CN112649561B - Gas detection module - Google Patents

Abstract

A gas detection module is characterized in that a gas inlet concave surface and a gas outlet concave surface are formed on the side wall surface of a base, a gas inlet groove area and a gas outlet groove area are formed on the surface of the base, the gas inlet concave surface is communicated with the gas inlet groove area, the gas outlet concave surface is communicated with the gas outlet groove area, and then the gas inlet groove area and the gas outlet groove area are covered by a film, so that the effects of side gas inlet and side gas outlet are achieved.

Description

Gas detection module

technical field

This case relates to a gas detection module, especially a gas detection module that is extremely thin and is used to combine with portable electronic devices or mobile devices.

Background technique

In recent years, people's requirements for the living environment have gradually increased. Before going out, in addition to confirming the weather information, the quality of the air quality has also received more and more attention. However, the current air quality information must rely on the monitoring stations installed, but only Provide air quality information in large areas, but cannot provide detailed air quality information in small areas.

In view of this, how to provide a gas detection module and be able to combine the gas detection module with the portable electronic device that is necessary for people nowadays, so that the air quality information can be obtained only by the portable electronic device in hand, It is indeed a problem that needs to be solved at present.

Contents of the invention

The main purpose of this case is to provide a gas detection module, which includes a base, a micropump, a driver circuit board and a gas sensor to form a module, so that it can be easily embedded in mobile devices or portable electronic devices for implementation.

A broad implementation of this case is a gas detection module, comprising: a base, including: a first surface; a second surface, opposite to the first surface; a plurality of sidewalls, from the side of the first surface The sides extend longitudinally to the sides of the second surface, wherein one of the side wall surfaces is recessed, an air inlet concave surface and an air outlet concave surface are arranged at intervals between the air inlet concave surface and the air outlet concave surface; an accommodating space is formed from the The second surface is recessed toward the first surface and is formed in the inner area of the side wall surface. The accommodating space also partitions a micropump loading area, a detection area and an air guide passage area, and the micropump loading area It communicates with the air guide passage area through a vent gap, and the detection area and the air guide passage area communicate with each other through a communication opening; an air intake groove area is formed by recessing from the first surface, and an air intake passage is provided. The hole communicates with the air guide channel area, and is provided with a vent groove, communicated with the air intake concave surface of the side wall surface; and an air outlet groove area is formed from the depression of the first surface, and is provided with an air outlet through hole, and The bearing area of the micropump is connected, and an air outlet groove is provided, which is connected to the air outlet concave surface of the side wall; a micropump is accommodated in the bearing area of the micropump, and covers the air outlet through hole; a driving circuit board, The cover is attached to the second surface of the base to form the micropump loading area, the detection area and the air guide passage area of the accommodating space, so that the gas can be obtained from the air intake in the air intake groove area. A gas guide path that enters through the through hole and is discharged from the gas outlet through hole in the gas outlet groove area; a gas sensor is electrically connected to the driving circuit board and is correspondingly installed in the detection area to detect the passing gas and a film, which is attached to cover the air inlet groove area and the air outlet groove area, so that the gas can enter the air inlet groove area from the air inlet concave surface of the side wall surface, and enter the air inlet groove area through the ventilation groove, and then enter the air inlet groove area by The air intake through hole enters the air guide path, and then is discharged from the air outlet through hole in the air outlet groove area, and communicates with the air outlet concave surface of the side wall through the air outlet groove to form side exhaust; wherein, the base , the micropump, the driving circuit board, the gas sensor and the thin film are made of a tiny material in a modular structure, and the modular structure has a length, a width and a height, wherein the micropump drives the acceleration to guide the external The gas is introduced into the gas guide channel area from the side inlet concave surface of the side wall surface, and is detected by the gas sensor in the detection area. The air outlet through hole is discharged, and communicates with the air outlet concave surface of the side wall through the air outlet groove to form side exhaust.

Description of drawings

FIG. 1A is a schematic diagram of the appearance of the gas detection module in this case.

FIG. 1B is an exploded schematic diagram of the sealing position of the film of the gas detection module in this case on the base.

FIG. 1C is an exploded schematic diagram of relevant components of the gas detection module of this case.

Fig. 2 is a schematic diagram of a micropump assembled on the base of the gas detection module in this case.

FIG. 3 is a schematic cross-sectional view of the gas path of the gas detection module of the present case.

FIG. 4 is a schematic cross-sectional view of the gas path viewed from another angle of the gas detection module of the present invention.

FIG. 5A is an exploded schematic view of the micropump of the gas detection module of this case.

