CN211831598U - Heat dissipation assembly of mobile device - Google Patents

Abstract

A mobile device heat dissipation assembly, comprising: a housing body having a vent hole and a positioning containing seat, wherein the positioning containing seat is arranged corresponding to the vent hole, and the bottom of the positioning containing seat is communicated with the vent hole; a micro pump, which is arranged in the positioning containing seat and corresponds to the vent hole communicated with the bottom of the positioning containing seat, and is used for discharging gas transmitted when the micro pump is driven to operate; a heat-dissipating tube plate, which contains heat-dissipating liquid therein, and one end of which is positioned on the positioning and accommodating seat and is contacted with the heating element of the mobile device so as to perform liquid-state convection heat exchange on a heat source emitted by the heating element; the gas guided by the micro pump forms heat convection, exchanges heat with the heat absorbed by the heat dissipation tube plate and is exhausted from the vent hole.

Description

Mobile device cooling components

technical field

This case relates to a heat dissipation component for a mobile device, especially a very thin liquid heat dissipation module for combining with a portable electronic device or a mobile device.

Background technique

With the rapid development of smartphones in recent years, their specifications, equipment, and functions have been rapidly upgraded. In order to meet their needs, the internal processing chip capability must also be greatly improved. However, if the heat energy generated by the processing chip is not fast enough Exclusion will greatly affect its energy efficiency. For example, 5G high-speed transmission, which is currently being developed in various countries, needs to have the function of rapid heat dissipation inside it. In view of this, how to provide a mobile device heat dissipation module, so that mobile devices can quickly dissipate heat, It is a problem that needs to be solved at present.

Utility model content

The main purpose of this application is to provide a liquid cooling module, which can be installed in a portable electronic device to improve the cooling effect.

A broad implementation aspect of the present application is a heat dissipation component of a mobile device, comprising: a casing body having a ventilation hole and a positioning accommodating seat, wherein the positioning accommodating seat is disposed corresponding to the ventilation hole, and the positioning accommodating seat The bottom of the seat is communicated with the ventilation hole; a micro-pump is arranged in the positioning and accommodating seat, corresponding to the ventilation hole communicated with the bottom of the positioning and accommodating seat, for the gas transmitted when the micro-pump is driven to operate by The vent hole is discharged; a heat dissipation tube plate contains heat dissipation liquid inside, and one end is positioned on the positioning and accommodating seat, and is in contact with the heating element of the mobile device, so as to perform liquid convection heat exchange with the heat source emitted by the heating element; wherein , the gas guided by the micro-pump forms heat convection, heats the heat absorbed by the heat dissipation tube plate, and is discharged through the ventilation hole.

Description of drawings

FIG. 1 is a three-dimensional schematic diagram of the heat dissipation component of the mobile device of the present invention.

FIG. 2 is another perspective schematic diagram of the heat dissipation assembly of the mobile device of the present invention.

FIG. 3 is a cross-sectional three-dimensional schematic diagram of the heat dissipation component of the mobile device of the present invention.

FIG. 4 is a schematic cross-sectional view of the heat dissipation component of the mobile device of the present invention.

FIG. 5A is an exploded schematic diagram of the first embodiment of the micropump of the present invention.

FIG. 5B is another perspective exploded schematic diagram of the first embodiment of the micropump of the present invention.

6A is a schematic cross-sectional view of the first embodiment of the micropump of the present invention.

6B to 6C are schematic diagrams of the operation of the first embodiment of the micropump of the present invention.

FIG. 7A is an exploded schematic diagram of the second embodiment of the micropump of the present invention.

FIG. 7B is another perspective exploded schematic diagram of the second embodiment of the micropump of the present invention.

FIG. 8A is a schematic cross-sectional view of the second embodiment of the micropump of the present invention.

FIG. 8B is a schematic diagram of a derivative implementation of the second embodiment of the micropump of the present invention.

8C to 8E are schematic diagrams of the operation of the second embodiment of the micropump of the present invention.

FIG. 9A is a schematic cross-sectional view of the third embodiment of the micropump of the present invention.

FIG. 9B is an exploded schematic diagram of the third embodiment of the micropump of the present invention

10A to 10C are schematic diagrams of the operation of the third embodiment of the micro pump of the present invention.

Fig. 11 is a three-dimensional schematic diagram of the liquid pump of the present invention.

Figure 12 is a schematic top view of the liquid pump of the present invention.

FIG. 13A is an exploded schematic diagram of the liquid pump of the present invention.

FIG. 13B is a schematic exploded view of another angle of the liquid pump of the present invention.

Fig. 14 is a schematic sectional view of the section line AA' in Fig. 12 .

Fig. 15 is a schematic cross-sectional view of the section line BB' in Fig. 12 .

16A to 16B are schematic diagrams of the operation of the liquid pump.

