CN112788910A - Heat dissipation assembly of mobile device - Google Patents

Abstract

A heat dissipation assembly for a mobile device, comprising: a casing body with a ventilation hole and a positioning accommodating seat, wherein the positioning accommodating seat is arranged corresponding to the ventilation hole, and the bottom of the positioning accommodating seat communicates with the ventilation hole; a a micro-pump, which is arranged in the positioning and accommodating seat and corresponds to the ventilation hole at the bottom of the positioning and accommodating seat, so that the gas transmitted when the micro-pump is driven and operated is discharged through the ventilation hole; a heat dissipation tube plate, The inside contains a heat dissipation liquid, and one end is positioned on the positioning accommodating seat, and is in contact with the heating element of the mobile device to perform liquid convection heat exchange with the heat source emitted by the heating element; wherein, the gas guided by the micro-pump forms heat Convection, the heat absorbed by the heat dissipation tube plate is exchanged and discharged through the ventilation hole.

Description

Heat dissipation assembly of mobile device

Technical Field

The present disclosure relates to a heat dissipation assembly for a mobile device, and more particularly, to a liquid heat dissipation module for use in combination with a portable electronic device or a mobile device.

Background

In recent years, with the rapid development of smart phones, the specifications, the equipment and the functions of smart phones are rapidly upgraded, and in order to meet the requirements, the capacity of an internal processing chip also needs to be greatly improved, but if the heat energy generated by the processing chip during high-speed operation cannot be quickly removed, the energy efficiency of the processing chip is greatly influenced, for example, in the 5G high-speed transmission developed in all countries, a rapid heat dissipation function needs to be provided in the processing chip; accordingly, what is needed is a heat dissipation module for a mobile device, which can dissipate heat quickly.

Disclosure of Invention

The present disclosure provides a liquid heat dissipation module, which can be disposed in a portable electronic device to improve heat dissipation.

One broad aspect of the present disclosure is a heat dissipation assembly for a mobile device, comprising: a casing body having a vent hole and a positioning containing seat, wherein the positioning containing seat is arranged corresponding to the vent hole, and the bottom of the positioning containing seat is communicated with the vent hole; a micro pump, which is arranged in the positioning containing seat and corresponds to the vent hole communicated with the bottom of the positioning containing seat, and is used for discharging gas transmitted when the micro pump is driven to operate; a heat radiation tube plate, the interior of which contains heat radiation liquid, and one end of which is positioned on the positioning containing seat and is contacted with the heating element of the mobile device so as to carry out liquid-state convection heat exchange on a heat source emitted by the heating element; the gas guided by the micro pump forms heat convection, exchanges heat with the heat absorbed by the heat dissipation tube plate and is exhausted from the vent hole.

Drawings

Fig. 1 is a perspective view of a heat dissipation assembly of a mobile device.

Fig. 2 is a schematic perspective view of another angle of the heat dissipation assembly of the mobile device of the present disclosure.

Fig. 3 is a schematic cross-sectional perspective view of a heat dissipation assembly of a mobile device according to the present disclosure.

FIG. 4 is a schematic cross-sectional view of a heat dissipation assembly of a mobile device according to the present disclosure.

FIG. 5A is an exploded view of the micro-pump according to the first embodiment of the present invention.

Fig. 5B is another schematic angle exploded view of the first embodiment of the micro-pump of the present disclosure.

FIG. 6A is a schematic cross-sectional view of a first embodiment of the micropump of the present invention.

FIGS. 6B to 6C are schematic views illustrating the operation of the micro-pump according to the first embodiment of the present invention.

FIG. 7A is an exploded view of a second embodiment of the present micropump.

Fig. 7B is another exploded view of the micropump according to the second embodiment of the present invention.

FIG. 8A is a schematic cross-sectional view of a second embodiment of the micropump of the present invention.

FIG. 8B is a schematic view of a second embodiment of the micropump according to the present invention in a derivative implementation manner.

FIGS. 8C to 8E are schematic views illustrating the operation of the second embodiment of the present micro pump.

FIG. 9A is a schematic cross-sectional view of a third embodiment of the micro-pump of the present disclosure.

FIG. 9B is an exploded view of a micro-pump according to a third embodiment of the present disclosure

FIG. 10A to FIG. 10C are schematic views illustrating the operation of the micro-pump according to the third embodiment of the present invention.

Fig. 11 is a perspective view of the liquid pump.

Fig. 12 is a schematic top view of the liquid pump of the present invention.

Fig. 13A is an exploded view of the liquid pump of the present disclosure.

Fig. 13B is another exploded view of the liquid pump of the present disclosure.

FIG. 14 is a cross-sectional view taken along line AA' in FIG. 12.

FIG. 15 is a cross-sectional view taken along line BB' in FIG. 12.

Fig. 16A to 16B are operation diagrams of the liquid pump.