FIG. 5B is an exploded schematic diagram of the micropump of the gas detection module of the present application viewed from another angle.

FIG. 6A is a schematic cross-sectional view of the micropump of the gas detection module of the present case.

6B is a schematic cross-sectional view of another embodiment of the micropump of the gas detection module of the present invention.

6C to 6E are schematic diagrams of the operation of the micropump shown in FIG. 6A .

Fig. 7A is a schematic cross-sectional view of a MEMS pump.

Fig. 7B is an exploded schematic diagram of the MEMS pump.

8A to 8C are schematic diagrams of the operation of the MEMS pump.

FIG. 9 is a schematic diagram of the gas detection module embedded in the mobile device in this case.

FIG. 10 is a schematic cross-sectional view of a gas detection module assembled in a portable electronic device in this case.

Explanation of reference signs

1: base

11: First Surface

12: second surface

13: side wall surface

13a: Concave air intake

13b: Air outlet concave surface

14: Storage space

14a: Micropump loading area

14b: Detection area

14c: Airway area

14d: Vent gap

14e: Communication opening

15: Air intake slot area

15a: Air intake through hole

15b: Air intake groove

16: Outlet groove area

16a: Air outlet through hole

16b: Outlet groove

2: micro pump

21: Air intake plate

211: air intake

212: busbar groove

213: confluence chamber

22: Resonant plate

221: hollow hole

23: Piezoelectric Actuator

231: Hoverboard

232: Frame

233: bracket

234: Piezoelectric element

235: Void

236: Convex

24: The first insulating sheet

25: conductive sheet

26: Second insulating sheet

27: Chamber space

2a: MEMS pump

21a: first substrate

211a: Inflow hole

212a: first surface

213a: second surface

22a: First oxide layer

221a: confluence channel

222a: Confluence Chamber

23a: Second substrate

231a: Silicon wafer layer

2311a: Actuator

2312a: Peripheral part

2313a: connection part

2314a: Fluid channel

232a: second oxide layer

2321a: Vibration Chamber

233a: Silicon layer

2331a: perforation

2332a: Vibration Department

2333a: fixed part

2334a: Third Surface

2335a: Fourth Surface

24a: Piezoelectric component

241a: lower electrode layer

242a: piezoelectric layer

243a: insulating layer

244a: upper electrode layer

3: Driver circuit board

4: Gas sensor

5: film

6: Portable Electronic Devices

7: Mobile device

7a: Air inlet

7b: Air outlet

L: Length

W: width

H: Thickness

Detailed ways

Some typical embodiments that embody the features and advantages of this case will be described in detail in the description of the latter paragraph. It should be understood that the present case can have various changes in different aspects without departing from the scope of the present case, and the descriptions and diagrams therein are used for illustration in nature rather than limiting the present case.

1A to 1C, this case provides a gas detection module, including a base 1, a micropump 2, a drive circuit board 3, a gas sensor 4 and a film 5; wherein the base 1, micro The pump 2, the drive circuit board 3, the gas sensor 4 and the film 5 are modular structures made of tiny materials, and the modular structure has a length, a width and a height, wherein the length, width and height of the module structure are between 1 between centimeters (mm) and 999 centimeters (mm), or between 1 micrometer (μm) and 999 micrometers (μm), or between 1 nanometer (nm) and 999 nanometers (nm), but not as such limit. In this embodiment, the length of the module structure is between 1 micrometer and 999 micrometers, the width is between 1 micrometer and 999 micrometers, and the volume formed by the height is between 1 micrometer and 999 micrometers, or the length of the module structure is between 1 nanometer and 999 micrometers. 999 nanometers, a volume between 1 nanometer and 999 nanometers, and a height between 1 nanometer and 999 nanometers, but not limited thereto, and the volume can be changed according to actual needs.

The above-mentioned base 1 includes a first surface 11, a second surface 12, a four-way side wall surface 13, an accommodating space 14, an air inlet groove area 15 and an air outlet groove area 16, the first surface 11 and the second The surfaces 12 are two opposite surfaces, and the four-way side wall surface 13 is formed by extending longitudinally from the side of the first surface 11 to the side of the second surface 12, and one of the four-way side wall surfaces 13 is recessed toward the side wall surface 13 with an air intake concave surface 13a And an air outlet concave surface 13b, the air inlet concave surface 13a and the air outlet concave surface 13b are arranged at intervals; the accommodation space 14 is formed by recessing the area space in the side wall surface 13 from the second surface 12 toward the first surface 11, and the accommodation space 14 is separated. A micropump bearing area 14a, a detection area 14b and an air guide passage area 14c, and the micro pump bearing area 14a and the air guide passage area 14c communicate with each other through a ventilation gap 14d, and the detection area 14b and the air guide passage area 14c pass through a The communication openings 14e communicate with each other.

