TW201819766A - Air cooling heat dissipation device - Google Patents

Abstract

An air cooling heat dissipation device is disclosed and is for dissipating heat to an electronic device. The air cooling heat dissipation device comprises a diversion carrier, and the diversion carrier comprises a first surface, a second surface, a chamber, an inlet opening, and a plurality of diversion vent grooves, wherein the chamber of the diversion carrier penetrates the first surface and the second surface, the inlet opening is disposed on the first surface and communicates with the chamber. A plurality of diversion vent grooves is disposed on the second surface and communicates with the chamber, and the electronic device is disposed within the chamber. The air cooling heat dissipation device further comprises an air pump, which is disposed on the first surface of the diversion carrier and closes the inlet opening. By driving the air pump, the air flows into the chamber via the inlet opening and makes heat exchanged with the electronic device, and the air is discharged by a plurality of diversion vent grooves after heat exchanged with the electronic device.

Description

Air cooling device

The present invention relates to an air-cooling heat dissipating device, and more particularly to an air-cooling heat dissipating device that uses a gas pump to provide a driving airflow for heat dissipation.

With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, video players, etc. have been trending toward thin, portable, high-performance, and these electronic devices are In the limited internal space, various high-accumulation or high-power electronic components must be configured. In order to make the electronic device faster and more powerful, the electronic components inside the electronic device will generate more heat during operation, and Causes high temperatures. In addition, most of these electronic devices are designed to be thin, flat, and compact, and have no additional internal space for heat dissipation. Therefore, electronic components in electronic devices are susceptible to heat and high temperatures, which may cause interference or interference. Damage and other issues.

Generally speaking, the heat dissipation method inside the electronic device can be divided into active heat dissipation and passive heat dissipation. The active heat dissipation is usually disposed inside the electronic device by using an axial fan or a blower fan, and the airflow is driven by the axial fan or the blower fan to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation. . However, axial fans and blower fans generate large noise during operation, and their bulk is not easy to be thinner and smaller, and axial fans and blower fans have a shorter service life. Therefore, the traditional axial flow fan and the blower fan are not suitable for heat dissipation in thin and light portable and portable electronic devices.

Furthermore, many electronic components are soldered to a printed circuit board (PCB) using techniques such as Surface Mount Technology (SMT) and Selective Soldering, but soldered by the soldering method described above. The electronic components are easily separated from the printed circuit board after being in a high thermal energy and high temperature environment for a long time, and most of the electronic components are not resistant to high temperatures. If the electronic components are in a high heat and high temperature environment for a long time, It is easy to cause the performance stability of electronic components to decrease and the lifespan to be shortened.

Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. As shown in FIG. 1 , the conventional heat dissipating mechanism is a passive heat dissipating mechanism, and includes a heat conducting plate 12 which is adhered to a electronic component 11 to be dissipated by a thermal conductive adhesive 13 by a thermal conductive adhesive. 13 and the heat conduction path formed by the heat conduction plate 12 allows the electronic component 11 to achieve heat dissipation by heat conduction and natural convection. However, the heat dissipation mechanism of the foregoing heat dissipation mechanism is inferior and cannot meet the application requirements.

In view of this, it is necessary to develop an air-cooling heat sink to solve the problems faced by the prior art.

The purpose of the present invention is to provide an air-cooling heat dissipating device, which can be applied to various electronic devices to perform circulating heat convection heat dissipation on electronic components inside the electronic device, improve heat dissipation performance, reduce noise, and enable electronic components inside the electronic device. Stable performance and long life.

Another object of the present invention is to provide an air-cooling heat dissipating device having a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the use of the air cooling device. life.

In order to achieve the above object, a generalized implementation of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component, the air-cooling heat dissipating device comprising: a flow guiding carrier, including a first surface, a second surface, and a chamber a gas guiding end opening and a plurality of flow guiding exhaust grooves, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding exhaust grooves are disposed And on the second surface and in communication with the chamber, wherein the electronic component is housed in the chamber; and the gas is pumped, disposed on the first surface of the flow guiding carrier, and the opening of the gas guiding end is closed, wherein the gas is driven by driving The airflow is introduced into the chamber through the air-conducting end opening, and the electronic components are heat-exchanged, and the airflow after heat exchange with the electronic components is discharged through the plurality of guiding exhaust grooves.