Description of reference numerals

1: case body

11: Air vents

12: Positioning the receptacle

2: Micro pump

21: Air blow hole sheet

210: Suspension Tablets

211: Hollow Hole

212: Connector

213: void

22: Cavity frame

23: Actuator

231: Piezoelectric Carrier

2311: Piezo Pins

232: Adjust the resonance plate

233: Piezo Plate

24: Insulation frame

25: Conductive Frame

251: Conductive pins

252: Conductive Electrodes

26: Resonance Chamber

27: Airflow Chamber

21A: Air intake plate

211A: Air intake

212A: Bus bar slot

213A: Combined Chamber

22A: Resonant sheet

221A: Hollow hole

222A: Movable part

223A: Fixed part

23A: Piezoelectric Actuator

231A: Hoverboard

232A: Outer frame

233A: Bracket

234A: Piezoelectric element

235A: void

236A: convex part

24A: First insulating sheet

25A: Conductive sheet

26A: Second insulating sheet

27A: Chamber Space

21B: First substrate

211B: Inflow hole

212B: First Surface

213B: Second Surface

22B: First oxide layer

221B: Busway

222B: Combined Chamber

23B: Second substrate

231B: Silicon Wafer Layer

2311B: Actuator

2312B: Peripheral Department

2313B: Connector

2314B: Fluid Channels

232B: Second oxide layer

2321B: Vibration Chamber

233B: Silicon layer

2331B: Perforated

2332B: Vibration Department

2333B: Fixed part

2334B: Third Surface

2335B: Fourth Surface

24B: Piezoelectric Components

241B: Lower electrode layer

242B: Piezoelectric Layer

243B: Insulation layer

244B: Upper electrode layer

3: heat pipe plate

4: Liquid pump

41: Bonnet body

411: Bonnet first surface

412: Bonnet second surface

413: Entryway

413a: Entrance flange

413b: first protruding structure

414: Exit Channel

414a: Exit lugs

414b: Exit Chamber

415: Detent

42: valve piece

42a: The first valve piece

42b: Second valve plate

421a, 421b: Central valve plate

422a, 422b: Extension brackets

423a, 423b: through holes

43: Valve base

431: The first surface of the bottom of the valve

432: The second surface of the valve bottom

433: Inlet valve passage

433a: Entry Recess

433b: Entry Chamber

434: Outlet valve channel

434a: Outlet Recess

434b: Second protruding structure

435: Docking card hole

436: Collection Chamber

44: Actuator

441: Vibration plate

441a: Electrical pins

442: Piezoelectric element

45: outer cylinder

451: Inner wall recessed space

452: Center groove

453: Penetration frame

46: Sealant

5: Heating element

Detailed ways

Some typical embodiments embodying the features and advantages of the present case will be described in detail in the description of the latter paragraph. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are essentially used for illustration rather than limiting this case.

Please refer to FIG. 1 to FIG. 4 , the present application provides a heat dissipation component for a mobile device, including a casing body 1 , a micro pump 2 , and a heat dissipation tube plate 3 ; the casing body 1 has a ventilation hole 11 and a positioning accommodating seat 12 , the positioning accommodating seat 12 is located inside the casing body 1, and is arranged corresponding to the ventilation hole 11 and communicates with it, and the positioning accommodating seat 12 is communicated with the outside of the casing body 1 through the ventilation hole 11; the micro pump 2 is arranged in the positioning accommodating The seat 12 corresponds to the vent hole 11. When the micro pump 2 starts to operate, the transmission gas is discharged from the vent hole 11; the heat dissipation tube plate 3 has a heat dissipation liquid inside, which is located in the casing body 1, and its one end is positioned in the positioning container. The seat 12 is in contact with a heating element 5 of the mobile device to exchange heat with the heat source emitted by the heating element 5. The heat dissipation liquid flows in the heat dissipation tube plate 3, so that the heat source can be spread evenly, and then conducts the heat source through the micro pump 2. The sent gas forms heat convection, heats the heat absorbed by the heat dissipation tube plate 3 , and finally the gas is discharged through the ventilation holes 11 .

Please refer to FIGS. 5A to 6A , the first embodiment of the micro pump 2 is a blower micro pump, which includes: an air injection hole sheet 21 , a cavity frame 22 , an actuating body 23 , an insulating frame 24 and a conductive frame 25 . The air injection hole sheet 21 is made of a flexible material, and has a suspension sheet 210 , a hollow hole 211 and a plurality of connecting pieces 212 . The suspension sheet 210 is a sheet-like structure capable of bending and vibrating, but it is not limited thereto, and the shape of the suspension sheet 210 can also be one of square, circle, ellipse, triangle and polygon. The hollow hole 211 runs through the center of the suspension sheet 210 for gas circulation. In this embodiment, the number of the connecting pieces 212 is four, and the air injection hole sheet 21 is fixed in the positioning accommodating seat 12 through the connecting pieces 212 . The cavity frame 22 is stacked on the air injection hole sheet 21 , and its shape corresponds to the air injection hole sheet 21 . Resonance chamber 26 . The insulating frame 24 is stacked on the actuating body 23 , and its appearance is similar to that of the cavity frame 22 . The conductive frame 25 is stacked on the insulating frame 24, and its appearance is similar to that of the insulating frame 24. The conductive frame 25 has a conductive pin 251 and a conductive electrode 252. The conductive pin 251 extends outward from the outer edge of the conductive frame 25 and conducts electricity. The electrodes 252 extend inward from the inner edge of the conductive frame 25 . In addition, the actuating body 23 further includes a piezoelectric carrier plate 231 , an adjustment resonance plate 232 and a piezoelectric plate 233 . The piezoelectric carrier plate 231 is supported and stacked on the cavity frame 22 , and the adjustment resonance plate 232 is supported and stacked on the cavity frame 22 . On the piezoelectric carrier plate 231 , the piezoelectric plate 233 is carried and stacked on the adjustment resonance plate 232 , and the adjustment resonance plate 232 and the piezoelectric plate 233 are accommodated in the insulating frame 24 and are electrically connected by the conductive electrodes 252 of the conductive frame 25 The piezoelectric plate 233, wherein the piezoelectric carrier plate 231 and the adjustment resonance plate 232 are all made of conductive materials, the piezoelectric carrier plate 231 has a piezoelectric pin 2311, the piezoelectric pin 2311 and the conductive pin 251 Connect the driving signal (driving frequency and driving voltage), the driving signal can be formed by the piezoelectric pins 2311, the piezoelectric carrier plate 231, the adjustment resonance plate 232, the piezoelectric plate 233, the conductive electrodes 252, the conductive frame 25, and the conductive pins 251 In the first circuit, the conductive frame 25 and the actuator 23 are blocked by the insulating frame 24 to avoid short circuit, so that the driving signal can be transmitted to the piezoelectric plate 233. After the piezoelectric plate 233 receives the driving signal (driving frequency and driving voltage), Deformation is generated due to the piezoelectric effect, and the piezoelectric carrier plate 231 and the adjustment resonance plate 232 are further driven to generate reciprocating bending vibration.

