TW201639758A - Cover tape for electronic component packaging and package for electronic component - Google Patents

Abstract

A cover tape for electronic component packaging of the present invention comprises a base material layer, a sealant layer provided on one surface of the base material layer, and an antistatic layer provided on the opposite surface of the base material layer from the sealant layer, wherein if the surface resistance at the surface of the antistatic layer measured at 23 DEG C and 50% RH is deemed R50 and the surface resistance at the surface of the antistatic layer measured at 23 DEG C and 30% RH is deemed R30, then the value of R50/R30 is at least 0.35 but not more than 2.8.

Description

Cover tape for electronic parts packaging and package for electronic parts

The present invention relates to a cover tape for electronic component packaging and a package for an electronic component.

In the past, electronic components such as transistors, diodes, capacitors, and piezoelectric element registers have been housed in a carrier that is continuously formed into a pocket that can accommodate the electronic component. The package body made of the cover tape of the carrier tape is subjected to heat sealing treatment, and then wound around a paper or plastic reel, and transported to a work area for surface mounting of an electronic circuit board or the like. Then, after the cover tape of the package is peeled off in the work area, the electronic component is taken out from the bag portion formed on the carrier tape to be surface-mounted on an electronic circuit board or the like. In response to the miniaturization of electronic equipment in recent years, it is required to be more compact and highly mounted. Therefore, electronic parts in recent years tend to be more susceptible to static electricity.

For example, Patent Document 1 discloses a cover tape which is provided with a sealant layer on a base material layer in order to suppress static electricity generated when the carrier tape is peeled off, and the sealant layer contains a polyolefin resin and a polyether/polyolefin copolymer.

Patent Document 2 discloses a cover tape which is controlled so that the surface resistance 値 of the sealant layer conforms to a specific condition in order to suppress static electricity or the like due to friction between the cover tape and the electronic component. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-2012-214252 (Patent Document 2) JP-A-2012-30897

[Question to be Solved by the Invention] However, in recent years, the technical level required for the viewpoint of the countermeasure against static electricity of the cover tape has become higher and higher. The inventors of the present invention conducted various investigations on the conventional cover tape, and as a result, found the following problems. When the package containing the electronic component is transported in a state of being wound on the reel, the vibration of the carrier may cause the carrier tape to adhere to the cover tape, that is, opposite to the surface of the sealant layer of the cover tape. The surface of the side generates static electricity due to friction. Because of such static electricity, it sometimes causes problems such as failure of electronic components housed in the package or attachment during substrate mounting. Based on such knowledge, the inventors of the present invention found that there is room for improvement in the countermeasure against static electricity on the surface opposite to the surface of the sealant layer for the conventional cover tape.

The present invention provides a cover tape for electronic component packaging which is excellent in anti-friction charging property. [How to solve the problem]

The inventors of the present invention have diligently studied in order to achieve the above-mentioned problems, and have found that an electronic component having a base material layer, a sealant layer provided on one side of the base material layer, and an antistatic layer provided on the other surface of the base material layer The surface resistance of the surface of the antistatic layer measured at 23 ° C, 50% RH in the cover tape for packaging, and the ratio of the surface resistance 値 of the surface of the antistatic layer measured at 23 ° C, 30% RH It is effective as a design pointer for improving the antistatic property accompanying the peeling of the carrier tape, and the present invention has been completed.

According to the present invention, there is provided a cover tape for packaging an electronic component, comprising: a base material layer; a sealant layer provided on one side of the base material layer; and a side opposite to the one side of the base material layer The antistatic layer of the surface; the surface resistance of the surface of the antistatic layer measured at 23 ° C, 50% RH is R ₅₀ , and the surface of the antistatic layer is measured at 23 ° C, 30% RH. When the surface resistance 値 is R ₃₀ , the enthalpy after R ₅₀ /R ₃₀ is 0.35 or more and 2.8 or less.

The inventors of the present invention considered other viewpoints, and in an effort to achieve the above-mentioned problems, it was found that: a sealant layer having a base material layer, one side of the base material layer, and an antistatic layer provided on the other side of the base material layer In the cover tape for electronic parts packaging, the absolute rate of the friction band voltage of the surface of the antistatic layer measured under different humidity conditions is a scale of the rate of change from 5 kV to 50 V (electrostatic voltage decay time), The design of the design of the antistatic property accompanying the peeling of the carrier tape is effective, and the present invention has been completed.

According to the present invention, there is provided a cover tape for packaging an electronic component, comprising: a base material layer; a sealant layer provided on one side of the base material layer; and a side opposite to the one side of the base material layer The antistatic layer of the surface; the absolute voltage of the friction band of the surface of the antistatic layer is attenuated from 5 kV to 50 V, and the decay time of the electrostatic voltage measured at 23 ° C and 50% RH is S ₅₀ , when the electrostatic voltage decay time measured at 23 ° C and 30% RH is S ₃₀ , the value of S ₅₀ /S ₃₀ is 0.7 or more and 1 or less. Moreover, according to the present invention, a package for an electronic component is provided by a component storage tape comprising a carrier tape and a cover tape, wherein the carrier tape is formed by arranging component storage portions for accommodating electronic components at predetermined intervals; The cover member is formed so as to be coated on the component storage portion of the carrier tape, and the component storage tape can be wound into a reel shape, and the cover tape is the cover tape for electronic component packaging. [Effects of the Invention]

According to the present invention, it is possible to provide a cover tape for electronic component packaging which is excellent in anti-friction charging property.

Fig. 1 is a schematic cross-sectional view showing an example of a cover tape for electronic component packaging of the embodiment. As shown in Fig. 1, the cover tape 10 for electronic component packaging (hereinafter also referred to as "cover tape") of the present embodiment has a base material layer 1 and a sealant layer 2 provided on one side of the base material layer 1; The antistatic layer 3 is provided on the opposite side of the one surface of the base material layer 1. Moreover, the cover tape 10 is such that the surface resistance of the surface of the antistatic layer 3 measured at 23 ° C and 50% RH is R ₅₀ , and the surface of the antistatic layer 3 is measured at 23 ° C and 30% RH. When the surface resistance 値 is R ₃₀ , the enthalpy after R ₅₀ /R ₃₀ is 0.35 or more and 2.8 or less. Thereby, a cover tape excellent in antistatic property accompanying peeling of the carrier tape can be obtained. Further, the above surface resistance 値 can be measured in accordance with IEC 61340.

Fig. 2 is a view showing an example of a state in which a cover tape for electronic component packaging of the present embodiment is sealed to a carrier tape. First, the method of using the cover tape will be described with reference to FIG. 2 . As shown in Fig. 2, the cover tape 10 is a cover material of the carrier tape 20, and the carrier tape 20 is formed by continuously forming the concave bag portion 21 in accordance with the shape of the electronic component. Specifically, the cover tape 10 is used by being adhered (for example, heat-sealed) to the surface of the carrier tape 20 so that the opening portion of the bag portion 21 of the carrier tape 20 is entirely covered. In addition, as will be described later, the structure obtained by adhering the cover tape 10 to the carrier tape 20 is referred to as an electronic component package 100.

Actually, at the manufacturing site of the electronic device, the package 100 for electronic parts is produced in accordance with the following procedure. First, the electronic component is housed in the pocket portion 21 of the carrier tape 20. Next, the cover tape 10 is adhered to the surface of the carrier tape 20 so as to cover the opening of the pocket portion 21 of the carrier tape 20, whereby the electronic component can be sealed and housed in the package 100. The structure in which the electronic component is housed is wound around a paper or plastic reel in a state in which the package 100 is wound, and transported to a work area for surface mounting of an electronic circuit board or the like. As described above, when the electronic component is transported while the package 100 is wound around the reel, the bottom surface 20a of the carrier tape 20 comes into contact (friction) with the surface 10a of the cover tape 10.

In the present embodiment, the packaging system for electronic components is composed of a component storage tape composed of the carrier tape 20 and the cover tape 10, and the carrier tape 20 is formed by arranging the component storage portions (bag portions 21) accommodating the electronic components at predetermined intervals. The 10 series is provided so as to be coated on the component storage portion of the carrier tape 20. This part storage belt can be wound into a reel shape. Further, the cover tape (cover tape 10) for electronic component packaging of the present embodiment may be in the form of a sheet or a roll which can be wound into a reel shape.