In order to achieve the above object, another generalized embodiment of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component. The air-cooling heat dissipating device comprises: a flow guiding carrier, including a first surface, a second surface, and a chamber a gas guiding end opening and a plurality of flow guiding exhaust grooves, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding exhaust grooves are disposed And on the second surface and in communication with the chamber, wherein the electronic component is housed in the chamber; the heat sink is attached to the electronic component and located in the chamber; and the gas is pumped and disposed on the first surface of the flow guiding carrier, And closing the air-conducting end opening, wherein the gas is pumped to introduce the airflow into the chamber through the air-conducting end opening, and the electronic component is heat-exchanged, and the airflow after heat exchange with the electronic component is passed through a plurality of guides The exhaust vent is discharged.

In order to achieve the above object, a more general implementation of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component. The air-cooling heat dissipating device comprises: a flow guiding carrier comprising a first surface, a second surface, and a chamber a gas guiding end opening and a plurality of flow guiding exhaust grooves, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding exhaust grooves are disposed On the second surface and in communication with the chamber, wherein the electronic component is housed in the chamber; the heat pipe string is attached to the surface of the electronic component and located in the chamber; and the gas pump is disposed on the flow guide carrier a surface, and a closed air-conducting end opening, wherein the gas is pumped by the driving gas to introduce the airflow into the chamber through the air-conducting end opening, and heat exchanges the electronic components, and the airflow after heat exchange with the electronic components is passed through A plurality of diversion vents are exhausted.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not to be construed as a limitation.

2A is a schematic structural view of the air-cooling heat dissipating device of the first embodiment of the present invention, FIG. 2B is a structural schematic view of the air-cooling heat dissipating device shown in FIG. 2A in the AA cross section, and FIG. 3 is a second FIG. Schematic diagram of the structure of the flow guiding carrier. As shown in Figures 2A, 2B and 3, the air-cooling heat sink 2 of the present invention can be applied to an electronic device such as, but not limited to, a portable computer, a tablet computer, an industrial computer, a portable communication device, and a video player. The heat dissipation of the electronic component 3 to be dissipated in the electronic device is performed. The air cooling device 2 of the present invention includes a flow guiding carrier 20 and a gas pump 22. The flow guiding carrier 20 includes a first surface 20a, a second surface 20b, a chamber 201, an air guiding end opening 202, and a plurality of guiding exhaust grooves 203, wherein the chamber 201 extends through the first surface 20a and the second surface 20b. The air guide end opening 202 is disposed on the first surface 20a and communicates with the chamber 201. A plurality of diversion vents 203 are disposed on the second surface 20b for gas circulation, wherein one end of each of the diversion vents 203 is in communication with the chamber 201, and each of the diversion vents 203 The other end extends to the side wall 204 of the flow guide carrier 20 and is in communication with the exterior whereby the side walls 204 of the flow guide carrier 20 form a plurality of exhaust end openings 205. The chamber 201 of the flow guiding carrier 20 houses the electronic component 3. The gas pump 22 is fixed to the first surface 20a of the flow guide carrier 20, and is assembled and positioned at the air guide end opening 202, and closes the air guide end opening 202. The gas pump 22 is driven to introduce the gas flow into the chamber 201 of the flow guiding carrier 20 via the air guiding end opening 202, and exchange heat with the electronic component 3, and the airflow after heat exchange with the electronic component 3 is passed through A plurality of diversion vents 203 are exhausted to achieve heat dissipation to the electronic component 3.

In some embodiments, the flow guide carrier 20 can be, but is not limited to, a frame. In the present embodiment, the air guide opening 202 is located in a central region of the first surface 20a. The electronic component 3 is disposed on a carrier substrate 4, wherein the carrier substrate 4 can be, but not limited to, a printed circuit board. The carrier substrate 4 is connected to the second surface 20b of the flow guiding carrier 20, and the electronic component 3 is housed in the chamber 201 of the flow guiding carrier 20. A plurality of flow guiding exhaust grooves 203 are disposed on the second surface 20b and extend outward in a radial manner. In some embodiments, the exhaust end opening 205 formed at the other end of the plurality of flow guiding exhaust grooves 203 is located at a plurality of side walls 204 of the flow guiding carrier 20 and at a plurality of corners 207, thereby allowing airflow to The periphery of the flow guiding carrier 20 is discharged outward.

