CN119012647A - Electronic element heat abstractor - Google Patents
Electronic element heat abstractor Download PDFInfo
- Publication number
- CN119012647A CN119012647A CN202411231948.8A CN202411231948A CN119012647A CN 119012647 A CN119012647 A CN 119012647A CN 202411231948 A CN202411231948 A CN 202411231948A CN 119012647 A CN119012647 A CN 119012647A
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- Prior art keywords
- cavity
- air
- groove
- heat dissipation
- air outlet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of electronic element heat dissipation, in particular to an electronic element heat dissipation device which comprises a heat dissipation assembly and a PCB (printed circuit board) arranged at the top of the heat dissipation assembly, wherein the heat dissipation assembly comprises a heat dissipation placing seat and a heat dissipation fan frame, and an installation square groove is formed in one end of the heat dissipation placing seat. When the temperature of an electronic element on one side of the PCB close to the air outlet block is higher, heat can be transmitted to the red copper frame plate through the PCB, then the heat is transmitted to the memory metal bent rod through the red copper heat conduction column and the red copper heat conduction rod, the memory metal bent rod is heated to deform and tends to be arc-shaped, and the arc-shaped inner rod is pushed out from the inside of the arc-shaped outer cylinder, so that one end of the movable wind shielding inclined plate, which is far away from the rotating rod, moves to one side, which is close to the bottom of the inner cavity of the air guide cavity, and therefore air flow in the air guide cavity is blocked and conducted, cooling air flow discharged by the air outlet groove II is increased, local efficient heat dissipation of the bottom of the PCB is achieved, and the electronic element with higher temperature is more beneficial to heat dissipation.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a heat dissipation device for electronic devices.
Background
The electronic component is the basis for forming the electronic product, and knowing the type, structure and performance of the commonly used electronic component and correctly selecting the electronic component is the basis for learning and mastering the electronic technology, and the commonly used electronic component comprises: resistors, capacitors, inductors, potentiometers, transformers, etc., can be currently classified into two major categories, i.e., conventional mounting and surface mounting, with transistors and diodes being referred to as electronic devices.
In order to protect electronic components and prolong the service life of the electronic components, a radiator is arranged in most electrical equipment, the radiator is a device for radiating the components which are easy to generate in the electrical equipment, the radiator generally contacts the electronic components and radiates heat into the air through strip-shaped or block radiating fins, the radiating efficiency of the radiating fins is low, the use is inconvenient, and the traditional radiator is to put the electronic components on the radiator and only radiates the surfaces of the electronic components, and the positions which are easy to accumulate heat, such as pins, are ignored, so that further improvement is necessary.
Disclosure of Invention
The invention provides a heat dissipation device for electronic components, which aims to solve the problems in the background art.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The heat dissipation assembly comprises a heat dissipation assembly and a PCB (printed circuit board) arranged at the top of the heat dissipation assembly, wherein the heat dissipation assembly comprises a heat dissipation placing seat and a heat dissipation fan frame, an installation square groove is formed in one end of the heat dissipation placing seat, two first partition plates are fixedly arranged in the installation square groove, three air guide blocks are fixedly arranged at the bottom of an inner cavity of the installation square groove, air guide grooves I are formed in the three air guide blocks, liquid nitrogen cavities are formed in the three air guide blocks, air outlet holes are formed in the three air guide blocks, an exhaust cavity I is formed in one side of the inner cavity of the heat dissipation placing seat, an exhaust cavity I is formed in the inner side of the side air outlet block, two partition plates II are fixedly arranged in the inner side of the exhaust cavity I, air guide pipes are communicated with one end of the side air guide blocks far away from the side air outlet block I, air outlet cavities II are fixedly communicated with one end of the side air guide pipes far away from the side air outlet block I, and air outlet cavities II are formed in the side air outlet block I are fixedly communicated with one side air outlet block II;
an exhaust cavity III is formed in the bottom of one side of the installation square groove, an air collecting cavity II is formed in one end, far away from the installation square groove, of the exhaust cavity III, and an air outlet groove IV is formed in one side of the heat dissipation placing seat;
An exhaust cavity II is formed in one side of the bottom of the inner cavity of the installation square groove, an air guide cavity is formed in the heat dissipation placing seat, an air guide groove II is formed in one end of the heat dissipation placing seat, a ventilation groove I is formed in the top of the heat dissipation placing seat, and a ventilation groove II is formed in the top of the heat dissipation placing seat;
A first radiating fan, a second radiating fan and a third radiating fan are fixedly arranged in the radiating fan frame;
the top fixed mounting of PCB board has electronic component, the pin of electronic component bottom runs through the PCB board, and extends to the bottom of PCB board.