Here, the inventors of the present invention conducted various studies, and as a result, the following findings were found. Specifically, when a structure in which a manufactured electronic component is accommodated is transported using a conventional cover tape, vibration during transportation causes a surface where the carrier tape and the cover tape are adhered, that is, a seal with the cover tape. The surface of the agent layer on the opposite side generates static electricity due to friction. Static electricity caused by friction during transportation sometimes causes problems such as failure of electronic components housed in the package or attachment during mounting of the substrate. Based on such findings, the inventors of the present invention have found that the conventional cover tape has a room for improvement in the countermeasure against static electricity on the surface opposite to the surface of the sealant layer. For example, it is generally considered that reducing the surface resistance 値 is an antistatic countermeasure. However, even if the surface resistance is lowered, there is still frictional charging. Based on such findings, it is considered that suppression of charging according to the working environment can suppress the occurrence of triboelectric charging.

Further intensive research revealed that most of the conventional cover tapes were accompanied by changes in the humidity of the working environment at the manufacturing site of the electronic device, and the surface resistance of the surface of the antistatic layer was greatly changed. Specifically, in the conventional cover tape, the rate of change of the surface resistance 値R ₅₀ and the surface resistance 値R ₃₀ is larger than 2.8 times. Thus, the inventors of the present invention have obtained the following findings: a conventional cover tape in which electric charge generated by static electricity generated by friction is highly likely to move through moisture adhering to the surface of the antistatic layer, and thus attention is paid to characteristics. The factors include humidity changes and finding new design guidelines.

That is, the cover tape of the present embodiment has the surface resistance 値R ₅₀ of the surface of the antistatic layer measured at 23 ° C and 50% RH and the surface of the antistatic layer measured at 23 ° C and 30% RH as described above. The ratio of the surface resistance 値R ₃₀ , that is, R ₅₀ /R ₃₀ , is in accordance with specific conditions. Thus, the static electricity generated by the contact between the bottom surface of the carrier tape and the surface of the cover tape caused by the vibration when the electronic component is transported can be reduced for the electronic components housed in the package body composed of the carrier tape and the cover tape. Therefore, the problem of static electricity generated by the contact between the bottom surface of the carrier tape and the surface of the cover tape due to vibration when the electronic component is transported causes electrostatic breakdown of the electronic component or adhesion during substrate mounting can be suppressed.

In the cover tape of the present embodiment, the lower limit R of R ₅₀ /R _{30 is} , for example, preferably 0.35 or more, more preferably 0.4 or more, still more preferably 0.5 or more. On the other hand, the upper limit of the above R ₅₀ /R _{30 is} , for example, preferably 2.8 or less, more preferably 2.5 or less, still more preferably 2 or less, still more preferably 1.5 or less. Thereby, the antistatic property accompanying the peeling of the carrier tape can be further improved. Further, in the conventional representative cover tape, most of the above R ₅₀ /R ₃₀ is about 0.06. In particular, when the enthalpy of R ₅₀ /R _{30 is not more than} the above upper limit ,, a cover tape excellent in discharge characteristics can be obtained even if static electricity is generated by friction. Moreover, since the change in surface resistance 値 due to a change in humidity is small, it can be a cover tape excellent in preservability. On the other hand, when the above R ₅₀ /R ₃₀ is the above lower limit 値 or more, even if the working environment at the manufacturing site of the electronic device is a dry state with a humidity of about 30 RH%, the cover tape and the electronic component can be rubbed during transportation. The generated static electricity, the static electricity generated when the carrier tape is peeled off from the cover tape, the electrostatic discharge from the adhered dust, the static electricity generated from the contents, and the like are excellent. In the cover tape of the present embodiment, when the R ₅₀ /R ₃₀ is in accordance with a specific condition, that is, the change rate of the surface resistance 値 of the humidity change in the working environment at the manufacturing site of the electronic device is small, and it is considered that the friction is caused by friction. The generated electrostatic charge can move in the material forming the antistatic layer, and therefore, it is possible to suppress the movement of moisture attached to the surface of the antistatic layer like a conventional cover tape.

Further, the present embodiment forms the cover tape, at 23 ℃, 50% RH the surface resistance measured at the surface of the antistatic layers Zhi R ₅₀ deg.] C and at 23 is, the surface resistance of the surface of the 12% RH measurement to obtain an antistatic layer of Zhi The ratio of R ₁₂ , i.e., R ₅₀ /R ₁₂ , is preferably 0.1 or more and 10 or less, more preferably 0.125 or more and 8 or less, and most preferably 0.17 or more and 6 or less. Thereby, it is possible to more closely control the humidity change of the working environment accompanying the manufacturing site of the electronic device, and the surface resistance 値 of the antistatic layer of the cover tape fluctuates, so that the cover tape which is more excellent in antistatic property accompanying the peeling of the carrier tape can be obtained. .

Further, from another point of view, in the present embodiment, the cover tape 10 is a time when the absolute value of the friction band voltage of the surface of the antistatic layer 3 is attenuated from 5 kV to 50 V, that is, the electrostatic voltage decay time, so that 23 The enthalpy measured by ° C and 50% RH is S ₅₀ , and when S ₃₀ is measured at 23 ° C and 30% RH, the enthalpy after S ₅₀ /S ₃₀ is 0.7 or more and 1 or less. Thereby, it is possible to achieve a cover tape which is excellent in antistatic property accompanying the peeling of the carrier tape. Further, as will be described later, "electrostatic voltage decay time S" is a time period in which the absolute value of the friction band voltage of the surface of the antistatic layer 3 is attenuated from 5 kV to 50 V.

In particular, most of the conventional cover tapes vary greatly in the friction band voltage of the surface of the antistatic layer accompanying the humidity change of the working environment at the manufacturing site of the electronic device. Specifically, the conventional cover tape has not reached 0.7 after S ₅₀ /S ₃₀ calculated from the electrostatic voltage decay time S ₅₀ and the electrostatic voltage decay time S ₃₀ described above. Thus, the inventors of the present invention have obtained the following knowledge: the conventional cover tape has a high possibility that the electric charge due to the static electricity generated by the friction moves via the moisture adhered to the surface of the antistatic layer to cause the occurrence of triboelectric charging, focusing on characteristics including humidity. Change and find new design guidelines.

That is, the cover tape of the present embodiment aspect, as described above, at from 23 ℃, 50% RH, measured decay time of the electrostatic voltage at S ₅₀ and 23 ℃, 30% RH was measured static voltage decay time of calculating the ₃₀ S S _{After 50} / S ₃₀ is subject to specific conditions. Thereby, the static electricity generated by the vibration of the electronic component when the bottom surface of the carrier tape comes into contact with the surface of the cover tape can be reduced by the influence of the static electricity contained in the package body composed of the carrier tape and the cover tape. Therefore, it is possible to suppress the problem that static electricity is generated in the electronic component due to the contact between the bottom surface of the carrier tape and the surface of the cover tape due to the vibration when the electronic component is transported, or the substrate is attached during mounting.

In the cover tape of the present embodiment, the lower limit of the S ₅₀ /S _{30 is} , for example, 0.7 or more, preferably 0.8 or more, and more preferably 0.9 or more. On the other hand, the upper limit S of the above S ₅₀ /S ₃₀ is not particularly limited and may be, for example, 1 or less. Thereby, the antistatic property accompanying the peeling of the carrier tape can be further improved. Specifically, when the S ₅₀ /S ₃₀ is in the range of the above-mentioned number, even if the working environment of the manufacturing site of the electronic device is a dry state with a humidity of about 30% RH, the friction between the cover tape and the electronic component can be achieved during transportation. The generated static electricity, the static electricity generated when the carrier tape is peeled off from the cover tape, the electrostatic discharge from the adhered dust, the static electricity generated from the contents, and the like are excellent.

Here, in order to measure the electrostatic voltage decay time S, the friction band voltage of the surface of the antistatic layer to be applied can be measured, for example, by the following method. First, the surface of the antistatic layer of the cover tape is neutralized from the surface of the object which is in contact with the surface of the antistatic layer of the cover tape, for example, a carrier tape. Then, the surface of the antistatic layer of the cover tape is contacted twice in one direction with respect to the surface of the object at a speed of, for example, a speed of about 100 mm/s and a distance of about 50 mm, and the above-mentioned frictional band voltage is measured using a known surface potentiometer. . Further, the friction band voltage of the present embodiment can be obtained by directly measuring the friction band voltage of the surface of the antistatic layer by using a known surface potentiometer, and the obtained result can be obtained by measuring the friction band voltage of the surface of the object. Calculate the result.

