CN206251548U - Air cooling heat dissipation device - Google Patents

Abstract

An air-cooled heat dissipation device is used to dissipate heat from electronic components. The air-cooled heat dissipation device includes a flow guide carrier and a gas pump. The flow guide carrier has a first flow guide chamber, a second flow guide chamber, a gas guide end opening, a plurality of connecting air grooves, and a plurality of flow guide exhaust grooves. The gas guide end opening is connected to the first flow guide chamber, and the first flow guide chamber is separated from the second flow guide chamber and connected by a plurality of connecting air grooves. The second flow guide chamber and the plurality of flow guide exhaust grooves are connected to the outside of the flow guide carrier, and the second flow guide chamber cover is placed above the electronic component. The gas pump is arranged to close the gas guide end opening, and the gas pump is driven to guide the airflow into the electronic component for heat exchange and then discharged.

Description

Air Cooling Device

【Technical field】

This case relates to an air cooling and heat dissipation device, especially an air cooling and heat dissipation device that uses a gas pump to provide driving airflow for heat dissipation.

【Background technique】

With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, audio-visual players, etc. have developed towards thinner, portable and high-performance trends. These electronic devices Various high-integration or high-power electronic components must be arranged in its limited internal space. In order to make the electronic equipment faster and more powerful, the electronic components inside the electronic equipment will generate more heat during operation. , and lead to high temperature. In addition, most of these electronic devices are designed to be thin, flat and compact, and there is no additional internal space for heat dissipation and cooling, so the electronic components in the electronic devices are easily affected by heat energy and high temperature, which will cause interference or interference. damage etc.

Generally speaking, the heat dissipation methods inside electronic devices can be divided into active heat dissipation and passive heat dissipation. Active heat dissipation usually adopts an axial fan or a blower fan to be installed inside the electronic device, and the axial fan or blower fan drives the airflow to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation . However, the axial flow fan and the blower fan will generate a lot of noise during operation, and their volume is too large to be thinned and miniaturized, and the service life of the axial flow fan and the blower fan is relatively short. Therefore, traditional axial flow fans and blower fans are not suitable for heat dissipation in thinner and portable electronic devices.

Furthermore, many electronic components will be soldered on a printed circuit board (PCB) using technologies such as Surface Mount Technology (SMT) and Selective Soldering. Electronic components, in a high heat and high temperature environment for a long time, it is easy to separate the electronic components from the printed circuit board, and most electronic components are not resistant to high temperatures. This will lead to a decrease in performance stability and shortened life of electronic components.

FIG. 1 is a schematic structural diagram of a conventional heat dissipation mechanism. As shown in Figure 1, the traditional heat dissipation mechanism is a passive heat dissipation mechanism, which includes a heat conduction plate 12, the heat conduction plate 12 is bonded to an electronic component 11 to be dissipated by a heat conduction glue 13, And the heat conduction path formed by the heat conduction plate 12 enables the electronic component 11 to dissipate heat through heat conduction and natural convection. However, the heat dissipation efficiency of the aforementioned heat dissipation mechanism is poor, which cannot meet the application requirements.

In view of this, it is necessary to develop an air-cooling heat dissipation device to solve the problems faced by the prior art.

【Content of utility model】

The purpose of this case is to provide an air-cooling heat dissipation device, which can be applied to various electronic equipment to conduct side wind heat convection heat dissipation on the electronic components inside the electronic equipment, so as to improve the heat dissipation efficiency, reduce noise, and make the electronic components inside the electronic equipment The performance is stable and the service life is extended, and there is no need to superimpose a heat sink on the electronic components, which can make the overall electronic equipment thinner and lighter.

Another purpose of this case is to provide an air-cooling heat dissipation device, which has a temperature control function, and can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, so as to improve the heat dissipation performance and prolong the use of the air-cooling heat dissipation device life.