As mentioned above, the adjustment resonance plate 232 is located between the piezoelectric plate 233 and the piezoelectric carrier plate 231 , and as a buffer between the two, the vibration frequency of the piezoelectric carrier plate 231 can be adjusted. Basically, the thickness of the adjustment resonance plate 232 is greater than the thickness of the piezoelectric carrier plate 231 , and the thickness of the adjustment resonance plate 232 can be varied, thereby adjusting the vibration frequency of the actuating body 23 .

The plurality of connecting members 212 define a plurality of gaps 213 between the suspension piece 210 and the inner edge of the positioning and accommodating seat 12 for gas circulation. Please continue to refer to FIG. 6A , the air injection hole sheet 21 , the cavity frame 22 , the actuating body 23 , the insulating frame 24 and the conductive frame 25 are correspondingly stacked in sequence and disposed in the positioning receptacle 12 , the air injection hole sheet 21 and the positioning receptacle An air flow chamber 27 is formed between the bottom surfaces (not shown) of 12 . The airflow chamber 27 communicates with the resonance chamber 26 among the actuator body 23 , the cavity frame 22 and the suspension sheet 210 through the hollow hole 211 of the air injection hole sheet 21 . By controlling the vibration frequency of the gas in the resonance chamber 26 to be close to the same as the vibration frequency of the suspension plate 210, the resonance chamber 26 and the suspension plate 210 can generate a Helmholtz resonance effect, so that the The gas transfer efficiency is improved.

6B and 6C are schematic diagrams of the operation of the micro-pump shown in FIG. 6A . Please review FIG. 6B first. When the piezoelectric plate 233 moves in a direction away from the bottom surface of the positioning receptacle 12 , it drives the suspension piece 210 of the air injection hole piece 21 . Moving away from the bottom surface of the positioning and accommodating seat 12 , the volume of the airflow chamber 27 is rapidly expanded, and its internal pressure drops to form a negative pressure, attracting the gas from the outside of the micro-pump 2 to flow in through the plurality of gaps 213 and enter through the hollow holes 211 The resonance chamber 26 increases the air pressure in the resonance chamber 26 to generate a pressure gradient. As shown in FIG. 6C , when the piezoelectric plate 233 drives the suspension sheet 210 of the air injection hole sheet 21 to move toward the bottom surface of the positioning receptacle 12 , the gas in the resonance chamber 26 quickly flows out through the hollow hole 211 , squeezing the air flow chamber. The gas in the chamber 27 is ejected rapidly and in large quantities in an ideal gas state close to Bernoulli's law. According to the principle of inertia, the air pressure inside the resonant chamber 26 after exhausting is lower than the equilibrium air pressure, and the gas will be guided into the resonant chamber 26 again. Therefore, by repeating the actions of FIG. 6B and FIG. 6C, the piezoelectric plate 233 can be controlled to vibrate reciprocally, and the vibration frequency of the gas in the resonance chamber 26 and the vibration frequency of the piezoelectric plate 233 can be controlled to be close to the same, so that The Helmholtz resonance effect is generated to achieve high-speed and large-scale gas transmission.

Please refer to FIGS. 7A to 8A , the second embodiment of the micro pump 2 is a piezoelectric pump, which includes an air intake plate 21A, a resonance plate 22A, a piezoelectric actuator 23A, and a first insulating plate 24A, a conductive sheet 25A, a second insulating sheet 26A and other structures, wherein the piezoelectric actuator 23A is provided corresponding to the resonance sheet 22A, and the air intake plate 21A, the resonance sheet 22A, the piezoelectric actuator 23A, the first An insulating sheet 24A, a conductive sheet 25A, and a second insulating sheet 26A are stacked in sequence.

The air intake plate 21A has at least one air intake hole 211A, at least one confluence row groove 212A and a confluence chamber 213A. In this embodiment, the number of air intake holes 211A is preferably four, but not limited to this . The air inlet 211A runs through the air inlet plate 21A, and is used for the gas to flow into the micro pump 2 from the air inlet 211A according to the action of atmospheric pressure. The intake plate 21A has at least one bus bar groove 212A, the number and position of which are corresponding to the intake holes 211A on the other surface of the intake plate 21A. The number of the intake holes 211A in this embodiment is four, and the corresponding The number of the busbar grooves 212A is also four; the busbar chamber 213A is located at the center of the air inlet plate 21A, one end of the aforementioned four busbar grooves 212A is connected to the corresponding air inlet hole 211A, and the other end is connected to the inlet port 211A. The confluence chamber 213A at the center of the gas plate 21A, whereby the gas entering the bus bar groove 212A from the air inlet 211A can be guided and collected to the confluence chamber 213A. In this embodiment, the air inlet plate 21A has an integrally formed air inlet hole 211A, a bus bar groove 212A and a bus chamber 213A.

In some embodiments, the material of the air intake plate 21A can be made of stainless steel, but not limited thereto. In other embodiments, the depth of the bus chamber 213A is the same as the depth of the bus groove 212A, but not limited thereto.

The resonant plate 22A is made of a flexible material, but not limited thereto, and the resonator plate 22A has a hollow hole 221A corresponding to the confluence chamber 213A of the air inlet plate 21A for supplying gas pass. In other embodiments, the resonant plate 22A can be made of a copper material, but not limited thereto.

The piezoelectric actuator 23A is assembled by a suspension plate 231A, an outer frame 232A, at least one bracket 233A and a piezoelectric element 234A; the suspension plate 231A is a square shape, and can bend and vibrate, and the outer frame 232A is arranged around the suspension board 231A, and at least one bracket 233A is connected between the suspension board 231A and the outer frame 232A to provide elastic support. The suspension board 231A is driven to bend and vibrate by generating deformation with the applied voltage, and the side length of the piezoelectric element 234A is less than or equal to the side length of the suspension board 231A; wherein, there are multiple gaps between the suspension board 231A, the outer frame 232A and the bracket 233A 235A, the gap 235A allows gas to pass through; in addition, the piezoelectric actuator 23A further includes a convex portion 236A, the convex portion 236A is arranged on the other surface of the suspension board 231A, and is opposite to the piezoelectric element 234A. surface.