The above-mentioned air intake groove area 15 is formed by being recessed from the first surface 11, and includes an air intake through hole 15a and an air intake groove 15b. Between the gas passage hole 15a and the air intake concave surface 13a, and make the air intake passage hole 15a and the air intake concave surface 13a communicate with each other.

The above-mentioned air outlet groove area 16 is formed in a depression from the first surface 11, and includes an air outlet through hole 16a and an air outlet groove 16b. between the concave surfaces 13b, and make the air outlet through hole 16a communicate with the air outlet concave surface 13b.

Please refer to Fig. 1C and Fig. 2 at the same time, the micropump 2 is housed in the micropump carrying area 14a of the accommodation space 14, and covers the air outlet through hole 16a, in addition, the micropump 2 is electrically connected to the drive circuit board 3 connection, the operation of the micropump 2 is controlled by the drive signal provided by the drive circuit board 3 , and the drive signal (not shown) of the micropump 2 is provided by the drive circuit board 3 .

Please continue to refer to Fig. 1C, the driving circuit board 3 cover is attached to the second surface 12 of the base 1 to form the micropump bearing area 14a, the detection area 14b and the gas guide passage area 14c of the accommodating space 14 to promote the gas flow. An air guiding path is obtained through the air intake through hole 15 a of the air intake slot area 15 and then discharged through the air outlet through hole 16 a of the air outlet slot area 16 .

The gas sensor 4 is positioned on the drive circuit board 3 and is electrically connected to the drive circuit board 3. When the drive circuit board 3 is attached to the second surface 12 of the base 1, the gas sensor 4 is correspondingly accommodated in the accommodating The detection area 14b of the space 14, and detect the gas information in the detection area 14b.

The above-mentioned film 5 is attached on the first surface of the base 1, and covers the air inlet groove area 15 and the air outlet groove area 16, so that the gas is sucked in from the side of the air inlet concave surface 13a on the side wall surface, and passes through the air inlet groove. 15b communicates into the air intake groove area 15, then enters the air guide path through the air intake through hole 15a, and then is discharged from the air outlet through hole 16a of the air outlet groove area 16, and communicates with the air outlet concave surface 13b of the side wall surface 13 through the air outlet groove 16b. Form side vents.

It can be seen from the above description that the external air of the gas detection module can be accelerated by driving the micropump 2, and the side air intake is formed by the side wall surface 13 and then introduced into the air guide passage area 14c, passing through the gas sensor 4 located in the detection area 14b The gas information is detected, and the imported gas is then guided by the micropump 2, which can be discharged from the gas outlet through hole 16a of the gas outlet groove area 16, and communicated with the gas outlet concave surface 13b of the side wall surface 13 through the gas outlet groove 16b to form side exhaust; , the aforementioned gas sensor 4 is a volatile organic compound sensor, but not limited thereto. Of course, the film 5 is not attached to the first surface of the base 1, so that the gas is directly entered into the air guide path through the air inlet through hole 15a, and then discharged from the air outlet through hole 16a of the air outlet groove area 16, forming a vertical air intake. And exhaust, this case provides a gas detection module to choose the application of side air intake and side exhaust or vertical air intake and exhaust according to actual needs.

Please refer to Fig. 3 and Fig. 4 at the same time, the driving circuit board 3 provides the driving signal to control the micropump 2 to operate, and the micropump 2 starts to absorb the gas in the micropump bearing area 14a, and discharges it through the air outlet through hole 16a. At this time, The micropump loading area 14a presents a negative pressure state, so that the gas passing through the air guide channel area 14c communicated with the ventilation gap 14d enters the micropump loading area 14a from the ventilation gap 14d, and begins to flow from the air intake through hole 15a of the air intake groove area 15 The gas drawn enters the gas guide passage area 14c, and the gas entering the air guide passage area 14c not only enters the micropump bearing area 14a, but also part of the gas enters the detection area 14b through the communication opening 14e, for the gas sensor located in the detection area 14b 4. Gas information is detected.

