CN211603081U - Gas detection module - Google Patents

Abstract

A gas detection module is characterized in that a gas inlet concave surface and a gas outlet concave surface are formed on the side wall surface of a base, a gas inlet groove area and a gas outlet groove area are formed on the surface of the base, the gas inlet concave surface is communicated with the gas inlet groove area, the gas outlet concave surface is communicated with the gas outlet groove area, and the gas inlet groove area and the gas outlet groove area are sealed by films, so that the effects of side gas inlet and side gas outlet are achieved.

Description

Gas detection module

technical field

This case relates to a gas detection module, especially an ultra-thin gas detection module that is combined with a portable electronic device or a mobile device.

Background technique

In recent years, people's requirements for living environment have gradually increased. In addition to confirming weather information before going out, more and more attention has been paid to the quality of air quality. However, the current air quality information must rely on the monitoring set by the Environmental Protection Agency of the Executive Yuan. It can only provide air quality information in large areas, and cannot provide air quality information in small areas in detail.

In view of this, how to provide a gas detection module, which can be combined with a portable electronic device that is necessary for people today, so that air quality information can be obtained only with the portable electronic device in hand, It is a problem that needs to be solved at present.

Utility model content

The main purpose of this case is to provide a gas detection module, which includes a base, a micro pump, a driving circuit board and a gas sensor to form a module, which can be easily embedded in a mobile device or a portable electronic device for application.

A broad implementation aspect of the present application is a gas detection module, comprising: a base, including: a first surface; a second surface opposite to the first surface; a plurality of sidewall surfaces from the first surface side The edge is longitudinally extended to the side of the second surface, wherein a side wall surface is recessed with an air inlet concave surface and an air outlet concave surface, and the air inlet concave surface and the air outlet concave surface are arranged at intervals; an accommodating space, from the The second surface is recessed toward the first surface and is formed in the area space within the side wall surface. The accommodating space is also divided into a micro-pump carrying area, a detection area and an air guide passage area, and the micro-pump carrying area The air guide passage area is communicated with each other through a ventilation notch, and the detection area and the air guide passage area are communicated with each other through a communication opening; an air intake groove area is recessed from the first surface and is provided with an air intake channel A hole, communicated with the air guide passage area, and a ventilation groove is provided, which is communicated with the air inlet concave surface of the side wall surface; and an air outlet groove area, which is recessed from the first surface. The micro-pump bearing area is connected, and an air outlet groove is provided, which is communicated with the air outlet concave surface of the side wall surface; a micro pump is accommodated in the micro pump bearing area and covers the air outlet through hole; a driving circuit board, The cover is attached to the second surface of the base to form the micro-pump bearing area, the detection area and the air-guiding passage area of the accommodating space, and the gas is formed by the air-intake of the air-intake groove area A gas guide path that enters through holes and is discharged from the gas outlet through holes in the gas outlet groove area; a gas sensor is electrically connected to the driving circuit board, and is correspondingly accommodated in the detection area to detect the passing gas and a film, which is attached and covers the air inlet groove area and the air outlet groove area, so that the gas can be inhaled by the air inlet concave surface of the side wall surface, and enter the air inlet groove area through the ventilation groove, and then pass through the air inlet groove area. The air inlet through hole enters the air guide path, and is discharged from the air outlet through hole in the air outlet groove area, and the air outlet groove communicates with the air outlet concave surface of the side wall surface to form side air exhaust; wherein, the base , The micro-pump, the driving circuit board, the gas sensor and the thin film are made of a micro-material module structure, and the module structure has a length, a width and a height, wherein the micro-pump drives the acceleration to guide the external The gas is introduced into the air guide passage area from the side air intake concave formed by the air intake concave surface of the side wall surface, and is detected by the gas sensor in the detection area. The air outlet through hole is discharged, and the air outlet groove is communicated with the air outlet concave surface of the side wall surface to form side air exhaust.

Description of drawings

FIG. 1A is a schematic diagram of the appearance of the gas detection module of the present invention.

FIG. 1B is an exploded schematic view of the cover position of the film of the gas detection module of the present invention on the base.

FIG. 1C is an exploded schematic diagram of the relevant components of the gas detection module of the present invention.

FIG. 2 is a schematic diagram of the assembly and combination of the micro pump on the base of the gas detection module of the present invention.

FIG. 3 is a schematic cross-sectional view of the gas path of the gas detection module of the present invention.

FIG. 4 is a schematic cross-sectional view of the gas path of the gas detection module of the present invention viewed from another angle.

FIG. 5A is an exploded schematic diagram of the micropump of the gas detection module of the present invention.