Description of the reference numerals

1: casing body

11: vent hole

12: positioning holder

2: micro pump

21: air injection hole sheet

210: suspension plate

211: hollow hole

212: connecting piece

213: voids

22: cavity frame

23: actuating body

231: piezoelectric carrier plate

2311: piezoelectric pin

232: tuning the resonator plate

233: piezoelectric plate

24: insulating frame

25: conductive frame

251: conductive pin

252: conductive electrode

26: resonance chamber

27: airflow chamber

21A: air inlet plate

211A: air intake

212A: bus bar groove

213A: confluence chamber

22A: resonance sheet

221A: hollow hole

222A: movable part

223A: fixing part

23A: piezoelectric actuator

231A: suspension plate

232A: outer frame

233A: support frame

234A: piezoelectric element

235A: voids

236A: convex part

24A: first insulating sheet

25A: conductive sheet

26A: second insulating sheet

27A: chamber space

21B: first substrate

211B: inflow hole

212B: first surface

213B: second surface

22B: first oxide layer

221B: confluence channel

222B: confluence chamber

23B: second substrate

231B: silicon wafer layer

2311B: actuating part

2312B: outer peripheral portion

2313B: connecting part

2314B: fluid channel

232B: second oxide layer

2321B: vibration chamber

233B: silicon layer

2331B: perforation

2332B: vibrating part

2333B: fixing part

2334B: third surface

2335B: the fourth surface

24B: piezoelectric component

241B: lower electrode layer

242B: piezoelectric layer

243B: insulating layer

244B: upper electrode layer

3: radiating tube plate

4: liquid pump

41: valve cover body

411: first surface of valve cover

412: second surface of valve cover

413: inlet channel

413 a: inlet flange

413 b: first protrusion structure

414: outlet channel

414 a: outlet flange

414 b: outlet chamber

415: clamping piece

42: valve plate

42 a: first valve plate

42 b: second valve plate

421a, 421 b: central valve plate

422a, 422 b: extension support

423a, 423 b: through hole

43: valve base

431: first surface of valve bottom

432: second surface of valve bottom

433: inlet valve passage

433 a: inlet flange

433 b: inlet chamber

434: outlet valve passage

434 a: outlet flange

434 b: second protrusion structure

435: butt joint fastening hole

436: flow-collecting chamber

44: actuator

441: vibrating reed

441 a: electrical connection pin

442: piezoelectric element

45: outer cylinder

451: inner wall concave space

452: central groove

453: penetrate through the frame opening

46: sealing glue

5: heating element

Detailed Description

Some exemplary embodiments that embody the features and advantages of this disclosure will be described in detail in the description that follows. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Referring to fig. 1 to 4, a heat dissipation assembly for a mobile device is provided, which includes a housing body 1, a micro pump 2, and a heat dissipation tube plate 3; the machine shell body 1 is provided with a vent hole 11 and a positioning containing seat 12, the positioning containing seat 12 is positioned inside the machine shell body 1, is arranged corresponding to the vent hole 11 and is communicated with the vent hole, and the positioning containing seat 12 is communicated with the outside of the machine shell body 1 through the vent hole 11; the micro pump 2 is arranged on the positioning containing seat 12 and corresponds to the vent hole 11, and when the micro pump 2 starts to operate, the transmission gas is discharged from the vent hole 11; the heat radiation tube plate 3 is internally provided with a heat radiation liquid which is positioned in the shell body 1, one end of the heat radiation liquid is positioned in the positioning containing seat 12 and is contacted with a heating element 5 of the action device to carry out heat exchange on a heat source emitted by the heating element 5, the heat radiation liquid flows in the heat radiation tube plate 3 to enable the heat source to be uniformly diffused, and gas guided by the micro pump 2 forms heat convection to carry out heat exchange on heat absorbed by the heat radiation tube plate 3, and finally the gas is discharged from the vent hole 11.

Referring to fig. 5A to 6A, a first embodiment of the micro-pump 2 is a blower micro-pump, comprising: an air injection hole plate 21, a cavity frame 22, an actuating body 23, an insulating frame 24 and a conductive frame 25. The air hole plate 21 is made of a flexible material, and has a suspension plate 210, a hollow hole 211, and a plurality of connecting members 212. The suspension plate 210 is a plate-shaped structure capable of bending and vibrating, but not limited thereto, the shape of the suspension plate 210 may be one of square, circle, ellipse, triangle and polygon. The hollow hole 211 is formed through the center of the floating plate 210 for gas to flow through. In this embodiment, the number of the connecting members 212 is four, and the fumarole pieces 21 are fixedly disposed in the positioning accommodation seat 12 through the connecting members 212. The cavity frame 22 is stacked on the air injection hole piece 21, and the shape thereof corresponds to the air injection hole piece 21, the actuating body 23 is stacked on the cavity frame 22, and a resonance chamber 26 is defined between the actuating body and the cavity frame 22 and between the actuating body and the suspension piece 210. An insulating frame 24 is stacked on the actuating body 23, and has an appearance similar to that of the cavity frame 22. The conductive frame 25 is stacked on the insulating frame 24, and has an appearance similar to that of the insulating frame 24, and the conductive frame 25 has a conductive pin 251 and a conductive electrode 252, the conductive pin 251 extends outward from the outer edge of the conductive frame 25, and the conductive electrode 252 extends inward from the inner edge of the conductive frame 25. In addition, the actuator 23 further includes a piezoelectric carrier 231, an adjusting resonator plate 232 and a piezoelectric plate 233, the piezoelectric carrier 231 is stacked on the cavity frame 22, the adjusting resonator plate 232 is stacked on the piezoelectric carrier 231, the piezoelectric plate 233 is stacked on the adjusting resonator plate 232, the adjusting resonator plate 232 and the piezoelectric plate 233 are housed in the insulating frame 24, and the piezoelectric plate 233 is electrically connected to the conductive electrode 252 of the conductive frame 25, wherein the piezoelectric carrier 231 and the adjusting resonator plate 232 are made of conductive material, the piezoelectric carrier 231 has a piezoelectric pin 2311, the piezoelectric pin 2311 is connected to the conductive pin 251 to form a driving signal (driving frequency and driving voltage), the driving signal is formed by the piezoelectric pin 2311, the piezoelectric carrier 231, the adjusting resonator plate 232, the piezoelectric plate 233, the conductive electrode 252, the conductive frame 25 and the conductive pin 251, the insulating frame 24 isolates the conductive frame 25 from the actuator 23 to prevent short circuit, so that the driving signal is transmitted to the piezoelectric plate 233, and the piezoelectric plate 233 is deformed by the piezoelectric effect after receiving the driving signal (driving frequency and driving voltage) to further drive the piezoelectric carrier plate 231 and adjust the resonator plate 232 to generate reciprocating bending vibration.

As described above, the tuning resonator plate 232 is located between the piezoelectric plate 233 and the piezoelectric carrier plate 231, and serves as a buffer between the two, thereby tuning the vibration frequency of the piezoelectric carrier plate 231. Basically, the thickness of the tuning resonance plate 232 is greater than the thickness of the piezoelectric carrier plate 231, and the thickness of the tuning resonance plate 232 is variable, thereby tuning the vibration frequency of the actuating body 23.

