CN206251546U - Air Cooling Device - Google Patents

Abstract

An air-cooled heat dissipation device is provided for dissipating heat from an electronic component. The air-cooled heat dissipation device comprises a carrier and an air pump. The carrier comprises an airflow circulation channel, an air guide end opening and an air exhaust end opening, wherein the carrier covers the electronic element and enables the electronic element to be positioned in the airflow circulation channel. The gas pump is fixedly arranged on the carrier and closes the opening of the gas guide end, wherein the gas pump is driven to lead the gas flow into the gas flow circulation channel through the opening of the gas guide end and carry out heat exchange on the electronic element, and the gas flow after the heat exchange with the electronic element is discharged through the opening of the gas discharge end.

Description

Air Cooling Device

【Technical field】

This case relates to an air cooling and heat dissipation device, especially an air cooling and heat dissipation device that uses a gas pump to provide driving airflow for heat dissipation.

【Background technique】

With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, audio-visual players, etc. have developed towards thinner, portable and high-performance trends. These electronic devices Various high-integration or high-power electronic components must be arranged in its limited internal space. In order to make the electronic equipment faster and more powerful, the electronic components inside the electronic equipment will generate more heat during operation. , and lead to high temperature. In addition, most of these electronic devices are designed to be thin, flat and compact, and there is no additional internal space for heat dissipation and cooling, so the electronic components in the electronic devices are easily affected by heat energy and high temperature, which will cause interference or interference. damage etc.

Generally speaking, the heat dissipation methods inside electronic devices can be divided into active heat dissipation and passive heat dissipation. Active heat dissipation usually adopts an axial fan or a blower fan to be installed inside the electronic device, and the axial fan or blower fan drives the airflow to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation . However, the axial flow fan and the blower fan will generate a lot of noise during operation, and their volume is too large to be thinned and miniaturized, and the service life of the axial flow fan and the blower fan is relatively short. Therefore, traditional axial flow fans and blower fans are not suitable for heat dissipation in thinner and portable electronic devices.

Furthermore, many electronic components will be soldered on a printed circuit board (PCB) using technologies such as Surface Mount Technology (SMT) and Selective Soldering. Electronic components, in a high heat and high temperature environment for a long time, it is easy to separate the electronic components from the printed circuit board, and most electronic components are not resistant to high temperatures. This will lead to a decrease in performance stability and shortened life of electronic components.

FIG. 1 is a schematic structural diagram of a conventional heat dissipation mechanism. As shown in Figure 1, the traditional heat dissipation mechanism is a passive heat dissipation mechanism, which includes a heat conduction plate 12, the heat conduction plate 12 is bonded to an electronic component 11 to be dissipated by a heat conduction glue 13, And the heat conduction path formed by the heat conduction plate 12 enables the electronic component 11 to dissipate heat through heat conduction and natural convection. However, the heat dissipation efficiency of the aforementioned heat dissipation mechanism is poor, which cannot meet the application requirements.

In view of this, it is necessary to develop an air-cooling heat dissipation device to solve the problems faced by the prior art.

【Content of utility model】

The purpose of this case is to provide an air-cooling heat dissipation device, which can be applied to various electronic equipment to dissipate heat from the electronic components inside the electronic equipment, so as to improve the heat dissipation efficiency, reduce noise, and stabilize the performance of the electronic components inside the electronic equipment And prolong the service life.

Another purpose of this case is to provide an air-cooling heat dissipation device, which has a temperature control function, and can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, so as to improve the heat dissipation performance and prolong the use of the air-cooling heat dissipation device life.

In order to achieve the above purpose, a broader implementation of this case is to provide an air-cooling heat dissipation device for dissipating heat from electronic components. The air cooling heat dissipation device includes a carrier and a gas pump. The carrier includes an air flow channel, an opening at the air-guiding end and an opening at the exhaust end, wherein the carrier covers the electronic component and makes the electronic component located in the air flow channel. The gas pump is fixed on the carrier and closes the opening of the gas guide end. By driving the gas pump, the air flow is introduced into the air flow channel through the opening of the gas guide end to exchange heat with the electronic components. The exchanged air flow exits through the exhaust port opening.