In the present embodiment, the gas pump 22 is a piezoelectrically actuated gas pump for driving gas flow. The gas pump 22 is fixed to the first surface 20a of the flow guide carrier 20, and is assembled and positioned at the air guide end opening 202, and closes the air guide end opening 202. The carrier substrate 4 is disposed on the second surface 20b of the flow guiding carrier 20, in other words, the combination cover of the flow guiding carrier 20 and the gas pump 22 is bonded to the carrier substrate 4, and the electronic component 3 is placed in the guide. In the chamber 201 of the flow carrier 20. By closing the air guiding end opening 202 by the gas pump 22 and the carrier substrate 4, the air guiding end opening 202, the chamber 201 and the plurality of guiding exhaust grooves 203 can be defined to form a closed flow path, thereby focusing on the electrons Component 3 dissipates heat and enhances heat dissipation. It should be emphasized that this case is not limited to the formation of closed flow channels, and other flow path forms can be adjusted and changed according to actual application needs. Of course, in another embodiment (not shown), the flow guiding carrier 20 can also be provided with a receiving portion at the periphery of the air guiding end opening 202, that is, the receiving portion is a recess in which the first surface 20a is recessed inward. At the periphery of the air-conducting end opening 202, the gas pump 22 is directly assembled on the accommodating portion to close the air-conducting end opening 202, and the heat-dissipating effect of the air-cooling heat-dissipating device 2 described above can also be implemented. The gas pump 22 is recessed and assembled in the accommodating portion to reduce the overall height of the air-cooling heat dissipating device 2, and the effect of thinning and thinning can be achieved.

In the present embodiment, the gas pump 22 is used to drive the gas flow to introduce the gas into the chamber 201 from the outside of the air-cooling heat sink 2 via the air-conducting end opening 202. When the gas pump 22 introduces the gas into the chamber 201, the introduced gas exchanges heat with the electronic component 3 in the chamber 201, and pushes the airflow in the chamber 201 to flow rapidly, so that the airflow after the heat exchange passes the heat energy through the guide. The plurality of flow guiding exhaust grooves 203 of the flow carrier 20 are discharged to the outside of the air cooling heat sink 2. Since the gas pump 22 is continuously operated to introduce a gas, the electronic component 3 can exchange heat with the continuously introduced gas, and the heat-exchanged gas is discharged through the plurality of flow guiding exhaust grooves 203 of the flow guiding carrier 20. Thereby, the heat dissipation to the electronic component 3 can be achieved, and the heat dissipation performance can be improved, thereby increasing the performance stability and the life of the electronic component 3.

Fig. 4 is a schematic cross-sectional view showing the air-cooling heat dissipating device of the second embodiment of the present invention. As shown in FIG. 4, the air-cooling heat dissipating device 2a of the present embodiment is similar to the air-cooling heat dissipating device 2 shown in FIG. 2B, and the same component numbers denote the same structures, elements, and functions, and will not be described again. Compared with the air-cooling heat dissipating device 2 shown in FIG. 2B, the air-cooling heat dissipating device 2a of the present embodiment further includes a heat sink 25 connected to the surface of the electronic component 3 and located in the chamber 201. The heat sink 25 includes a base 251 and a plurality of heat sinks 252. The base 251 is attached to the surface of the electronic component 3, and a plurality of heat sinks 252 are vertically connected to the base 251. By the arrangement of the heat sink 25, the heat dissipation area can be increased, and the heat energy generated by the electronic component 3 can be exchanged with the gas introduced into the chamber 201 via the heat sink 25 to improve the heat dissipation performance.

Fig. 5 is a schematic cross-sectional view showing the air-cooling heat dissipating device of the third embodiment of the present invention. As shown in FIG. 5, the air-cooling heat dissipating device 2b of the present embodiment is similar to the air-cooling heat dissipating device 2 shown in FIG. 2B, and the same component numbers denote the same structures, elements and functions, and will not be described again. Compared with the air-cooling heat dissipating device 2 shown in FIG. 2B, the air-cooling heat dissipating device 2b of the present embodiment includes a heat-conducting heat pipe column 26 connected to the surface of the electronic component 3 and located in the chamber 201. The heat pipe string 26 is attached to the surface of the electronic component 3, and the heat pipe string 26 is made of a heat conductive material having a high thermal conductivity. In some embodiments, one end of the heat pipe string 26 extends from the side wall 204 of the flow guide carrier 20 out of the outer side of the flow guide carrier 20, and the other end of the heat pipe string 26 extends to the surface of the electronic component 3 and is associated with the electron. Element 3 is in contact. By the arrangement of the heat-conducting column 26, the heat energy generated by the electronic component 3 can be heat-exchanged with the gas in the chamber 201 through the heat-conducting column 26 to improve the heat dissipation performance.