The connectors 212 define a plurality of gaps 213 between the floating plate 210 and the inner edge of the positioning receptacle 12 for gas to flow through. Referring to fig. 6A, the air hole piece 21, the cavity frame 22, the actuator 23, the insulating frame 24 and the conductive frame 25 are correspondingly stacked and disposed on the positioning receptacle 12 in sequence, and an air flow chamber 27 is formed between the air hole piece 21 and a bottom surface (not labeled) of the positioning receptacle 12. The air flow chamber 27 communicates with the resonance chamber 26 between the actuating body 23, the cavity frame 22 and the floating plate 210 through the hollow hole 211 of the air injection hole plate 21. By controlling the vibration frequency of the gas in the resonant cavity 26 to be approximately the same as the vibration frequency of the floating plate 210, the resonant cavity 26 and the floating plate 210 can generate a Helmholtz resonance effect (Helmholtz resonance), so that the gas transmission efficiency is improved.

Referring to fig. 6B and fig. 6C, as shown in fig. 6A, when the piezoelectric plate 233 moves away from the bottom surface of the positioning receptacle 12, the floating plate 210 of the jet hole plate 21 is driven to move away from the bottom surface of the positioning receptacle 12, so that the volume of the air flow chamber 27 expands sharply, the internal pressure thereof decreases to form a negative pressure, and the air outside the micro pump 2 is sucked into the resonance chamber 26 through the plurality of gaps 213 and the hollow hole 211, so that the air pressure in the resonance chamber 26 increases to generate a pressure gradient. As shown in fig. 6C, when the piezoelectric plate 233 drives the floating plate 210 of the air injection hole piece 21 to move toward the bottom surface of the positioning and accommodating seat 12, the air in the resonant cavity 26 flows out rapidly through the hollow hole 211, and the air in the air flow cavity 27 is squeezed, so that the converged air is injected rapidly and in large quantity in an ideal gas state close to bernoulli's law. The evacuated resonant chamber 26 has an internal gas pressure below the equilibrium gas pressure, which leads the gas to re-enter the resonant chamber 26, according to the principle of inertia. Thus, by repeating the operations of fig. 6B and 6C, the piezoelectric plate 233 is controlled to vibrate in a reciprocating manner, and the vibration frequency of the gas in the resonance chamber 26 is controlled to be approximately the same as the vibration frequency of the piezoelectric plate 233, so as to generate the helmholtz resonance effect, thereby realizing high-speed and large-volume gas transmission.

Referring to fig. 7A to 8A, a second embodiment of the micro-pump 2 is a piezoelectric pump, which includes an air inlet plate 21A, a resonator plate 22A, a piezoelectric actuator 23A, a first insulator plate 24A, a conductive plate 25A, and a second insulator plate 26A, wherein the piezoelectric actuator 23A is disposed corresponding to the resonator plate 22A, and the air inlet plate 21A, the resonator plate 22A, the piezoelectric actuator 23A, the first insulator plate 24A, the conductive plate 25A, and the second insulator plate 26A are sequentially stacked.

The intake plate 21A has at least one intake hole 211A, at least one bus bar groove 212A and a converging chamber 213A, and in the embodiment, the number of the intake holes 211A is preferably 4, but not limited thereto. The air inlet hole 211A penetrates through the air inlet plate 21A, and is used for allowing air to flow into the micro pump 2 from the air inlet hole 211A under the action of atmospheric pressure. The air intake plate 21A has at least one bus bar groove 212A, the number and position of which are corresponding to the air intake holes 211A on the other surface of the air intake plate 21A, the number of the air intake holes 211A in this embodiment is 4, and the number of the corresponding bus bar groove 212A is also 4; the converging chamber 213A is located at the center of the air intake plate 21A, one end of the 4 bus slots 212A is connected to the corresponding air intake holes 211A, and the other end is connected to the converging chamber 213A at the center of the air intake plate 21A, so that the air entering the bus slots 212A from the air intake holes 211A can be guided and converged to the converging chamber 213A. In the present embodiment, the air inlet plate 21A has an air inlet hole 211A, a bus groove 212A and a bus chamber 213A formed integrally.

In some embodiments, the air inlet plate 21A may be made of stainless steel, but not limited thereto. In other embodiments, the depth of the bus chamber 213A is the same as the depth of the bus groove 212A, but not limited thereto.

The resonator plate 22A is made of a flexible material, but not limited thereto, and the resonator plate 22A has a hollow hole 221A formed therein and disposed corresponding to the manifold chamber 213A of the inlet plate 21A for the gas to pass therethrough. In other embodiments, the resonator plate 22A may be made of a copper material, but not limited thereto.

The piezoelectric actuator 23A is assembled by a suspension plate 231A, an outer frame 232A, at least one support 233A and a piezoelectric element 234A; the suspension plate 231A is square and can be bent and vibrated, the outer frame 232A is arranged around the suspension plate 231A, at least one bracket 233A is connected between the suspension plate 231A and the outer frame 232A to provide an elastic support effect, the piezoelectric element 234A is also square and attached to one surface of the suspension plate 231A to be deformed along with applied voltage to drive the suspension plate 231A to be bent and vibrated, and the length of the side of the piezoelectric element 234A is less than or equal to that of the side of the suspension plate 231A; a plurality of gaps 235A are formed among the suspension plate 231A, the outer frame 232A and the bracket 233A, and the gaps 235A are used for air to pass through; in addition, the piezoelectric actuator 23A further includes a protrusion 236A, and the protrusion 236A is disposed on the other surface of the suspension plate 231A and disposed on the two surfaces of the suspension plate 231A opposite to the piezoelectric element 234A.