In order to achieve the above purpose, a broader implementation of this case is to provide an air-cooled heat dissipation device for dissipating heat from electronic components. The air-cooled heat dissipation device includes: a flow guide carrier, which has a first surface, a second surface, The wall, the first flow guide chamber, the second flow guide chamber, the opening of the air guide end, a plurality of communication air grooves and a plurality of flow guide exhaust grooves, wherein the first surface and the second surface are respectively arranged on the two side walls The upper and lower surfaces, while the first diversion chamber and the second diversion chamber are separated and arranged between the two side walls, the gas guide end is opened on the first surface, and the first diversion chamber runs through the second surface and the gas guide chamber. The end openings are connected, the second diversion chamber is recessed on the second surface and separated from the first diversion chamber, and communicated with the first diversion chamber with a plurality of communication air grooves, and the plurality of diversion exhaust grooves It is arranged on one of the side walls and communicates with the second diversion chamber, and the cover of the second diversion chamber accommodates the electronic component; and a gas pump is arranged on the diversion carrier to close the opening of the gas diversion end; Wherein, by driving the gas pump, the air flow is introduced into the first flow guide chamber through the opening of the gas guide end, and the air flow is introduced into the second flow guide chamber through a plurality of communicating air grooves, and the electronic components are heat exchanged, and will be connected with the electronic components. The airflow after the heat exchange of the electronic components is discharged through a plurality of flow guide and exhaust slots.

【Description of drawings】

FIG. 1 is a schematic structural diagram of a traditional heat dissipation mechanism.

FIG. 2A is a schematic structural diagram of the air-cooling heat dissipation device of the first embodiment of the present application.

FIG. 2B is a schematic structural diagram of the air-cooling heat dissipation device shown in FIG. 2A at the section AA.

3A and 3B are structural schematic diagrams of the flow guiding carrier shown in FIG. 2A at different viewing angles.

4A and 4B are schematic diagrams of the exploded structure of the gas pump in a preferred embodiment of the present invention at different viewing angles.

FIG. 5 is a schematic cross-sectional structure diagram of the piezoelectric actuator shown in FIGS. 4A and 4B .

FIG. 6 is a schematic cross-sectional structure diagram of the gas pump shown in FIGS. 4A and 4B .

7A to 7E are flow charts showing the operation of the gas pump shown in FIGS. 4A and 4B .

FIG. 8 is a schematic structural diagram of an air-cooling heat dissipation device according to a second embodiment of the present application.

【detailed description】

Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are used as illustrations in nature, rather than construed to limit this case.

FIG. 2A is a schematic structural view of the air cooling device of the first embodiment of the present case, FIG. 2B is a schematic structural view of the air cooling device shown in FIG. 2A in section A-A, and FIGS. Schematic diagram of the structure of the fluid carrier at different angles of view. As shown in Figures 2A, 2B and 3A and 3B, the air cooling device 2 of this case can be applied to an electronic device, such as but not limited to a portable computer, a tablet computer, an industrial computer, a portable communication device, an audio-visual player , so as to dissipate heat from the electronic components 3 to be dissipated in the electronic equipment. The air-cooling heat dissipation device 2 in this case includes a flow guiding carrier 20 and an air pump 22 . The air guide carrier 20 includes a first surface 20a, a second surface 20b, a first air guide chamber 200, a second air guide chamber 201, an air guide end opening 202, a plurality of communicating air grooves 203, a plurality of air guide exhaust 204 , two side walls 205 a , 205 b , a partition connecting wall 206 and an accommodating portion 207 .

The first surface 20a and the second surface 20b are respectively arranged on the upper and lower surfaces of the two side walls 205a, 205b, and the gas guide port opening 202 is arranged on the first surface 20a to communicate with the first flow guide chamber 200, the accommodating portion 207 is recessed on the first surface 20 a, which means that the accommodating portion 207 is a groove recessed inward on the first surface 20 a, and is on the periphery of the opening 202 of the air guide end. The first guide chamber 200 runs through the second surface 20 b , and the gas guide end opening 202 communicates with the first guide chamber 200 . The second flow guiding chamber 201 is an accommodating space recessed inwardly on the second surface 20 b of the flow guiding carrier 20 . The second flow-guiding chamber 201 of the flow-guiding carrier 20 is a cover for enclosing the electronic component 3 . The first flow guiding chamber 200 and the second flow guiding chamber 201 are disposed between the two side walls 205 a , 205 b and separated by a partition connecting wall 206 .