As shown in FIG. 8A , the air intake plate 21A, the resonance sheet 22A, the piezoelectric actuator 23A, the first insulating sheet 24A, the conductive sheet 25A, and the second insulating sheet 26A are stacked in sequence, and the piezoelectric actuator 23A has The thickness of the suspension plate 231A is smaller than the thickness of the outer frame 232A. When the resonance plate 22A is stacked on the piezoelectric actuator 23A, a cavity can be formed between the suspension plate 231A of the piezoelectric actuator 23A, the outer frame 232A and the resonance plate 22A Chamber space 27A.

Please refer to FIG. 8B again, another embodiment of the piezoelectric pump, the components of which are the same as those of the previous embodiment (FIG. 8A), so they will not be repeated. The difference is that the piezoelectric actuator 23A is not actuated. The suspension plate 231A extends away from the resonance plate 22A by punching, and is not at the same level as the outer frame 232A. The extension distance can be adjusted by the bracket 233A. The electric actuator 23A has a protruding shape.

In order to understand the output operation mode of the gas transmission provided by the micro pump 2, please continue to refer to FIGS. 8C to 8E , please refer to FIG. 8C first, the piezoelectric element 234A of the piezoelectric actuator 23A is deformed after being applied with a driving voltage The suspension plate 231A is driven to move upward. At this time, the volume of the chamber space 27A is increased, and a negative pressure is formed in the chamber space 27A, so that the gas in the confluence chamber 213A is drawn into the chamber space 27A, and the resonance plate 22A is resonated at the same time. The influence of the principle is simultaneously driven upward, which increases the volume of the confluence chamber 213A, and because the gas in the confluence chamber 213A enters the chamber space 27A, the interior of the confluence chamber 213A is also in a negative pressure state. The air holes 211A and the bus bar grooves 212A are used to draw gas into the bus chamber 213A. Referring to FIG. 8D again, the piezoelectric element 234A drives the suspension plate 231A to displace downward, compresses the chamber space 27A, pushes the gas in the chamber space 27A to transport it upward through the gap 235A, and discharges the gas from the micro pump 2 , and simultaneously , the resonance plate 22A resonates with the suspension plate 231A and displaces downward, and makes the gas entering the confluence chamber 213A through the air inlet hole 211A and the bus bar groove 212A enter the chamber space 27A through the hollow hole 221A. Finally, referring to FIG. 8E , when the suspension plate 231A returns to its original position, the resonance plate 22A is displaced upward due to resonance and inertia. At this time, the resonance plate 22A will compress the gas in the chamber space 27A and move it toward the gap 235A, and The volume in the confluence chamber 213A is increased, so that the gas can be continuously collected in the confluence chamber 213A through the air inlet holes 211A and the confluence grooves 212A. The gas transmission action step enables the micro-pump 2 to continuously enter the gas from the gas inlet hole 211A into the flow channel formed by the gas inlet plate 21A and the resonant sheet 22A to generate a pressure gradient, and then transport upward through the gap 235A to make the gas flow at a high speed to achieve a micro The effect of pump 2 delivering gas.

The third embodiment of the micropump 2 in this case can be a MEMS pump. Please refer to FIGS. 9A and 9B . The MEMS pump includes a first substrate 21B, a first oxide layer 22B, a second substrate 23B, and a pressure Electrical assembly 24B. The MEMS pump of this embodiment is integrally formed through the processes of epitaxy, deposition, photolithography, and etching in the semiconductor manufacturing process, so it should not be disassembled. In order to describe its internal structure in detail, the exploded view shown in FIG. 9B is used. detail.

The first substrate 21B is a silicon wafer (Si wafer) with a thickness ranging from 150 to 400 micrometers (μm). The first substrate 21B has a plurality of inflow holes 211B, a first surface 212B and a second surface 213B. In this embodiment, the number of the plurality of inflow holes 211B is 4, but not limited to this, and each inflow hole 211B penetrates from the second surface 213B to the first surface 212B, and the inflow holes 211B are used to enhance the The inflow effect causes the inflow hole 211B to exhibit a tapered taper from the second surface 213B to the first surface 212B.

The first oxide layer 22B is a silicon dioxide (SiO ₂ ) film with a thickness between 10 and 20 micrometers (μm). The first oxide layer 22B is stacked on the first surface 212B of the first substrate 21B. An oxide layer 22B has a plurality of confluence channels 221B and a confluence chamber 222B. The numbers and positions of the confluence channels 221B and the inflow holes 211B of the first substrate 21B correspond to each other. In this embodiment, the number of the confluence channels 221B is also four, one end of the four confluence channels 221B is respectively connected to the four inflow holes 211B of the first substrate 21B, and the other ends of the four confluence channels 221B are connected to the confluence flow. In the chamber 222B, after the gas enters through the inflow holes 211B respectively, it passes through the correspondingly connected confluence channels 221B and then converges into the confluence chamber 222B.

The second substrate 23B is bonded to the first substrate 21B and includes a silicon wafer layer 231B, a second oxide layer 232B and a silicon material layer 233B. The silicon wafer layer 231B has an actuating portion 2311B, a peripheral portion 2312B, a plurality of connecting portions 2313B, and a plurality of fluid channels 2314B. The actuating portion 2311B is circular, the outer peripheral portion 2312B is a hollow ring, surrounding the periphery of the actuating portion 2311B, the connecting portion 2313B is respectively connected between the actuating portion 2311B and the peripheral portion 2312B, and the fluid channel 2314B surrounds the The outer periphery of the moving part 2311B is respectively located between the connecting parts 2313B. The second oxide layer 232B is a silicon oxide layer with a thickness ranging from 0.5 to 2 micrometers (μm), formed on the silicon wafer layer 231B in a hollow ring shape, and defines a vibration chamber 2321B with the silicon wafer layer 231B . The silicon material layer 233B is circular, located on the second oxide layer 232B and bonded to the first oxide layer 22B. The silicon material layer 233B is a silicon dioxide (SiO ₂ ) film with a thickness between 2 and 5 micrometers (μm). It has a through hole 2331B, a vibrating part 2332B, a fixing part 2333B, a third surface 2334B and a fourth surface 2335B. The through hole 2331B is formed in the center of the silicon material layer 233B, the vibration part 2332B is located in the peripheral area of the through hole 2331B, and corresponds to the vibration chamber 2321B vertically; In the oxide layer 232B, the third surface 2334B is bonded to the second oxide layer 232B, and the fourth surface 2335B is bonded to the first oxide layer 22B; the piezoelectric element 24B is stacked on the actuating portion 2311B of the silicon wafer layer 231B.