FIG. 5B is an exploded schematic diagram of the micro-pump of the gas detection module of the present invention viewed from another angle.

FIG. 6A is a schematic cross-sectional view of a micropump of the gas detection module of the present invention.

6B is a schematic cross-sectional view of another embodiment of the micropump of the gas detection module of the present invention.

6C to 6E are schematic diagrams of the operation of the micro-pump shown in FIG. 6A .

FIG. 7A is a schematic cross-sectional view of the MEMS pump.

FIG. 7B is an exploded schematic diagram of the MEMS pump.

8A to 8C are schematic diagrams of the operation of the MEMS pump.

FIG. 9 is a schematic diagram of the gas detection module embedded in the mobile device of the present invention.

FIG. 10 is a schematic cross-sectional view of the present gas detection module assembled in a portable electronic device.

Description of reference numerals

1: base

11: First surface

12: Second surface

13: Side wall surface

13a: Air intake concave

13b: Air outlet concave

14: accommodating space

14a: Micro-pump carrying area

14b: Detection area

14c: Air passage area

14d: Ventilation gap

14e: Communication opening

15: Intake slot area

15a: Air intake through hole

15b: Intake groove

16: Air outlet tank area

16a: Air outlet through hole

16b: Air outlet groove

2: Micro pump

21: Air intake plate

211: Air intake

212: Bus bar slot

213: Convergence Chamber

22: Resonance sheet

221: Hollow hole

23: Piezoelectric Actuators

231: Hoverboard

232: Outer frame

233: Bracket

234: Piezoelectric element

235: void

236: convex part

24: The first insulating sheet

25: Conductive sheet

26: Second insulating sheet

27: Chamber Space

2a: MEMS pump

21a: first substrate

211a: Inflow hole

212a: first surface

213a: Second surface

22a: first oxide layer

221a: Busway

222a: Convergence Chamber

23a: Second substrate

231a: Silicon Wafer Layer

2311a: Actuator

2312a: Peripheral

2313a: Connections

2314a: Fluid Channels

232a: second oxide layer

2321a: Vibration Chamber

233a: Silicon layer

2331a: Perforation

2332a: Vibration Division

2333a: Fixed part

2334a: Third Surface

2335a: Fourth Surface

24a: Piezoelectric components

241a: lower electrode layer

242a: Piezoelectric layer

243a: Insulation layer

244a: upper electrode layer

3: Drive circuit board

4: Gas sensor

5: Film

6: Portable electronic device

7: Mobile Devices

7a: Intake inlet

7b: Air outlet

L: length

W: width

H: Thickness

Detailed ways

Some typical embodiments embodying the features and advantages of the present case will be described in detail in the description of the latter paragraph. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are essentially used for illustration rather than limiting this case.

Please refer to FIGS. 1A to 1C , the present application provides a gas detection module, which includes a base 1 , a micro pump 2 , a driving circuit board 3 , a gas sensor 4 and a film 5 ; wherein the base 1 , the micro pump The pump 2, the driving circuit board 3, the gas sensor 4 and the thin film 5 are made of a module structure with tiny materials, and the module structure has a length, a width and a height, wherein the length, width and height of the module structure are between 1 between millimeters (mm) and 999 millimeters (mm), or between 1 micrometer (μm) and 999 micrometers (μm), or between 1 nanometer (nm) and 999 nanometers (nm), but not as such limit. In this embodiment, the length of the module structure is between 1 μm and 999 μm, the width is between 1 μm and 999 μm and the height is between 1 μm and 999 μm. The volume formed by 999 nanometers, the width is between 1 nanometer and 999 nanometers, and the height is between 1 nanometer and 999 nanometers, but this is not limited, and the volume can be arbitrarily changed according to actual needs.

The above-mentioned base 1 includes a first surface 11 , a second surface 12 , a four-way sidewall surface 13 , an accommodating space 14 , an air inlet groove area 15 and an air outlet groove area 16 , the first surface 11 and the second air groove area 16 . The surface 12 is two opposite surfaces. The four-way sidewall surface 13 is formed by the side of the first surface 11 extending longitudinally to the side of the second surface 12. One of the four-way sidewall surfaces 13 is recessed toward the sidewall surface 13 with an intake concave surface 13a. and an air outlet concave surface 13b, the air inlet concave surface 13a and the air outlet concave surface 13b are arranged at intervals; the accommodating space 14 is formed by recessing from the second surface 12 toward the first surface 11 in the area space within the side wall surface 13, and the accommodating space 14 is separated from A micro-pump carrying area 14a, a detection area 14b, and an air guide passage area 14c, the micro-pump carrying area 14a and the air guide passage area 14c communicate with each other through a ventilation gap 14d, and the detection area 14b and the air guide passage area 14c pass through a The communication openings 14e communicate with each other.