A plurality of communication air grooves 203 are disposed in the partition connecting wall 206 for communication between the first flow guiding chamber 200 and the second flow guiding chamber 201 for gas circulation. A plurality of flow guide exhaust grooves 204 are provided on one side wall 205b of the flow guide carrier 20 to communicate with the second flow guide chamber 201 for the gas in the second flow guide chamber 201 to flow through the air cooling device 2 outside. The gas pump 22 is assembled and positioned in the accommodating portion 207 of the flow guiding carrier 20, and closes the opening 202 of the gas guiding end, such that the gas pump 22 is recessed and assembled in the accommodating portion 207, which can reduce the cost of the air cooling device 2. overall height. Wherein, by driving the gas pump 22, the gas flow is introduced into the first flow guiding chamber 200 of the flow guiding carrier 20 through the opening 202 of the gas guiding end, and flows into the second flow guiding chamber 201 after passing through a plurality of communicating air grooves 203, The electronic component 3 is provided with a side wind for heat exchange, and the air flow after heat exchange with the electronic component 3 is discharged through a plurality of guide exhaust slots 204 to realize heat dissipation for the electronic component 3 . Of course, in another embodiment (not shown), the flow guiding carrier 20 may not be provided with the accommodating portion 207, and the gas pump 22 is directly assembled on the first surface 20a to close the opening 202 of the gas guiding end. The heat dissipation effect of the air cooling heat dissipation device 2.

In this embodiment, the electronic component 3 is disposed on a carrier substrate 4, wherein the carrier substrate 4 can be but not limited to a printed circuit board. The carrier substrate 4 is connected to the second surface 20 b of the flow guide carrier 20 , and accommodates the electronic component 3 in the second flow guide chamber 201 of the flow guide carrier 20 .

In this embodiment, the gas pump 22 is a piezo-actuated gas pump for driving gas flow. The gas pump 22 is fixedly installed in the accommodating portion 207 of the flow guide carrier 20 , and is assembled and positioned at the opening 202 of the air guide end, and closes the opening 202 of the air guide end. The second surface 20b of the flow guide carrier 20 is attached to the carrier substrate 4. In other words, the combination of the flow guide carrier 20 and the gas pump 22 is a cover bonded to the carrier substrate 4, and the cover of the electronic component 3 is accommodated on the carrier substrate 4. In the second diversion chamber 201 of the diversion carrier 20 . By means of the gas pump 22 and the carrier substrate 4 closing the gas guide end opening 202, the gas guide end opening 202, the first flow guide chamber 200, the plurality of communicating air grooves 203, the second flow guide chamber 201, and the plurality of guide air guide chambers The flow exhaust groove 204 defines a closed flow channel, thereby concentrating heat dissipation on the electronic components 3 to improve heat dissipation performance. It should be emphasized that this case is not limited to forming a closed flow channel, and other flow channel forms can also be adjusted and changed according to actual application requirements.

In this embodiment, the gas pump 22 is used to drive the gas flow, so as to introduce the gas from the outside of the air-cooled heat dissipation device 2 into the first flow-guiding chamber 200 through the gas-guiding end opening 202, and make the gas flow pass through the communicating air groove 203 into the second guide chamber 201. When the gas pump 22 introduces the gas into the first flow guiding chamber 200, and makes the gas flow into the second flow guiding chamber 201 through the communication groove 203, the introduced gas and the electronic components 3 in the second flow guiding chamber 201 heat exchange, and promote the rapid flow of the airflow in the second flow guiding chamber 201 , and promote the heat exchanged airflow to discharge the heat energy to the outside of the air-cooling heat dissipation device 2 through the multiple flow guiding exhaust slots 204 of the flow guiding carrier 20 . Since the gas pump 22 operates continuously to introduce gas, the electronic component 3 can exchange heat with the continuously introduced gas, and at the same time, the gas after heat exchange can be discharged through a plurality of flow guide exhaust grooves 204 of the flow guide carrier 20, In this way, the heat dissipation of the electronic component 3 can be realized, and the heat dissipation performance can be improved, thereby increasing the performance stability and lifespan of the electronic component 3 .