In the above-mentioned electronic component heat abstractor, two baffle one will install square groove internal partition and become first cavity, second cavity and third cavity, and radiator fan one, radiator fan two and radiator fan three are located the top of first cavity, second cavity and third cavity respectively, three the wind-guiding piece is fixed mounting respectively in the inside of first cavity, second cavity and third cavity, exhaust cavity two is seted up in the bottom of first cavity, exhaust cavity one is seted up in one side of second cavity, exhaust cavity three is seted up in the bottom of third cavity one side, the one end of the air-out hole that three wind-guiding piece inside was seted up is all linked together with wind guiding groove one, and the position that the air-out hole that three wind-guiding piece inside was seted up was kept away from the one end of wind guiding groove one is corresponding with exhaust cavity two, exhaust cavity one and exhaust cavity three respectively.
In the above-mentioned electronic component heat dissipating device, the two partition boards divide the interior of the first exhaust cavity into a first air cavity, a second air cavity and a third air cavity, the second air cavity is communicated with the first air outlet slot, and the first air cavity and the third air cavity are respectively communicated with the two side air outlet blocks.
In the above-mentioned electronic component heat abstractor, the top fixed mounting of wind-guiding chamber inner chamber has fixed swash plate that keeps out wind, the top fixed mounting of seat is placed in the heat dissipation has the arc, air-out groove three has been seted up to one side of arc, the dwang has been installed in the top rotation of wind-guiding chamber inner chamber, the outside fixed mounting of dwang has movable swash plate that keeps out wind, air-out groove two has been seted up at the top of seat is placed in the heat dissipation, one side fixed mounting of ventilation groove two has the arc urceolus, the internally mounted of arc urceolus has the memory metal curved bar, the bottom fixed mounting of memory metal curved bar has the arc interior pole, the top fixed mounting of memory metal curved bar has the red copper heat-conducting rod, the equal fixed mounting in four corners at seat top is placed in the heat dissipation support column, the equal fixed mounting in top of support column has the red copper frame plate, wherein two the inside of support column is all fixed mounting red copper heat-conducting column.
In the above-mentioned electronic component heat abstractor, the top fixed mounting of seat is placed in the heat dissipation has the water conservancy diversion slope piece, water conservancy diversion slope piece fixed mounting is kept away from the one side of air-out groove three at the arc, the top fixed mounting of seat is placed in the heat dissipation has the water conservancy diversion swash plate, the water conservancy diversion swash plate is located the top of air-out groove two.
In the above-mentioned electronic component heat dissipating device, one side of the first air collecting cavity is communicated with one side of the fifth air outlet groove, the top of the second air guiding groove is communicated with the bottom of the fifth air outlet groove, and the bottom of the second air guiding groove is communicated with the top of the air guiding cavity.
In the above-mentioned electronic component heat abstractor, the fixed swash plate that keeps out wind is located the bottom of ventilation groove one, the activity swash plate that keeps out wind is located the bottom of ventilation groove two, the one end that memory metal curved bar was kept away from to the arc in the pole is fixed connection with the top of activity swash plate that keeps out wind, the centre of a circle of dwang cross section and the centre of a circle of arc in pole and arc urceolus cross section are the same point.
In the above-mentioned electronic component heat dissipating device, the bottom of the red copper frame plate is in contact with the top of the red copper heat conducting column, and one end of the red copper heat conducting rod, which is far away from the memory metal bent rod, is connected with the bottom of the red copper heat conducting column.
In the above-mentioned heat dissipating device for electronic component, the memory metal bent rod is made of nickel-titanium alloy, and the modification temperature is 40 ℃.