As shown in fig. 8A, the intake plate 21A, the resonator plate 22A, the piezoelectric actuator 23A, the first insulating plate 24A, the conductive plate 25A, and the second insulating plate 26A are sequentially stacked, the thickness of the suspension plate 231A of the piezoelectric actuator 23A is smaller than that of the outer frame 232A, and when the resonator plate 22A is stacked on the piezoelectric actuator 23A, a chamber space 27A is formed between the suspension plate 231A, the outer frame 232A, and the resonator plate 22A of the piezoelectric actuator 23A.

Referring to fig. 8B, the elements of another embodiment of the piezoelectric pump are the same as those of the previous embodiment (fig. 8A), and therefore not described in detail, but the difference is that when the piezoelectric pump is not operated, the suspension plate 231A of the piezoelectric actuator 23A extends away from the resonator plate 22A in a stamping manner, is not at the same level as the outer frame 232A, the extending distance thereof can be adjusted by the bracket 233A, and the bracket 233A and the suspension plate 231A are not parallel to each other, so that the piezoelectric actuator 23A is protruded.

To understand the output actuation manner of the micro pump 2 for providing gas transmission, please refer to fig. 8C to 8E, please refer to fig. 8C first, the piezoelectric element 234A of the piezoelectric actuator 23A is deformed to drive the suspension plate 231A to move upward after being applied with the driving voltage, at this time, the volume of the chamber space 27A is increased to form a negative pressure in the chamber space 27A, so as to draw the gas in the bus chamber 213A into the chamber space 27A, and the resonance plate 22A is synchronously driven upward under the influence of the resonance principle, so as to increase the volume of the bus chamber 213A, and the gas in the bus chamber 213A is also in a negative pressure state due to the relationship that the gas in the bus chamber 213A enters the chamber space 27A, so as to draw the gas into the bus chamber 213A through the gas inlet hole 211A and the bus groove 212A. Referring to fig. 8D, the piezoelectric element 234A drives the suspension plate 231A to move downward, thereby compressing the chamber space 27A, pushing the gas in the chamber space 27A to be delivered upward through the gap 235A, and discharging the gas from the micro pump 2, and meanwhile, the resonator plate 22A resonates with the suspension plate 231A to move downward, so that the gas entering the manifold chamber 213A through the gas inlet hole 211A and the manifold groove 212A enters the chamber space 27A through the hollow hole 221A. Finally, referring to fig. 8E, when the suspension plate 231A returns to the original position, the resonance plate 22A moves upward due to resonance and inertia, and at this time, the resonance plate 22A compresses the gas in the chamber space 27A and moves the gas toward the gap 235A, and the volume in the confluence chamber 213A is raised, so that the gas can continuously converge in the confluence chamber 213A through the gas inlet hole 211A and the bus groove 212A, and by continuously repeating the gas transmission actuation steps provided by the micro pump 2 shown in fig. 8C to 8E, the micro pump 2 can continuously allow the gas to enter the flow channel formed by the gas inlet plate 21A and the resonance plate 22A from the gas inlet hole 211A to generate a pressure gradient, and then the gas is transported upward through the gap 235A, so that the gas flows at a high speed, thereby achieving the effect of gas transmission by the micro pump 2.

Referring to fig. 9A and 9B, the third embodiment of the micro-pump 2 can be a micro-electromechanical pump, which includes a first substrate 21B, a first oxide layer 22B, a second substrate 23B, and a piezoelectric element 24B. The mems pump of the present embodiment is integrally formed by processes such as epitaxy, deposition, photolithography and etching in the semiconductor process, and should not be disassembled, and for the purpose of describing the internal structure thereof, it is described in detail with the exploded view shown in fig. 9B.

The first substrate 21B is a silicon wafer (Si wafer) with a thickness of 150 to 400 μm, the first substrate 21B has a plurality of inflow holes 211B, a first surface 212B and a second surface 213B, in the embodiment, the number of the inflow holes 211B is 4, but not limited thereto, and each of the inflow holes 211B penetrates from the second surface 213B to the first surface 212B, and the inflow holes 211B have a tapered shape from the second surface 213B to the first surface 212B to enhance the inflow effect.

The first oxide layer 22B is a silicon dioxide (SiO)₂) The thickness of the thin film is between 10 to 20 micrometers (μm), the first oxide layer 22B is stacked on the first surface 212B of the first substrate 21B, the first oxide layer 22B has a plurality of bus channels 221B and a bus chamber 222B, and the number and the positions of the bus channels 221B and the inflow holes 211B of the first substrate 21B correspond to each other. In this embodiment, the number of the bus channels 221B is also 4, one end of each of the 4 bus channels 221B is respectively connected to the 4 inflow holes 211B of the first substrate 21B, and the other end of each of the 4 bus channels 221B is connected to the bus chamber 222B, so that the gas enters from the inflow holes 211B, passes through the corresponding connected bus channel 221B, and then converges into the bus chamber 222B.

The second substrate 23B is bonded to the first substrate 21B and includes a silicon wafer layer 231B, a second oxide layer 232B, and a silicon material layer 233B. The silicon wafer layer 231B has an actuating portion 2311B, a peripheral portion 2312B, a plurality of connecting portions 2313B, and a plurality of fluid channels 2314B. The actuating portion 2311B is circular, the outer peripheral portion 2312B is hollow and annular, and surrounds the actuating portion 2311B, the connecting portions 2313B are respectively connected between the actuating portion 2311B and the outer peripheral portion 2312B, and the fluid passages 2314B surround the outer periphery of the actuating portion 2311B and are respectively located between the connecting portions 2313B. The second oxide layer 232B is an oxygenThe silicon layer, which has a thickness of 0.5 to 2 micrometers (μm), is formed on the silicon wafer layer 231B, and has a hollow ring shape, and defines a vibration chamber 2321B with the silicon wafer layer 231B. The silicon layer 233B is circular, is located on the second oxide layer 232B and is bonded to the first oxide layer 22B, and the silicon layer 233B is silicon dioxide (SiO)₂) The film has a thickness of 2 to 5 micrometers (μm), and has a through hole 2331B, a vibrating portion 2332B, a fixing portion 2333B, a third surface 2334B, and a fourth surface 2335B. The through hole 2331B is formed in the center of the silicon layer 233B, the vibrating portion 2332B is located in the peripheral region of the through hole 2331B and vertically corresponds to the vibration chamber 2321B, the fixing portion 2333B is the peripheral region of the silicon layer 233B and is fixed to the second oxide layer 232B by the fixing portion 2333B, the third surface 2334B is joined to the second oxide layer 232B, and the fourth surface 2335B is joined to the first oxide layer 22B; the piezoelectric element 24B is stacked on the actuation portion 2311B of the silicon wafer layer 231B.