Please refer to Fig. 5A and shown in Fig. 5B, micropump 2 comprises and comprises an inlet plate 21, a resonant sheet 22, a piezoelectric actuator 23, a first insulating sheet 24, a conductive sheet 25 and a second insulating sheet. sheet 26 and other structures, wherein the piezoelectric actuator 23 is set corresponding to the resonant sheet 22, and the gas inlet plate 21, the resonant sheet 22, the piezoelectric actuator 23, the first insulating sheet 24, the conductive sheet 25 and the second The two insulating sheets 26 and the like are stacked in sequence.

As shown in Figure 5A, Figure 5B and Figure 6C, the above-mentioned air intake plate 21 has at least one air intake hole 211, at least one confluence row groove 212 and a confluence chamber 213, in this embodiment, the number of air intake holes 211 Four are preferred, but not limited thereto. The air inlet 211 runs through the air inlet plate 21, and is used for gas to flow into the micropump 2 from the air inlet 211 in response to the effect of atmospheric pressure. There is at least one confluence row groove 212 on the air intake plate 21, and its number and position are set corresponding to the air intake holes 211 on the other surface of the air intake plate 21. The number of air intake holes 211 in this embodiment is 4, and the corresponding The number of confluence row grooves 212 is also four; the confluence chamber 213 is located at the center of the intake plate 21, one end of the aforementioned four confluence row grooves 212 is connected to the corresponding air inlet hole 211, and the other end is connected to the inlet port 211. The confluence chamber 213 at the center of the gas plate 21 can guide the gas that enters the confluence and drain groove 212 from the air inlet 211 and concentrate it into the confluence chamber 213 . In this embodiment, the air intake plate 21 has an air intake hole 211, a confluence row groove 212 and a confluence chamber 213 integrally formed. In some embodiments, the material of the intake plate 21 may be made of stainless steel, but it is not limited thereto. In some other embodiments, the depth of the bus chamber 213 is the same as that of the bus groove 212 , but not limited thereto.

The above-mentioned resonant piece 22 is made of a flexible material, but not limited thereto, and has a hollow hole 221 on the resonant piece 22, which is set corresponding to the confluence chamber 213 of the air inlet plate 21, for gas supply pass. In other embodiments, the resonant plate 22 may be made of a copper material, but not limited thereto.

The above-mentioned piezoelectric actuator 23 is assembled by a suspension plate 231, an outer frame 232, at least one support 233 and a piezoelectric element 234; the suspension plate 231 is a square shape, and can bend and vibrate. The frame 232 is arranged around the suspension board 231, and at least one bracket 233 is connected between the suspension board 231 and the outer frame 232 to provide the effect of elastic support. The piezoelectric element 234 is also square and attached to a surface of the suspension board 231. It is used to apply voltage to generate deformation to drive the suspension board 231 to bend and vibrate, and the side length of the piezoelectric element 234 is less than or equal to the side length of the suspension board 231; wherein, there are multiple gaps between the suspension board 231, the outer frame 232 and the bracket 233 235, the gap 235 for gas to pass through; in addition, the piezoelectric actuator 23 further includes a convex portion 236, and the convex portion 236 is arranged on the other surface of the floating plate 231, and is arranged on both sides of the floating plate 231 opposite to the piezoelectric element 234. surface.

As shown in Figure 6A, the intake plate 21, the resonant sheet 22, the piezoelectric actuator 23, the first insulating sheet 24, the conductive sheet 25, and the second insulating sheet 26 are sequentially stacked and set, and the piezoelectric actuator 23 The thickness of the suspension plate 231 is smaller than the thickness of the outer frame 232. When the resonant plate 22 is stacked on the piezoelectric actuator 23, a cavity can be formed between the suspension plate 231 of the piezoelectric actuator 23, the outer frame 232 and the resonant plate 22. Room space 27.

Please refer to Fig. 6B again, another embodiment of the micropump 2, its elements are the same as the previous embodiment (Fig. 6A), so it will not be described in detail, the difference is that the suspension plate 231 of the piezoelectric actuator 23 is formed by stamping Extending in a direction away from the resonant sheet 22, and not at the same level as the outer frame 232; the air intake plate 21, the resonant sheet 22, the piezoelectric actuator 23, the first insulating sheet 24, the conductive sheet 25, and the second insulating sheet 26 After sequentially stacking and combining, wherein, a cavity spacing is formed between a surface of the suspension plate 231 and the resonance plate 22, and the cavity spacing will affect the transmission effect of the micropump 2, so maintaining a fixed cavity spacing is necessary for the micropump 2 It is very important to provide a stable transmission efficiency. In this way, the micropump 2 forms the suspension plate 231 by stamping to make it concave, so that the surface of the suspension plate 231 and the surface of the outer frame 232 are non-coplanar, that is, the suspension plate 231 One surface is different from the surface of the outer frame 232, forming a drop, and the first surface of the suspension plate 231 is far away from the surface of the outer frame 232, so that the suspension plate 231 of the piezoelectric actuator 23 is recessed to form a space and can form a space with the resonant plate 22. The adjusted chamber spacing is directly improved by adopting the above-mentioned suspended plate 231 of the piezoelectric actuator 23 to form a recess to form a structure of a chamber space. In this way, the required chamber spacing can be adjusted by adjusting the piezoelectric actuator. The concave distance of the floating plate 231 of the device 23 is completed, which effectively simplifies the structural design for adjusting the chamber spacing, and also achieves the advantages of simplifying the manufacturing process and shortening the manufacturing time.