Compared with the prior art, the electronic element heat dissipation device has the advantages that:
1. The second heat dissipation fan can be used for spraying outside air flow to the top of the PCB, dissipating heat to the electronic components on one side of the top of the PCB, and dissipating heat in an air circulation mode to achieve good heat dissipation effect;
2. The external air flow can be sprayed to the bottom of the PCB through the arranged heat radiation fan III, the pins at the bottom of the electronic element are subjected to blowing heat radiation, and the surfaces of the pins at the bottom of the electronic element are subjected to heat radiation, so that the heat radiation of the part of the electronic element which is easy to accumulate heat is realized, the working efficiency is higher, and the heat radiation effect is good;
3. The inside that can send external air current to first cavity through the radiator fan that sets up, then carry out water conservancy diversion cooling through the inside wind-guiding groove one of the inside wind-guiding piece of first cavity, liquid nitrogen chamber and apopore and discharge, later go into the inside of wind-guiding chamber through the chamber of airing exhaust second to carry out the reinforcement through the cooling air current of wind-guiding groove two to the five spun cooling air current of air-out groove, also can carry out the reinforcement through air-out groove three and air-out groove two to the cooling air current of PCB board bottom, promote local radiating effect.
4. When the temperature of the electronic component on one side of the PCB close to the air outlet block is higher, heat can be transmitted to the red copper frame plate through the PCB, then the heat is transmitted to the memory metal bent rod through the red copper heat conduction column and the red copper heat conduction rod, the memory metal bent rod is heated to deform and tends to be arc-shaped, the arc-shaped inner rod is pushed out from the inside of the arc-shaped outer cylinder, one end of the movable wind shielding inclined plate, far away from the rotating rod, moves to one side, close to the bottom of the inner cavity of the air guide cavity, so that the air flow in the air guide cavity is blocked and drained, the cooling air flow exhausted by the air outlet groove II is increased, local efficient heat dissipation of the bottom of the PCB is realized, and the electronic component with higher temperature is more favorable for heat dissipation.
Drawings
Fig. 1 is a schematic view of a three-dimensional structure of a heat dissipating device for electronic components according to the present invention;
Fig. 2 is a schematic perspective view of a heat dissipating assembly according to the present invention;
FIG. 3 is a schematic side view of a heat dissipating assembly according to the present invention;
FIG. 4 is a schematic view of a heat dissipating assembly according to the present invention;
FIG. 5 is a schematic view of a heat dissipating assembly according to the present invention;
FIG. 6 is a schematic view of a heat dissipating assembly according to the present invention;
FIG. 7 is a schematic view of a heat dissipating assembly according to the present invention;
Fig. 8 is a schematic diagram of a heat dissipation assembly with four structures partially cut away according to the present invention
FIG. 9 is an enlarged schematic view of the structure of FIG. 8A according to the present invention;
fig. 10 is a schematic cross-sectional view of an arc-shaped sleeve according to the present invention.
In the figure: 1. a heat dissipation placing seat; 2. a side air outlet block I; 3. a first heat radiation fan; 4. a heat dissipation fan frame; 5. a second heat dissipation fan; 6. a third heat radiation fan; 7. an air outlet groove I; 8. a red copper frame plate; 9. a diversion sloping plate; 10. an air outlet groove II; 11. an arc-shaped plate; 12. an air guide pipe; 13. a second side air outlet block; 14. an air outlet groove III; 15. a diversion slope block; 16. an air outlet groove IV; 17. a support column; 18. a PCB board; 19. an electronic component; 20. a memory metal bent rod; 21. installing a square groove; 211. a third chamber; 212. a second chamber; 213. a first chamber; 22. an air guide block; 23. an air guiding inclined plate; 24. an air guide groove I; 25. a first partition board; 26. a first ventilation groove; 27. fixing a wind shielding inclined plate; 28. an air guide cavity; 29. an air guide groove II; 30. a first wind collecting cavity; 31. an air outlet groove V; 32. a wind gathering cavity II; 33. an exhaust cavity III; 34. a second partition board; 35. an exhaust cavity I; 36. an air outlet hole; 37. a liquid nitrogen chamber; 38. a red copper heat conduction column; 39. a ventilation groove II; 40. a rotating lever; 41. an arc outer cylinder; 42. an arc-shaped inner rod; 43. a movable wind shielding sloping plate; 44. a red copper heat conducting rod; 45. and an exhaust cavity II.