The piezoelectric element 24B includes a lower electrode layer 241B, a piezoelectric layer 242B, an insulating layer 243B and an upper electrode layer 244B, the lower electrode layer 241B is stacked on the actuating portion 2311B of the silicon wafer layer 231B, the piezoelectric layer 242B is stacked on the lower electrode layer 241B, the two are electrically connected through the contact area, furthermore, the width of the piezoelectric layer 242B is smaller than the width of the lower electrode layer 241B, so that the piezoelectric layer 242B cannot completely shield the lower electrode layer 241B, the insulating layer 243B is stacked on a partial area of the piezoelectric layer 242B and an area of the lower electrode layer 241B not shielded by the piezoelectric layer 242B, and finally the upper electrode layer 244B is stacked on the insulating layer 243B and an area of the piezoelectric layer 242B not shielded by the insulating layer 243B, so that the upper electrode layer 244B can be electrically connected with the piezoelectric layer 242B by contacting the piezoelectric layer, and the insulating layer 243B is used to block between the upper electrode layer 244B, avoid the direct contact between the two to cause short circuit.

Referring to fig. 10A to 10C, fig. 10A to 10C are schematic operation diagrams of the mems pump. Referring to fig. 10A, after the lower electrode layer 241B and the upper electrode layer 244B of the piezoelectric element 24B receive the driving voltage and the driving signal and transmit the driving voltage and the driving signal to the piezoelectric layer 242B, the piezoelectric layer 242B begins to deform due to the inverse piezoelectric effect, which drives the actuating portion 2311B of the silicon wafer layer 231B to start to displace, and when the piezoelectric element 24B drives the actuating portion 2311B to move upward to pull away the distance from the second oxide layer 232B, at this time, the volume of the vibration chamber 2321B of the second oxide layer 232B is increased, so that a negative pressure is formed in the vibration chamber 2321B, and the gas in the bus chamber 222B of the first oxide layer 22B is sucked into the through-hole 2331B. As shown in fig. 10B, when the actuator 2311B is pulled by the piezoelectric element 24B to move upward, the vibrating portion 2332B of the silicon material layer 233B moves upward due to the resonance principle, and when the vibrating portion 2332B moves upward, the space of the vibration chamber 2321B is compressed and the gas in the vibration chamber 2321B is pushed to move toward the fluid channel 2314B of the silicon wafer layer 231B, so that the gas can be discharged upward through the fluid channel 2314B, and while the vibrating portion 2332B moves upward to compress the vibration chamber 2321B, the volume of the bus chamber 222B is increased due to the displacement of the vibrating portion 2332B, and a negative pressure is formed inside thereof, so as to suck the gas outside the micro-electromechanical pump into the micro-electromechanical pump from the inflow hole 211B. Finally, as shown in fig. 10C, when the piezoelectric element 24B drives the actuating portion 2311B of the silicon wafer layer 231B to move downward, the gas in the vibration chamber 2321B is pushed toward the fluid channel 2314B and exhausted, and the vibration portion 2332B of the silicon material layer 233B is driven by the actuating portion 2311B to move downward, so as to synchronously compress the gas in the confluent chamber 222B and move it toward the vibration chamber 2321B through the through hole 2331B, and then when the piezoelectric element 24B drives the actuating portion 2311B to move upward, the volume of the vibration chamber 2321B is greatly increased, so that the gas is sucked into the vibration chamber 2321B with high suction force, and the above operations are repeated, so that the actuating portion 2311B is continuously driven by the piezoelectric element 24B to move up and down and the vibrating portion 2332B is driven to move up and down, thereby changing the internal pressure of the micro pump and enabling the micro pump to continuously suck and exhaust gas, thereby completing the operation of the microelectromechanical pump.

As shown in fig. 4, the heat dissipation assembly of the mobile device further includes a liquid pump 4, the liquid pump 4 is connected to the heat dissipation tube plate 3 and is communicated with the interior of the heat dissipation tube plate 3, and the liquid pump 4 can pump and drive the heat dissipation liquid to flow circularly after being actuated, so as to accelerate the flow speed of the heat dissipation liquid, rapidly diffuse the heat source on the heat dissipation tube plate 3, and accelerate the heat exchange effect of the heat dissipation tube plate 3.

Referring to fig. 11 to 13B, the liquid pump 4 includes a valve cover 41, two sets of valve plates 42, a valve base 43, an actuator 44 and an outer cylinder 45. Wherein an actuator 44, a valve base 43, two sets of valve plates 42, and a valve cover 41 are sequentially disposed in the outer cylinder 45, and the inner portion of the outer cylinder 45 is sealed by a sealant 46.

Referring to fig. 11, 13A, 13B and 15, the valve cap body 41 has a first surface 411, a second surface 412, an inlet passage 413, an outlet passage 414 and a plurality of locking members 415, wherein the inlet passage 413 and the outlet passage 414 respectively penetrate between the first surface 411 and the second surface 412, the inlet passage 413 is provided with an inlet flange 413A protruding from an outer edge of the second surface 412, a first protrusion 413B protruding from the inlet flange 413A is provided on the outer edge of the second surface 412, the outlet passage 414 is provided with an outlet flange 414a protruding from an outer edge of the second surface 412, an outlet chamber 414B is recessed from a center of the outlet flange 414a, and the locking members 415 protrude from the second surface 412. In the present embodiment, the number of the locking elements 415 is 2, but not limited thereto, and the number can be set according to the actual positioning requirement.