In order to achieve the above purpose, another broad form of implementation of this case is to provide an air-cooling heat dissipation device for dissipating heat from electronic components. The air cooling heat dissipation device includes: a carrier, a radiator and a gas pump. The carrier includes an air flow channel, an opening at the air-guiding end and an opening at the exhaust end, wherein the carrier covers the electronic component and makes the electronic component located in the air flow channel. The heat sink is arranged on the electronic component and located in the air flow channel. The gas pump is fixed on the carrier and closes the opening of the gas-leading end, wherein by driving the gas pump, the airflow is introduced into the air-flow passage through the opening of the gas-leading end to exchange heat with the electronic component, and will be connected with the electronic component The airflow after heat exchange is discharged through the exhaust port opening.

【Description of drawings】

FIG. 1 is a schematic structural diagram of a traditional heat dissipation mechanism.

FIG. 2A is a schematic structural diagram of the air-cooling heat dissipation device of the first embodiment of the present application.

FIG. 2B is a schematic structural diagram of the air-cooling heat dissipation device shown in FIG. 2A at the section AA.

FIG. 3 is a schematic cross-sectional structure diagram of an air-cooling heat dissipation device according to a second embodiment of the present application.

4A and 4B are schematic diagrams of the exploded structure of the gas pump in a preferred embodiment of the present invention at different viewing angles.

FIG. 5 is a schematic cross-sectional structure diagram of the piezoelectric actuator shown in FIGS. 4A and 4B .

FIG. 6 is a schematic cross-sectional structure diagram of the gas pump shown in FIGS. 4A and 4B .

FIGS. 7A to 7E are flow charts showing the operation of the gas pump shown in FIGS. 4A and 4B.

FIG. 8 is a schematic structural diagram of an air-cooling heat dissipation device according to a third embodiment of the present application.

【detailed description】

Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are used as illustrations in nature, rather than construed to limit this case.

FIG. 2A is a schematic structural view of the air cooling device of the first embodiment of the present invention, and FIG. 2B is a schematic structural view of the air cooling device shown in FIG. 2A in section AA. As shown in Figures 2A and 2B, the air cooling device 2 of this case can be applied to an electronic device, such as but not limited to a portable computer, a tablet computer, an industrial computer, a portable communication device, an audio-visual player, to The electronic components 3 to be dissipated in the equipment are dissipated. The air-cooling heat dissipation device 2 in this case includes a carrier 20 and a gas pump 22 , wherein the carrier 20 includes an opening 23 at an air guiding end, an opening 24 at an exhausting end, and a gas circulation channel 25 . The carrier 20 covers the electronic component 3 and makes the electronic component 3 located in the air flow channel 25 . The gas pump 22 is fixed on the carrier 20 , is assembled and positioned at the opening 23 of the gas guiding end, and closes the opening 23 of the gas guiding end. Wherein, by driving the gas pump 22, the airflow is introduced into the airflow passage 25 through the opening 23 of the air-guiding end, and heat exchange is performed on the electronic component 3, and the airflow after heat exchange with the electronic component 3 is passed through the opening 24 of the exhaust end. Discharge, in order to realize the heat dissipation of electronic components 3.

In some embodiments, the carrier 20 is formed by combining the plurality of heat insulating plates 27, and the plurality of heat insulating plates 27 define and form the gas circulation channel 25, the gas guide port opening 23 and the exhaust port opening twenty four. The gas pump 22 is fixed on the heat insulation board 27 of the carrier 20 . The carrier 20 covers the electronic component 3 , and the gas port opening 23 is provided corresponding to the electronic component 3 . In some embodiments, the electronic component 3 is disposed on the heat conduction plate 4 and can dissipate heat through the heat conduction path of the heat conduction plate 4 . The heat insulating plate 27 of the carrier 20 is connected to the heat conducting plate 4 . The heat conduction plate 4 is made of high thermal conductivity material, such as but not limited to artificial graphite.