Figures 4A and 4B are schematic diagrams of the exploded structure of the gas pump in a preferred embodiment of the present case at different viewing angles, Figure 5 is a schematic cross-sectional structure diagram of the piezoelectric actuator shown in Figures 4A and 4B, and Figure 6 is a schematic diagram of the structure of Figures 4A and 4B Schematic diagram of the cross-sectional structure of the gas pump shown. As shown in Figures 4A, 4B, 5 and 6, the gas pump 22 is a piezoelectric actuated gas pump, and includes an inlet plate 221, a resonance plate 222, a piezoelectric actuator 223, insulating plates 2241, 2242 and conductive sheet 225 and other structures, wherein the piezoelectric actuator 223 is set corresponding to the resonant sheet 222, and makes the intake plate 221, the resonant sheet 222, the piezoelectric actuator 223, the insulating sheet 2241, the conductive sheet 225 and another insulating sheet The pieces 2242 and the like are stacked in sequence, and the cross-sectional view of the assembly is shown in FIG. 6 .

In this embodiment, the air intake plate 221 has at least one air intake hole 221a, and the number of the air intake holes 221a is preferably four, but not limited thereto. The air intake hole 221a penetrates the air intake plate 221 for gas to flow into the gas pump 22 through the at least one air intake hole 221a in accordance with the effect of atmospheric pressure from outside the device. The air intake plate 221 has at least one busbar hole 221b for correspondingly setting the at least one air intake hole 221a on the other surface of the air intake plate 221 . There is a central concave portion 221c at the center of the bus hole 221b, and the central concave portion 221c is connected to the bus hole 221b, so that the gas entering the bus hole 221b from the at least one air inlet hole 221a can be guided and converged. Converging to the central recess 221c for gas transfer. In this embodiment, the air inlet plate 221 has an integrally formed air inlet hole 221a, a confluence row hole 221b, and a central concave portion 221c, and a confluence chamber for confluent gas is formed correspondingly at the central concave portion 221c for temporary storage of gas . In some embodiments, the material of the intake plate 221 may be, for example but not limited to, stainless steel. In some other embodiments, the depth of the confluence cavity formed by the central recess 221c is the same as the depth of the confluence row holes 221b, but not limited thereto. The resonant plate 222 is made of a flexible material, but not limited thereto, and has a hollow hole 2220 on the resonant plate 222, which is set corresponding to the central concave portion 221c of the air inlet plate 221, so that the gas can circulate . In some other embodiments, the resonant plate 222 may be made of a copper material, but not limited thereto.

The piezoelectric actuator 223 is assembled by a suspension board 2231, an outer frame 2232, at least one bracket 2233 and a piezoelectric sheet 2234, wherein the piezoelectric sheet 2234 is attached to the first surface of the suspension board 2231. The surface 2231c is used to apply voltage to generate deformation to drive the suspension board 2231 to bend and vibrate, and the at least one bracket 2233 is connected between the suspension board 2231 and the outer frame 2232. In this embodiment, the bracket 2233 is connected to the Between the suspension board 2231 and the outer frame 2232, its two ends are respectively connected to the outer frame 2232 and the suspension board 2231 to provide elastic support, and there is at least one gap 2235 between the bracket 2233, the suspension board 2231 and the outer frame 2232 , the at least one gap 2235 communicates with the opening 202 of the gas-guiding end for gas circulation. It should be emphasized that the types and quantities of the suspension board 2231 , the outer frame 2232 and the brackets 2233 are not limited to the foregoing embodiments, and can be changed according to actual application requirements. In addition, the outer frame 2232 is disposed around the outer side of the suspension board 2231 and has a conductive pin 2232c protruding outwards for power supply connection, but not limited thereto.