Further, in the cover tape of the present embodiment, the electrostatic voltage decay time measured at 23 ° C and 50% RH is S ₅₀ , and the electrostatic voltage decay time measured at 23 ° C and 12% RH is S ₁₂ . The enthalpy of S ₅₀ /S ₁₂ is preferably 0.2 or more and 1 or less, more preferably 0.4 or more and 1 or less, and most preferably 0.5 or more and 1 or less. Thereby, the frictional charge amount of the antistatic layer of the cover tape can be more strictly controlled in accordance with the humidity change of the work environment at the manufacturing site of the electronic device, so that the cover tape which is more excellent in antistatic property accompanying the peeling of the carrier tape can be obtained.

The lower limit 全 of the total light transmittance of the cover tape of the present embodiment is preferably 80% or more, and more preferably 85% or more. Thereby, it is possible to impart a degree of transparency necessary for checking whether or not the electronic component is correctly accommodated in the pocket portion of the carrier tape for the package body composed of the cover tape and the carrier tape. In other words, when the total light transmittance of the base material layer is at least the above lower limit 値, the electronic component housed inside the package can be seen and confirmed from the outside of the package body composed of the cover tape and the carrier tape. Further, the upper limit of the total light transmittance of the cover tape is not particularly limited, and may be, for example, 100% or less. Further, the total light transmittance of the cover tape can be measured in accordance with JIS K7105 (1981).

In the cover tape of the present embodiment, a sheet made of a material made of polystyrene is superposed on the surface of the antistatic layer of the cover tape, and the sheet is rubbed twice at a speed of 100 mm/s at intervals of 50 mm. The friction band voltage was measured at 23 ° C and 50% RH after the second. The friction band voltage of such a cover tape is not particularly limited, and is, for example, preferably -1800 V or more and 1800 V or less, more preferably -1500 V or more and 1500 V or less, more preferably -1000 V or more and 1000 V or less, and more preferably -800 V or more and 800 V or less. Thereby, the influence of static electricity generated by the contact between the bottom surface of the carrier tape and the surface of the cover tape on the electronic components housed in the package body composed of the carrier tape and the cover tape can be further reduced by the vibration when the electronic component is transported. Further, the surface of the antistatic layer of the cover tape is neutralized from the surface of the object which is in contact with the surface of the antistatic layer of the cover tape, for example, a carrier tape. Next, the surface of the antistatic layer of the cover tape was brought into contact with the surface of the object twice in one direction, and the above-mentioned friction band voltage was measured using a known surface potentiometer. Further, the friction band voltage of the present embodiment can be obtained by directly measuring the friction band voltage of the surface of the antistatic layer by a known surface potentiometer, and the result obtained from the friction band voltage of the surface of the object to be measured can also be obtained. Calculate the result.

The width of the cover tape of the present embodiment is not particularly limited, and may be, for example, 2 mm or more and 100 mm or less, preferably 2 mm or more and 80 mm or less, and more preferably 2 mm or more and 50 mm or less.

Hereinafter, the structure of each layer forming the cover tape of the present embodiment will be described in detail.

<Base material layer 1> The material constituting the base material layer can withstand the use of the cover tape when the cover tape is formed on the base material layer and the sealant layer to form a cover tape, and when the cover tape is adhered to the carrier tape. The mechanical strength to the extent of the stress applied from the outside can withstand the heat resistance of the cover tape to the extent of the heat history applied when the carrier tape is adhered. Moreover, the form of the material constituting the base material layer is not particularly limited, and may be a film shape from the viewpoint of easy processing.

Specific examples of the material constituting the base material layer include a polyester resin, a polyamide resin, a polyolefin resin, a polyacrylate resin, a polymethacrylate resin, a polyimide resin, and a poly A carbonate resin, an ABS resin, or the like. Among them, the viewpoint of improving the mechanical strength of the cover tape, the polyester resin is preferable, and the polyethylene terephthalate is more preferable. Further, from the viewpoint of improving the mechanical strength and flexibility of the cover tape, nylon 6 may be used as the material constituting the base material layer. Further, the material constituting the base material layer may contain a sliding material. These materials may be used alone or in combination of two or more.

The base material layer may be formed of a single layer film containing the above materials, or may be formed using a multilayer film in which each layer contains the above materials. Moreover, the form of the film used for forming the base material layer may be an unstretched film, or may be a film extending in a uniaxial direction or a biaxial direction, and the viewpoint of improving the mechanical strength of the cover tape may be used. A film that extends in the axial or biaxial direction.

The thickness of the base material layer may be, for example, 9 μm or more and 25 μm or less, and preferably 9 μm or more and 16 μm or less. When the thickness of the base material layer is less than or equal to the above upper limit ,, the rigidity of the cover tape is not too high, and even if the carrier tape after sealing is subjected to torsional stress, the cover tape may follow the deformation of the carrier tape and the peeling can be suppressed. Further, when the thickness of the base material layer is not less than the above upper limit 値, the mechanical strength of the cover tape can be improved. Therefore, even when the cover tape is peeled off at a high speed from the carrier tape, the cover tape can be prevented from being broken.

The lower limit of the total light transmittance of the substrate layer is, for example, preferably 80% or more, more preferably 85% or more. Thereby, it is possible to impart a degree of transparency necessary for checking whether or not the electronic component is correctly accommodated in the pocket portion of the carrier tape for the package body composed of the cover tape and the carrier tape. In other words, when the total light transmittance of the base material layer is at least the above lower limit 値, the electronic component housed inside the package can be seen and confirmed from the outside of the package body composed of the cover tape and the carrier tape. Further, the upper limit of the total light transmittance of the base material layer is not particularly limited, and may be, for example, 100% or less. Further, the total light transmittance of the substrate layer can be measured in accordance with JIS K7105 (1981).

<Sealant Layer 2> In the cover tape of the present embodiment, the sealant layer is provided on the surface opposite to the surface on which the antistatic layer of the base material layer is provided. The surface of the sealant layer contacts the carrier tape when the cover tape is used as described above. In the present embodiment, by providing a multilayer structure including an antistatic layer, a base material layer, and a sealant layer, it is possible to achieve a balance between adhesion and peelability of the carrier tape, and to achieve an electronic component excellent in antistatic property. Cover tape for packaging.

As the material constituting the sealant layer, for example, a thermoplastic resin such as an acrylic resin or a polyester resin, and an antistatic agent can be used. Specific examples of the antistatic agent may be selected from metal fillers such as tin oxide, zinc oxide, titanium oxide, and smectite, and polyoxyethylene alkylamines, quaternary ammonium salts, and alkyl sulfonates. a surfactant such as a surfactant, a polyoxyethylene alkylamine, a quaternary ammonium, an alkyl sulfonate, a polyether or the like, which is a block type or a random type of a polymer type antistatic agent, an ionic liquid, or a poly a pyrrole, a poly(3,4-ethylidene dioxythiophene polyacetylene, a conductive polymer composed of a polyaniline and a derivative thereof, or a mixture of carbon or a mixture thereof. A filler of various shapes, such as carbon black, white carbon, carbon fiber, or a carbon tube, may be used. One of these may be used or two or more of them may be used in combination.

The material constituting the sealant layer may be selected from the viewpoints of preventing adhesion during transportation, and may be selected from oxide particles mainly composed of barium, magnesium or calcium, inorganic particles such as cerium oxide and talc, and polyethylene. One of the group of organic particles such as particles, polyacrylate particles, and polystyrene particles or a blend of the above.

The thickness of the sealant layer may be, for example, 1 μm or more and 15 μm or less, preferably 1 μm or more and 10 μm or less, and more preferably 1 μm or more and 5 μm or less, from the viewpoint of improving the balance between the adhesiveness and the peeling property of the carrier tape.