In this embodiment, the gas pump 22 is a piezo-electrically actuated gas pump, used to drive the gas flow, so as to introduce the gas from the outside of the air cooling device 2 into the gas circulation channel 25 through the gas guide port opening 23 . When the gas pump 22 introduces gas into the gas circulation channel 25, the introduced gas exchanges heat with the electronic components 3 in the carrier 20, and promotes the gas in the gas circulation channel 25 to flow rapidly, so that the airflow after the heat exchange transfers the heat energy through the exhaust. The gas end opening 24 is discharged to the outside of the air cooling device 2 . Since the gas pump 22 operates continuously to introduce gas, the electronic component 3 can exchange heat with the continuously introduced gas, and at the same time, the airflow after the heat exchange is discharged through the exhaust port opening 24, thereby realizing the electronic component 3 The heat dissipation can be improved, and the heat dissipation performance can be improved, thereby increasing the performance stability and lifespan of the electronic component 3 .

FIG. 3 is a schematic cross-sectional structure diagram of an air-cooling heat dissipation device according to a second embodiment of the present application. As shown in FIG. 3 , the air-cooling device 2 a of this embodiment is similar to the air-cooling device 2 shown in FIG. 2B , and the same component numbers represent the same structures, components and functions, which will not be repeated here. Compared with the air cooling device 2 shown in FIG. 2B , the air cooling device 2 a of this embodiment further includes a radiator 29 connected to the surface of the electronic component 3 and located in the gas circulation channel 25 . The heat sink 29 includes a base 291 and a plurality of cooling fins 292 , the base 291 is attached to the surface of the electronic component 3 , and the plurality of cooling fins 292 are vertically connected to the base 291 . The disposition of the radiator 29 can increase the heat dissipation area, so that the heat energy generated by the electronic component 3 can exchange heat with the gas in the gas circulation channel 25 through the radiator 29, so as to improve the heat dissipation performance.

Figures 4A and 4B are schematic diagrams of the exploded structure of the gas pump in a preferred embodiment of the present case at different viewing angles, Figure 5 is a schematic cross-sectional structure diagram of the piezoelectric actuator shown in Figures 4A and 4B, and Figure 6 is a schematic diagram of the structure of Figures 4A and 4B Schematic diagram of the cross-sectional structure of the gas pump shown. As shown in Figures 4A, 4B, 5 and 6, the gas pump 22 is a piezoelectric actuated gas pump, and includes an inlet plate 221, a resonance plate 222, a piezoelectric actuator 223, insulating plates 2241, 2242 and conductive sheet 225 and other structures, wherein the piezoelectric actuator 223 is set corresponding to the resonant sheet 222, and makes the intake plate 221, the resonant sheet 222, the piezoelectric actuator 223, the insulating sheet 2241, the conductive sheet 225 and another insulating sheet The pieces 2242 and the like are stacked in sequence, and the cross-sectional view of the assembly is shown in FIG. 6 .

In this embodiment, the air intake plate 221 has at least one air intake hole 221a, and the number of the air intake holes 221a is preferably four, but not limited thereto. The air intake hole 221a penetrates the air intake plate 221 for gas to flow into the gas pump 22 through the at least one air intake hole 221a in accordance with the effect of atmospheric pressure from outside the device. The air intake plate 221 has at least one busbar hole 221b for correspondingly setting the at least one air intake hole 221a on the other surface of the air intake plate 221 . There is a central concave portion 221c at the center of the bus hole 221b, and the central concave portion 221c is connected to the bus hole 221b, so that the gas entering the bus hole 221b from the at least one air inlet hole 221a can be guided and converged. Converging to the central recess 221c for gas transfer. In this embodiment, the air inlet plate 221 has an integrally formed air inlet hole 221a, a confluence row hole 221b, and a central concave portion 221c, and a confluence chamber for confluent gas is formed correspondingly at the central concave portion 221c for temporary storage of gas . In some embodiments, the material of the intake plate 221 may be, for example but not limited to, stainless steel. In some other embodiments, the depth of the confluence cavity formed by the central recess 221c is the same as the depth of the confluence row holes 221b, but not limited thereto. The resonant plate 222 is made of a flexible material, but not limited thereto, and has a hollow hole 2220 on the resonant plate 222, which is set corresponding to the central concave portion 221c of the air inlet plate 221, so that the gas can circulate . In some other embodiments, the resonant plate 222 may be made of a copper material, but not limited thereto.