The suspension board 2231 is a stepped surface structure (as shown in FIG. 5 ), which means that the second surface 2231b of the suspension board 2231 has a convex portion 2231a, and the convex portion 2231a can be but not limited to a circular convex portion. structure. The protrusion 2231a of the suspension board 2231 is coplanar with the second surface 2232a of the outer frame 2232, and the second surface 2231b of the suspension board 2231 and the second surface 2233a of the bracket 2233 are also coplanar, and the protrusion of the suspension board 2231 There is a certain depth between 2231a and the second surface 2232a of the outer frame 2232 and the second surface 2231b of the suspension board 2231 and the second surface 2232a of the bracket 2233 . The first surface 2231c of the suspension board 2231 is flat and coplanar with the first surface 2232b of the outer frame 2232 and the first surface 2233b of the bracket 2233, and the piezoelectric sheet 2234 is attached to the flat suspension board 2231. at the first surface 2231c. In some other embodiments, the shape of the suspension board 2231 can also be a double-sided flat plate-like square structure, which is not limited thereto, and can be changed arbitrarily according to the actual implementation situation. In some embodiments, the suspension board 2231 , the bracket 2233 and the outer frame 2232 can be integrally formed, and can be made of a metal plate, such as but not limited to stainless steel. In some other embodiments, the side length of the piezoelectric film 2234 is smaller than the side length of the suspension plate 2231 . In some other embodiments, the side length of the piezoelectric sheet 2234 is equal to the side length of the suspension board 2231 , and is also designed as a square plate structure corresponding to the suspension board 2231 , but it is not limited thereto.

The insulating sheet 2241, the conductive sheet 225 and another insulating sheet 2242 of the gas pump 22 are correspondingly arranged under the piezoelectric actuator 223 in sequence, and its shape roughly corresponds to that of the outer frame 2232 of the piezoelectric actuator 223. form. In some embodiments, the insulating sheets 2241 and 2242 are made of insulating material, such as but not limited to plastic, so as to provide an insulating function. In some other embodiments, the conductive sheet 225 can be made of conductive material, such as but not limited to metal material, to provide an electrical conduction function. In this embodiment, a conductive pin 225a can also be provided on the conductive sheet 225 to realize the function of electrical conduction.

In this embodiment, the gas pump 22 is formed by stacking the intake plate 221, the resonant sheet 222, the piezoelectric actuator 223, the insulating sheet 2241, the conductive sheet 225, and another insulating sheet 2242 in sequence, and the resonant There is a gap h between the sheet 222 and the piezoelectric actuator 223. In this embodiment, a filler is filled in the gap h between the resonant sheet 222 and the periphery of the outer frame 2232 of the piezoelectric actuator 223. Material, such as but not limited to conductive glue, so that the depth of the gap h can be maintained between the resonant plate 222 and the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, thereby guiding the airflow to flow more quickly, and Since the protruding portion 2231a of the suspension plate 2231 and the resonant plate 222 keep a proper distance, the contact and interference between each other is reduced, and the generation of noise can be reduced. In some other embodiments, the height of the outer frame 2232 of the piezoelectric actuator 223 can also be increased to increase a gap when assembling it with the resonant plate 222 , but the present invention is not limited thereto.

In this embodiment, the resonant piece 222 has a movable part 222a and a fixed part 222b. After the air intake plate 221, the resonant piece 222 and the piezoelectric actuator 223 are assembled in sequence, the movable part 222a can Together with the gas inlet plate 221 on it, a chamber for converging gas is formed, and a first chamber 220 is further formed between the resonant plate 222 and the piezoelectric actuator 223 for temporarily storing gas, and the first chamber 220 communicates with the chamber at the central recess 221c of the air intake plate 221 through the hollow hole 2220 of the resonant plate 222, and the two sides of the first chamber 220 are formed by the support 2233 of the piezoelectric actuator 223. The gap 2235 communicates with the gas-guiding end opening 202 disposed thereunder.