The two sets of valve plates 42 are made of Polyimide (PI) polymer material, and the manufacturing method thereof mainly utilizes a reactive ion gas dry etching (RIE) method to coat a photosensitive photoresist on the valve plate 42 structure, and after exposing and developing the valve plate 42 structure pattern, etching is performed, since the Polyimide (PI) plate is protected from etching by the photoresist covering part, the valve plate 42 can be etched, the two sets of valve plates 42 comprise a first valve plate 42a and a second valve plate 42b, the first valve plate 42a and the second valve plate 42b are respectively provided with a central valve plate a and 421b, a plurality of extension supports 422a and 422b are respectively arranged around the central valve plates 421a and 421b for elastic support, and a through hole 423a, and a through hole 422b are respectively formed between the adjacent extension supports 422a and 422b, 423 b.

The valve base 43 is abutted with the valve cover body 41, and the first valve plate 42a and the second valve plate 42b are positioned therebetween, the valve base 43 has a valve bottom first surface 431, a valve bottom second surface 432, an inlet valve channel 433 and an outlet valve channel 434, wherein the inlet valve channel 433 and the outlet valve channel 434 are arranged between the valve bottom first surface 431 and the valve bottom second surface 432 in a penetrating manner, and the inlet valve channel 433 is provided with an inlet recessed edge 433a recessed at the inner edge of the valve bottom first surface 431 for abutting against the inlet flange 413a of the valve cover body 41, and the first valve plate 42a is arranged therebetween, so that the central valve plate 421a is abutted against the first protruding structure 413b of the valve cover body 41 to close the inlet channel 413 of the valve cover body 41, the central valve plate 421a of the first valve plate 42a is normally abutted against the first protruding structure 413b, to generate a preload force and facilitate the preload to prevent reverse flow (as shown in fig. 15), an inlet chamber 433b is recessed in the center of the inlet recess edge 433a, and the outlet valve passage 434 is recessed with an outlet recess edge 434a on the inner edge of the valve bottom first surface 431, and a second protrusion structure 434b is protruded in the center of the outlet recess edge 434a, and the outlet recess edge 434a is abutted against the outlet flange 414a of the valve cover body 41, and the second valve piece 42b is disposed therebetween, so that the central valve piece 421b is abutted by the second protrusion structure 434b to close the outlet valve passage 434 of the valve base 43, and the central valve piece 421b of the second valve piece 42b is normally abutted against the second protrusion structure 434b to generate a preload force and facilitate the preload to prevent reverse flow (as shown in fig. 15), and the valve bottom first surface 431 is also provided with the same number of abutting engagement holes 435 corresponding to the plurality of engagement pieces 415 of the valve cover body 41, as shown in fig. 14, the plurality of locking elements 415 of the valve cover body 41 are correspondingly locked into the plurality of abutting locking holes 435 of the valve cover body 41, so that the valve base 43 and the valve cover body 41 can abut and cover the first valve piece 42a and the second valve piece 42b, and realize positioning and assembly, in this embodiment, the number of the locking elements 415 is 2, so the number of the abutting locking holes 435 is 2, but not limited thereto, and can be set according to the number of actual positioning requirements. Also, the valve base second surface 432 is recessed to form a manifold chamber 436, and the manifold chamber 436 communicates with the inlet valve passage 433 and the outlet valve passage 434.

The actuator 44 includes a vibration plate 441 and a piezoelectric element 442, wherein the vibration plate 441 is made of metal, the piezoelectric element 442 is made of piezoelectric powder of lead zirconate titanate (PZT) series with high piezoelectric number, the piezoelectric element 442 is attached to one side of the vibration plate 441, the vibration plate 441 covers the valve bottom second surface 432 of the valve base 43 to seal the current collecting chamber 436, and the vibration plate 441 has an electrical pin 441a for electrically connecting to an external power source so that the piezoelectric element 442 can be driven to deform and vibrate and displace.

The outer cylinder 45 has an inner wall concave space 451 on one side, and the bottom of the inner wall concave space 451 has a hollow central groove 452 and a penetrating frame 453 penetrating one side of the outer cylinder 45 and communicating with the outside, wherein the inner wall concave space 451 is sequentially inserted by the actuator 44, the valve base 43, the two sets of valve plates 42 and the valve cover 41, and the electrical pin 441a of the actuator 44 is penetrated and positioned in the penetrating frame 453. The sealing compound 46 is positioned in the inner wall concave space 451, and the piezoelectric element 442 of the actuator 44 is correspondingly disposed in the central groove 452 and is driven to vibrate and displace in the central groove 452.

As shown in fig. 16A, when the piezoelectric element 442 is driven by voltage to vibrate and displace downward, the inlet chamber 433B of the valve base 43 forms suction to pull the central valve plate 421a of the first valve plate 42a to displace, at this time, the central valve plate 421a of the first valve plate 42a does not close the inlet channel 413 of the valve cover 41, so that the liquid is introduced from the inlet channel 413 of the valve cover 41 into the inlet chamber 433B of the valve base 43 through the through hole 423a of the first valve plate 42a and flows into the collecting chamber 436 to buffer the concentrated liquid, and thereafter, as shown in fig. 16B, when the piezoelectric element 442 of the actuator 44 vibrates and displaces upward, the liquid buffered in the collecting chamber 436 pushes toward the outlet valve channel 434 of the valve base 43, so that the central valve plate 421B of the second valve plate 42B is separated from the top of the second protruding structure 434B, the fluid is smoothly flowed into the outlet chamber 414b of the valve cover 41 through the through hole 423b of the second valve plate 42b and then flowed out of the outlet passage 414, thereby achieving the liquid transfer.