The piezoelectric actuator 223 is assembled by a suspension board 2231, an outer frame 2232, at least one bracket 2233 and a piezoelectric sheet 2234, wherein the piezoelectric sheet 2234 is attached to the first surface of the suspension board 2231. The surface 2231c is used to apply voltage to generate deformation to drive the suspension board 2231 to bend and vibrate, and the at least one bracket 2233 is connected between the suspension board 2231 and the outer frame 2232. In this embodiment, the bracket 2233 is connected to the Between the suspension board 2231 and the outer frame 2232, its two ends are respectively connected to the outer frame 2232 and the suspension board 2231 to provide elastic support, and there is at least one gap 2235 between the bracket 2233, the suspension board 2231 and the outer frame 2232 , the at least one gap 2235 communicates with the opening 23 of the gas-guiding end for gas circulation. It should be emphasized that the types and quantities of the suspension board 2231 , the outer frame 2232 and the brackets 2233 are not limited to the foregoing embodiments, and can be changed according to actual application requirements. In addition, the outer frame 2232 is disposed around the outer side of the suspension board 2231 and has a conductive pin 2232c protruding outwards for power supply connection, but not limited thereto.

The suspension board 2231 is a stepped surface structure (as shown in FIG. 5 ), which means that the second surface 2231b of the suspension board 2231 has a convex portion 2231a, and the convex portion 2231a can be but not limited to a circular convex portion. structure. The protrusion 2231a of the suspension board 2231 is coplanar with the second surface 2232a of the outer frame 2232, and the second surface 2231b of the suspension board 2231 and the second surface 2233a of the bracket 2233 are also coplanar, and the protrusion of the suspension board 2231 There is a certain depth between 2231a and the second surface 2232a of the outer frame 2232 and the second surface 2231b of the suspension board 2231 and the second surface 2233a of the bracket 2233 . The first surface 2231c of the suspension board 2231 is flat and coplanar with the first surface 2232b of the outer frame 2232 and the first surface 2233b of the bracket 2233, and the piezoelectric sheet 2234 is attached to the flat suspension board 2231. at the first surface 2231c. In some other embodiments, the shape of the suspension board 2231 can also be a double-sided flat plate-like square structure, which is not limited thereto, and can be changed arbitrarily according to the actual implementation situation. In some embodiments, the suspension board 2231 , the bracket 2233 and the outer frame 2232 can be integrally formed, and can be made of a metal plate, such as but not limited to stainless steel. In some other embodiments, the side length of the piezoelectric film 2234 is smaller than the side length of the suspension plate 2231 . In some other embodiments, the side length of the piezoelectric sheet 2234 is equal to the side length of the suspension board 2231 , and is also designed as a square plate structure corresponding to the suspension board 2231 , but it is not limited thereto.

The insulating sheet 2241, the conductive sheet 225 and another insulating sheet 2242 of the gas pump 22 are correspondingly arranged under the piezoelectric actuator 223 in sequence, and its shape roughly corresponds to that of the outer frame 2232 of the piezoelectric actuator 223. form. In some embodiments, the insulating sheets 2241 and 2242 are made of insulating material, such as but not limited to plastic, so as to provide an insulating function. In some other embodiments, the conductive sheet 225 can be made of conductive material, such as but not limited to metal material, to provide an electrical conduction function. In this embodiment, a conductive pin 225a can also be provided on the conductive sheet 225 to realize the function of electrical conduction.

In this embodiment, the gas pump 22 is formed by stacking the intake plate 221, the resonant sheet 222, the piezoelectric actuator 223, the insulating sheet 2241, the conductive sheet 225, and another insulating sheet 2242 in sequence, and the resonant There is a gap h between the sheet 222 and the piezoelectric actuator 223. In this embodiment, a filler is filled in the gap h between the resonant sheet 222 and the periphery of the outer frame 2232 of the piezoelectric actuator 223. Material, such as but not limited to conductive glue, so that the depth of the gap h can be maintained between the resonant plate 222 and the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, thereby guiding the airflow to flow more quickly, and Since the protruding portion 2231a of the suspension plate 2231 and the resonant plate 222 keep a proper distance, the contact and interference between each other is reduced, and the generation of noise can be reduced. In some other embodiments, the height of the outer frame 2232 of the piezoelectric actuator 223 can also be increased to increase a gap when assembling it with the resonant plate 222 , but the present invention is not limited thereto.