In order to understand the output actuation mode of the above-mentioned micropump 2 providing gas transmission, please continue to refer to FIG. 6C to FIG. 6E , please refer to FIG. 6C first, the piezoelectric element 234 of the piezoelectric actuator 23 is deformed after being applied with a driving voltage The suspension plate 231 is driven to move upwards. At this time, the volume of the chamber space 27 is increased, and a negative pressure is formed in the chamber space 27, and the gas in the confluence chamber 213 is drawn into the chamber space 27, and the resonant plate 22 is resonated at the same time. The influence of the principle is driven upward synchronously, which increases the volume of the confluence chamber 213, and because the gas in the confluence chamber 213 enters the chamber space 27, the inside of the confluence chamber 213 is also in a negative pressure state, and then through the The air hole 211 and the confluence row groove 212 absorb gas into the confluence chamber 213; please refer to FIG. 6D again, the piezoelectric element 234 drives the suspension plate 231 to move downward, compressing the cavity space 27, and similarly, the resonance plate 22 is suspended The plate 231 is displaced downward due to resonance, simultaneously pushes the gas in the chamber space 27 downward and is transported upward through the gap 235, and the gas is discharged by the micropump 2; finally, please refer to FIG. 6E, when the suspension plate 231 returns to its original position, The resonant plate 22 is still displaced downward due to inertia. At this time, the resonant plate 22 will move the gas in the compressed chamber space 27 to the gap 235, and increase the volume in the confluence chamber 213, so that the gas can continuously pass through the intake air. Holes 211 and confluence row grooves 212 are gathered in the confluence chamber 213, and the micropump can make the gas flow from the air inlet hole 211 continuously by repeating the above-mentioned micropump steps shown in Fig. 6C to Fig. 6E to provide gas transmission. Entering the flow channel formed by the intake plate 21 and the resonant plate 22 to generate a pressure gradient, and then transported upwards through the gap 235, so that the gas flows at a high speed, achieving the effect of the micro pump 2 transporting the gas.

Another embodiment of the micropump 2 of this case can be a microelectromechanical pump 2a, please refer to FIG. 7A and FIG. 7B, the microelectromechanical pump 2a includes a first substrate 21a, a first oxide layer 22a, a second substrate 23a and A piezoelectric component 24a; as a supplementary note, the MEMS pump 2a of this embodiment is processed through epitaxy, deposition, photolithography, and etching in the semiconductor manufacturing process, and should not be disassembled. In order to describe its internal structure in detail, it is decomposed Figure detailed.

The first substrate 21a is a silicon wafer (Si wafer), and its thickness is between 150 to 400 microns (μm). The first substrate 21a has a plurality of inflow holes 211a, a first surface 212a, and a second surface 213a. In this embodiment, the number of the plurality of inflow holes 211a is four, but not limited thereto, and each inflow hole 211a penetrates from the second surface 213a to the first surface 212a, and the inflow holes 211a are used to lift The inflow effect makes the inflow hole 211a present a tapered tapered shape from the second surface 213a to the first surface 212a.

The first oxide layer 22a is a silicon dioxide (SiO2) film, its thickness is between 10 to 20 microns (μm), the first oxide layer 22a is stacked on the first surface 212a of the first substrate 21a, the first The oxide layer 22a has a plurality of confluence channels 221a and a confluence chamber 222a, and the number and position of the confluence channels 221a and the inflow holes 211a of the first substrate 21a correspond to each other. In this embodiment, the number of confluence channels 221a is also four, and one ends of the four confluence channels 222a are respectively connected to the four inflow holes 211a of the first substrate 21a, while the other ends of the four confluence channels 221a are connected to the confluence channels 221a. The chamber 222a allows the gases to enter through the inflow holes 211a respectively, pass through the corresponding confluence channels 221a connected thereto, and then converge into the confluence chamber 222a.