In summary, the heat dissipation assembly for a mobile device provided by the present disclosure utilizes a heat dissipation tube plate having a heat dissipation liquid therein to dissipate heat of a heating element (such as a processing chip) of the mobile device, utilizes a liquid pump to accelerate the flow of the heat dissipation liquid, so that heat energy can be rapidly and evenly dispersed throughout the heat dissipation tube plate to accelerate the dissipation effect, and then utilizes a micro pump to deliver gas to the heat dissipation tube plate to perform heat exchange, thereby reducing the temperature of the heat dissipation tube plate, greatly improving the heat dissipation effect, and effectively reducing the overheating problem of the processor of the mobile device.

Claims (14)

1. A heat dissipation assembly for a mobile device, comprising:

a housing body having a vent hole and a positioning containing seat, wherein the positioning containing seat is arranged corresponding to the vent hole, and the bottom of the positioning containing seat is communicated with the vent hole;

a micro pump, which is arranged in the positioning containing seat and corresponds to the vent hole communicated with the bottom of the positioning containing seat, and is used for discharging gas transmitted when the micro pump is driven to operate;

a heat dissipation tube plate, which contains heat dissipation liquid inside, and one end of which is positioned on the positioning containing seat and is contacted with a heating element of the mobile device so as to perform liquid-state convection heat exchange on a heat source emitted by the heating element;

the gas guided by the micro pump forms heat convection, exchanges heat with the heat absorbed by the heat dissipation tube plate and is exhausted from the vent hole.

2. The mobile device heat sink assembly of claim 1, wherein the micro pump comprises:

the air injection hole sheet comprises a plurality of connecting pieces, a suspension sheet and a hollow hole, the suspension sheet can be bent and vibrated, the connecting pieces are adjacent to the periphery of the suspension sheet, the hollow hole is formed in the central position of the suspension sheet, the suspension sheet is fixedly arranged through the connecting pieces, the connecting pieces elastically support the suspension sheet, an air flow chamber is formed at the bottom of the air injection hole sheet, and at least one gap is formed between the connecting pieces and the suspension sheet;

a cavity frame bearing and superposed on the suspension plate;

an actuating body bearing and overlapping on the cavity frame to receive voltage and perform reciprocating bending vibration;

an insulating frame bearing and superposed on the actuating body; and

a conductive frame, which is arranged on the insulating frame in a bearing and stacking manner;

the actuating body, the cavity frame and the suspension sheet form a resonance chamber, the actuating body is driven to drive the air injection hole sheet to resonate, the suspension sheet of the air injection hole sheet generates reciprocating vibration displacement, the gas enters the airflow chamber through the gap and is discharged, and the transmission flow of the gas is realized.

3. The heat sink assembly of claim 2, wherein the actuator comprises:

a piezoelectric carrier plate bearing and superposed on the cavity frame;

the adjusting resonance plate is loaded and stacked on the piezoelectric carrier plate; and

and the piezoelectric plate is loaded and stacked on the adjusting resonance plate to receive voltage to drive the piezoelectric carrier plate and the adjusting resonance plate to perform reciprocating bending vibration.

4. The mobile device heat sink assembly of claim 1, wherein the micro pump comprises:

the air inlet plate is provided with at least one air inlet hole, at least one bus bar groove corresponding to the position of the air inlet hole and a confluence chamber, the air inlet hole is used for introducing air, and the bus bar groove is used for guiding the air introduced from the air inlet hole to the confluence chamber;

a resonance sheet having a hollow hole corresponding to the position of the confluence chamber and a movable part around the hollow hole; and

a piezoelectric actuator, which is arranged corresponding to the resonance sheet in position;

the air inlet plate, the resonance sheet and the piezoelectric actuator are sequentially stacked, and a cavity space is formed between the resonance sheet and the piezoelectric actuator, so that when the piezoelectric actuator is driven, the gas is led in from the air inlet hole of the air inlet plate, is collected to the collecting cavity through the collecting groove, and then is resonated with the movable part of the resonance sheet through the hollow hole of the resonance sheet to transmit the gas.

5. The mobile device heat sink assembly of claim 4, wherein the piezoelectric actuator comprises:

a suspension plate having a square shape and capable of bending and vibrating;

the outer frame is arranged around the outer side of the suspension plate;

at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and

the piezoelectric element is attached to one surface of the suspension plate and used for receiving voltage to drive the suspension plate to vibrate in a bending mode.

6. The mobile device heat sink assembly of claim 4, wherein the micro pump comprises:

a suspension plate having a first surface and a second surface, the first surface having a convex portion;

the outer frame is arranged around the outer side of the suspension plate;

at least one support connected between the suspension plate and the outer frame to provide elastic support for the suspension plate; and

the piezoelectric element is attached to the second surface of the suspension plate and used for applying voltage to drive the suspension plate to bend and vibrate;

the at least one support is formed between the suspension plate and the outer frame, the suspension plate and the outer frame are positioned at different levels, and the first surface of the suspension plate and the resonator plate keep a cavity space.

7. The mobile device heat sink assembly of claim 4, wherein the micro pump further comprises a first insulating sheet, a conductive sheet and a second insulating sheet, wherein the air inlet plate, the resonator plate, the piezoelectric actuator, the first insulating sheet, the conductive sheet and the second insulating sheet are stacked in sequence.

8. The mobile device heat sink assembly of claim 1, wherein the micro-pump is a micro-electromechanical pump comprising:

a first substrate having a plurality of inflow holes, the plurality of inflow holes being tapered;

a first oxide layer stacked on the first substrate, the first oxide layer having a plurality of converging channels and a converging chamber, the converging channels being communicated between the converging chamber and the inflow holes;

a second substrate bonded to the first substrate, comprising:

a silicon wafer layer having:

an actuating portion, which is circular;

an outer peripheral portion, which is in a hollow ring shape and surrounds the periphery of the actuating portion;

a plurality of connecting portions respectively connected between the actuating portion and the outer circumferential portion; and

a plurality of fluid channels surrounding the periphery of the actuating part and respectively positioned among the connecting parts;

the second oxidation layer is formed on the silicon crystal layer, is in a hollow ring shape, and defines a vibration chamber with the silicon crystal layer; and

a circular silicon layer on the second oxide layer and bonded to the first oxide layer, comprising:

a through hole formed in the center of the silicon material layer;

a vibrating part located in the peripheral area of the through hole;

a fixing part located at the peripheral region of the silicon material layer; and

and the piezoelectric component is circular and is stacked on the actuating part of the silicon wafer layer.