6A and 6B are respectively schematic views of the exploded structure of the gas pump of the preferred embodiment of the present invention at different viewing angles, and FIG. 7 is a schematic cross-sectional structural view of the piezoelectric actuator shown in FIGS. 6A and 6B, and FIG. It is a schematic diagram of the cross-sectional structure of the gas pump shown in Figs. 6A and 6B. As shown in FIGS. 6A, 6B, 7 and 8, the gas pump 22 is a piezoelectrically actuated gas pump and includes an air inlet plate 221, a resonance plate 222, a piezoelectric actuator 223, and an insulating sheet 2241. 2242 and a conductive sheet 225 and the like, wherein the piezoelectric actuator 223 is disposed corresponding to the resonator piece 222, and the air inlet plate 221, the resonance piece 222, the piezoelectric actuator 223, the insulating piece 2241, the conductive piece 225, and Another insulating sheet 2242 and the like are sequentially stacked, and the assembled cross-sectional view is as shown in FIG.

In the present embodiment, the air inlet plate 221 has at least one air inlet hole 221a, and the number of the air inlet holes 221a is preferably four, but not limited thereto. The air inlet hole 221a penetrates the air inlet plate 221 for allowing gas to flow from the at least one air inlet hole 221a into the gas pump 22 from the outside of the device in response to atmospheric pressure. The air inlet plate 221 has at least one bus bar hole 221b corresponding to the at least one air inlet hole 221a of the other surface of the air intake plate 221. The center AC portion of the bus bar hole 221b has a central recess portion 221c, and the center recess portion 221c communicates with the bus bar hole 221b, whereby the gas entering the bus bar hole 221b from the at least one air inlet hole 221a can be guided and converged. Concentration to the central recess 221c to achieve gas transfer. In the present embodiment, the air inlet plate 221 has an integrally formed air inlet hole 221a, a bus bar hole 221b and a central recessed portion 221c, and a confluent chamber corresponding to a confluent gas is formed at the central recess portion 221c for temporarily storing the gas. . In some embodiments, the material of the air inlet plate 221 may be made of, for example, but not limited to, a stainless steel material. In other embodiments, the depth of the confluence chamber formed by the central recess 221c is the same as the depth of the bus bar hole 221b, but is not limited thereto. The resonator piece 222 is made of a flexible material, but not limited thereto, and has a hollow hole 2220 on the resonance piece 222, which is disposed corresponding to the central concave portion 221c of the air inlet plate 221 to allow gas to circulate. . In other embodiments, the resonant plate 222 can be made of a copper material, but is not limited thereto.

The piezoelectric actuator 223 is assembled by a suspension plate 2231, an outer frame 2132, at least one bracket 2233, and a piezoelectric piece 2234. The piezoelectric piece 2234 is attached to the first suspension plate 2231. The surface 2231c is configured to apply a voltage to generate a deformation to drive the suspension plate 2231 to bend and vibrate, and the at least one bracket 2233 is connected between the suspension plate 2231 and the outer frame 2232. In this embodiment, the bracket 2233 is connected to the Between the suspension plate 2231 and the outer frame 2232, the two ends are respectively connected to the outer frame 2232 and the suspension plate 2231 to provide elastic support, and at least one gap between the bracket 2233, the suspension plate 2231 and the outer frame 2232. 2235, the at least one gap 2235 is in communication with the air guide opening 202 for gas circulation. It should be emphasized that the type and number of the suspension plate 2231, the outer frame 2232, and the bracket 2233 are not limited to the foregoing embodiments, and may be changed according to actual application requirements. In addition, the outer frame 2232 is disposed on the outer side of the suspension plate 2231, and has an outwardly protruding conductive pin 2232c for power connection, but is not limited thereto.

The suspension plate 2231 is a stepped surface structure (as shown in FIG. 7), that is, the second surface 2231b of the suspension plate 2231 has a convex portion 2231a, which may be, but is not limited to, a circular shape. Raised structure. The convex portion 2231a of the suspension plate 2231 is coplanar with the second surface 2232a of the outer frame 2232, and the second surface 2231b of the suspension plate 2231 and the second surface 2233a of the bracket 2233 are also coplanar, and the convex portion of the suspension plate 2231 The second surface 2232a of the 2231a and the outer frame 2232 has a specific depth between the second surface 2231b of the suspension plate 2231 and the second surface 2232a of the bracket 2233. The first surface 2231c of the suspension plate 2231 is flush with the first surface 2232b of the outer frame 2232 and the first surface 2233b of the bracket 2233, and the piezoelectric piece 2234 is attached to the flat suspension plate 2231. At the first surface 2231c. In other embodiments, the shape of the suspension plate 2231 may also be a double-sided flat plate-like square structure, and is not limited thereto, and may be changed according to actual application conditions. In some embodiments, the suspension plate 2231, the bracket 2233, and the outer frame 2232 may be integrally formed, and may be composed of a metal plate such as, but not limited to, a stainless steel material. In still other embodiments, the length of the side of the piezoelectric sheet 2234 is smaller than the length of the side of the suspension plate 2231. In other embodiments, the length of the piezoelectric sheet 2234 is equal to the length of the side of the suspension plate 2231, and is also designed as a square plate structure corresponding to the suspension plate 2231, but is not limited thereto.