The above-mentioned air inlet groove area 15 is formed concavely from the first surface 11, and includes an air intake through hole 15a and an air intake groove 15b. Between the air through hole 15a and the air intake concave surface 13a, the air intake through hole 15a and the air intake concave surface 13a communicate with each other.

The air outlet groove area 16 is recessed from the first surface 11, and includes an air outlet through hole 16a and an air outlet groove 16b. The air outlet through hole 16a communicates with the micro-pump bearing area 14a, and the air outlet groove 16b is connected to the air outlet through hole 16a and the air outlet. Between the concave surfaces 13b, the air outlet through hole 16a and the air outlet concave surface 13b communicate with each other.

Please refer to FIG. 1C and FIG. 2 at the same time, the micro-pump 2 is accommodated in the micro-pump bearing area 14 a of the accommodating space 14 , and covers the air outlet through hole 16 a , in addition, the micro-pump 2 and the driving circuit board 3 are electrically connected When connected, the action of the micro pump 2 is controlled by the driving signal provided by the driving circuit board 3 , and the driving signal (not shown) of the micro pump 2 is provided on the driving circuit board 3 .

Please continue to refer to FIG. 1C , the driving circuit board 3 is covered and attached to the second surface 12 of the base 1 to form the micro-pump carrying area 14 a , the detection area 14 b and the air-guiding passage area 14 c of the accommodating space 14 , so as to promote the gas There is an air guide path that is exhausted from the air inlet through holes 15a of the air inlet groove area 15 and then from the air outlet through holes 16a of the air outlet groove area 16 .

The above-mentioned gas sensor 4 is positioned on the driving circuit board 3 and is electrically connected to the driving circuit board 3. When the driving circuit board 3 is attached to the second surface 12 of the base 1, the gas sensor 4 is correspondingly accommodated in the The detection area 14b of the space 14 is detected, and the gas information in the detection area 14b is detected.

The above-mentioned film 5 is attached to the first surface of the base 1, and covers the air inlet groove area 15 and the air outlet groove area 16, so that the gas can be inhaled from the side of the air inlet concave surface 13a of the side wall surface, and pass through the air inlet groove. 15b is connected into the air inlet groove area 15, and then enters the air guide path through the air inlet through hole 15a, and is discharged from the air outlet through hole 16a of the air outlet groove area 16, and communicates with the air outlet concave surface 13b of the side wall surface 13 through the air outlet groove 16b. Forms side exhaust.

It can be seen from the above description that the external gas of the gas detection module can be accelerated and guided by driving the micro pump 2, and the side air intake is formed by the side wall surface 13 and then introduced into the gas guide passage area 14c, and passes through the gas sensor 4 located in the detection area 14b. The gas information is detected, and the imported gas is then guided by the micro pump 2, which can be discharged from the gas outlet through hole 16a of the gas outlet groove area 16, and communicated with the gas outlet concave surface 13b of the side wall surface 13 through the gas outlet groove 16b to form side exhaust; wherein , the aforementioned gas sensor 4 is a volatile organic compound sensor, but not limited thereto. Of course, the film 5 is not attached to the first surface of the base 1, so that the gas can directly enter the air guide path through the air inlet through hole 15a, and then be discharged through the air outlet through hole 16a of the air outlet groove area 16, forming a vertical air intake And exhaust, this case provides a gas detection module to choose the application of side intake side exhaust or vertical plane intake and exhaust according to actual needs.

Please refer to FIG. 3 and FIG. 4 at the same time, the driving circuit board 3 provides a driving signal to control the action of the micro-pump 2, and the micro-pump 2 starts to absorb the gas in the micro-pump carrying area 14a and discharges it through the gas outlet through hole 16a. The micro-pump carrying area 14a is in a negative pressure state, so that the gas passing through the air-guiding passage area 14c communicated with the ventilation gap 14d enters the micro-pump carrying area 14a from the air-venting gap 14d, and begins to pass through the air-intake through hole 15a of the air-intake groove area 15. The drawn gas enters the air guide passage area 14c, and the gas entering the air guide passage area 14c not only enters the micro pump carrying area 14a, but also part of the gas enters the detection area 14b through the communication opening 14e for the gas sensor located in the detection area 14b. 4. Gas information is detected.