In this embodiment, after the air intake plate 221, the resonant plate 222 and the piezoelectric actuator 223 are assembled in sequence, the resonant plate 222 has a movable part 222a and a fixed part 222b, and the movable part 222a can be Together with the gas inlet plate 221 on it, a chamber for converging gas is formed, and a first chamber 220 is further formed between the resonant plate 222 and the piezoelectric actuator 223 for temporarily storing gas, and the first chamber 220 communicates with the cavity at the center recess 221c of the intake plate 221 through the hollow hole 2220 of the resonant plate 222, and the two sides of the first cavity 220 are formed between the brackets 2233 of the piezoelectric actuator 223 The gap 2235 communicates with the gas guide port opening 23 disposed thereunder.

Figures 7A to 7E are flow charts showing the operation of the gas pump shown in Figures 4A and 4B. Please refer to FIG. 6, FIG. 7A to FIG. 7E, the operation process of the gas pump in this case is briefly described as follows. When the gas pump 22 is in operation, the piezoelectric actuator 223 is actuated by a voltage to vibrate vertically reciprocatingly with the bracket 2233 as a fulcrum. As shown in Figure 7A, when the piezoelectric actuator 223 is actuated by the voltage to vibrate downward, since the resonant plate 222 is a light and thin sheet structure, when the piezoelectric actuator 223 vibrates, the resonance The sheet 222 will also carry out vertical reciprocating vibration with the resonance, that is, the part of the resonant sheet 222 corresponding to the central concave part 221c will also deform with the bending vibration, that is, the part corresponding to the central concave part 221c is the movable part of the resonant sheet 222. The part 222a is based on that when the piezoelectric actuator 223 bends and vibrates downward, the movable part 222a of the resonant plate 222 corresponding to the central concave part 221c will be brought in and pressed by the gas and vibrated by the piezoelectric actuator 223. Driven, and as the piezoelectric actuator 223 bends and vibrates downward, the gas enters from at least one air inlet 221a on the air inlet plate 221, and passes through at least one bus row hole 221b to collect into the central central recess 221c, and then flow down into the first chamber 220 through the hollow hole 2220 on the resonant plate 222 corresponding to the central concave portion 221c. Thereafter, driven by the vibration of the piezoelectric actuator 223, the resonant plate 222 will resonate vertically and vibrate vertically, as shown in FIG. Vibrate downwards, and stick to the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, so that the area other than the convex portion 2231a of the suspension plate 2231 and the fixed portion 222b on both sides of the resonant plate 222 will converge The distance between the chambers will not become smaller, and the volume of the first chamber 220 will be compressed by the deformation of the resonant plate 222, and the circulation space in the middle of the first chamber 220 will be closed, so that the gas in it is pushed to both sides The flow, in turn, passes through the gap 2235 between the brackets 2233 of the piezoelectric actuator 223 downwards. Afterwards, as shown in FIG. 7C , the movable portion 222 a of the resonant plate 222 bends and vibrates upwards to return to its original position, and the piezoelectric actuator 223 is driven by voltage to vibrate upwards, thus pressing the first chamber 220 as well. volume, but at this time, since the piezoelectric actuator 223 is lifted upwards, the gas in the first chamber 220 will flow towards both sides, and the gas will continuously flow from at least one air inlet 221a on the air inlet plate 221 enters, and then flows into the cavity formed by the central recess 221c. Afterwards, as shown in FIG. 7D , the resonant plate 222 is vibrated upward by the upward lift of the piezoelectric actuator 223. At this time, the movable part 222a of the resonant plate 222 also vibrates upward, thereby slowing down the continuous self-advancement of the gas. At least one air inlet 221a on the gas plate 221 enters and then flows into the cavity formed by the central concave portion 221c. Finally, as shown in FIG. 7E, the movable part 222a of the resonant piece 222 also returns to the initial position. From this embodiment, it can be seen that when the resonant piece 222 vibrates vertically, it can be connected with the piezoelectric actuator. The gap h between 223 increases the maximum distance of its vertical displacement. In other words, setting the gap h between the two structures enables the resonant plate 222 to produce a larger vertical displacement during resonance. Therefore, a pressure gradient is generated in the flow channel design of the gas pump 22, so that the gas flows at a high speed, and the gas is transmitted from the suction end to the discharge end through the impedance difference in the direction of the flow channel, so as to complete the gas delivery operation. Even in the state of air pressure at the discharge end, there is still the ability to continuously push the gas into the gas circulation channel 25, and the effect of silence can be achieved. Repeat the operation of the gas pump 22 in Figures 7A to 7E to make the gas pump 22 A gas transport from the outside to the inside is produced.