The surface resistance 値 of the sealant layer is considered to be, for example, 10 ⁴ Ω or more and 10 ¹¹ Ω or less at 23 ° C and 50 RH% from the viewpoint of discharging static electricity generated for various reasons to the outside with good efficiency. 10 ⁵ Ω or more and 10 ¹⁰ Ω or less, more preferably 10 ⁵ Ω or more and 10 ⁹ Ω or less. The above surface resistance 値 can be measured in accordance with IEC61340.

<Antistatic Layer 3> In the cover tape of the present embodiment, the antistatic layer is provided on the surface opposite to the surface on which the sealant layer of the base material layer is provided. As described above, when the electronic component is housed in a package formed of a carrier tape and a cover tape, the surface of the antistatic layer may contact the bottom surface of the carrier tape.

The following is a description of the material forming the antistatic layer.

The material forming the antistatic layer preferably contains, for example, a material which is formed on the bottom surface of the carrier tape, and is formed in a triboelectric series as compared with a material which forms an object which accommodates the electronic component and is in contact with the surface of the antistatic layer when transported. "Positive compound" on the positive side; and "negative compound" on the negative side of the motor electric sequence compared with the material forming the object. Thereby, it is possible to suppress static electricity accompanying friction when the surface of the antistatic layer contacts the object. Although the detailed mechanism is not known, it is presumed that when the surface of the antistatic layer contacts the object, the positive compound contained in the material forming the antistatic layer is positively charged, and on the other hand, the negative compound is charged to the negative polarity. It can become electrically neutralized in the antistatic layer.

Here, the inventors of the present invention found that the specific material is used as the object in contact with the surface of the antistatic layer, and as a reference, the antistatic friction of the antistatic layer can be stably obtained when the positive compound and the negative compound are used in combination. Sex. Further research revealed that the use of cotton (100% cotton) as a reference can avoid the influence of positive and negative changes in charging due to the friction material, and can safely obtain the combination of the positive compound and the negative compound of the present embodiment. The anti-friction chargeability of the obtained antistatic layer. The method for measuring the positive and negative charge amount is, for example, a method in which the surface of the resin sheet or the surface of the film coated on the resin sheet is rubbed with cotton cloth (cotton 100%), and then measured by a surface potentiometer. In this case, for example, a surface potentiometer such as a Static Sensor 718 manufactured by 3M Company can be used.

The compound of the present embodiment may be a compound which is positively charged with respect to cotton, and examples thereof include a styrene acrylate copolymer, an ester acrylate copolymer, an acrylic resin, a vinyl alcohol, a formaldehyde-modified nylon, and an aziridine compound. A positive binder resin such as an epoxy compound or a carbodiimide compound. These may be used alone or in combination of two or more.

In addition, as a positive compound, for example, a material which forms a bottom surface of a carrier tape or the like which forms an object which accommodates an electronic component and is in contact with the surface of the antistatic layer during transportation, may also contain an aziridine compound because it usually contains polystyrene or the like. And its ring opening compound. The aziridine compound generally refers to a compound having an aziridine group, and specific examples thereof include N,N'-hexamethylene-1,6-bis(1-aziridine carboxamide), N, N'-diphenylmethane-4,4'-bis(1-aziridine carboxamide), trimethylolpropane-tri-β-aziridine propionate, N,N'-toluene -2,4-bis(1-Aziridine carboxamide), triethylene melamine, trimethylolpropane-tri-beta (2-methylaziridine) propionate, bis-m-xylylene carbonate -1-2-methylaziridine, tri-1-aziridine phosphine oxide, cis-1-2-methylaziridine phosphine oxide, and the like. Further, as the aziridine compound, a commercially available product such as Chemitite PZ-33 or DZ-22E manufactured by Nippon Shokubai Co., Ltd. may be used. Further, the ring-opening compound of the aziridine compound means a compound in which the aziridine group in the aziridine compound is in an open state.

The content of the above-mentioned positive compound is preferably 0.2% by weight or more and 98% by weight or less based on the total amount of the material forming the antistatic layer, and more preferably 0.5% by weight or more and 90% by weight or less. Thereby, the physical strength of the coating film is improved, and the sliding of the antistatic agent caused by the contact is more tolerated.

The negative compound of the present embodiment may be a negatively charged resin such as a fluororesin or a polyester compound as long as it is a compound which is negatively charged with respect to cotton. These may be used alone or in combination of two or more.

Further, as a negative compound, a material which forms an object such as a material on the bottom surface of the carrier tape and which accommodates an electronic component and is in contact with the surface of the antistatic layer during transportation often contains polystyrene or the like. Therefore, an ester compound can also be used. The ester compound refers to a compound in which an organic acid or an inorganic acid and an alcohol are bonded and formed by a dehydration reaction, and specific examples thereof include polyethylene terephthalate, polybutylene terephthalate, and polynaphthalene dicarboxylic acid. Ethylene glycol esters, such derivatives, and the like.

The content of the negative compound is preferably 0.2% by weight or more and 98% by weight or less based on the total amount of the material forming the antistatic layer, and more preferably 0.5% by weight or more and 90% by weight or less. Thereby, the physical strength of the coating film is improved, and the sliding of the antistatic agent due to the contact is more tolerated.

Here, as a result of investigation by the inventors of the present invention, it has been found that the anti-friction chargeability of the antistatic layer can be improved by using the above-mentioned positive compound together with a negative compound. Further, in the antistatic layer in which the positive compound and the negative compound are sufficiently dispersed, it is possible to appropriately control the characteristics including the surface resistance 値, the electrostatic voltage decay time, and the like as a factor of humidity change, and excellent anti-friction charging property can be achieved. The detailed mechanism is not known, but it is considered that since the positive compound and the negative compound can neutralize the frictional charge generated by the friction, the characteristic including the humidity change factor can be appropriately controlled.

Further, it is understood that the blending amount of the positive compound and the negative compound can be controlled by the use of the solid components in order to easily control the anti-friction chargeability. Specifically, the lower limit 含量 of the content of the solid component of the negative compound is preferably 50% by weight or more, and preferably 60% by weight or more based on 100% by weight of the total of the solid component of the positive compound and the solid component of the negative compound. More preferably, 70% by weight or more is more preferable. The upper limit of the content of the solid content of the negative compound is not particularly limited. For example, the total solid content of the solid compound and the negative compound may be 99% by weight or less, or may be 95% by weight or less. It can also be 90% by weight or less. Thus, by achieving the balance between the positive compound and the negative compound, the stability of the antistatic layer excellent in anti-friction charging property can be improved.

The upper limit 表面 of the surface resistance 値 of the antistatic layer is preferably at least 10 ¹¹ Ω at 23 ° C and 15 RH%, more preferably 10 ¹⁰ Ω or less, more preferably 10 ⁹ Ω or less, and more preferably 10 ⁷ Ω or less. . Thereby, the antistatic property can be improved. Zhi the lower limit of the surface resistance of the antistatic layer Zhi, at 23 ℃, 15RH% of conditions, is not particularly limited, and may be, for example: more than 10 ³ Ω, preferably less than 10 ⁴ Ω. The above surface resistance 値 can be measured in accordance with IEC61340.

The material for forming the antistatic layer is preferably a conductive polymer in view of reducing the surface resistance of the antistatic layer and suppressing generation of static electricity accompanying friction. Specific examples of the conductive polymer include polyaniline and polypyrrole. Among them, a polyethylene dioxythiophene/polystyrenesulfonic acid (PEDOT/PSS) compound can be preferably used. These may be used alone or in combination of two or more.

The material for forming the antistatic layer preferably contains a surfactant in view of improving the moisture permeability and the flatness of the antistatic layer. The surfactant may be a low molecular type surfactant or a polymer type surfactant, and a surfactant containing a fluoroalkyl structure may be preferably used. These may be used alone or in combination of two or more.

The friction band voltage of the antistatic layer is preferably -1800 V or more and 1800 V or less, more preferably -1500 V or more and 1500 V or less, still more preferably -1000 V or more and 1000 V or less, and more preferably -1000 V or more and 1000 V or less, preferably 23 C or 50% RH. -800V or more and 800V or less, preferably -500V or more and 500V or less. Further, the absolute value of the friction band voltage of the antistatic layer is, for example, preferably 1800 V or less, more preferably 1500 V or less, still more preferably 1000 V or less, and more preferably 800 V or less under the conditions of 23 ° C and 50% RH. The best is below 500V. Thereby, it is possible to suppress a problem that the bottom surface of the carrier tape comes into contact with the surface of the cover tape due to the vibration when the electronic component is transported, and the electronic component is damaged by static electricity or causes a problem in mounting the substrate.