Please refer to FIG. 5A and FIG. 5B , the micro pump 2 includes an air intake plate 21 , a resonance plate 22 , a piezoelectric actuator 23 , a first insulating sheet 24 , a conductive sheet 25 and a second insulating sheet 26 and other structures, wherein the piezoelectric actuator 23 is provided corresponding to the resonance sheet 22, and the air intake plate 21, the resonance sheet 22, the piezoelectric actuator 23, the first insulating sheet 24, the conductive sheet 25 and the second Two insulating sheets 26 and the like are stacked in sequence.

As shown in FIG. 5A , FIG. 5B and FIG. 6C , the air intake plate 21 has at least one air intake hole 211 , at least one confluence row groove 212 and a confluence chamber 213 . In this embodiment, the number of air intake holes 211 4 is better, but not limited to this. The air inlet 211 penetrates through the air inlet plate 21 , and is used for gas to flow into the micro pump 2 from the air inlet 211 according to the action of atmospheric pressure. The intake plate 21 is provided with at least one busbar groove 212, the number and position of which are set corresponding to the intake holes 211 on the other surface of the intake plate 21. The number of the intake holes 211 in this embodiment is four, and the corresponding The number of the busbar grooves 212 is also four; the busbar chamber 213 is located at the center of the air inlet plate 21, one end of the aforementioned four busbar grooves 212 is connected to the corresponding air inlet hole 211, and the other end is connected to the intake port 211. The confluence chamber 213 at the center of the gas plate 21 , whereby the gas entering the confluence grooves 212 from the air inlet holes 211 can be guided and concentrated to the confluence chamber 213 . In this embodiment, the air intake plate 21 has an air intake hole 211 , a bus bar groove 212 and a bus chamber 213 which are integrally formed. In some embodiments, the material of the air intake plate 21 may be made of stainless steel, but not limited thereto. In other embodiments, the depth of the bus chamber 213 is the same as the depth of the bus groove 212 , but not limited thereto.

The above-mentioned resonance plate 22 is made of a flexible material, but not limited to this, and the resonance plate 22 has a hollow hole 221 corresponding to the confluence chamber 213 of the air inlet plate 21 and is provided for gas supply. pass. In other embodiments, the resonant plate 22 may be formed of a copper material, but not limited thereto.

The above-mentioned piezoelectric actuator 23 is assembled by a suspension plate 231, an outer frame 232, at least one bracket 233 and a piezoelectric element 234; the suspension plate 231 is a square shape, and can bend and vibrate outside. The frame 232 is arranged around the suspension board 231. At least one bracket 233 is connected between the suspension board 231 and the outer frame 232 to provide elastic support. The piezoelectric element 234 is also a square shape and is attached to a surface of the suspension board 231. It is used to apply a voltage to generate deformation to drive the suspension board 231 to bend and vibrate, and the side length of the piezoelectric element 234 is less than or equal to the side length of the suspension board 231 ; wherein, there are multiple gaps between the suspension board 231 , the outer frame 232 and the bracket 233 235, the gap 235 is for gas to pass through; in addition, the piezoelectric actuator 23 further includes a convex part 236, the convex part 236 is arranged on the other surface of the suspension board 231, and is opposite to the piezoelectric element 234 and is arranged on two sides of the suspension board 231. surface.

As shown in FIG. 6A , the air intake plate 21 , the resonance plate 22 , the piezoelectric actuator 23 , the first insulating sheet 24 , the conductive sheet 25 , and the second insulating sheet 26 are stacked in sequence. The thickness of the suspension plate 231 is smaller than the thickness of the outer frame 232 . When the resonance plate 22 is stacked on the piezoelectric actuator 23 , a cavity can be formed between the suspension plate 231 of the piezoelectric actuator 23 , the outer frame 232 and the resonance plate 22 . Room space 27.

Referring to FIG. 6B again, another embodiment of the micro pump 2 has the same components as the previous embodiment ( FIG. 6A ), so it will not be repeated. The difference is that the suspension plate 231 of the piezoelectric actuator 23 is formed by stamping Extends in a direction away from the resonance sheet 22 and is not at the same level as the outer frame 232; the air intake plate 21, the resonance sheet 22, the piezoelectric actuator 23, the first insulating sheet 24, the conductive sheet 25, the second insulating sheet 26 After being stacked and combined in sequence, a cavity spacing is formed between a surface of the suspension plate 231 and the resonance plate 22 , and the cavity spacing will affect the transmission effect of the micro pump 2 . Therefore, maintaining a fixed cavity spacing is necessary for the micro pump 2 . It is very important to provide stable transmission efficiency. In this way, the micro-pump 2 forms the suspension board 231 by stamping so that it is recessed, so that a surface of the suspension board 231 and a surface of the outer frame 232 are non-coplanar, that is, the suspension board 231 One surface of the outer frame 232 is different from the other surface, forming a drop, and one surface of the suspension plate 231 is far away from the other surface of the outer frame 232, so that the suspension plate 231 of the piezoelectric actuator 23 is recessed to form a space so as to form a compatible space with the resonance plate 22. The adjusted spacing of the chambers is directly improved by forming a cavity space in the suspension plate 231 of the above-mentioned piezoelectric actuator 23 with shaped depressions. In this way, the required spacing of the chambers can be adjusted by adjusting the piezoelectric actuator. The suspension plate 231 of the device 23 is formed by forming the recessed distance, which effectively simplifies the structural design for adjusting the spacing between the chambers, and also achieves the advantages of simplifying the process and shortening the process time.