As mentioned above, through the operation of the above-mentioned gas pump 22, the gas is introduced into the gas circulation channel 25, so that the introduced gas exchanges heat with the electronic components 3, and promotes the gas in the gas circulation channel 25 to flow rapidly, thereby promoting heat exchange. The resulting gas discharges heat energy from the opening 24 of the exhaust port to the outside of the air-cooled heat sink 2 , thereby improving the efficiency of heat dissipation and cooling, thereby increasing the performance stability and life of the electronic component 3 .

FIG. 8 is a schematic structural diagram of an air-cooling heat dissipation device according to a third embodiment of the present application. As shown in FIG. 8 , the air-cooling device 2 b of this embodiment is similar to the air-cooling device 2 shown in FIG. 2B , and the same component numbers represent the same structures, components and functions, which will not be repeated here. Compared with the air-cooled heat dissipation device 2 shown in FIG. 2B, the air-cooled heat dissipation device 2c of this embodiment has a temperature control function, and it further includes a control system 21. The control system 21 includes a control unit 211 and a temperature sensor 212, wherein The control unit 211 is electrically connected with the gas pump 22 to control the operation of the gas pump 22 . The temperature sensor 212 is disposed in the carrier 20 and adjacent to the electronic component 3 for sensing the temperature near the electronic component 3 , or directly attached to the electronic component 3 to sense the temperature of the electronic component 3 . The temperature sensor 212 is electrically connected to the control unit 211 , senses the temperature of the electronic component 3 , and transmits the sensing signal to the control unit 211 . The control unit 211 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 212, and sends a control signal when the control unit 211 determines that the temperature of the electronic component 3 is higher than the temperature threshold To the gas pump 22, so as to enable the operation of the gas pump 22, so that the gas pump 22 drives the airflow to cool the electronic component 3, so that the electronic component 3 can be cooled and the temperature can be lowered. When the control unit 211 judges that the temperature of the electronic component 3 is lower than the temperature threshold value, it sends a control signal to the gas pump 22 to stop the operation of the gas pump 22, thereby preventing the gas pump 22 from continuing to operate and resulting in shortened service life. Reduce the consumption of extra energy. Therefore, through the setting of the control system 21, the gas pump 22 of the air-cooling heat dissipation device 2 can perform heat dissipation and cooling when the temperature of the electronic component 3 is overheated, and stop operating after the temperature of the electronic component 3 drops, thereby avoiding the gas pump. 22 Continuous operation leads to shortened life span, reduces extra energy consumption, and also enables the electronic component 3 to operate in a better temperature environment, improving the stability of the electronic component 3 .

To sum up, this case provides an air-cooled heat dissipation device, which can be applied to various electronic equipment to dissipate heat from the electronic components inside, so as to improve heat dissipation performance, reduce noise, and stabilize the performance of the electronic components inside the electronic equipment. Extended service life. In addition, the air-cooling heat dissipation device in this case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic equipment, so as to improve the heat dissipation performance and prolong the service life of the heat dissipation device.

This case can be modified in various ways by the people who are familiar with this technology, Ren Shijiang, but all of them do not break away from the intended protection of the scope of the attached patent application.

【Symbol Description】

11: Electronic components

12: heat conduction plate

13: thermal adhesive

2: Air-cooled cooling device

20: carrier

22: Gas pump

220: First Chamber

221: Air intake plate

221a: air intake hole

221b: busbar hole

221c: central recess

222: Resonant plate

222a: Movable part

222b: fixed part

2220: hollow hole

223: Piezoelectric Actuator

2231: Hoverboard

2231a: convex part

2231b: second surface

2231c: First Surface

2232: outer frame

2232a: second surface

2232b: first surface

2232c: Conductive pins

2233: bracket

2233a: second surface

2233b: first surface

2234: piezoelectric sheet

2235: Void

2241, 2242: insulating sheet

225: conductive sheet

225a: Conductive pin

23: Gas port opening

24: Exhaust port opening

25: Gas circulation channel

27: heat shield

29: Radiator

291: base

292: heat sink

3: Electronic components

4: Heat conduction plate

21: Control system

211: Control unit

212: temperature sensor

Claims (9)