The second oxide layer 232a is a silicon oxide layer with a thickness between 0.5 and 2 micrometers (μm), formed on the silicon wafer layer 231a in a hollow ring shape, and defines a vibration chamber 2321a with the silicon wafer layer 231a. The silicon material layer 233a is circular, located on the second oxide layer 232a and bonded to the first oxide layer 22a. The silicon material layer 233a is a silicon dioxide (SiO2) film with a thickness between 2 and 5 microns (μm), having A through hole 2331a, a vibration part 2332a, a fixed part 2333a, a third surface 2334a and a fourth surface 2335a. The through hole 2331a is formed in the center of the silicon material layer 233a, the vibration part 2332a is located in the peripheral area of the through hole 2331a, and is vertically corresponding to the vibration chamber 2321a, and the fixed part 2333a is the peripheral area of the silicon material layer 233a, and is fixed to the second part by the fixed part 2333a. The oxide layer 232a, the third surface 2334a is bonded to the second oxide layer 232a, and the fourth surface 2335a is bonded to the first oxide layer 22a; the piezoelectric element 24a is stacked on the actuator portion 2311a of the silicon wafer layer 231a.

The piezoelectric component 24a includes a lower electrode layer 241a, a piezoelectric layer 242a, an insulating layer 243a and an upper electrode layer 244a. The lower electrode layer 241a is stacked on the actuator portion 2311a of the silicon wafer layer 231a, and the piezoelectric layer 242a is stacked on the The lower electrode layer 241a, the two are electrically connected through the contact area. In addition, the width of the piezoelectric layer 242a is smaller than the width of the lower electrode layer 241a, so that the piezoelectric layer 242a cannot completely cover the lower electrode layer 241a. An insulating layer 243a is stacked on the partial area of the layer 242a and the area of the lower electrode layer 241a not covered by the piezoelectric layer 242a, and finally the insulating layer 243a is stacked on the area of the piezoelectric layer 242a not covered by the insulating layer 243a. The electrode layer 244a allows the upper electrode layer 244a to be in contact with the piezoelectric layer 242a to be electrically connected, while the insulating layer 243a is used to block between the upper electrode layer 244a and the lower electrode layer 241a to avoid a short circuit caused by direct contact between the two.

Please refer to FIG. 8A to FIG. 8C . FIG. 8A to FIG. 8C are schematic diagrams of the operation of the MEMS pump 2a. Please refer to FIG. 8A first, when the lower electrode layer 241a and the upper electrode layer 244a of the piezoelectric component 24a receive the driving voltage and driving signal (not shown) transmitted by the driving circuit board 3, they are conducted to the piezoelectric layer 242a, After the piezoelectric layer 242a receives the driving voltage and the driving signal, it begins to deform due to the influence of the inverse piezoelectric effect, which will drive the actuating part 2311a of the silicon wafer layer 231a to start to displace. When the piezoelectric component 24a drives the actuating part 2311a to move upward At this time, the volume of the vibration chamber 2321a of the second oxide layer 232a will increase, so that a negative pressure will be formed in the vibration chamber 2321a, which is used to divert the flow of the first oxide layer 22a The gas in the chamber 222a is sucked into it through the perforation 2331a. Please continue to refer to FIG. 8B. When the actuating part 2311a is pulled upward by the piezoelectric component 24a and moves upward, the vibrating part 2332a of the silicon material layer 233a will move upward due to the influence of the resonance principle. When the vibrating part 2332a moves upward, it will compress the vibration The space of the chamber 2321a also pushes the gas in the vibration chamber 2321a to move to the fluid channel 2314a of the silicon wafer layer 231a, so that the gas can be discharged upward through the fluid channel 2314a. When the vibration part 2332a moves upward to compress the vibration chamber 2321a, The volume of the confluence chamber 222a is increased due to the displacement of the vibrating part 2332a, and a negative pressure is formed inside it, and the gas absorbed from the microelectromechanical pump 2a enters it through the inflow hole 211a, and finally, as shown in Figure 8C, the piezoelectric component 24a drives the silicon wafer When the actuating part 2311a of the layer 231a is displaced downward, the gas in the vibration chamber 2321a is pushed to the fluid channel 2314a, and the gas is discharged, and the vibrating part 2332a of the silicon material layer 233a is also driven downward by the actuating part 2311a , the gas in the synchronously compressed confluence chamber 222a moves to the vibration chamber 2321a through the perforation 2331a, and when the piezoelectric component 24a drives the actuating part 2311a to move upward, the volume of the vibration chamber 2321a will be greatly increased, thereby having a higher The suction force draws the gas into the vibration chamber 2321a, and then repeats the above actions, so that the piezoelectric component 24a continuously drives the actuating part 2311a to move up and down and the vibration part 2332a moves up and down. By changing the inside of the microelectromechanical pump 2a The pressure makes it continuously draw and discharge gas, thereby completing the action of the microelectromechanical pump 2a.