In order to understand the output operation mode of the above-mentioned micro pump 2 providing gas transmission, please continue to refer to FIG. 6C to FIG. 6E , please refer to FIG. 6C first, the piezoelectric element 234 of the piezoelectric actuator 23 is deformed after being applied with a driving voltage The suspension plate 231 is driven to move upward, and the volume of the chamber space 27 is increased at this time, and a negative pressure is formed in the chamber space 27, so that the gas in the confluence chamber 213 is drawn into the chamber space 27, and the resonance plate 22 is resonated at the same time. The influence of the principle is simultaneously driven upward, which increases the volume of the confluence chamber 213, and because the gas in the confluence chamber 213 enters the chamber space 27, the interior of the confluence chamber 213 is also in a negative pressure state. The air holes 211 and the busbar grooves 212 are used to absorb gas into the confluence chamber 213; please refer to FIG. 6D again, the piezoelectric element 234 drives the suspension plate 231 to move downward, compressing the chamber space 27, and similarly, the resonance plate 22 is suspended The plate 231 is displaced downward due to resonance, and synchronously pushes the gas in the chamber space 27 downward and conveys it upward through the gap 235, and the gas is discharged from the micro pump 2; finally, please refer to FIG. 6E, when the suspension plate 231 returns to its original position, The resonance sheet 22 is still displaced downward due to inertia. At this time, the resonance sheet 22 will move the gas in the compression chamber space 27 to the gap 235, and increase the volume in the confluence chamber 213, so that the gas can continuously pass through the intake air The holes 211 and the busbar grooves 212 are gathered in the confluence chamber 213, and the micropump provides the gas transmission action steps shown in FIG. The flow channel formed by the inlet plate 21 and the resonance sheet 22 generates a pressure gradient, and is transported upward through the gap 235 to make the gas flow at a high speed to achieve the effect of the micropump 2 transporting the gas.

Another embodiment of the micro-pump 2 in this case can be a micro-electro-mechanical pump 2 a. Please refer to FIG. 7A and FIG. 7B . The micro-electro-mechanical pump 2 a includes a first substrate 21 a, a first oxide layer 22 a, a second substrate 23 a and A piezoelectric component 24a; it is added that the MEMS pump 2a of this embodiment is processed through epitaxy, deposition, photolithography, and etching in the semiconductor manufacturing process, so it should not be disassembled. In order to describe its internal structure in detail, it is specially disassembled. Figure details.

The first substrate 21a is a silicon wafer (Si wafer) with a thickness between 150 and 400 micrometers (μm). The first substrate 21a has a plurality of inflow holes 211a, a first surface 212a, and a second surface 213a. In this embodiment, the number of the plurality of inflow holes 211a is 4, but not limited to this, and each inflow hole 211a penetrates from the second surface 213a to the first surface 212a, and the inflow holes 211a are used for lifting The inflow effect causes the inflow hole 211a to present a tapered taper from the second surface 213a to the first surface 212a.

The first oxide layer 22a is a silicon dioxide (SiO2) film with a thickness between 10 and 20 micrometers (μm). The first oxide layer 22a is stacked on the first surface 212a of the first substrate 21a. The oxide layer 22a has a plurality of confluence channels 221a and a confluence chamber 222a. The numbers and positions of the confluence channels 221a and the inflow holes 211a of the first substrate 21a correspond to each other. In this embodiment, the number of the confluence channels 221a is also four, one end of the four confluence channels 222a is connected to the four inflow holes 211a of the first substrate 21a respectively, and the other ends of the four confluence channels 221a are connected to the confluence flow. In the chamber 222a, after the gas enters through the inflow holes 211a respectively, it passes through the correspondingly connected confluence channels 221a and then converges into the confluence chamber 222a.