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1-9, a heat dissipating device for electronic components comprises a heat dissipating assembly and a PCB 18 placed on top of the heat dissipating assembly, wherein the heat dissipating assembly comprises a heat dissipating placing base 1 and a heat dissipating fan frame 4, a first heat dissipating fan 3, a second heat dissipating fan 5 and a third heat dissipating fan 6 are fixedly installed inside the heat dissipating fan frame 4, a square groove 21 is formed inside one end of the heat dissipating placing base 1, two first partition plates 25 are fixedly installed inside the square groove 21, three air guiding blocks 22 are fixedly installed at the bottom of the inner cavity of the square groove 21, an air guiding groove 24 is formed inside the three air guiding blocks 22, liquid nitrogen cavities 37 are formed inside the three air guiding blocks 22, air outlet holes 36 are formed inside the three air guiding blocks 22, a first side air outlet block 2 is fixedly installed on one side of the inner cavity of the heat dissipating placing base 1, an air outlet cavity 35 is formed inside the first side air outlet block 2, two second partition plates 34 are fixedly installed inside the air outlet cavity 35, an air outlet groove I7 is formed in one side of the side air outlet block I2, two ends of the side air outlet block I2 are communicated with air guide pipes 12, one end, far away from the side air outlet block I2, of each air guide pipe 12 is fixedly communicated with a side air outlet block II 13, an air collecting cavity I30 is formed in the side air outlet block II 13, an air outlet groove V31 is formed in one side of the side air outlet block II 13, two partition plates II 34 divide the interior of the air outlet cavity I35 into a first air cavity, a second air cavity and a third air cavity, a heat radiating fan I3, a heat radiating fan II 5 and a heat radiating fan III 6 are respectively positioned at the tops of a first cavity 213, a second cavity 212 and a third cavity 211, the second air cavity is communicated with the air outlet groove I7, the first air cavity and the third air cavity are respectively communicated with the two side air outlet blocks II 13, external air flow can be guided into the interior of the second cavity 212 through the arranged heat radiating fan II 5, then the air is discharged through the first air guide groove 24 and the air outlet 36 in the air guide block 22 in the second chamber 212, and the air flow is cooled through the top and the bottom of the liquid nitrogen cavity 37 in the flowing process, so that the heat dissipation effect is improved, and then the electronic element 19 on one side of the top of the PCB 18 is dissipated through the ejection of the first air guide groove 7 and the second air guide cavity in the first air exhaust cavity 35 to the top of the PCB 18, and the heat dissipation is carried out in an air circulation mode, so that the good heat dissipation effect is achieved.
In addition, wind is guided to the inside of the wind guide pipe 12 through the first wind cavity and the third wind cavity in the first wind exhaust cavity 35 and is conveyed to the inside of the wind gathering cavity 30 in the second wind outlet block 13, and then is sprayed out to the top of the PCB 18 through the fifth wind outlet groove 31, so that the electronic component 19 on the other side of the top of the PCB 18 is radiated, the bidirectional wind is sprayed for radiating, the radiating effect on the electronic components 19 on two sides is guaranteed, the radiating performance is good, good radiating is guaranteed, and meanwhile, the service life of the electronic component is prolonged.
Wherein, the third air exhausting cavity 33 has been seted up to installation square groove 21 one side bottom, air collecting cavity two 32 has been seted up to the one end that the third air exhausting cavity 33 kept away from installation square groove 21, air outlet groove four 16 has been seted up to one side of seat 1 is placed in the heat dissipation, the top fixed mounting of PCB board 18 has electronic component 19, the pin at electronic component 19 bottom runs through PCB board 18, and extend to the bottom of PCB board 18, can lead the inside of third cavity 211 with external air current through the heat dissipation fan three 6 that sets up, then discharge through air guiding groove one 24 and the air outlet hole 36 of the inside air-guiding piece 22 of third cavity 211, and flow the in-process can cool off the air current through the top and the bottom of liquid nitrogen chamber 37, promote the radiating effect, afterwards, through air exhausting cavity three 33, air collecting cavity two 32 and air outlet groove four 16 blowout to the bottom of PCB board 18, the pin at electronic component 19 bottom carries out the heat dissipation of blowing, the pin surface at electronic component 19 bottom, thereby realize easily accumulating heat to electronic component 19, the position, the work efficiency is higher, the radiating effect is good.