The insulating sheet 2241 of the gas pump 22 and the conductive sheet 225 and the other insulating sheet 2242 are sequentially disposed under the piezoelectric actuator 223, and the shape thereof substantially corresponds to the outer frame 2232 of the piezoelectric actuator 223. The form. In some embodiments, the insulating sheets 2241, 2242 are made of an insulating material such as, but not limited to, a plastic, and the insulating function is provided. In other embodiments, the conductive sheet 225 may be formed of a conductive material such as, but not limited to, a metal material to provide an electrical conduction function. In this embodiment, a conductive pin 225a may be disposed on the conductive sheet 225 to achieve an electrical conduction function.

In this embodiment, the gas pump 22 is sequentially stacked by the air inlet plate 221, the resonance plate 222, the piezoelectric actuator 223, the insulating sheet 2241, the conductive sheet 225, and the other insulating sheet 2242, and A gap h is formed between the resonator piece 222 and the piezoelectric actuator 223. In the present embodiment, a gap h between the periphery of the frame 2232 outside the resonator piece 222 and the piezoelectric actuator 223 is filled in. The filling material, such as but not limited to the conductive paste, maintains the depth of the gap h between the resonator piece 222 and the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, thereby guiding the airflow to flow more rapidly. Further, since the convex portion 2231a of the suspension plate 2231 is kept at an appropriate distance from the resonance piece 222, the mutual contact interference is reduced, and the noise generation can be reduced. In other embodiments, the height of the outer frame 2232 of the high voltage electric actuator 223 may be increased to increase a gap when assembled with the resonant plate 222, but not limited thereto.

In this embodiment, the resonant plate 222 has a movable portion 222a and a fixed portion 222b. When the air bearing plate 221, the resonant plate 222 and the piezoelectric actuator 223 are sequentially assembled, the movable portion 222a can be mounted thereon. The air inlet plates 221 together form a chamber for the confluent gas, and a first chamber 220 is further formed between the resonance plate 222 and the piezoelectric actuator 223 for temporarily storing gas, and the first chamber 220 is The cavity at the central recess 221c of the air inlet plate 221 is communicated through the hollow hole 2220 of the resonator piece 222, and the two sides of the first chamber 220 are separated by a gap 2235 between the brackets 2233 of the piezoelectric actuator 223. It is in communication with the air guiding end opening 202 provided thereunder.