9. The mobile device heat sink assembly of claim 8, wherein the piezoelectric element comprises:

a lower electrode layer;

a piezoelectric layer stacked on the lower electrode layer;

an insulating layer, which is laid on partial surface of the piezoelectric layer and partial surface of the lower electrode layer; and

and the upper electrode layer is superposed on the insulating layer and the rest surface of the piezoelectric layer, which is not provided with the insulating layer, and is electrically connected with the piezoelectric layer.

10. The mobile device heat sink assembly of claim 1 further comprising a liquid pump in communication with the interior of the heat sink tube plate for pumping the heat sink liquid to circulate therein to accelerate the heat exchange of the heat sink tube plate.

11. The mobile device heat sink assembly of claim 10, wherein the liquid pump comprises:

a valve cover body, having a first surface of the valve cover, a second surface of the valve cover, an outlet channel, an inlet channel and a plurality of clamping members, wherein the inlet channel and the outlet channel are arranged between the first surface of the valve cover and the second surface of the valve cover in a penetrating manner, the outer edge of the inlet channel on the second surface of the valve cover is convexly provided with an inlet flange, a first convex structure is convexly arranged on the inlet flange, the outer edge of the outlet channel on the second surface of the valve cover is convexly provided with an outlet flange, the center of the outlet flange is concavely provided with an outlet cavity, and the plurality of clamping members are outwards protruded from the second surface of the valve cover;

two groups of valve plates, including a first valve plate and a second valve plate, wherein the first valve plate and the second valve plate are respectively provided with a central valve plate, the periphery of the central valve plate is respectively provided with a plurality of extension supports for elastic support, and a through hole is formed between every two adjacent extension supports;

a valve base, which is butt jointed with the valve cover body, and the first valve sheet and the second valve sheet are positioned and arranged between the first surface and the second surface, the valve base has a valve bottom first surface, a valve bottom second surface, an inlet valve channel and an outlet valve channel, wherein, the inlet valve channel and the outlet valve channel are arranged between the valve bottom first surface and the valve bottom second surface, and the inner edge of the inlet valve channel on the valve bottom first surface is concavely provided with an inlet concave edge for butt joint with the inlet convex edge of the valve cover body, and the first valve sheet is arranged between the two, so that the central valve sheet is contacted with the first convex structure of the valve cover body to seal the inlet channel of the valve cover body, the center of the inlet concave edge is concavely provided with an inlet cavity, and the inner edge of the outlet valve channel on the valve bottom first surface is concavely provided with an outlet concave edge, a second protruding structure is convexly arranged at the center of the outlet concave edge, the outlet concave edge is butted with the outlet flange of the valve cover body, the second valve sheet is arranged between the second valve sheet and the second protruding structure, so that the central valve sheet is abutted by the second protruding structure to seal the outlet valve passage of the valve base, the first surface of the valve bottom is concavely provided with a plurality of butt-joint clamping holes corresponding to the plurality of clamping parts of the valve cover body, so that the valve base and the valve cover body can butt-joint and seal the first valve sheet and the second valve sheet to realize positioning and assembly, and the second surface of the valve bottom is sunken to form a flow collecting chamber to communicate the inlet valve passage and the outlet valve passage;

the actuator comprises a vibrating piece and a piezoelectric element, wherein the piezoelectric element is attached to one side of the vibrating piece, the vibrating piece is provided with an electric pin, and the vibrating piece covers the second surface of the valve bottom of the valve base to seal the current collecting cavity;

an outer cylinder, one side of which is concavely provided with an inner wall concave space, the bottom of the inner wall concave space is provided with a hollowed central groove and a penetrating frame opening which penetrates one side and is communicated with the outside, wherein the inner wall concave space is internally and sequentially provided with the actuator, the valve base, two groups of valve plates and the valve cover body, the electric pin of the actuator is penetrated and positioned in the penetrating frame opening and is positioned by filling a sealant in the inner wall concave space, and the piezoelectric element of the actuator is correspondingly arranged in the central groove and can vibrate and displace when being driven;

the inlet channel of the valve cover body corresponds to the inlet chamber of the valve base and is communicated with the inlet chamber of the valve base in a control mode through the first valve sheet, and the outlet chamber of the valve cover body corresponds to the outlet valve channel of the valve base and is communicated with the outlet chamber of the valve base in a control mode through the second valve sheet.

12. The heat sink assembly of claim 11 wherein the first protrusion of the cover abuts the central plate of the first valve plate to seal the inlet channel of the cover to generate a predetermined force to prevent backflow.

13. The mobile device heat sink assembly of claim 11 wherein the second protrusion of the valve base abuts the central panel of the second valve panel to close the outlet valve channel of the valve base to create a pre-load to prevent reverse flow.

14. The heat sink assembly as claimed in claim 11, wherein when the piezoelectric element of the actuator vibrates downwards, the inlet chamber of the valve base forms a suction force to pull the central plate of the first valve plate to move, without closing the inlet channel of the valve cover, so that the liquid is introduced from the inlet channel of the valve cover, flows into the inlet chamber of the valve base through the through hole of the first valve plate, and flows into the collecting chamber to buffer the concentrated liquid, and when the piezoelectric element of the actuator vibrates upwards, the concentrated liquid buffered in the collecting chamber is pushed toward the outlet valve channel of the valve base, so that the central plate of the second valve plate is separated from the top of the second protruding structure, so that the fluid smoothly flows into the outlet chamber of the valve cover through the through hole of the second valve plate, and then flows out through the outlet channel, the liquid transfer is completed.

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