vertical signal lines includes a horizontal pattern, so that the second vertical signal lines can be appropriately segmented in the vertical direction, so as to reduce the number of the second vertical signal lines adjacent to the The length of the electrical connection of the horizontal signal line can reduce the coupling effect between the second vertical signal line and the adjacent first vertical signal line, which helps to improve the pixel while meeting the requirements of narrow frame design. the quality of the array.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.
10、20、30A、30B、40:畫素陣列 100:基板 110、110-1~110-4、110-p、310、310-1~310-3:第二縱向訊號線 112、112-1、112-3、312、312-1:第一縱向圖案 114、114-1、114-3、314、314-1:橫向圖案 116、116-1、116-3、316、316-1:第二縱向圖案 120、120-1:第一轉接結構 122、122-1:第二轉接結構 200:定電壓線 202:主線段 204:支線段 AA:主動區 BA:周邊區 C1、Cm:畫素行 CS、CS1~CS4、CSp:導通結構 D1~D4:長度 DL、DL1、DL2、DL7、DL13、DLm+1:第一縱向訊號線 GD、GD1、GD2、GDp:閘極驅動墊 GL、GL1、GL2、GLn:橫向訊號線 I1:第一絕緣層 I2:第二絕緣層 L、La、Lb:長度 M1:第一導體層 M2:第二導體層 PX、PX11、PX12、PX1n、PXmn:畫素結構 R1、Rn:畫素列 TR:溝槽 V1:第一通孔 V2:第二通孔 Vgl:低準位電壓 Vgh:高準位電壓 Wx:橫向寬度 Wy:縱向長度 X:橫向方向 Y:縱向方向10, 20, 30A, 30B, 40: pixel array 100: Substrate 110, 110-1~110-4, 110-p, 310, 310-1~310-3: Second vertical signal line 112, 112-1, 112-3, 312, 312-1: first longitudinal pattern 114, 114-1, 114-3, 314, 314-1: Horizontal pattern 116, 116-1, 116-3, 316, 316-1: Second longitudinal pattern 120, 120-1: The first transfer structure 122, 122-1: The second switching structure 200: constant voltage line 202: main line segment 204: Branch segment AA: Active area BA: Surrounding area C1, Cm: pixel row CS, CS1 to CS4, CSp: On structure D1~D4: Length DL, DL1, DL2, DL7, DL13, DLm+1: The first vertical signal line GD, GD1, GD2, GDp: Gate drive pads GL, GL1, GL2, GLn: Horizontal signal lines I1: first insulating layer I2: Second insulating layer L, La, Lb: length M1: first conductor layer M2: second conductor layer PX, PX11, PX12, PX1n, PXmn: pixel structure R1, Rn: pixel column TR: groove V1: first through hole V2: second via Vgl: low level voltage Vgh: high level voltage Wx: horizontal width Wy: Vertical length X: landscape orientation Y: portrait orientation
圖1A是依照本發明的第一實施例的一種畫素陣列的俯視示意圖。 圖1B是圖1A的畫素陣列中沿剖線A-A’的剖面示意圖。 圖2是依照本發明的第二實施例的一種畫素陣列的俯視示意圖。 圖3A是依照本發明的第三實施例的一種畫素陣列的俯視示意圖。 圖3B是圖3A的畫素陣列中沿剖線A-A’的剖面示意圖。 圖4是依照本發明的第三實施例的另一種畫素陣列的俯視示意圖。 圖5是依照本發明的第四實施例的一種畫素陣列的局部俯視示意圖。FIG. 1A is a schematic top view of a pixel array according to a first embodiment of the present invention. Fig. 1B is a schematic cross-sectional view along the line A-A' of the pixel array of Fig. 1A. FIG. 2 is a schematic top view of a pixel array according to a second embodiment of the present invention. 3A is a schematic top view of a pixel array according to a third embodiment of the present invention. Fig. 3B is a schematic cross-sectional view along the line A-A' of the pixel array of Fig. 3A. FIG. 4 is a schematic top view of another pixel array according to the third embodiment of the present invention. FIG. 5 is a partial top plan view of a pixel array according to a fourth embodiment of the present invention.
10:畫素陣列10: Pixel array
100:基板100: Substrate
110、110-1~110-4、110-p:第二縱向訊號線110, 110-1~110-4, 110-p: The second vertical signal line
112、112-1、112-3:第一縱向圖案112, 112-1, 112-3: first longitudinal pattern
114、114-1、114-3:橫向圖案114, 114-1, 114-3: Horizontal pattern
116、116-1、116-3:第二縱向圖案116, 116-1, 116-3: Second longitudinal pattern
120、120-1:第一轉接結構120, 120-1: The first transfer structure
122、122-1:第二轉接結構122, 122-1: The second switching structure
AA:主動區AA: Active area
BA:周邊區BA: Surrounding area
C1、Cm:畫素行C1, Cm: pixel row
CS、CS1~CS4、CSp:導通結構CS, CS1~CS4, CSp: conduction structure
DL、DL1、DL2、DL7、DL13、DLm+1:第一縱向訊號線DL, DL1, DL2, DL7, DL13, DLm+1: The first vertical signal line
GD、GD1、GD2、GDp:閘極驅動墊GD, GD1, GD2, GDp: Gate drive pads
GL、GL1、GL2、GLn:橫向訊號線GL, GL1, GL2, GLn: Horizontal signal lines
L:長度L: length
PX、PX11、PX12、PX1n、PXmn:畫素結構PX, PX11, PX12, PX1n, PXmn: pixel structure
R1、Rn:畫素列R1, Rn: pixel column
Wx:橫向寬度Wx: horizontal width
Wy:縱向長度Wy: Vertical length
X:橫向方向X: landscape orientation
Y:縱向方向Y: portrait orientation
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