9A to 9E are flow chart diagrams of the gas pumping operation shown in Figs. 6A and 6B. Please refer to Fig. 8 and Fig. 9A to Fig. 9E. The operation flow of the gas pump in this case is briefly described as follows. When the gas pump 22 is actuated, the piezoelectric actuator 223 is biased by the voltage and is reciprocatingly vibrating in the vertical direction with the holder 2233 as a fulcrum. As shown in FIG. 9A, when the piezoelectric actuator 223 is vibrated downward by voltage, since the resonance piece 222 is a light and thin sheet-like structure, when the piezoelectric actuator 223 vibrates, The resonating piece 222 also resonates to reciprocate vertically, that is, the portion of the resonating piece 222 corresponding to the central concave portion 221c is also deformed by bending vibration, that is, the portion corresponding to the central concave portion 221c is movable of the resonant piece 222. The portion 222a is such that when the piezoelectric actuator 223 is bent downward, the movable portion 222a of the resonator piece 222 corresponding to the central recess 221c is driven by the introduction and pushing of the gas and the vibration of the piezoelectric actuator 223. And as the piezoelectric actuator 223 is bent and vibrated downward, the gas enters through at least one air inlet hole 221a on the air intake plate 221, and passes through at least one bus bar hole 221b to be collected to the central central recess 221c. Then, the hollow hole 2220 disposed corresponding to the central recess 221c on the resonator piece 222 flows downward into the first chamber 220. Thereafter, due to the vibration of the piezoelectric actuator 223, the resonator piece 222 resonates and reciprocates vertically. As shown in Fig. 9B, the movable portion 222a of the resonator piece 222 is also followed. The vibration is downwardly slid and adhered to the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, so that the convergence between the region other than the convex portion 2231a of the suspension plate 2231 and the fixed portion 222b on both sides of the resonance plate 222 The spacing of the chambers does not become small, and is deformed by the resonant plate 222 to compress the volume of the first chamber 220 and close the intermediate flow space of the first chamber 220, thereby causing the gas therein to be pushed to both sides. The flow, which in turn passes through the gap 2235 between the brackets 2233 of the piezoelectric actuator 223, traverses the flow. Thereafter, as shown in FIG. 9C, the movable portion 222a of the resonator piece 222 is bent and vibrated upward to return to the initial position, and the piezoelectric actuator 223 is driven by the voltage to vibrate upward, thus also pressing the first chamber 220. The volume, but at this time, the piezoelectric actuator 223 is lifted upward, so that the gas in the first chamber 220 flows toward both sides, thereby driving the gas continuously from at least one air inlet hole on the air inlet plate 221. The 221a enters and flows into the chamber formed by the central recess 221c. Thereafter, as shown in FIG. 9D, the resonator piece 222 is resonated upward by the upward vibration of the piezoelectric actuator 223, and the movable portion 222a of the resonator piece 222 is also vibrated upward, thereby slowing down the gas continuously. At least one air inlet hole 221a in the gas plate 221 enters and flows into the chamber formed by the central recess portion 221c. Finally, as shown in Fig. 9E, the movable portion 222a of the resonator piece 222 also returns to the initial position. It can be seen from this embodiment that when the resonant plate 222 performs vertical reciprocating vibration, the maximum distance between the vertical displacement of the resonant plate 222 and the piezoelectric actuator 223 can be increased, in other words, in the two The provision of a gap h between the structures allows the resonator piece 222 to generate a larger vertical displacement when resonating. Therefore, a pressure gradient is generated in the flow channel design of the gas pump 22, so that the gas flows at a high speed, and the gas is transmitted from the suction end to the discharge end through the difference in impedance of the flow path in and out of the flow path to complete the gas transfer operation. Even if there is air pressure at the discharge end, there is still the ability to continuously push the gas into the air guide end chamber 23a, and the effect of mute can be achieved, so that the gas pump 22 of FIG. 9A to FIG. 9E is repeated to operate. Gas pump 22 produces a gas transfer from the outside to the inside.

As described above, the gas is introduced into the chamber 201 of the flow guiding carrier 20 by the operation of the gas pump 22, so that the introduced gas exchanges heat with the electronic component 3, and the gas in the chamber 201 is pushed to flow rapidly. The heat-exchanged gas discharges thermal energy to the outside of the air-cooling heat dissipating device 2 through the plurality of diversion venting grooves 203 of the flow guiding carrier 20, thereby improving the efficiency of heat dissipation and cooling, thereby increasing the performance stability of the electronic component 3. And life.

FIG. 10 is a schematic structural view of an air-cooling heat dissipating device according to a third preferred embodiment of the present invention. As shown in FIG. 10, the air-cooling heat dissipating device 2c of the present embodiment is similar to the air-cooling heat dissipating device 2 shown in FIG. 2B, and the same component numbers denote the same structures, elements, and functions, and will not be described again. Compared with the air-cooling heat dissipating device 2 shown in FIG. 2B, the air-cooling heat dissipating device 2c of the present embodiment has a temperature control function, and further includes a control system 21 including a control unit 211 and a temperature sensor. 212, wherein the control unit 21 is electrically coupled to the gas pump 22 to control the operation of the gas pump 22. The temperature sensor 212 is disposed in the chamber 201 of the flow guiding carrier 20 and adjacent to the electronic component 3 for sensing the temperature of the electronic component 3. The temperature sensor 212 is electrically connected to the control unit 21, senses the temperature in the vicinity of the electronic component 3, or directly attaches to the electronic component 3 to sense the temperature of the electronic component 3, and transmits the sensing signal to the control unit 211. The control unit 211 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 212. When the control unit 211 determines that the temperature of the electronic component 3 is higher than the temperature threshold, the control unit 211 issues a The control signal is applied to the gas pump 22 to operate the gas pump 22, whereby the gas pump 22 drives the airflow to dissipate heat from the electronic component 3, thereby cooling the electronic component 3 and lowering the temperature. When the control unit 211 determines that the temperature of the electronic component 3 is lower than the temperature threshold, a control signal is sent to the gas pump 22 to stop the operation of the gas pump 22, thereby preventing the gas pump 22 from continuing to operate and causing the life. Shorten and reduce the loss of extra energy. Therefore, through the setting of the control system 21, the gas pump 22 of the air-cooling heat sink 2 can be cooled and cooled when the temperature of the electronic component 3 is overheated, and stops after the temperature of the electronic component 3 is lowered, thereby avoiding the gas pump. The continued operation of the Pu 22 results in a shortened life span, reducing the consumption of additional energy, and also allowing the electronic component 3 to operate in a preferred temperature environment to improve the stability of the electronic component 3.