Further, the lower limit of the film thickness of the antistatic layer of the present embodiment is not particularly limited, and may be, for example, 1 nm or more, preferably 10 nm or more, and more preferably 20 nm or more. Thereby, the mechanical strength of the antistatic layer can be improved. Further, the upper limit of the film thickness of the antistatic layer is not particularly limited, and may be, for example, 5 μm or less, preferably 4 μm or less, and more preferably 3 μm or less. Thereby, the flexibility of the entire cover tape in which the antistatic layer is laminated can be improved. Moreover, the bulk density of the volume of the cover tape per unit accommodation space can also be increased.

<Other Layers> The cover tape of the present embodiment may be provided with an intermediate layer (not shown) between the base material layer and the sealant layer. Thereby, the cushioning property of the entire cover tape can be improved, and at the same time, the adhesion between the carrier tapes to be adhered can be improved.

Examples of the material for forming the intermediate layer include an olefin resin, a styrene resin, and a cyclic olefin resin. Among them, an olefin-based resin can also be used from the viewpoint of improving the adhesion to the carrier tape to be adhered. These may be used alone or in combination of two or more.

The thickness of the intermediate layer can be, for example, 10 μm or more and 30 μm or less, and preferably 15 μm or more and 25 μm or less, from the viewpoint of improving the adhesion of the carrier tape to be adhered.

In the cover tape of the present embodiment, an adhesive layer may be provided between the base material layer and the sealant layer or between the base material layer and the antistatic layer. Thereby, the mechanical strength of the cover tape can be improved.

The material forming the above adhesive layer contains a resin. Specific examples of the resin include an urethane-based dry-coating adhesive resin, an adhesive resin for a tackifying coating, and the like. Generally, a polyester composition such as a polyester polyol or a polyether polyol and an isocyanate can be used. Compound combination, polybutadiene, polyimide resin, and the like.

Next, a description will be given of a material for forming an object which is in contact with the surface of the antistatic layer when the electronic component is housed and transported. In the above-mentioned object, the bottom surface of the carrier tape may be exemplified, but it is not limited as long as it is in contact with the surface of the antistatic layer when the electronic component is housed and transported. Further, specific examples of the material for forming the object include a material for forming a carrier tape such as polystyrene, polyethylene terephthalate or polycarbonate, polyethylene, and rubber (processing of natural rubber, synthetic rubber, etc.) And get the material) and so on.

Next, a method of manufacturing the cover tape of the present embodiment will be described. The manufacturing method of the cover tape in this embodiment differs from the conventional manufacturing method, and it is necessary to strictly control the manufacturing conditions mentioned later. That is, the surface resistance 値R ₅₀ of the surface of the antistatic layer measured at 23 ° C and 50% RH can be obtained by 23 ° C, 30% RH using a manufacturing method in which various factors of the following two conditions are strictly controlled. The ratio of the surface resistance 値R ₃₀ of the surface of the antistatic layer measured, that is, the cover tape of R ₅₀ /R _{30 which} meets the above specific conditions. (1) a blending composition of a resin material forming an antistatic layer (2) a combination of a material forming an antistatic layer and a material forming a substrate layer

However, the cover tape in the present embodiment is premised on the strict control of various factors of the above two conditions, and various specific manufacturing conditions such as temperature setting of the manufacturing apparatus can be employed. In other words, the cover tape in the present embodiment can be produced by a known method in addition to various factors for strictly controlling the above two conditions. In the antistatic layer, for example, a positively charged positive compound and a negatively charged negative compound are used in combination, and these are preferably in a state of good dispersion, and the like, including surface resistance enthalpy, etc., The characteristic of the factor is such that R ₅₀ , R ₃₀ and R ₅₀ /R ₃₀ are the elements of the desired range. An example of a method for producing a cover tape on the premise that the various factors of the above two conditions are strictly controlled is listed below. First, a predetermined material is applied to one side of the substrate layer and dried to form an antistatic layer. Then, the sealant layer is laminated by extrusion lamination on the opposite side to the surface of the substrate layer on which the antistatic layer has been formed. In this way, the cover tape of this embodiment can be produced. Further, after the sealant layer is formed into a sheet by an extrusion processing method, the obtained sheet may be laminated on the opposite side to the surface on which the antistatic layer of the base material layer has been formed.

Moreover, the manufacturing method of the cover tape of this embodiment of another viewpoint is demonstrated. The manufacturing method of the cover tape in this embodiment differs from the conventional manufacturing method, and it is necessary to strictly control the manufacturing conditions mentioned later. That is, the absolute enthalpy of the friction band voltage of the surface of the antistatic layer measured at 23 ° C and 50% RH can be obtained by a method of manufacturing various factors that strictly control the following two conditions to attenuate from 5 kV to 50 V. The voltage decay time S ₅₀ , the absolute value of the friction band voltage of the surface of the antistatic layer measured at 23 ° C, 30% RH, is attenuated from 5 kV to 50 V, and the electrostatic voltage decay time S ₃₀ , S ₅₀ /S ₃₀ Cover tape for specific conditions. (1) a blending composition of a resin material forming an antistatic layer (2) a combination of a material forming an antistatic layer and a material forming a substrate layer

However, the cover tape in the present embodiment is premised on various factors for strictly controlling the above two conditions, and various specific manufacturing conditions such as temperature setting of the manufacturing apparatus can be employed. In other words, the cover tape in the present embodiment can be produced by a known method in addition to strictly controlling various factors of the above two conditions. In the above, for example, a positively charged positive compound and a negatively charged negative compound are used in combination, and these are preferably in a state of good dispersion, and the like, as appropriate, includes a characteristic of humidity change as a factor including a static voltage decay time. Let S ₅₀ , S ₃₀ , and S ₅₀ /S ₃₀ be the elements of the desired range. Hereinafter, an example of a manufacturing method of a cover tape on the premise that various factors of the above two conditions are strictly controlled will be described. First, a predetermined material is applied to one side of the substrate layer and dried to form an antistatic layer. Next, the sealant layer was laminated by extrusion lamination on the opposite side to the surface of the base material layer on which the antistatic layer had been formed. In this way, the cover tape of this embodiment can be produced. Further, after the sealant layer is formed into a sheet by an extrusion method, the obtained sheet may be laminated on the opposite side to the surface on which the antistatic layer of the base material layer has been formed.

Further, when the intermediate layer is formed, the intermediate layer may be laminated by extrusion lamination on the surface opposite to the surface on which the antistatic layer of the base material layer has been formed, or may be formed by extrusion processing. After the intermediate layer is formed into a sheet, the obtained sheet is laminated on the opposite side to the surface on which the antistatic layer of the base material layer has been formed.

Further, when the adhesive layer is formed, a material which is applied to the target surface by a conventionally known coating method can be used.

The above description has been made with respect to the embodiments of the present invention, but these descriptions are examples of the present invention, and various configurations other than the above may be employed. [Examples]

Hereinafter, the present invention will be described using examples and comparative examples, but the present invention is not limited to these examples.

[Example A] In each of Example A and Comparative Example A, the respective raw material components used for the production of the antistatic layer and the sealant layer are as follows.

<Antistatic layer> (Antistatic agent) ・Antistatic agent A1: Conductive polymer including a compound of polyethylene dioxythiophene/polystyrenesulfonic acid (PEDOT/PSS) (CLEVIOS P, manufactured by Herarus Co., Ltd.) Antistatic agent A2: Tin dioxide (manufactured by Nikki Catalyst Co., Ltd.) ・Antistatic agent A3: Cationic low molecular surfactant (Elegan 264-30, manufactured by Nippon Oil Co., Ltd.) ・Antistatic agent A4: Cationic polymer interface Active agent (Taisi fine chemical, Akuri 1SX-1090)

(Diluted solvent) ・Diluted solvent A1: Isopropyl alcohol: Water = 1:1 ・Diluted solvent A2: Toluene: Methyl ethyl ketone = 1:1 ・Diluted solvent A3: Isopropanol

(Adhesive resin) ・Positive binder resin A1: carbodiimide (Carbodilite V-02-L2, manufactured by Nisshinbo Chemical Co., Ltd.) ・Positive binder resin A2: Acrylic resin (Aron S-1001, manufactured by Toagosei Co., Ltd.) Negative binder resin A3: Water-soluble polyester resin (Plascoat Z760, manufactured by Mutual Chemical Co., Ltd.) ・Negative binder resin A4: Water-soluble polyester resin (Plascoat Z565, manufactured by Mutual Chemical Co., Ltd.)