The second oxide layer 232a is a silicon oxide layer with a thickness of 0.5 to 2 micrometers (μm), formed on the silicon wafer layer 231a in a hollow ring shape, and defines a vibration chamber 2321a with the silicon wafer layer 231a. The silicon material layer 233a is circular, located on the second oxide layer 232a and bonded to the first oxide layer 22a. The silicon material layer 233a is a silicon dioxide (SiO2) film with a thickness between 2 and 5 micrometers (μm), and has A through hole 2331a, a vibrating portion 2332a, a fixing portion 2333a, a third surface 2334a and a fourth surface 2335a. The through hole 2331a is formed in the center of the silicon material layer 233a, the vibration part 2332a is located in the peripheral area of the through hole 2331a, and vertically corresponds to the vibration chamber 2321a, and the fixed part 2333a is the peripheral area of the silicon material layer 233a, and is fixed to the first In the oxide layer 232a, the third surface 2334a is bonded to the second oxide layer 232a, and the fourth surface 2335a is bonded to the first oxide layer 22a; the piezoelectric element 24a is stacked on the actuating portion 2311a of the silicon wafer layer 231a.

The piezoelectric element 24a includes a lower electrode layer 241a, a piezoelectric layer 242a, an insulating layer 243a and an upper electrode layer 244a, the lower electrode layer 241a is stacked on the actuating portion 2311a of the silicon wafer layer 231a, and the piezoelectric layer 242a is stacked on the The lower electrode layer 241a is electrically connected through its contact area. In addition, the width of the piezoelectric layer 242a is smaller than that of the lower electrode layer 241a, so that the piezoelectric layer 242a cannot completely cover the lower electrode layer 241a. The insulating layer 243a is stacked on the partial region of the layer 242a and the region of the lower electrode layer 241a not shielded by the piezoelectric layer 242a, and finally stacked on the insulating layer 243a and the region of the piezoelectric layer 242a not shielded by the insulating layer 243a. The electrode layer 244a allows the upper electrode layer 244a to be electrically connected to the piezoelectric layer 242a, and the insulating layer 243a is used to isolate the upper electrode layer 244a and the lower electrode layer 241a to avoid short circuit caused by direct contact between the two.

Please refer to FIGS. 8A to 8C . FIGS. 8A to 8C are schematic diagrams of the operation of the MEMS pump 2 a. Referring to FIG. 8A first, when the lower electrode layer 241a and the upper electrode layer 244a of the piezoelectric element 24a receive the driving voltage and the driving signal (not shown) transmitted by the driving circuit board 3, they are conducted to the piezoelectric layer 242a, After the piezoelectric layer 242a receives the driving voltage and the driving signal, it begins to deform due to the influence of the inverse piezoelectric effect, which will drive the actuating portion 2311a of the silicon wafer layer 231a to begin to displace. The distance between the second oxide layer 232a and the second oxide layer 232a is increased. At this time, the volume of the vibration chamber 2321a of the second oxide layer 232a will increase, so that a negative pressure is formed in the vibration chamber 2321a, which is used for the confluence of the first oxide layer 22a. The gas in the chamber 222a is drawn into it through the perforation 2331a. Please continue to refer to FIG. 8B , when the actuating portion 2311a is displaced upward by the traction of the piezoelectric element 24a, the vibration portion 2332a of the silicon material layer 233a will be displaced upward due to the influence of the resonance principle. When the vibration portion 2332a is displaced upward, it will compress and vibrate. The space of the chamber 2321a and push the gas in the vibration chamber 2321a to move to the fluid channel 2314a of the silicon wafer layer 231a, so that the gas can be discharged upward through the fluid channel 2314a, while the vibration part 2332a is displaced upward to compress the vibration chamber 2321a, The volume of the confluence chamber 222a is increased due to the displacement of the vibrating part 2332a, and a negative pressure is formed inside the confluence chamber 222a, which sucks the gas outside the MEMS pump 2a into it through the inflow hole 211a. Finally, as shown in FIG. 8C, the piezoelectric element 24a drives the silicon wafer. When the actuating portion 2311a of the layer 231a is displaced downward, the gas in the vibration chamber 2321a is pushed to the fluid channel 2314a, and the gas is discharged, and the vibrating portion 2332a of the silicon material layer 233a is also moved downward by the actuating portion 2311a. , the gas in the synchronously compressed confluence chamber 222a moves to the vibration chamber 2321a through the perforation 2331a, and when the piezoelectric component 24a drives the actuating portion 2311a to move upward, the volume of the vibration chamber 2321a will be greatly increased, and there will be a higher The gas is sucked into the vibration chamber 2321a by the suction force of 2321a, and the above actions are repeated, so that the piezoelectric element 24a continuously drives the up and down displacement of the actuating part 2311a and drives the up and down displacement of the vibration part 2332a. By changing the inner part of the microelectromechanical pump 2a The pressure causes it to continuously absorb and discharge gas, thereby completing the action of the MEMS pump 2a.