The piezoelectric element 24B includes a lower electrode layer 241B, a piezoelectric layer 242B, an insulating layer 243B and an upper electrode layer 244B. The lower electrode layer 241B is stacked on the actuating portion 2311B of the silicon wafer layer 231B, and the piezoelectric layer 242B is stacked on the The lower electrode layer 241B is electrically connected through its contact area. In addition, the width of the piezoelectric layer 242B is smaller than that of the lower electrode layer 241B, so that the piezoelectric layer 242B cannot completely cover the lower electrode layer 241B. The insulating layer 243B is stacked on the partial region of the electrical layer 242B and the region of the lower electrode layer 241B not shielded by the piezoelectric layer 242B, and finally stacked on the insulating layer 243B and the region of the piezoelectric layer 242B not shielded by the insulating layer 243B The upper electrode layer 244B is placed so that the upper electrode layer 244B can be electrically connected to the piezoelectric layer 242B, and the insulating layer 243B is used to block the upper electrode layer 244B and the lower electrode layer 241B to avoid short circuit caused by direct contact.

Please refer to FIG. 10A to FIG. 10C , which are schematic diagrams of the operation of the MEMS pump. Referring to FIG. 10A , after the lower electrode layer 241B and the upper electrode layer 244B of the piezoelectric element 24B receive the driving voltage and the driving signal and conduct them to the piezoelectric layer 242B, the piezoelectric layer 242B is affected by the inverse piezoelectric effect. When the deformation starts, the actuating portion 2311B of the silicon wafer layer 231B is driven to start to displace. When the piezoelectric element 24B drives the actuating portion 2311B to move upward, the distance between the second oxide layer 232B and the second oxide layer 232B is increased. The volume of the vibration chamber 2321B of 232B will increase, so that a negative pressure will be formed in the vibration chamber 2321B, and the gas in the confluence chamber 222B of the first oxide layer 22B will be sucked into it through the through holes 2331B. Please continue to refer to FIG. 10B , when the actuating portion 2311B is displaced upward by the traction of the piezoelectric element 24B, the vibrating portion 2332B of the silicon material layer 233B will be displaced upward due to the resonance principle. When the vibrating portion 2332B is displaced upward, the vibration cavity will be compressed. the space of the chamber 2321B and push the gas in the vibration chamber 2321B to move to the fluid channel 2314B of the silicon wafer layer 231B, so that the gas can be discharged upward through the fluid channel 2314B, and when the vibration part 2332B is displaced upward to compress the vibration chamber 2321B, the confluence flows The volume of the chamber 222B is increased due to the displacement of the vibrating part 2332B, and a negative pressure is formed inside the chamber 222B, and the gas outside the MEMS pump is drawn into it through the inflow hole 211B. Finally, as shown in FIG. 10C , when the piezoelectric element 24B drives the actuating portion 2311B of the silicon wafer layer 231B to displace downward, the gas in the vibration chamber 2321B is pushed toward the fluid channel 2314B, and the gas is discharged, while the The vibrating portion 2332B is also moved downward by the actuating portion 2311B, and synchronously compresses the gas in the confluence chamber 222B, so that it moves toward the vibrating chamber 2321B through the through hole 2331B, and then the piezoelectric element 24B drives the actuating portion 2311B to move upward. When , the volume of the vibration chamber 2321B will be greatly increased, and then the gas will be sucked into the vibration chamber 2321B with a higher suction force, and the above actions will be repeated, so that the piezoelectric element 24B will continue to drive the actuator 2311B to move up and down and The interlocking vibration part 2332B is displaced up and down to change the internal pressure of the micro-electro-mechanical pump, so that it continuously absorbs and discharges gas, thereby completing the action of the micro-electro-mechanical pump.

Please continue to refer to FIG. 4 , the heat dissipation component of the mobile device in this case further includes a liquid pump 4 . The liquid pump 4 is connected to the heat dissipation tube plate 3 and communicated with the interior of the heat dissipation tube plate 3 . After the liquid pump 4 is activated, it can pump and drive heat dissipation. The liquid circulates and flows to speed up the flow speed of the heat dissipation liquid, so that the heat source on the heat dissipation tube plate 3 spreads rapidly, and the heat exchange effect of the heat dissipation tube plate 3 is accelerated.

Referring to FIGS. 11 to 13B , the liquid pump 4 includes a valve cover body 41 , two sets of valve plates 42 , a valve base 43 , an actuator 44 and an outer cylinder 45 . Among them, an actuator 44, a valve base 43, two groups of valve pieces 42, and a valve cover body 41 are respectively arranged in the outer cylinder 45 in sequence, and are then assembled by sealing the inside of the outer cylinder 45 with a sealant 46.

11, 13A, 13B and 15, the valve cover body 41 has a valve cover first surface 411, a valve cover second surface 412, an inlet channel 413, an outlet channel 414 and a plurality of latches The component 415, wherein the inlet channel 413 and the outlet channel 414 respectively penetrate between the first surface 411 of the valve cover and the second surface 412 of the valve cover, and the outer edge of the inlet channel 413 on the second surface 412 of the valve cover is protruded with an inlet protrusion. A first protruding structure 413b is protruded on the inlet flange 413a, and an outlet flange 414a is protruded from the outer edge of the outlet channel 414 on the second surface 412 of the valve cover, and the outlet flange 414a is An outlet chamber 414b is recessed in the center, and a plurality of latching members 415 protrude outward from the second surface 412 of the valve cover. In this embodiment, the number of the latches 415 is 2, but not limited to this, and can be set according to the actual number of positioning requirements.