Finally, please refer to FIG. 1A and FIG. 9. The gas path of the gas detection module in this case is designed as side air intake and side air outlet, so that the gas detection module can be embedded in a mobile device 7 for application, and the overall structural design of the gas detection module is also Thinning can be achieved, the preferred length L can be between 20mm and 30mm, the preferred width W can be between 10mm and 20mm, and the preferred thickness H can be between 1mm and 6mm. It is used on the mobile device 7, and forms side air intake and side air outlet corresponding to the air inlet 7a and air outlet 7b on the side wall of the mobile device 7, so that the gas detection module of this case can be easily embedded in the mobile device 7 for implementation , wherein the mobile device 7 can be a smart phone, a smart watch and other devices; in addition, please refer to Figure 10, the preferred length of the gas detection module in this case is between 20mm and 30mm, and the preferred width is between 10mm and 20mm , When the preferred thickness is between 1mm and 6mm, it can also be assembled in a portable electronic device 6, which can be a mobile power supply, an air quality detection device, an air cleaner and other devices.

To sum up, the gas detection module provided in this case forms an air inlet concave surface and an air outlet concave surface through the side wall of the base, and forms an air inlet groove area and an air outlet groove area on the surface of the base, connecting the air inlet concave surface air groove area , the air outlet concave surface communicates with the air outlet groove area, and then the air inlet groove area and the air outlet groove area are covered with a film, so that the effect of using side air intake and side air outlet can be realized, and a micro pump is used to transmit the gas, and the base of the case , a micropump, a driving circuit board and a gas sensor constitute a gas detection module, which can be easily embedded in a mobile device or a portable electronic device. The combination thereof has great industrial applicability and advancement.

Claims (12)

1. A gas detection module, comprising:

a base, comprising:

a first surface;

a second surface opposite to the first surface;

the side wall surfaces are formed by extending longitudinally from the first surface side edge to the second surface side edge, wherein one side wall surface is recessed with an air inlet concave surface and an air outlet concave surface, and the air inlet concave surface and the air outlet concave surface are arranged at intervals;

the accommodating space is formed by recessing the inner area space of the side wall surface from the second surface to the first surface, and is divided into a micropump bearing area, a detection area and an air guide passage area;

an air inlet groove area concavely formed from the first surface and provided with an air inlet through hole communicated with the air guide passage area and an air vent groove communicated with the air inlet concave surface of the side wall surface; and

the air outlet groove area is concavely formed from the first surface and is provided with an air outlet through hole which is communicated with the micropump bearing area, and an air outlet groove which is communicated with the air outlet concave surface of the side wall surface;

the micro pump is accommodated in the micro pump bearing area and covers the air outlet through hole;

the driving circuit board is covered on the second surface of the base to form the micropump bearing region, the detection region and the air guide passage region of the accommodating space, so that air can enter from the air inlet through hole of the air inlet groove region and then is discharged from the air outlet through hole of the air outlet groove region;

the gas sensor is electrically connected to the driving circuit board and correspondingly accommodated in the detection area to detect passing gas; and

the film is attached to cover the air inlet groove area and the air outlet groove area, so that air is enabled to enter the air inlet groove area through the air inlet concave surface of the side wall surface and enter the air guide path through the air inlet through hole, is exhausted through the air outlet through hole of the air outlet groove area, and is communicated with the air outlet concave surface of the side wall surface through the air outlet groove to form side exhaust;

the base, the micropump, the driving circuit board, the gas sensor and the film are made of micro materials, and the module structure has a length, a width and a height, wherein the micropump drives, accelerates and guides external gas to be led into the gas guide passage area from the side surface formed by the gas inlet concave surface of the side wall surface, the gas sensor detects the gas in the detection area, the led gas is led by the micropump, and is discharged from the gas outlet through hole of the gas outlet groove area, and the led gas is communicated with the gas outlet concave surface of the side wall surface through the gas outlet groove to form side exhaust.

2. The gas detection module of claim 1, wherein the module structure has a volume of 1 micron to 999 microns in length, 1 micron to 999 microns in width, and 1 micron to 999 microns in height.