(surfactant) ・Interactive surfactant A1: BYK Japan, BYK-3440 ・Interactive surfactant A2: Sannopco, SN Dispersant 9228

<Sealant layer> ・Styrene-methyl (meth) acrylate copolymer (Estiren MS-600, manufactured by Nippon Steel Chemical Co., Ltd., hereinafter also referred to as "St-MMA".) ・Ethylene-methyl acrylate copolymer (Duvalt Mitsui Polychemicals, Elvaloy AC 1820. Hereinafter also referred to as "EMA".) ・Polyether/polyolefin copolymer (Pelestat 212, manufactured by Sanyo Chemical Industries, Ltd.. Hereinafter also referred to as "PEG-PP").

<Manufacture of Cover Tape of Example A> First, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd.: E5102) having a thickness of 16 μm was prepared as a substrate layer. The total light transmittance of the obtained substrate layer was 87.7%.

Then, a material for forming an antistatic layer was prepared in the following manner. Further, the blending composition of each of the reagents is shown in Table 1. The antistatic agent was stirred for 30 seconds while adding a dilution solvent. Then, in order to improve the adhesion of the substrate and the dispersion stability, the binder resin and the surfactant were added, followed by stirring for 30 seconds. In this way, a material which forms a liquid-like antistatic layer is prepared.

Then, the obtained material (liquid form) of the obtained antistatic layer was applied to one side of the base material layer using a bar coater or a gravure coater to have a wet film thickness of 4 μm. It was then dried at 100 ° C to prepare an antistatic layer.

Then, the sealant layer was laminated by extrusion lamination on the opposite side to the surface of the base material layer on which the antistatic layer was formed. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. Further, the thickness of the sealant layer was 5 μm.

The cover tapes of Examples A1 and A2 were produced in the above manner. The width of the obtained cover tape is 8 mm.

<Manufacture of Cover Tape of Comparative Example A> The antistatic layer was prepared in the same manner as in Example A by using a mixed solution of an antistatic agent and a diluent solvent obtained by adding a binder resin and a surfactant as shown in Table 1. Cover tape.

The following evaluations were carried out using each of the cover tapes of Example A and Comparative Example A.

<Evaluation method> ・Surface resistance 表面 of the surface of the antistatic layer: The surface resistance 表面 of the surface of the antistatic layer under the three humidity conditions of 50 RH%, 30 RH%, and 12 RH% at a temperature of 23 ° C was measured in accordance with IEC 61340. Also, the unit is Ω.

・Full light transmittance: The total light transmittance of the cover tape was measured in accordance with JIS K7105 (1981). Also, the unit is %.

- Friction band voltage: The friction band voltage measured at 23 ° C and 50% RH is measured by the method described in the following (1) to (7) with reference to Fig. 3 . Also, the unit is V.

(1) A rubber body 40 having a surface resistance 1.0 of 1.0 × 10 ¹³ Ω or more and having a plate shape is provided on a pedestal 30 with a surface resistance of less than 1.0 × 10 ¹¹ Ω. Then, two insulators 50 are placed on the rubber body 40 at predetermined intervals. Further, the insulator 50 is a quadrangular prism shape having a thickness of 10 mm or more and a surface resistance 値 of 1.0 × 10 ¹³ Ω or more. Then, the polystyrene film 70 (Clearen CST2401, manufactured by Electrochemical Co., Ltd.) having a width of 8 mm was fixed by double-sided tape so as to be in contact with both of the insulators 50. Further, the polystyrene sheet 70 is a friction object which is measured and brought into contact with each cover tape as will be described later. Further, the pedestal 30 with the wheel is always in an earth state.

(2) The polystyrene film 70 was neutralized using an ionizer (BLH-H, manufactured by Kasuga Electric Co., Ltd.).

(3) Moving the pedestal 30 with the wheel, and moving the polystyrene film 70 under the measuring probe 60 equipped with a surface potentiometer (MODEL370, manufactured by TREK Co., Ltd.), and confirming that the polystyrene film 70 has been removed. . Further, the distance between the polystyrene sheet 70 and the measurement probe 60 is set to 1 to 2 mm.

(4) The cover tape 10 is wound around a support 80 having a surface resistance of less than 1.0 × 10 ⁹ Ω and having a rod shape so that the antistatic layer becomes a surface layer. In order to reduce the influence of charging at the time of holding by hand, the support 80 is composed of a conductor made of a film in which carbon is mixed. Further, the cover tape 10 is also removed by the same method as the polystyrene film 70.

(5) The pedestal 30 with the wheel is moved, and the polystyrene film 70 is moved from below the measuring probe 60, and the surface of the polystyrene film 70 is rubbed by the antistatic layer wound around the cover tape 10 of the support 80. At this time, the friction of the cover tape 10 by the antistatic layer is in a state in which the pedestal 30 of the wheel is fixed, and the speed in the longitudinal direction of the polystyrene film 70 is 100 mm/s and 50 mm. Rub the interval 2 times.

(6) The polystyrene film 70 is moved under the measuring probe 60 within 5 seconds after the friction between the antistatic layer of the cover tape 10 and the polystyrene film 70 is started, and the friction band voltage is measured using an ionizer. .

(7) From the friction band voltage of the surface of the obtained polystyrene film 70, the friction band voltage of the surface of the antistatic layer of the cover tape 10 was calculated. Further, both the polystyrene sheet 70 and the cover tape 10 used for the measurement of the friction band voltage were subjected to the above-described electrostatic voltage of 0 V before the friction test. Therefore, when the friction band voltage on the surface of the polystyrene sheet 70 is 100 V, the friction band voltage of the surface of the antistatic layer of the cover tape 10 can be calculated to be 100 V (=0 V - 100 V).

The evaluation results of the above evaluation items are shown in Table 1 below together with the blending composition of the antistatic layer.

【Table 1】

The cover tapes of Examples A1 and A2 were all excellent in the balance between adhesiveness and peelability of the carrier tape, and were excellent in antistatic property accompanying the peeling of the carrier tape. In particular, the cover tapes of Examples A1 and A2 contain both a positive binder resin and a negative binder resin, and an antistatic layer is formed using a material containing a conductive polymer, so frictional charging itself is less likely to occur. On the other hand, the cover tapes of Comparative Examples A1 and A2 had humidity dependency with respect to the antistatic property of the carrier tape peeling, and did not meet the required level. The obtained cover tape was rubbed against a polystyrene carrier tape, and the absolute 値 of the surface electrostatic voltage of the cover tape was measured. As a result, it was found that the anti-friction charging properties of Examples A1 and A2 were good. On the other hand, it is understood that the anti-friction charging properties of Comparative Examples A1 and A2 are not good. Further, after the obtained cover tape is heat-sealed to the carrier tape, it is wound around a seal to obtain a package for electronic components wound in a reel shape.

[Example B] In each of Example B and Comparative Example B, the raw material components used in the production of the antistatic layer and the sealant layer are as follows.

<Antistatic layer> (Antistatic agent) ・Antistatic agent B1: Conductive polymer containing polyethylene dioxythiophene/polystyrenesulfonic acid (PEDOT/PSS) compound (CLEVIOS P, manufactured by Herarus Co., Ltd.) Antistatic agent B2: Tin dioxide (manufactured by Nikki Catalyst Co., Ltd.) ・Antistatic agent B3: Cationic low molecular surfactant (Elegan 264-30, manufactured by Nippon Oil Co., Ltd.) ・Antistatic agent B4: Cationic polymer interface Active agent (Taisi fine chemical, Akuri 1SX-1090)

(Diluted solvent) ・Diluted solvent B1: Isopropyl alcohol: Water = 1:1 ・Diluted solvent B2: Toluene: Methyl ethyl ketone = 1:1 ・Diluted solvent B3: Isopropanol

(Binder resin) ・Binder resin B1: carbodiimide (Carbodilite V-02-L2, manufactured by Nisshinbo Chemical Co., Ltd.) ・Positive binder resin B2: Acrylic resin (Aron S-1001, manufactured by Toagosei Co., Ltd.) Negative binder resin B3: Water-soluble polyester resin (Plascoat Z760, manufactured by Mutual Chemical Co., Ltd.) ・Negative binder resin B4: Water-soluble polyester resin (Plascoat Z565, manufactured by Mutual Chemical Co., Ltd.)