The above-mentioned two groups of valve pieces 42 are mainly made of polyimide (PI) polymer material, and the manufacturing method mainly uses the method of reactive ion etching (RIE) to coat them with photosensitive photoresist. Above the valve sheet 42 structure, and after exposure and development of the valve sheet 42 structure pattern, etching is performed. Because the photoresist cover will protect the polyimide (PI) sheet from being etched, the valve sheet can be etched out. 42, the two groups of valve plates 42 include a first valve plate 42a and a second valve plate 42b, and the first valve plate 42a and the second valve plate 42b are respectively provided with a central valve plate 421a, 421b, and the central valve plate 421a, A plurality of extending brackets 422a and 422b are respectively arranged around the periphery of 421b for elastic support, and a through hole 423a and 423b are respectively formed between adjacent extending brackets 422a and 422b.

The above-mentioned valve base 43 is docked with the valve cover body 41, and the first valve piece 42a and the second valve piece 42b are positioned between the two. The valve base 43 has a valve bottom first surface 431 and a valve bottom second surface 432 , an inlet valve channel 433 and an outlet valve channel 434, wherein the inlet valve channel 433 and the outlet valve channel 434 are arranged between the first surface 431 of the valve bottom and the second surface 432 of the valve bottom, and the inlet valve channel 433 is connected to the valve The inner edge of the bottom first surface 431 is recessed with an inlet concave edge 433a for connecting with the inlet flange 413a of the valve cover body 41, and the first valve plate 42a is arranged therebetween, so that the central valve plate 421a is received by the valve cover body The first protruding structure 413b of the valve cover 41 is in contact with the first protruding structure 413b to close the inlet channel 413 of the valve cover body 41. The central valve plate 421a of the first valve plate 42a normally contacts the first protruding structure 413b to generate a pre-force and It is helpful for pre-tightening to prevent backflow (as shown in Figure 15), and an inlet chamber 433b is recessed in the center of the inlet concave edge 433a, and the inner edge of the outlet valve channel 434 on the first surface 431 of the valve bottom is recessed There is an outlet concave edge 434a, and a second protruding structure 434b is protruded in the center of the outlet concave edge 434a, and the outlet concave edge 434a is opposite to the outlet flange 414a of the valve cover body 41, and the second valve plate 42b is provided In the meantime, the central valve piece 421b is pressed against the second protruding structure 434b to close the outlet valve channel 434 of the valve base 43, and the central valve piece 421b of the second valve piece 42b is normally pressed against the second protruding structure 434b, In order to generate a pre-force and help to pre-tighten to prevent reverse flow (as shown in FIG. 15 ), the positions of the first surface 431 of the valve bottom corresponding to the plurality of latches 415 of the valve cover body 41 are also provided with the same position. 14, the plurality of latching members 415 of the valve cover body 41 are correspondingly snapped into the plurality of docking card holes 435 of the valve cover body 41 for connecting the valve base 43 to the valve cover body. 41 can connect and cover the first valve piece 42a and the second valve piece 42b and realize positioning and assembling. In this embodiment, the number of the latching pieces 415 is 2, so the number of the docking clamping holes 435 is 2, but this is not the case. The limit can be set according to the actual number of positioning requirements. In addition, the second surface 432 of the valve bottom is recessed to form a collecting chamber 436 , and the collecting chamber 436 communicates with the inlet valve channel 433 and the outlet valve channel 434 .

The above-mentioned actuator 44 includes a vibrating piece 441 and a piezoelectric element 442, the vibrating piece 441 is made of metal material, and the piezoelectric element 442 is made of piezoelectric powder of the lead zirconate titanate (PZT) series of high voltage electricity. , and the piezoelectric element 442 is attached to one side of the vibrating piece 441, and the vibrating piece 441 is covered on the second surface 432 of the valve bottom of the valve base 43 to close the collecting chamber 436, and the vibrating piece 441 has an electrical property The pin 441a is used for electrical connection with the external power source, so that the piezoelectric element 442 can be driven to deform and vibrate and displace.

The outer cylinder 45 is concavely provided with an inner wall recessed space 451 on one side, and the bottom of the inner wall recessed space 451 has a hollowed out central groove 452 and a penetration frame opening 453 that penetrates one side of the outer cylinder 45 and communicates with the outside. , wherein the inner wall recessed space 451 is sequentially placed by the actuator 44 , the valve base 43 , the two groups of valve plates 42 and the valve cover body 41 , and the electrical pins 441 a of the actuator 44 are inserted and positioned at the penetrate into the frame 453 . The sealing glue 46 is used for positioning in the recessed space 451 on the inner wall, and the piezoelectric element 442 of the actuator 44 is correspondingly disposed in the central groove 452, and can vibrate and displace in the central groove 452 when driven.

As shown in FIG. 16A , when the piezoelectric element 442 is driven by a voltage to vibrate and displace downward, the inlet chamber 433b of the valve base 43 forms a suction force to pull the first valve. The central valve plate 421a of the plate 42a is displaced. At this time, the central valve plate 421a of the first valve plate 42a does not close the inlet channel 413 of the valve cover body 41, so that the liquid is introduced from the inlet channel 413 of the valve cover body 41 through the first valve plate 42a. The penetrating through hole 423a of the valve base 43 flows into the inlet chamber 433b of the valve base 43, and flows into the collecting chamber 436 to buffer the concentrated liquid. Thereafter, as shown in FIG. 16B, when the piezoelectric element 442 of the actuator 44 vibrates and displaces upward, The liquid buffered and concentrated in the collecting chamber 436 is pushed to the outlet valve channel 434 of the valve base 43, so that the central valve plate 421b of the second valve plate 42b is separated from the top contact of the second protruding structure 434b, so that the fluid can be smoothly discharged from the second valve plate 42b. The permeable through hole 423b of the valve sheet 42b flows into the outlet chamber 414b of the valve cover body 41, and then flows out through the outlet channel 414 to achieve liquid transmission.