1. a kind of air cooling heat abstractor, is used to an electronic element radiating, it is characterised in that the air cooling heat abstractor is included：

One carrier, including an air flow passage, an air guide end opening and an exhaust end opening, wherein the carrier enclosure lid electronics Element and make the electronic component be located at the air flow passage in；And

One gas pump, is fixedly arranged on the carrier, and closes the air guide end opening, wherein by the gas pump is driven, by air-flow The air flow passage is imported via air guide end opening and heat exchange is carried out to the electronic component, and will be carried out with the electronic component Air-flow after heat exchange is discharged via the exhaust end opening.

2. air cooling heat abstractor as claimed in claim 1, it is characterised in that the carrier includes that multiple thermal insulation board groups connect to define The air flow passage, the air guide end opening and the exhaust end opening are formed, the air guide end opening is corresponding with the electronic component to be set Put.

3. air cooling heat abstractor as claimed in claim 1, it is characterised in that the gas pump is a piezoelectric actuated gas pump.

4. air cooling heat abstractor as claimed in claim 3, it is characterised in that the piezoelectric actuated gas pump includes：

One inlet plate, confluxes with an at least air admission hole, at least one and round and constitutes a central recess for confluxing chamber, wherein An at least air admission hole supplies to import air-flow, the corresponding air admission hole of the round that confluxes, and guides the air-flow of the air admission hole to converge into this The chamber that confluxes that central recess is constituted；

One resonance plate, with a hollow hole corresponding to around the chamber that confluxes, and the hollow hole be a movable part；And

One piezo-activator, setting corresponding with the resonance plate；

Wherein, there is a gap to form a chamber between the resonance plate and the piezo-activator, so that the piezo-activator is driven When dynamic, air-flow is imported by an at least air admission hole for the inlet plate, the central recess be collected to through at least one round that confluxes, The hollow hole of the resonance plate is passed through, to enter in the chamber, is produced by the movable part of the piezo-activator and the resonance plate Resonance transfer air-flow.

5. air cooling heat abstractor as claimed in claim 4, it is characterised in that the piezo-activator is included：

One suspension board, with a first surface and a second surface, and flexible vibration；

One housing, around the outside for being arranged at the suspension board；

An at least support, is connected between the suspension board and the housing, to provide resilient support；And

One piezoelectric patches, with a length of side, the length of side is less than or equal to a length of side of the suspension board, and the piezoelectric patches is to be attached at On one first surface of the suspension board, to applied voltage driving the suspension board flexural vibrations.

6. air cooling heat abstractor as claimed in claim 5, it is characterised in that the suspension board is a square suspension board, and is had There is a convex portion.

7. air cooling heat abstractor as claimed in claim 4, it is characterised in that the piezoelectric actuated gas pump include a conducting strip, One first insulating trip and one second insulating trip, the wherein inlet plate, the resonance plate, the piezo-activator, first insulating trip, The conducting strip and second insulating trip are that sequentially stacking is set.

8. air cooling heat abstractor as claimed in claim 1, it further includes a control system, and the control system includes：

One control unit, is electrically connected to the gas pump, to control the gas pump to operate；And

One temperature sensor, is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Spend to export a sensing signal to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, the control unit makes the gas pump enable, to drive air current flow, and when the control unit is in receiving the sensing Signal, and when judging the temperature of the electronic component less than the temperature threshold value, the control unit makes the gas pump decommission.

9. a kind of air cooling heat abstractor, for an electronic element radiating, it is characterised in that the air cooling heat abstractor is included:

One carrier, including an air flow passage, an air guide end opening and an exhaust end opening, wherein the carrier enclosure lid electronics Element and make the electronic component be located at the air flow passage in；

One radiator, is arranged on the electronic component and positioned at the air flow passage；And

One gas pump, is fixedly arranged on the carrier, and closes the air guide end opening, wherein by the gas pump is driven, by air-flow The air flow passage is imported via air guide end opening and heat exchange is carried out to the electronic component, and will be carried out with the electronic component Air-flow after heat exchange is discharged via the exhaust end opening.