In summary, the present invention provides an air-cooling heat dissipating device, which can be applied to various electronic devices to dissipate heat from internal electronic components, improve heat dissipation performance, reduce noise, and stabilize and prolong the performance of electronic components inside electronic devices. life. In addition, the air-cooling heat dissipating device of the present case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the service life of the heat dissipating device.

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

11‧‧‧Electronic components
12‧‧‧heat transfer board
13‧‧‧thermal adhesive
2, 2a, 2b, 2c‧‧‧ air-cooling heat sink
20‧‧‧Guide vector
20a‧‧‧ first surface
20b‧‧‧second surface
201‧‧‧ chamber
202‧‧‧ Air conduction opening
203‧‧‧Guided exhaust trough
204‧‧‧ side wall
205‧‧‧Exhaust end opening
207‧‧‧ corner
21‧‧‧Control system
211‧‧‧Control unit
212‧‧‧temperature sensor
22‧‧‧ gas pump
220‧‧‧ first chamber
221‧‧‧Air intake plate
221a‧‧‧Air intake
221b‧‧‧ bus bar hole
221c‧‧‧Center recess
222‧‧‧Resonance film
222a‧‧‧movable department
222b‧‧‧Fixed Department
2220‧‧‧ hollow holes
223‧‧‧ Piezoelectric Actuator
2231‧‧‧suspension plate
2231a‧‧‧ convex
2231b‧‧‧ second surface
2231c‧‧‧ first surface
2232‧‧‧Front frame
2232a‧‧‧ second surface
2232b‧‧‧ first surface
2232c‧‧‧Electrical pins
2233‧‧‧ bracket
2233a‧‧‧second surface
2233b‧‧‧ first surface
2234‧‧‧ Piezo Pieces
2235‧‧‧ gap
2241, 2242‧‧‧Insulation
225‧‧‧Electrical sheet
225a‧‧‧Electrical pins
25‧‧‧ radiator
251‧‧‧Base
252‧‧‧ Heat sink
26‧‧‧Heat pipe column
3‧‧‧Electronic components
4‧‧‧Loading substrate

Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. 2A is a schematic structural view of the air-cooling heat dissipating device of the first embodiment of the present invention. Fig. 2B is a schematic view showing the structure of the air-cooling heat dissipating device shown in Fig. 2A in the AA cross section. Fig. 3 is a schematic view showing the structure of the flow guiding carrier shown in Fig. 2A. Figure 4 is a schematic view showing the structure of the air-cooling heat dissipating device of the second embodiment of the present invention. Figure 5 is a schematic view showing the structure of the air-cooling heat dissipating device of the third embodiment of the present invention. 6A and 6B are respectively schematic views showing the decomposition structure of the gas pump of the preferred embodiment of the present invention at different viewing angles. Fig. 7 is a schematic cross-sectional view showing the piezoelectric actuator shown in Figs. 6A and 6B. Fig. 8 is a schematic cross-sectional view showing the gas pump shown in Figs. 6A and 6B. 9A to 9E are flow chart diagrams of the gas pumping operation shown in Figs. 6A and 6B. Figure 10 is a schematic view showing the structure of the air-cooling heat dissipating device of the fourth embodiment of the present invention.

Claims (12)