To sum up, the heat dissipation component of the mobile device provided in this case uses the heat dissipation tube plate with the heat dissipation liquid inside to dissipate heat from the heat generating element (such as the processing chip) of the mobile device, and uses the liquid pump to speed up the flow of the heat dissipation liquid, so that the heat energy can be quickly It is evenly distributed on the entire heat dissipation tube plate to speed up the diffusion effect, and then the micro pump is used to transport gas to the heat dissipation tube plate for heat exchange, reducing the temperature of the heat dissipation tube plate, greatly improving the heat dissipation effect, and effectively reducing the problem of overheating of the mobile device processor. , with great industrial utilization and progress.

Claims (14)

1. A heat dissipation assembly for a mobile device, comprising: a casing body with a ventilation hole and a positioning accommodating seat, wherein the positioning accommodating seat is arranged corresponding to the ventilation hole, and the bottom of the positioning accommodating seat communicates with the ventilation hole; a micro-pump, disposed in the positioning accommodating seat, corresponding to the vent hole communicated with the bottom of the positioning accommodating seat, for the gas transmitted when the micro-pump is driven to be discharged through the vent hole; a heat dissipation tube plate, which contains heat dissipation liquid, and one end is positioned on the positioning accommodating seat, and is in contact with a heating element of the mobile device, so as to perform liquid convection heat exchange with the heat source emitted by the heating element; Wherein, the gas guided by the micro-pump forms heat convection, exchanges heat absorbed by the heat dissipation tube plate, and is discharged through the ventilation hole. 2. The heat dissipation assembly of claim 1, wherein the micro pump comprises: A jet hole piece includes a plurality of connecting pieces, a suspending piece and a hollow hole, the suspending piece can bend and vibrate, the plurality of connecting pieces are adjacent to the periphery of the suspending piece, and the hollow hole is formed at the center of the suspending piece , the suspending piece is fixedly arranged by the plurality of connecting pieces, the plurality of connecting pieces elastically support the suspending piece, and the bottom of the air jet hole piece forms an air flow chamber, and the plurality of connecting pieces and the suspending piece form an air flow chamber at least one gap; a cavity frame, loaded and stacked on the suspension sheet; an actuating body, which is loaded and stacked on the cavity frame to receive voltage and reciprocately bend and vibrate; an insulating frame, loaded and stacked on the actuating body; and a conductive frame, the bearing stack is arranged on the insulating frame; Wherein, a resonance chamber is formed between the actuating body, the cavity frame and the suspending piece. By driving the actuating body to drive the air jet hole sheet to generate resonance, the suspension sheet of the jet hole sheet is reciprocated. The ground vibrates and displaces, so as to cause the gas to enter the gas flow chamber through the gap and then be discharged, so as to realize the transmission flow of the gas. 3. The heat dissipation assembly of claim 2, wherein the actuating body comprises: a piezoelectric carrier plate, which is stacked on the cavity frame; an adjustment resonance plate, loaded and stacked on the piezoelectric carrier; and A piezoelectric plate is supported and stacked on the adjustment resonance plate to receive a voltage to drive the piezoelectric carrier plate and the adjustment resonance plate to reciprocately bend and vibrate. 4. The heat dissipation assembly of claim 1, wherein the micro pump comprises: an air intake plate, having at least one air intake hole, at least a pair of busbar grooves corresponding to the position of the air intake hole, and a confluence chamber, the air intake hole is used for introducing gas, and the busbar groove is used for guiding from the intake air the gas introduced by the hole to the manifold; a resonator plate with a hollow hole corresponding to the position of the confluence chamber and surrounded by a movable part; and a piezoelectric actuator, which is arranged correspondingly to the resonance plate in position; Wherein, the air intake plate, the resonance plate and the piezoelectric actuator are stacked in sequence, and a cavity space is formed between the resonance plate and the piezoelectric actuator for the piezoelectric actuation When the actuator is driven, the gas is introduced through the air inlet hole of the air inlet plate, collected into the confluence chamber through the bus bar groove, and then passes through the hollow hole of the resonant plate, so that the piezoelectric actuator and the The movable part of the resonance plate resonates to transmit the gas. 5. The heat dissipation assembly of claim 4, wherein the piezoelectric actuator comprises: a hoverboard, having a square shape and capable of bending and vibrating; an outer frame, arranged around the outer side of the suspension board; at least one bracket connected between the suspension board and the outer frame to provide elastic support; and A piezoelectric element with a side length, the side length is less than or equal to the side length of the suspension board, and the piezoelectric element is attached to a surface of the suspension board for receiving a voltage to drive the suspension board to bend and vibrate . 6. The heat dissipation assembly of claim 4, wherein the micro pump comprises: a suspension board, which has a first surface and a second surface, and the first surface has a convex part; an outer frame, arranged around the outer side of the suspension board; at least one bracket connected between the suspension board and the outer frame to provide elastic support for the suspension board; and a piezoelectric element attached to the second surface of the suspension board for applying a voltage to drive the suspension board to bend and vibrate; Wherein, the at least one bracket is formed between the suspension board and the outer frame, so that the suspension board and the outer frame are at different levels, and the first surface of the suspension board and the resonance sheet maintain a cavity space . 7. The heat dissipation assembly of claim 4, wherein the micro pump further comprises a first insulating sheet, a conductive sheet and a second insulating sheet, wherein the air intake plate, the resonance sheet, The piezoelectric actuator, the first insulating sheet, the conductive sheet and the second insulating sheet are stacked in sequence. 8 . The heat dissipation assembly of claim 1 , wherein the micro pump is a micro electro-mechanical pump, comprising: 8 . a first base plate with a plurality of inflow holes, the plurality of inflow holes are tapered; a first oxide layer on which the first substrate is stacked, the first oxide layer has a plurality of confluence channels and a confluence chamber, and the plurality of confluence channels are communicated between the confluence chamber and the plurality of inflow holes; A second substrate, bonded to the first substrate, includes: A silicon wafer layer having: An actuating part, which is circular; an outer peripheral portion, in the form of a hollow ring, surrounding the periphery of the actuating portion; a plurality of connecting parts respectively connected between the actuating part and the outer peripheral part; and a plurality of fluid passages surrounding the periphery of the actuating portion and respectively located between the plurality of connecting portions; a second oxide layer formed on the silicon wafer layer, in the shape of a hollow ring, and defining a vibration chamber with the silicon wafer layer; and A silicon material layer, in the shape of a circle, located in the second oxide layer and bonded to the first oxide layer, has: a through hole formed in the center of the silicon material layer; a vibrating part, located in the peripheral area of the perforation; a fixing portion located at the peripheral region of the silicon material layer; and A piezoelectric element, in the shape of a circle, is stacked on the actuating portion of the silicon wafer layer. 