7A to 7E are flow charts showing the operation of the gas pump shown in FIGS. 4A and 4B . Please refer to FIG. 6, FIG. 7A to FIG. 7E, the operation process of the gas pump in this case is briefly described as follows. When the gas pump 22 is in operation, the piezoelectric actuator 223 is actuated by a voltage to vibrate vertically reciprocatingly with the bracket 2233 as a fulcrum. As shown in Figure 7A, when the piezoelectric actuator 223 is actuated by the voltage to vibrate downward, since the resonant plate 222 is a light and thin sheet structure, when the piezoelectric actuator 223 vibrates, the resonance The sheet 222 will also carry out vertical reciprocating vibration with the resonance, that is, the part of the resonant sheet 222 corresponding to the central concave part 221c will also deform with the bending vibration, that is, the part corresponding to the central concave part 221c is the movable part of the resonant sheet 222. The part 222a is based on that when the piezoelectric actuator 223 bends and vibrates downward, the movable part 222a of the resonant plate 222 corresponding to the central concave part 221c will be brought in and pressed by the gas and vibrated by the piezoelectric actuator 223. Driven, and as the piezoelectric actuator 223 bends and vibrates downwards, the gas enters from at least one air inlet 221a on the air inlet plate 221, and passes through at least one busbar hole 221b to collect into the central central recess 221c , and then flow down into the first chamber 220 through the hollow hole 2220 corresponding to the central concave portion 221c on the resonant plate 222 . Thereafter, driven by the vibration of the piezoelectric actuator 223, the resonant plate 222 will resonate vertically and vibrate vertically, as shown in FIG. Vibrate downwards, and stick to the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, so that the area other than the convex portion 2231a of the suspension plate 2231 and the fixed portion 222b on both sides of the resonant plate 222 will converge The distance between the chambers will not become smaller, and the volume of the first chamber 220 will be compressed by the deformation of the resonant plate 222, and the circulation space in the middle of the first chamber 220 will be closed, so that the gas in it is pushed to both sides The flow, in turn, passes through the gap 2235 between the brackets 2233 of the piezoelectric actuator 223 downwards. Afterwards, as shown in FIG. 7C , the movable portion 222 a of the resonant plate 222 bends and vibrates upwards to return to its original position, and the piezoelectric actuator 223 is driven by voltage to vibrate upwards, thus pressing the first chamber 220 as well. volume, but at this time, since the piezoelectric actuator 223 is lifted upwards, the gas in the first chamber 220 will flow toward both sides, and then drive the gas to continuously flow from at least one air inlet on the air inlet plate 221 221a enters and then flows into the cavity formed by the central recess 221c. Afterwards, as shown in FIG. 7D , the resonant plate 222 is vibrated upward by the upward lift of the piezoelectric actuator 223. At this time, the movable part 222a of the resonant plate 222 also vibrates upward, thereby slowing down the continuous self-advancement of the gas. At least one air inlet 221a on the gas plate 221 enters and then flows into the cavity formed by the central concave portion 221c. Finally, as shown in FIG. 7E , the movable portion 222 a of the resonant piece 222 also returns to the initial position. It can be known from this embodiment that when the resonant plate 222 vibrates vertically reciprocatingly, the maximum distance of its vertical displacement can be increased by the gap h between it and the piezoelectric actuator 223, in other words, between the two A gap h is provided between the structures so that the resonant plate 222 can generate a greater vertical displacement during resonance. Therefore, a pressure gradient is generated in the flow channel design of the gas pump 22, so that the gas flows at a high speed, and the gas is transmitted from the suction end to the discharge end through the impedance difference in the direction of the flow channel, so as to complete the gas delivery operation, even if In the state of air pressure at the discharge end, there is still the ability to continuously push the gas into the first diversion chamber 200, and the effect of silence can be achieved. Repeat the operation of the gas pump 22 in Figures 7A to 7E to make the gas pump 22 produces a gas transport from the outside to the inside.

As mentioned above, through the operation of the above-mentioned gas pump 22, the gas is introduced into the first flow guide chamber 200 of the flow guide carrier 20, and the gas flow is introduced into the second flow guide chamber 201 through the communication gas groove 203, so that the introduced The gas exchanges heat with the electronic components 3, and continuously pushes the gas in the first flow guide chamber 200 to guide the airflow into the second flow guide chamber 201 through the communication air groove 203, so that the gas in the second flow guide chamber 201 quickly Flow, the gas after the heat exchange is promoted to discharge the heat energy to the outside of the air-cooled heat sink 2 through the multiple guide exhaust grooves 204 of the guide carrier 20, so as to improve the efficiency of heat dissipation and cooling, and then increase the efficiency of the electronic component 3 Performance stability and lifespan.