An air-cooling heat dissipating device for dissipating heat from an electronic component, the air-cooling heat dissipating device comprising: a flow guiding carrier comprising a first surface, a second surface, a chamber, an air guiding end opening and a plurality of guiding a flow venting groove, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding venting grooves are disposed at the a second surface is in communication with the chamber, wherein the electronic component is received in the chamber; and a gas pump is disposed on the first surface of the flow guiding carrier and encloses the air guiding opening, wherein By driving the gas pump, the airflow is introduced into the chamber through the air-conducting end opening, and the electronic component is heat-exchanged, and the airflow after heat exchange with the electronic component is passed through the plurality of airflow guiding tubes The air tank is discharged. The air-cooling heat dissipating device of claim 1, further comprising a carrier substrate connected to the second surface of the flow guiding carrier, wherein the electronic component is disposed on the carrier substrate. The air-cooling heat dissipating device of claim 2, wherein the flow guiding carrier further comprises a receiving portion, wherein the first surface is recessed inwardly, and the gas is pumped at the periphery of the air guiding end opening. The assembly is directly assembled on the receiving portion and the air guiding end opening is closed. The air-cooling heat dissipating device of claim 1, wherein the flow guiding carrier is a frame. The air-cooling heat dissipating device of claim 1, wherein the gas pump is a piezoelectrically actuated gas pump. The air-cooling heat dissipating device of claim 5, wherein the piezoelectric actuated gas pump comprises: an air inlet plate having at least one air inlet hole, at least one bus bar hole, and a confluence chamber a central recess, wherein the at least one air inlet is for introducing a gas flow, the bus hole corresponding to the air inlet, and the air flow guiding the air inlet is merged to the confluence chamber formed by the central recess; a resonance piece, Having a hollow hole corresponding to the confluence chamber, and the periphery of the hollow hole is a movable portion; and a piezoelectric actuator disposed corresponding to the resonance piece; wherein the resonance piece and the piezoelectric actuator Having a gap therebetween to form a chamber for driving the piezoelectric actuator to be introduced from the at least one air inlet hole of the air intake plate, and collecting the central air recess through the at least one bus bar hole And flowing through the hollow hole of the resonant piece to enter the chamber, and the piezoelectric actuator and the movable portion of the resonant piece generate a resonant transmission airflow. The air-cooling heat dissipating device of claim 6, wherein the piezoelectric actuator comprises: a suspension plate having a first surface and a second surface and being bendable and vibrating; an outer frame and a surrounding arrangement On the outer side of the suspension plate; at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and a piezoelectric piece having a side length which is less than or equal to one side of the suspension plate Long, and the piezoelectric sheet is attached to one of the first surfaces of the suspension plate for applying a voltage to drive the suspension plate to bend and vibrate. The air-cooling heat dissipating device of claim 7, wherein the suspension plate is a square suspension plate and has a convex portion. The air-cooling heat dissipating device of claim 7, wherein the piezoelectric actuated gas pump comprises a conductive sheet, a first insulating sheet and a second insulating sheet, wherein the air inlet plate and the resonant piece The piezoelectric actuator, the first insulating sheet, the conductive sheet and the second insulating sheet are stacked in sequence. The air-cooling heat dissipating device of claim 1, further comprising a control system comprising: a control unit electrically connected to the gas pump to control the gas pumping operation; and a temperature a sensor electrically connected to the control unit and adjacent to the electronic component to sense a temperature of the electronic component to output a sensing signal to the control unit; wherein, when the control unit receives the sensing Signaling, and determining that the temperature of the electronic component is greater than a temperature threshold, the control unit enables the gas pump to drive the airflow, and when the control unit receives the sensing signal and determines the electronic When the temperature of the component is below the temperature threshold, the control unit stops the gas pump from operating. An air-cooling heat dissipating device for dissipating heat from an electronic component, the air-cooling heat dissipating device comprising: a flow guiding carrier comprising a first surface, a second surface, a chamber, an air guiding end opening and a plurality of guiding a flow venting groove, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding venting grooves are disposed at the a second surface and is in communication with the chamber, wherein the electronic component is housed in the chamber; a heat sink attached to the electronic component and located in the chamber; and a gas pump disposed on the guide Flowing the first surface of the carrier and closing the gas-conducting end opening, wherein the gas is pumped to introduce a gas flow into the chamber via the gas-conducting end opening, and heat-exchange the electronic component, and The gas stream after heat exchange with the electronic component is discharged through the plurality of flow guiding exhaust grooves. An air-cooling heat dissipating device for dissipating heat from an electronic component, the air-cooling heat dissipating device comprising: a flow guiding carrier comprising a first surface, a second surface, a chamber, an air guiding end opening and a plurality of guiding a flow venting groove, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding venting grooves are disposed at the a second surface in communication with the chamber, wherein the electronic component is housed in the chamber; a heat pipe string attached to the surface of the electronic component and located in the chamber; and a gas pumping, setting At the first surface of the flow guiding carrier, and closing the air guiding end opening, wherein the gas pump is driven to introduce a gas flow into the chamber through the air guiding end opening, and the electronic component is heat exchanged And discharging the airflow after heat exchange with the electronic component through the plurality of flow guiding exhaust grooves.