(surfactant) ・Interfacial surfactant B1: BYK Japan, BYK-3440 ・Interactive surfactant B2: Sannopco, SN Dispersant 9228

<Sealant layer> ・Styrene-methyl (meth) acrylate copolymer (Estiren MS-600, manufactured by Nippon Steel Chemical Co., Ltd., hereinafter also referred to as "St-MMA".) ・Ethylene-methyl acrylate copolymer (Duvalt Mitsui Polychemicals, Elvaloy AC 1820. Hereinafter also referred to as "EMA".) ・Polyether/polyolefin copolymer (Pelestat 212, manufactured by Sanyo Chemical Industries, Ltd.. Hereinafter also referred to as "PEG-PP").

<Manufacturing of Cover Tape of Example B> First, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd.: E5102) having a thickness of 16 μm as a base material layer was prepared. The total light transmittance of the obtained substrate layer was 87.7%.

Then, a material for forming an antistatic layer was prepared in the following manner. Further, the blending composition of each of the reagents is shown in Table 2. The antistatic agent was stirred for 30 seconds while adding a dilution solvent. Then, in order to improve the adhesion of the substrate and the dispersion stability, the binder resin and the surfactant were added and stirred for 30 seconds. In this way, a material which forms a liquid-like antistatic layer is prepared.

Then, the obtained material (liquid form) which forms the antistatic layer was applied to one side of the base material layer using a bar coater or a gravure coater to have a wet thickness of 4 μm. Thereafter, it was dried at 100 ° C to prepare an antistatic layer.

Then, the sealant layer is laminated by extrusion lamination on the opposite side to the surface of the base material layer on which the antistatic layer has been formed. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. Further, the thickness of the sealant layer was 5 μm.

According to the above method, the cover tapes of Examples B1 and B2 were produced. The width of the obtained cover tape is 8 mm.

<Manufacturing of Cover Tape of Comparative Example B> As a material for forming the antistatic layer, a mixed solution of an antistatic agent and a diluent solvent obtained without adding a binder resin and a surfactant is used, and Example 1 and 2 The same method is used to make the cover tape.

The following evaluations were carried out using each of the cover tapes of Example B and Comparative Example B.

<Evaluation method> ・Static voltage decay time: The friction band voltage of the surface of the antistatic layer measured by the method described later was measured at a temperature of 23 ° C under three humidity conditions of 50% RH, 30% RH, and 12% RH. The absolute time is from 5kV to 50V. Also, the unit is seconds (s). Furthermore, in Table 1 below, the time from the attenuation of the friction band voltage from +5 kV to +50 V is S+, and the time after the friction band voltage is attenuated from -5 kV to -50 V is S-.

- Friction band voltage: The friction band voltage measured at 23 ° C and 50% RH was measured in the same manner as in the above Example A with reference to Fig. 3 . Also, the unit is V.

・Full light transmittance: The total light transmittance of the cover tape is measured in accordance with JIS K7105 (1981). Also, the unit is %.

The evaluation results of the above evaluation items are shown in Table 2 below together with the blending composition of the antistatic layer.

【Table 2】

The cover tapes of Examples B1 and B2 were excellent in the balance between the adhesiveness and the peelability of the carrier tape, and were excellent in antistatic property accompanying the release of the carrier tape. In particular, the cover tapes of Examples 1B and B2 contain both a positive binder resin and a negative binder resin, and the antistatic layer is formed using a material containing a conductive polymer, so that frictional charging itself is less likely to occur. On the other hand, the cover tapes of Comparative Examples B1 and B2 had humidity dependency with respect to the antistatic property of the carrier tape peeling, and did not meet the required level. The obtained cover tape was rubbed with a polystyrene carrier tape, and the absolute enthalpy of the electrostatic voltage on the surface of the cover tape was measured. As a result, it was found that the anti-friction charging properties were good for Examples B1 and B2. On the other hand, it was found that the anti-friction charging property was poor for Comparative Examples B1 and B2. Further, after the obtained cover tape is heat-sealed to the carrier tape, the package is wound around the package to obtain a package for an electronic component wound in a reel shape.

[Example C] In Example C, each raw material component used in the production of the antistatic layer was as follows.

(Adhesive Resin) ・Compound C1: Acrylate Copolymer Resin (Jurymer FC-80, manufactured by Toagosei Co., Ltd.) ・Negative Compound C1: Water-soluble polyester resin (Plascoat Z565, manufactured by Mutual Chemical Co., Ltd.)

(Antistatic agent) ・Antistatic agent C1: Conductive polymer containing a compound of polyethylene dioxythiophene/polystyrenesulfonic acid (PEDOT/PSS) (Orgacon ICP1010, manufactured by AGFA Materials, Japan)

(Others) ・Diluent C1: Isopropyl alcohol ・Diluent C2: Water ・ Neutralizing agent C1: Triethylamine (manufactured by Wako Pure Chemical Industries, Ltd.: TEA) ・Interfacial surfactant C1: BYK Japan, BYK-3440

<Preparation of Cover Tape of Example C> First, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd.: E5102) having a thickness of 16 μm as a base material layer was prepared. The total light transmittance of the obtained substrate layer was 87.7%.

Then, a material for forming an antistatic layer was prepared in the following manner. Further, the blending composition of the material forming the antistatic layer is shown in Table 3. The neutralizer was added to the antistatic agent while stirring with the solvent for 30 seconds. Then, in order to improve the adhesion of the substrate and the dispersion stability, the binder resin and the surfactant were added and stirred for 30 seconds. In this way, a material which forms a liquid-like antistatic layer is prepared.

Then, the obtained material (liquid form) which forms the antistatic layer was applied to one side of the base material layer using a bar coater or a gravure coater to have a wet thickness of 4 μm. Thereafter, it was dried at 100 ° C to prepare an antistatic layer.

Then, the sealant layer is laminated by extrusion lamination on the opposite side to the surface of the base material layer on which the antistatic layer has been formed. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. Further, the thickness of the sealant layer was 5 μm.

According to the above method, the cover tapes of Examples C1 to C3 were produced. The width of the obtained cover tape is 8mm.

The following evaluations were carried out using each of the cover tapes of Example C.

・Surface resistance 値: The surface resistance of the surface of the antistatic layer was measured under the three humidity conditions of 50 RH%, 30 RH%, and 12 RH% at a temperature of 23 ° C according to IEC 61340. Also, the unit is Ω.

・Full light transmittance: The total light transmittance of the cover tape is measured in accordance with JIS K7105 (1981). Also, the unit is %.

【table 3】

The obtained cover tape was rubbed against a polystyrene carrier tape, and the absolute 値 of the surface electrostatic voltage of the cover tape was measured. As a result, it was found that the anti-friction charging property was good for Examples C1 to C3. Further, the obtained cover tape is heat-sealed to the carrier tape, and then wound around the seal to obtain a package for electronic parts wound in a reel shape. The cover tapes of Examples C1 to C3 are excellent in anti-friction charging property against friction generated during transportation and the like, and excellent in antistatic property accompanying carrier tape peeling.

[Example D] In Example D, each raw material component used for the production of the antistatic layer and the sealant layer is as follows.

<antistatic layer> (adhesive resin) ・Compound compound D1: acrylate copolymer resin (Aracoat CL910, manufactured by Arakawa Chemical Co., Ltd.) ・Negative compound D1: Water-soluble polyester resin (Plascoat Z565, manufactured by Mutual Chemical Co., Ltd.)

(Antistatic agent) ・Antistatic agent D1: Conductive polymer containing a polyethylene dioxythiophene/polystyrenesulfonic acid (PEDOT/PSS) compound (Aracoat ACS332, manufactured by Arakawa Chemical Co., Ltd.)

(Others) ・Diluent D1: Isopropyl alcohol ・Diluent D2: Water ・Interacting agent D1: Aracoat ACS347, manufactured by Arakawa Chemical Co., Ltd.