FIG. 8 is a schematic structural diagram of an air-cooling heat dissipation device according to a second embodiment of the present application. As shown in FIG. 8 , the air-cooling device 2 a of this embodiment is similar to the air-cooling device 2 shown in FIG. 2B , and the same component numbers represent the same structures, components and functions, which will not be repeated here. Compared with the air-cooled heat dissipation device 2 shown in FIG. 2B, the air-cooled heat dissipation device 2a of this embodiment has a temperature control function, and it further includes a control system 21, and the control system 21 includes a control unit 211 and a temperature sensor 212, wherein The control unit 21 is electrically connected with the gas pump 22 to control the operation of the gas pump 22 . The temperature sensor 212 is disposed in the second flow-guiding chamber 201 of the flow-guiding carrier 20 and adjacent to the electronic component 3 for sensing the temperature of the electronic component 3 . The temperature sensor 212 is electrically connected to the control unit 21 and senses the temperature near the electronic component 3 , or is directly attached to the electronic component 3 to sense the temperature of the electronic component 3 and transmits the sensing signal to the control unit 211 . The control unit 211 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 212, and sends a control signal when the control unit 211 determines that the temperature of the electronic component 3 is higher than the temperature threshold To the gas pump 22, so as to enable the operation of the gas pump 22, so that the gas pump 22 drives the airflow to cool the electronic component 3, so that the electronic component 3 can be cooled and the temperature can be lowered. When the control unit 211 judges that the temperature of the electronic component 3 is lower than the temperature threshold value, it sends a control signal to the gas pump 22 to stop the operation of the gas pump 22, thereby preventing the gas pump 22 from continuing to operate and resulting in shortened service life. Reduce the consumption of extra energy. Therefore, through the setting of the control system 21, the gas pump 22 of the air-cooling heat dissipation device 2a can perform heat dissipation and cooling when the temperature of the electronic component 3 is overheated, and stop operating after the temperature of the electronic component 3 drops, thereby avoiding the gas pump 22. The lifespan is shortened due to continuous operation, reducing the consumption of extra energy, and also enabling the electronic component 3 to operate in a better temperature environment to improve the stability of the electronic component 3 .

To sum up, this case provides an air-cooling heat dissipation device, which can be applied to various electronic equipment to conduct side air heat convection heat dissipation for electronic components inside the electronic equipment, so as to improve heat dissipation performance, reduce noise, and make the interior of the electronic equipment The performance of the electronic components is stable and the service life is extended, and there is no need to superimpose a heat sink on the electronic components, so that the thickness of the overall electronic equipment can be reduced. In addition, the air-cooling heat dissipation device in this case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic equipment, so as to improve the heat dissipation performance and prolong the service life of the heat dissipation device.

【Symbol Description】

11: Electronic components

12: heat conduction plate

13: thermal adhesive

2. 2a: Air-cooled heat sink

20: diversion carrier

20a: first surface

20b: first surface

200: first diversion chamber

201: the second diversion chamber

202: Gas port opening

203: Connected air tank

204: diversion exhaust groove

205a, 205b: side walls

206: Partition connection wall

207: Storage Department

21: Control system

211: Control unit

212: temperature sensor

22: Gas pump

220: First chamber

221: Air intake plate

221a: air intake hole

221b: busbar hole

221c: central recess

222: Resonant plate

222a: Movable part

222b: Fixed part

2220: hollow hole

223: Piezoelectric Actuator

2231: Hoverboard

2231a: convex part

2231b: second surface

2231c: First Surface

2232: outer frame

2232a: second surface

2232b: first surface

2232c: Conductive pins

2233: bracket

2232a: second surface

2232b: first surface

2234: piezoelectric sheet

2235: Void

2241, 2242: insulating sheet

225: conductive sheet

225a: Conductive pin

3: Electronic components

4: Carrying substrate

h: gap

Claims (10)