Please refer to FIG. 1A and FIG. 9 finally, the gas path of the gas detection module in this case is designed as side inlet and side outlet, so that the gas detection module can be embedded in a mobile device 7 for application, and the overall structural design of the gas detection module is also Thinning can be achieved, the preferred length L can be between 20mm to 30mm, the preferred width W can be between 10mm and 20mm, and the preferred thickness H can be between 1mm and 6mm. It is used on the mobile device 7, and corresponds to the air inlet 7a and the air outlet 7b on the side wall of the mobile device 7 to form side air intake and side air outlet, so that the gas detection module of this case can be easily embedded in the mobile device 7 for application. , wherein the mobile device 7 can be a smart phone, a smart watch or other devices; in addition, please refer to FIG. 10 , the preferred length of the gas detection module in this case is between 20mm and 30mm, and the preferred width is between 10mm and 20mm. , When the preferred thickness is between 1mm and 6mm, it can also be assembled in a portable electronic device 6, and the portable electronic device 6 can be a mobile power supply, an air quality detection device, an air purifier and other devices.

To sum up, in the gas detection module provided in this case, the inlet concave surface and the air outlet concave surface are formed through the side wall surface of the base, and the air inlet groove area and the air outlet groove area are formed on the surface of the base, so that the air inlet concave surface and the air groove area are connected. , the air outlet concave surface is communicated with the air outlet groove area, and then the air inlet groove area and the air outlet groove area are covered with a film, so as to realize the effect of using side air intake and side air outlet, and then supplemented by a micro pump to transmit the gas, and let the base of this case be , a micro pump, a driving circuit board and a gas sensor constitute a gas detection module, which can be easily embedded in a mobile device or a portable electronic device, and is highly industrially applicable and progressive in combination with it.

Claims (12)

1. A gas detection module, comprising:

a base, comprising:

a first surface;

a second surface opposite to the first surface;

a plurality of side wall surfaces longitudinally extending from the first surface side to the second surface side, wherein one side wall surface is recessed with an air inlet concave surface and an air outlet concave surface, and the air inlet concave surface and the air outlet concave surface are arranged at intervals;

the accommodating space is formed by an inner area space which is recessed in the side wall surface from the second surface to the first surface, and is divided into a micropump bearing area, a detection area and an air guide passage area, the micropump bearing area is communicated with the air guide passage area through a ventilation notch, and the detection area is communicated with the air guide passage area through a communication opening;

an air inlet groove area formed by sinking from the first surface, provided with an air inlet through hole communicated with the air guide passage area and a ventilation groove communicated with the air inlet concave surface of the side wall surface; and

an air outlet groove area formed by sinking from the first surface, provided with an air outlet through hole communicated with the micro pump bearing area and an air outlet groove communicated with the air outlet concave surface of the side wall surface;

a micro pump accommodated in the micro pump bearing area and sealing the air outlet through hole;

the driving circuit board is attached to the second surface of the base through the sealing cover so as to form the micro-pump bearing area, the detection area and the air guide passage area of the accommodating space and form an air guide path in which air can enter from the air inlet through hole of the air inlet groove area and then is discharged from the air outlet through hole of the air outlet groove area;

the gas sensor is electrically connected with the driving circuit board and correspondingly accommodated in the detection area so as to detect the passing gas; and

a film attached to the air inlet groove area and the air outlet groove area to lead the air to be led in from the air inlet concave surface of the side wall surface, and then the air enters the air inlet groove area through the air vent groove, then the air enters the air guide path through the air inlet through hole, and then the air is discharged from the air outlet through hole of the air outlet groove area, and the air is communicated with the air outlet concave surface of the side wall surface through the air outlet groove to form side exhaust;

the base, the micropump, the driving circuit board, the gas sensor and the film are of a module structure made of micro materials, the module structure is provided with a length, a width and a height, the micropump drives and accelerates to guide external gas to enter the gas guide channel area from the side face through the gas inlet concave surface of the side wall surface, the gas sensor in the detection area detects the gas, the guided gas is guided and conveyed through the micropump and then discharged through the gas outlet through hole of the gas outlet groove area, and the gas outlet groove is communicated with the gas outlet concave surface of the side wall surface to form side exhaust.