9. The heat dissipation assembly of claim 8, wherein the piezoelectric assembly comprises: next electrode layer; a piezoelectric layer, stacked on the lower electrode layer; An insulating layer is laid on part of the surface of the piezoelectric layer and part of the surface of the lower electrode layer; and An upper electrode layer is stacked on the insulating layer and the other surface of the piezoelectric layer without the insulating layer, and is used for electrical connection with the piezoelectric layer. 10 . The heat dissipation assembly of claim 1 , further comprising a liquid pump for communicating with the inside of the heat dissipation tube plate, so that the heat dissipation liquid inside the heat dissipation tube plate can be pumped and circulated. 10 . , to accelerate the heat exchange effect of the heat dissipation tube plate. 11. The heat dissipation assembly of claim 10, wherein the liquid pump comprises: a valve cover body, which has a first surface of the valve cover, a second surface of the valve cover, an outlet channel, an inlet channel and a plurality of locking pieces, wherein the inlet channel and the outlet channel are arranged through the first valve cover Between the surface and the second surface of the valve cover, and the outer edge of the inlet channel on the second surface of the valve cover, an inlet flange is protruded, and a first protruding structure is protruded on the inlet flange, and An outlet flange is protruded from the outer edge of the outlet channel on the second surface of the valve cover, and an outlet chamber is recessed in the center of the outlet flange. bulge outwards; Two sets of valve pieces, including a first valve piece and a second valve piece, and the first valve piece and the second valve piece are respectively provided with a central valve piece, and a plurality of extension brackets are arranged around the central valve piece to for elastic support, and a through hole is formed between each of the extension brackets adjacent to each other; a valve base, which is butted with the valve cover body, and the first valve piece and the second valve piece are positioned and arranged therebetween, the valve base has a first surface of the valve bottom, a second surface of the valve bottom, a an inlet valve channel and an outlet valve channel, wherein the inlet valve channel and the outlet valve channel are arranged between the first surface of the valve bottom and the second surface of the valve bottom, and the inlet valve channel is located at the first surface of the valve bottom The inner edge on the surface is concavely provided with an inlet concave edge for connecting with the inlet flange of the valve cover body, and the first valve piece is arranged therebetween, so that the central valve piece is received by the first valve cover body. The protruding structure touches against the inlet channel of the valve cover body, and an inlet chamber is recessed in the center of the inlet concave edge, and the outlet valve channel is recessed on the inner edge of the first surface of the valve bottom There is an outlet concave edge, and a second protruding structure is protruded in the center of the outlet concave edge, the outlet concave edge is opposite to the outlet flange of the valve cover body, and the second valve sheet is arranged therebetween, The central valve plate is pressed against the second protruding structure to close the outlet valve channel of the valve base, and the first surface of the valve bottom is recessed corresponding to the positions of the plurality of latching pieces of the valve cover body There are a plurality of docking holes for the valve base and the valve cover to be docked to cover the first valve plate and the second valve plate and realize positioning and assembly, and the second surface of the valve bottom is recessed to form a manifold chamber, communicated with the inlet valve channel and the outlet valve channel; An actuator includes a vibrating piece and a piezoelectric element, the piezoelectric element is attached to one side of the vibrating piece, and the vibrating piece has an electrical pin, and the vibrating piece is covered on the valve base the second surface of the valve bottom to close the collecting chamber; An outer cylinder is provided with an inner wall recessed space on one side, and has a hollowed center groove at the bottom of the inner wall recessed space and a penetration frame opening that penetrates one side and communicates with the outside, wherein the inner wall recessed The actuator, the valve base, the two groups of the valve plates and the valve cover body are sequentially placed in the placement space, and the electrical pins of the actuator are inserted and positioned in the penetration frame opening, And fill a sealant in the inner wall recessed space for positioning, and the piezoelectric element of the actuator is correspondingly arranged in the central recess, and can vibrate and displace when driven; Wherein, the inlet passage of the valve cover body corresponds to the inlet chamber of the valve base, and is controlled and communicated with the first valve sheet, and the outlet chamber of the valve cover body corresponds to the outlet valve of the valve base The channel is controlled and communicated with the second valve sheet. 12 . The heat dissipation assembly of claim 11 , wherein the first protruding structure of the valve cover abuts against the central valve plate of the first valve plate, closing the inlet of the valve cover body. 13 . channel to generate a pre-force to prevent backflow. 13. The heat dissipation assembly of claim 11, wherein the second protruding structure of the valve base abuts against the central valve piece of the second valve piece, closing the outlet valve channel of the valve base , to generate a pre-force to prevent backflow. 14. The heat dissipation assembly of claim 11, wherein when the piezoelectric element of the actuator vibrates and displaces downward, the inlet chamber of the valve base forms a suction force to pull the first The displacement of the central valve plate of the valve plate does not close the inlet channel of the valve cover body, so that the liquid is introduced from the inlet channel of the valve cover body into the through hole of the first valve plate and flows into the valve seat. into the chamber and flow into the collecting chamber to buffer the concentrated liquid, and when the piezoelectric element of the actuator vibrates and displaces upward, the buffered and concentrated liquid in the collecting chamber flows to the outlet valve channel of the valve base Push, so that the central valve piece of the second valve piece is separated from the top contact of the second protruding structure, so that the fluid flows smoothly from the through hole of the second valve piece into the outlet chamber of the valve cover body , and then flow out from the outlet channel to complete the liquid transmission.

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