1. A kind of air-cooling heat dissipation device, in order to dissipate heat to an electronic component, it is characterized in that, this air-cooling heat dissipation device comprises: A flow guide carrier has a first surface, a second surface, two side walls, a first flow guide chamber, a second flow guide chamber, an air guide end opening, a plurality of communicating air grooves and a plurality of The diversion exhaust groove, wherein the first surface and the second surface are respectively arranged on the upper and lower surfaces of the two side walls, and the first diversion chamber and the second diversion chamber are separately arranged on the two side walls Between, the opening of the gas guiding end is arranged on the first surface, the first flow guiding chamber communicates with the opening of the gas guiding end through the second surface, and the second guiding cavity is recessed in the second surface. Surface, separated from the first guide chamber, and communicated with the first guide chamber through the plurality of communication air grooves, the plurality of guide exhaust grooves are arranged on one of the side walls and connected with the first guide chamber The second flow guidance chamber is connected, and the second flow guidance chamber cover accommodates the electronic component; and A gas pump, arranged on the flow guide carrier to close the opening of the gas guide end; Wherein, by driving the gas pump, the gas flow is introduced into the first flow-guiding chamber through the opening of the gas-guiding end, and the gas flow is introduced into the second flow-guiding chamber through the plurality of communicating air grooves, and the electronic components are processed. heat exchange, and the airflow after heat exchange with the electronic components is discharged through the plurality of guide and exhaust slots. 2 . The air-cooling heat dissipation device according to claim 1 , further comprising a carrier substrate connected to the second surface of the flow guide carrier, wherein the electronic component is disposed on the carrier substrate. 3 . 3. The air-cooling heat dissipation device according to claim 1, wherein the air-guiding carrier is further provided with an accommodating portion, the accommodating portion is recessed on the first surface, and on the periphery of the opening of the air-guiding end, The gas pump is arranged therein. 4. The air-cooling heat dissipation device according to claim 1, wherein the flow guide carrier comprises a partition connection wall, and the first flow guide chamber and the second flow guide chamber are connected by the partition connection wall Separated, and a plurality of communication air grooves are arranged in it to communicate with the first flow guide chamber and the second flow guide chamber. 5. The air-cooling heat dissipation device as claimed in claim 1, wherein the gas pump is a piezoelectric actuated gas pump. 6. The air-cooled heat dissipation device according to claim 5, wherein the piezoelectric actuated gas pump comprises: an air intake plate having at least one air intake hole, at least one confluence row hole and a central recess constituting a confluence chamber, wherein the at least one air intake hole is used to introduce airflow, the confluence row hole corresponds to the air intake hole, and The airflow guided by the air intake hole is converged to the confluence chamber formed by the central concave portion; a resonant plate having a hollow hole corresponding to the confluence chamber, and a movable part around the hollow hole; and A piezoelectric actuator is arranged corresponding to the resonant plate; Wherein, there is a gap between the resonant plate and the piezoelectric actuator to form a cavity, so that when the piezoelectric actuator is driven, the airflow is introduced from the at least one air inlet of the air inlet plate, Gather to the central recess through the at least one busbar hole, and then flow through the hollow hole of the resonant plate to enter the chamber, and the piezoelectric actuator and the movable part of the resonant plate generate a resonant transmission airflow. 7. The air-cooled heat dissipation device according to claim 6, wherein the piezoelectric actuator comprises: A suspension board has a first surface and a second surface, and can bend and vibrate; an outer frame is arranged around the outer side of the suspension board; at least one bracket connected between the suspension board and the outer frame to provide elastic support; and A piezoelectric sheet has a side length, the side length is less than or equal to the side length of the suspension board, and the piezoelectric sheet is attached to a first surface of the suspension board for applying voltage to drive the suspension board to bend vibration. 8 . The air-cooling heat dissipation device according to claim 7 , wherein the suspension board is a square suspension board and has a convex portion. 9. The air-cooling heat dissipation device according to claim 6, wherein the piezoelectric actuated gas pump comprises a conductive sheet, a first insulating sheet and a second insulating sheet, wherein the intake plate, the resonance sheet, the piezoelectric actuator, the first insulating sheet, the conductive sheet and the second insulating sheet are stacked in sequence. 10. The air-cooling heat dissipation device according to claim 1, further comprising a control system, the control system comprising: a control unit electrically connected to the gas pump to control the operation of the gas pump; and a temperature sensor, electrically connected to the control unit and adjacent to the electronic component, to sense a temperature of the electronic component to output a sensing signal to the control unit; Wherein, when the control unit receives the sensing signal and judges that the temperature of the electronic component is greater than a temperature threshold value, the control unit enables the gas pump to drive the air flow, and when the control unit When receiving the sensing signal and judging that the temperature of the electronic component is lower than the temperature threshold, the control unit stops the gas pump.