Wherein, one side of the bottom of the inner cavity of the installation square groove 21 is provided with a second exhaust cavity 45, the inside of the heat dissipation placing seat 1 is provided with a second air guide cavity 28, the inside of one end of the heat dissipation placing seat 1 is provided with a second air guide groove 29, the top of the inner cavity of the air guide cavity 28 is fixedly provided with a fixed wind shielding inclined plate 27, the top of the heat dissipation placing seat 1 is provided with a first air guide groove 26, the top of the heat dissipation placing seat 1 is fixedly provided with an arc plate 11, one side of the arc plate 11 is provided with a third air outlet groove 14, the top of the inner cavity of the air guide cavity 28 is rotatably provided with a rotating rod 40, the outside of the rotating rod 40 is fixedly provided with a movable wind shielding inclined plate 43, the top of the heat dissipation placing seat 1 is provided with a second air guide groove 39, the top of the heat dissipation placing seat 1 is provided with a second air outlet groove 10, one side of the air guide groove 39 is fixedly provided with an arc outer cylinder 41, the inside of the arc outer cylinder 41 is provided with a memory metal curved rod 20, the bottom of the memory metal curved rod 20 is fixedly provided with an arc inner rod 42, the top of the memory metal bent rod 20 is fixedly provided with a red copper heat conducting rod 44, the inside of the installation square groove 21 is divided into a first chamber 213, a second chamber 212 and a third chamber 211 by two first partition plates 25, three air guide blocks 22 are respectively and fixedly arranged in the first chamber 213, the second chamber 212 and the third chamber 211, an air exhaust cavity II 45 is arranged at the bottom of the first chamber 213, an air exhaust cavity I35 is arranged at one side of the second chamber 212, an air exhaust cavity III 33 is arranged at the bottom of one side of the third chamber 211, one end of an air outlet 36 arranged in the three air guide blocks 22 is communicated with the first air guide groove 24, the position of one end of the air outlet 36 arranged in the three air guide blocks 22 away from the first air guide groove 24 is corresponding to the positions of the air exhaust cavity II 45, the air exhaust cavity I35 and the air exhaust cavity III 33, one side of the air collecting cavity I30 is communicated with one side of the fifth air outlet groove 31, the top of wind guiding groove two 29 is linked together with the bottom of air-out groove five 31, the bottom of wind guiding groove two 29 is linked together with the top of wind guiding chamber 28, can lead the inside of first cavity 213 with external air current through the radiator fan one 3 that sets up, then discharge through the inside wind guiding groove one 24 of the inside wind guiding block 22 of first cavity 213 and air-out hole 36, and the in-process can cool off the air current through the top and the bottom of liquid nitrogen chamber 37, promote the radiating effect, afterwards discharge the inside of wind guiding chamber 28 through air-out cavity two 45, and strengthen the cooling air current that air-out groove five 31 spouted through air-out groove two 29, also can strengthen the cooling air current of PCB 18 bottom through air-out groove three 14 and air-out groove two 10, promote local radiating effect.
In addition, the fixed wind shielding inclined plate 27 is positioned at the bottom of the first ventilation groove 26, the movable wind shielding inclined plate 43 is positioned at the bottom of the second ventilation groove 39, one end of the arc-shaped inner rod 42, which is far away from the memory metal bent rod 20, is fixedly connected with the top of the movable wind shielding inclined plate 43, the circle center of the cross section of the rotating rod 40 and the circle center of the cross section of the arc-shaped inner rod 42 are the same point with the circle center of the cross section of the arc-shaped outer cylinder 41, the bottom of the red copper frame plate 8 is contacted with the top of the red copper heat conducting column 38, one end of the red copper heat conducting rod 44, which is far away from the memory metal bent rod 20, is connected with the bottom of the red copper heat conducting column 38, the material of the memory metal bent rod 20 is nickel-titanium alloy, the metamorphic temperature of the nickel-titanium alloy is 40 ℃, the four corners at the top of the heat dissipation placing seat 1 are fixedly provided with supporting columns 17, the tops of the supporting columns 17 are fixedly provided with the red copper frame plate 8, the two support columns 17 are fixedly provided with the red copper heat conducting columns 38, when the temperature of the electronic component 19 near the side of the first air outlet block 2 of the PCB 18 is higher, heat can be transmitted to the red copper frame plate 8 through the PCB 18, then the heat is transmitted to the memory metal bent rod 20 through the red copper heat conducting columns 38 and the red copper heat conducting rods 44, the memory metal bent rod 20 is heated to deform and tends to be arc-shaped, the arc-shaped inner rod 42 is pushed out from the inside of the arc-shaped outer cylinder 41, one end of the movable wind shielding inclined plate 43, far away from the rotating rod 40, moves towards the side near the bottom of the inner cavity of the air guide cavity 28, so that the air flow inside the air guide cavity 28 is blocked and drained, the cooling air flow exhausted by the second air outlet groove 10 is increased, the local efficient heat dissipation of the bottom of the PCB 18 is realized, and the electronic component 19 with higher temperature is more favorable for heat dissipation.