2. The gas detection module of claim 1, wherein the module structure has a volume of between 1 micron and 999 microns in length, between 1 micron and 999 microns in width, and between 1 micron and 999 microns in height.

3. The gas detection module of claim 1, wherein the module structure has a volume with a length of 1 nm to 999 nm, a width of 1 nm to 999 nm, and a height of 1 nm to 999 nm.

4. The gas detection module of claim 1, wherein the gas detection module has a length of between 2mm and 30mm, a width of between 2mm and 20mm, and a thickness of between 1mm and 6 mm.

5. The gas detection module of claim 1, wherein the gas sensor is a volatile organic compound sensor.

6. The gas detection module of claim 1, wherein the micropump comprises:

the air inlet plate is provided with at least one air inlet hole, at least one bus bar groove corresponding to the position of the air inlet hole and a confluence chamber, the air inlet hole is used for introducing air, and the bus bar groove is used for guiding the air introduced from the air inlet hole to the confluence chamber;

a resonance sheet having a central hole corresponding to the position of the confluence chamber and a movable part around the central hole; and

a piezoelectric actuator, which is arranged corresponding to the resonance sheet in position;

the air inlet plate, the resonance sheet and the piezoelectric actuator are sequentially stacked, and a cavity space is formed between the resonance sheet and the piezoelectric actuator, so that when the piezoelectric actuator is driven, the gas is led in from the air inlet hole of the air inlet plate, is collected to the collection cavity through the collection groove, and then is resonated with the movable part of the resonance sheet through the central hole of the resonance sheet to transmit the gas.

7. The gas detection module of claim 6, wherein the piezoelectric actuator comprises:

a suspension plate having a square shape and capable of bending and vibrating;

an outer frame surrounding the suspension plate;

at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and

the piezoelectric element is attached to one surface of the suspension plate and used for receiving voltage to drive the suspension plate to vibrate in a bending mode.

8. The gas detection module of claim 6, wherein the piezoelectric actuator comprises:

a suspension plate having a convex portion;

an outer frame surrounding the suspension plate;

at least one support connected between the suspension plate and the outer frame to provide elastic support for the suspension plate; and

the piezoelectric element is attached to one surface of the suspension plate and used for applying voltage to drive the suspension plate to vibrate in a bending way;

the at least one support is formed between the suspension plate and the outer frame, a surface of the suspension plate and a surface of the outer frame form a non-coplanar structure, and a cavity space is kept between the surface of the suspension plate and the resonator plate.

9. The gas detection module of claim 6, wherein the micropump further comprises a first insulating sheet, a conductive sheet, and a second insulating sheet, wherein the gas inlet plate, the resonator plate, the piezoelectric actuator, the first insulating sheet, the conductive sheet, and the second insulating sheet are sequentially stacked.

10. The gas detection module of claim 1, wherein the gas detection module has a length of between 20mm and 30mm, a width of between 10mm and 20mm, and a thickness of between 1mm and 6 mm.

11. The gas detection module of claim 1, wherein the micropump is a microelectromechanical pump comprising:

a first substrate having a plurality of inflow holes, the plurality of inflow holes being tapered;

the first oxide layer is stacked on the first substrate and provided with a plurality of confluence chambers and a confluence chamber, and the confluence chambers are communicated between the confluence chambers and the plurality of inflow holes;

a second substrate bonded to the first substrate, comprising:

a silicon wafer layer having:

an actuating portion, which is circular;

an outer peripheral portion, which is in a hollow ring shape and surrounds the periphery of the actuating portion;

a plurality of connecting portions respectively connected between the actuating portion and the outer circumferential portion; and

a plurality of fluid channels surrounding the periphery of the actuating part and respectively positioned among the connecting parts;

the second oxidation layer is formed on the silicon crystal layer, is in a hollow ring shape, and defines a vibration chamber with the silicon crystal layer;

a circular silicon layer on the second oxide layer and bonded to the first oxide layer, comprising:

a through hole formed in the center of the silicon material layer;

a vibrating part located in the peripheral area of the through hole; and

a fixing part located at the peripheral region of the silicon material layer; and

and the piezoelectric component is circular and is stacked on the actuating part of the silicon wafer layer.

12. The gas detection module of claim 11, wherein the piezoelectric element comprises:

a lower electrode layer;

a piezoelectric layer stacked on the lower electrode layer;

an insulating layer, which is laid on partial surface of the piezoelectric layer and partial surface of the lower electrode layer; and

and the upper electrode layer is superposed on the insulating layer and the rest surface of the piezoelectric layer, which is not provided with the insulating layer, and is electrically connected with the piezoelectric layer.

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