3. The gas detection module of claim 1, wherein the module structure has a volume of 1 nm to 999 nm in length, 1 nm to 999 nm in width, and 1 nm to 999 nm in height.

4. The gas detection module of claim 1, wherein the gas detection module has a length of between 2mm and 30mm, a width of between 2mm and 20mm, and a thickness of between 1mm and 6 mm.

5. The gas detection module of claim 1, wherein the gas sensor is a volatile organic compound sensor.

6. The gas detection module of claim 1, wherein the micropump comprises:

the air inlet plate is provided with at least one air inlet hole, at least one bus bar groove corresponding to the air inlet hole and a bus bar chamber, the air inlet hole is used for introducing air, and the bus bar groove is used for guiding the air introduced from the air inlet hole to the bus bar chamber;

a resonance plate having a central hole corresponding to the position of the converging chamber and surrounding a movable part; and

a piezoelectric actuator corresponding to the resonance plate in position;

the air inlet plate, the resonance plate and the piezoelectric actuator are sequentially stacked, and a chamber space is formed between the resonance plate and the piezoelectric actuator, so that when the piezoelectric actuator is driven, the air is led in through the air inlet hole of the air inlet plate, is converged into the converging chamber through the converging slot, and then passes through the central hole of the resonance plate, so that the piezoelectric actuator and the movable part of the resonance plate generate resonance to transmit the air.

7. The gas detection module of claim 6, wherein the piezoelectric actuator comprises:

a suspension plate having a square shape and being capable of bending and vibrating;

an outer frame surrounding the outer side of the suspension plate;

at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and

the piezoelectric element is provided with a side length which is smaller than or equal to the side length of the suspension plate, and is attached to one surface of the suspension plate and used for receiving voltage to drive the suspension plate to bend and vibrate.

8. The gas detection module of claim 6, wherein the piezoelectric actuator comprises:

a suspension plate having a convex portion;

an outer frame surrounding the outer side of the suspension plate;

at least one bracket connected between the suspension plate and the outer frame to provide elastic support for the suspension plate; and

a piezoelectric element attached to one surface of the suspension plate for applying a voltage to drive the suspension plate to vibrate in bending;

the at least one bracket is formed between the suspension plate and the outer frame, and forms a non-coplanar structure between a surface of the suspension plate and a surface of the outer frame, and keeps a chamber spacing between a surface of the suspension plate and the resonant plate.

9. The gas detection module of claim 6, wherein the micropump further comprises a first insulating sheet, a conductive sheet, and a second insulating sheet, wherein the gas inlet plate, the resonant sheet, the piezoelectric actuator, the first insulating sheet, the conductive sheet, and the second insulating sheet are stacked in sequence.

10. The gas detection module of claim 1, wherein the gas detection module is between 20mm and 30mm in length, between 10mm and 20mm in width, and between 1mm and 6mm in thickness.

11. The gas detection module of claim 1, wherein the micropump is a microelectromechanical pump comprising:

a first substrate having a plurality of inflow holes, the plurality of inflow holes being tapered;

the first oxide layer is overlapped with the first substrate and is provided with a plurality of converging chambers and a converging chamber, and the converging chambers are communicated between the converging chamber and the inflow holes;

a second substrate bonded to the first substrate, comprising:

a silicon wafer layer having:

an actuating part which is round;

an outer peripheral part, which is hollow ring-shaped and surrounds the periphery of the actuating part;

a plurality of connecting parts respectively connected between the actuating part and the outer peripheral part; and

a plurality of fluid channels surrounding the periphery of the actuating part and respectively positioned among the plurality of connecting parts;

a second oxide layer formed on the silicon wafer layer, having a hollow ring shape, and defining a vibration chamber with the silicon wafer layer;

a silicon material layer with a round shape, which is positioned on the second oxide layer and combined with the first oxide layer, and comprises:

a through hole formed in the center of the silicon layer;

a vibration part located in the peripheral area of the perforation; and

a fixing part located at the peripheral area of the silicon material layer; and

and the piezoelectric component is round and is overlapped with the actuating part of the silicon wafer layer.

12. The gas detection module of claim 11, wherein the piezoelectric assembly comprises:

a lower electrode layer;

a piezoelectric layer stacked on the lower electrode layer;

an insulating layer laid on part of the surface of the piezoelectric layer and part of the surface of the lower electrode layer; and

and the upper electrode layer is overlapped on the insulating layer and the rest surfaces of the piezoelectric layer, which are not provided with the insulating layer, and is used for being electrically connected with the piezoelectric layer.

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