<Sealant layer> ・Styrene-methyl (meth) acrylate copolymer (Estiren MS-600, manufactured by Nippon Steel Chemical Co., Ltd., hereinafter also referred to as "St-MMA".) ・Ethylene-methyl acrylate copolymer (Duvalt Mitsui Polychemicals, Elvaloy AC 1820. Hereinafter also referred to as "EMA".) ・Polyether/polyolefin copolymer (Pelestat 212, manufactured by Sanyo Chemical Industries, Ltd.. Hereinafter also referred to as "PEG-PP").

<Preparation of Cover Tape for Electronic Component Packaging of Example D> First, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd.: E5102) having a thickness of 25 μm as a base material layer was prepared. The total light transmittance of the obtained substrate layer was 87.7%.

Then, a material for forming an antistatic layer was prepared in the following manner. Further, the blending composition of the material forming the antistatic layer is shown in Table 4. To the antistatic agent, a dilution solvent in which isopropyl alcohol and water were blended at a predetermined ratio was added while stirring for 30 seconds. Then, in order to improve the adhesion of the substrate and the dispersion stability, the binder resin and the surfactant were added and stirred for 30 seconds. In this way, a material for forming an antistatic layer in a liquid state is prepared.

Then, the obtained material (liquid form) which forms the antistatic layer was applied to one side of the base material layer using a bar coater or a gravure coater to have a wet thickness of 4 μm. Thereafter, it was dried at 100 ° C for 1 minute to prepare an antistatic layer.

The sealant layer is laminated by extrusion lamination on the opposite side to the surface of the substrate layer on which the antistatic layer has been formed. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. Further, the thickness of the sealant layer was 5 μm.

The cover tapes for packaging electronic parts of Examples D1 to D4 were produced by the above method. The width of the obtained cover tape is 8mm.

The following evaluations were carried out using each of the cover tapes of Example D.

・Surface resistance 値: The surface resistance 表面 of the surface of the antistatic layer under three humidity conditions of 50 RH%, 30 RH%, and 12 RH% at a temperature of 23 ° C according to IEC 61340 was measured. Also, the unit is Ω.

・Full light transmittance: The total light transmittance of the cover tape is measured in accordance with JIS K7105 (1981). Also, the unit is %.

【Table 4】

The obtained cover tape was rubbed against a polystyrene carrier tape, and the absolute 値 of the surface electrostatic voltage of the cover tape was measured. As a result, it was found that the anti-friction charging property was good for Examples D1 to D4. Further, the obtained cover tape is heat-sealed to the carrier tape, and then wound around the seal to obtain a package for electronic parts wound in a reel shape. The cover tapes of the examples D1 to D4 are excellent in anti-friction charging property against friction generated during transportation and the like, and excellent in antistatic property accompanying the carrier tape peeling regardless of the type of material constituting the carrier tape.

The application is based on Japanese Patent Application No. 2015-046796, filed on March 10, 2015, and the priority of Japanese Patent Application No. 2015-075142, filed on Apr. 1, 2015. Inclusion.

1‧‧‧ substrate layer
2‧‧‧Sealant layer
3‧‧‧Antistatic layer
10‧‧ ‧ cover tape
10a‧‧‧ surface
20‧‧‧ Carrier tape
20a‧‧‧ bottom
21‧‧‧ bag department
30‧‧‧ pedestal
40‧‧‧Rubber body
50‧‧‧Insulator
60‧‧‧ probe
70‧‧‧Polystyrene film
80‧‧‧Support
100‧‧‧Package for electronic parts (package)

The above and other objects, features and advantages of the invention will be apparent from

Fig. 1 is a schematic cross-sectional view showing an example of a cover tape for electronic component packaging of the embodiment. Fig. 2 is a view showing an example of a state in which a cover tape for electronic component packaging of the present embodiment is sealed to a carrier tape. Fig. 3 is a view showing a method of measuring the friction band voltage.

1‧‧‧ substrate layer

2‧‧‧Sealant layer

3‧‧‧Antistatic layer

10‧‧ ‧ cover tape

Claims (17)

A cover tape for packaging electronic parts, comprising: a base material layer; a sealant layer disposed on one side of the base material layer; and an antistatic layer disposed on a side opposite to one of the one side of the base material layer ; order at 23 ℃, 50% RH, measured the surface resistance of the surface of the antistatic layer of the Zhi Zhi of R _50, at 23 ℃, the surface resistance of the antistatic surface layer of 30% RH to obtain measurements of the Zhi Zhi When it is R ₃₀ , the enthalpy of R ₅₀ /R ₃₀ is 0.35 or more and 2.8 or less. The cover tape for electronic component packaging according to claim 1, wherein the surface resistance of the surface of the antistatic layer measured at 23 ° C and 50% RH is R ₅₀ at 23 ° C, 12%. When the surface resistance 値 of the surface of the antistatic layer measured by RH is R ₁₂ , the enthalpy of R ₅₀ /R ₁₂ is 0.1 or more and 10 or less. A cover tape for packaging electronic parts, comprising: a base material layer; a sealant layer disposed on one side of the base material layer; and an antistatic layer disposed on a side opposite to one of the one side of the base material layer The absolute voltage of the friction band voltage on the surface of the antistatic layer is attenuated from 5kV to 50V, so that the decay time of the electrostatic voltage measured at 23°C and 50% RH is S ₅₀ , at 23 When the electrostatic voltage decay time measured by °C and 30% RH is S ₃₀ , the value of S ₅₀ /S ₃₀ is 0.7 or more and 1 or less. For example, the cover tape for electronic component packaging according to Item 3 of the patent application, wherein the static voltage decay time measured at 23 ° C and 50% RH is S ₅₀ , which is measured at 23 ° C and 12% RH. When the electrostatic voltage decay time 値 is S ₁₂ , the sum of S ₅₀ /S ₁₂ is 0.2 or more and 1 or less. The cover tape for electronic component packaging according to claim 1 or 3, wherein the cover tape for the electronic component package has a total light transmittance of 80% or more. The cover tape for electronic component packaging according to claim 1 or 3, wherein a surface of the antistatic layer of the cover tape for the electronic component is overlapped with a sheet formed of a material composed of polystyrene, and the The sheet was rubbed twice for 5 seconds at a speed of 100 mm/s and 50 mm, and the friction band voltage measured at 23 ° C and 50% RH was -1800 V or more and 1800 V or less. The cover tape for electronic component packaging according to claim 1 or 3, wherein the antistatic layer contains an ester compound. The cover tape for electronic component packaging according to claim 1 or 3, wherein the antistatic layer contains a positively charged positive compound and a negatively charged negative compound. The cover tape for electronic component packaging according to claim 8, wherein the content of the solid component of the negative compound is 100% by weight based on the total of the solid component of the positive compound and the solid component of the negative compound. 50% by weight or more. The cover tape for electronic component packaging according to claim 1 or 3, wherein the antistatic layer contains a conductive polymer. The cover tape for electronic component packaging according to claim 1 or 3, wherein the antistatic layer contains a surfactant. The cover tape for electronic component packaging according to claim 1 or 3, wherein the antistatic layer has a film thickness of 1 μm or more and 20 μm or less. The scope of the patent application or electronic component 3 of the first cover tape for packaging, wherein the surface resistance of the encapsulant layers Zhi at 23 ℃, 50RH% of conditions, less than 10 ⁵ Ω 10 ¹¹ Ω or less. The cover tape for electronic component packaging according to claim 1 or 3, wherein the sealant layer has a film thickness of 1 μm or more and 15 μm or less. The cover tape for electronic component packaging according to claim 1 or 3, wherein the base material layer has a total light transmittance of 80% or more. The cover tape for electronic component packaging according to claim 1 or 3, wherein the cover tape for the electronic component packaging has a width of 2 mm or more and 100 mm or less. A package for an electronic component, comprising a component storage tape comprising a carrier tape and a cover tape, wherein the carrier tape is formed by arranging component storage portions for accommodating electronic components at predetermined intervals; and the cover tape is formed by coating on the cover tape The component storage unit is provided in a manner of carrying the component storage unit; the component storage tape is wound into a reel shape, and the cover tape is a cover tape for electronic component packaging according to any one of claims 1 to 16.