The top fixed mounting that the seat 1 was placed in the heat dissipation has guide slope piece 15, and guide slope piece 15 fixed mounting is in the arc 11 one side of keeping away from air-out groove three 14, and the top fixed mounting that the seat 1 was placed in the heat dissipation has guide swash plate 9, and guide swash plate 9 is located the top of air-out groove two 10.
The air flow sprayed out through the air outlet groove four 16 is guided upwards when passing through the guide inclined plate 9 and the guide inclined plate block 15, and is blown to the bottom of the PCB 18, so that the heat dissipation effect is improved.
Further, the above-described fixed connection, unless explicitly stated and defined otherwise, is to be construed broadly, and may be, for example, welded, glued, or integrally formed, as is well known to those skilled in the art.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (9)
1. An electronic component heat abstractor, includes the radiating assembly to and place at the PCB board (18) at the radiating assembly top, its characterized in that: the heat radiation component comprises a heat radiation placing seat (1) and a heat radiation fan frame (4), wherein an installation square groove (21) is formed in one end of the heat radiation placing seat (1), two first partition plates (25) are fixedly arranged in the inner side of the installation square groove (21), three second partition plates (34) are fixedly arranged in the bottom of the inner cavity of the installation square groove (21), a first air guide groove (24) is formed in the inner part of the air guide block (22), liquid nitrogen cavities (37) are formed in the inner part of the air guide block (22), air outlet holes (36) are formed in the inner part of the air guide block (22), a first side air outlet block (2) is fixedly arranged on one side of the inner cavity of the heat radiation placing seat (1), an air outlet cavity (35) is formed in the inner side of the first side air outlet block (35), two second partition plates (34) are fixedly arranged in the inner side of the air outlet cavity (35), a first air outlet groove (7) is formed in one side of the air outlet block (2), two ends of the first side air outlet block (12) are communicated with one end of the second air guide block (13) and the two ends of the first side air outlet block (12) are communicated with one end of the second air outlet pipe (13), an air outlet groove five (31) is formed in one side of the side air outlet block II (13);
An exhaust cavity III (33) is formed in the bottom of one side of the installation square groove (21), an air collecting cavity II (32) is formed in one end, far away from the installation square groove (21), of the exhaust cavity III (33), and an air outlet groove IV (16) is formed in one side of the heat dissipation placing seat (1);
An exhaust cavity II (45) is formed in one side of the bottom of the inner cavity of the installation square groove (21), an air guide cavity (28) is formed in the heat dissipation placing seat (1), an air guide groove II (29) is formed in one end of the heat dissipation placing seat (1), a ventilation groove I (26) is formed in the top of the heat dissipation placing seat (1), and a ventilation groove II (39) is formed in the top of the heat dissipation placing seat (1);
A first radiating fan (3), a second radiating fan (5) and a third radiating fan (6) are fixedly arranged in the radiating fan frame (4);
The top of PCB board (18) fixed mounting has electronic component (19), the pin of electronic component (19) bottom runs through PCB board (18), and extends to the bottom of PCB board (18).
2. The electronic component heat dissipating device of claim 1, wherein: two baffle one (25) divide into first cavity (213), second cavity (212) and third cavity (211) with installation square groove (21) inside, and heat dissipation fan one (3), heat dissipation fan two (5) and heat dissipation fan three (6) are located respectively at the top of first cavity (213), second cavity (212) and third cavity (211), and three air guide block (22) are fixed mounting respectively in the inside of first cavity (213), second cavity (212) and third cavity (211), exhaust cavity two (45) are seted up in the bottom of first cavity (213), exhaust cavity one (35) are seted up in the bottom of second cavity (212), exhaust cavity three (33) are seted up in the bottom of third cavity (211) one side, the one end of air outlet (36) that air guide block (22) inside was seted up all is linked together with air guide groove one (24), and the position that air outlet (36) that air guide block (22) inside was seted up keep away from air guide groove one (24), exhaust cavity one end (35) and exhaust cavity one (33) of exhaust cavity one and exhaust cavity (33) are corresponding respectively.
3. The electronic component heat dissipating device of claim 1, wherein: the two partition boards II (34) divide the interior of the exhaust cavity I (35) into a first air cavity, a second air cavity and a third air cavity, the second air cavity is communicated with the air outlet groove I (7), and the first air cavity and the third air cavity are respectively communicated with the two side air outlet blocks II (13).
4. The electronic component heat dissipating device of claim 1, wherein: the top fixed mounting of wind-guiding chamber (28) inner chamber has fixed swash plate (27), the top fixed mounting of seat (1) is placed in the heat dissipation has arc (11), and arc (11) are located the top of ventilation groove one (26), air-out groove three (14) have been seted up to one side of arc (11), the top of wind-guiding chamber (28) inner chamber rotates and installs dwang (40), the outside fixed mounting of dwang (40) has movable swash plate (43), air-out groove two (10) have been seted up at the top of seat (1) is placed in the heat dissipation, one side fixed mounting of ventilation groove two (39) has arc urceolus (41), the internally mounted of arc urceolus (41) has memory metal bent rod (20), the bottom fixed mounting of memory metal bent rod (20) has arc interior rod (42), the top fixed mounting of memory metal bent rod (20) has red copper heat conduction rod (44), the four corners at seat (1) top is all fixed mounting support column (17), the equal fixed mounting of red copper support column (17) wherein two support column (8) are all fixed mounting red copper support column (38).
5. The electronic component heat dissipating device of claim 4, wherein: the top fixed mounting that seat (1) was placed in the heat dissipation has water conservancy diversion slope piece (15), water conservancy diversion slope piece (15) fixed mounting is kept away from one side of air-out groove three (14) in arc (11), the top fixed mounting that seat (1) was placed in the heat dissipation has water conservancy diversion swash plate (9), water conservancy diversion swash plate (9) are located the top of air-out groove two (10).
6. The electronic component heat dissipating device of claim 1, wherein: one side of the first air gathering cavity (30) is communicated with one side of the fifth air outlet groove (31), the top of the second air guiding groove (29) is communicated with the bottom of the fifth air outlet groove (31), and the bottom of the second air guiding groove (29) is communicated with the top of the air guiding cavity (28).
7. The electronic component heat dissipating device of claim 1, wherein: the fixed wind shielding inclined plate (27) is positioned at the bottom of the first ventilating groove (26), the movable wind shielding inclined plate (43) is positioned at the bottom of the second ventilating groove (39), one end, far away from the memory metal bent rod (20), of the arc-shaped inner rod (42) is fixedly connected with the top of the movable wind shielding inclined plate (43), and the circle center of the cross section of the rotating rod (40) and the circle center of the cross section of the arc-shaped inner rod (42) and the circle center of the cross section of the arc-shaped outer barrel (41) are the same point.
8. The electronic component heat dissipating device of claim 1, wherein: the bottom of the red copper frame plate (8) is contacted with the top of the red copper heat conduction column (38), and one end of the red copper heat conduction rod (44) away from the memory metal bent rod (20) is connected with the bottom of the red copper heat conduction column (38).
9. The electronic component heat dissipating device of claim 1, wherein: the memory metal bent rod (20) is made of nickel-titanium alloy, and the metamorphosis temperature is 40 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411231948.8A CN119012647A (en) | 2024-09-04 | 2024-09-04 | Electronic element heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411231948.8A CN119012647A (en) | 2024-09-04 | 2024-09-04 | Electronic element heat abstractor |
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| Publication Number | Publication Date |
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| CN119012647A true CN119012647A (en) | 2024-11-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411231948.8A Pending CN119012647A (en) | 2024-09-04 | 2024-09-04 | Electronic element heat abstractor |
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| Country | Link |
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| CN (1) | CN119012647A (en) |
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