TWI663109B - Cover tape for electronic component packaging and package for electronic component - Google Patents

Abstract

The cover tape for packaging electronic parts of the present invention includes: a base material layer; a sealant layer provided on one side of the base material layer; and an antistatic layer provided on the side opposite to the one side of the base material layer The surface resistance ₅₀ of the surface of the aforementioned antistatic layer measured at 23 ° C and 50% RH is R ₅₀ , and the surface resistance of the surface of the aforementioned antistatic layer measured at 23 ° C and 30% RH is R ₅₀ When 値 is R ₃₀ , the 値 of R ₅₀ / R ₃₀ is 0.35 or more and 2.8 or less.

Description

Cover tape for electronic parts packaging and packaging body for electronic parts

The present invention relates to a cover tape for packaging electronic parts and a packaging body for electronic parts.

In the past, electronic components such as transistors, diodes, capacitors, and piezo-electric device registers were stored at the manufacturing site of electronic equipment in a carrier tape formed by continuously forming a pocket portion capable of accommodating the electronic component and sealed in The packaging body composed of the cover tape of the carrier tape is heat-sealed, and is then wound around a paper or plastic reel, and is transported to a work area for surface mounting of electronic circuit boards and the like. Then, after the cover tape of the packaging body is peeled off in the work area, the electronic component is taken out of the bag portion formed on the carrier tape, and is surface-mounted on an electronic circuit board or the like. With respect to the above-mentioned electronic components, with the miniaturization of electronic devices in recent years, further miniaturization and high mounting are required. Therefore, in recent years, electronic parts tend to be more easily affected by static electricity.

For example, Patent Document 1 discloses a cover tape that includes a sealant layer on a base material layer in order to suppress static electricity generated when peeled from a carrier tape, and the sealant layer contains a polyolefin-based resin and a polyether / polyolefin copolymer.

Patent Document 2 discloses a cover tape, in order to suppress static electricity and the like caused by friction between the cover tape and electronic parts, and control the surface resistance 値 of the sealant layer to meet specific conditions. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2012-214252 [Patent Document 2] Japanese Patent Application Publication No. 2012-30897

[Problems to be Solved by the Invention] However, in recent years, the technical level for the viewpoint of static electricity countermeasures of cover tapes has been increasing. The present inventors conducted various investigations on the conventional cover tape, and as a result, found the following problems. When the packaging body containing the electronic components is transported in a state of being wound on a reel, the surface of the carrier tape and the cover tape adhered due to vibration during transportation, that is, opposite to the surface of the sealant layer of the cover tape The surface on the side generates static electricity due to friction. Because of such static electricity, sometimes the electronic parts contained in the package may fail, or problems such as sticking during board mounting may occur. Based on such knowledge and knowledge, the inventors of the present invention have found that there is room for improvement in the countermeasure against static electricity on the surface on the opposite side of the surface of the sealant layer with respect to the conventional cover tape.

The present invention provides a cover tape for packaging electronic parts with excellent anti-friction charging properties. [Methods for solving problems]

The inventors of the present case have worked hard to achieve the above-mentioned problems, and as a result, they have found that an electronic component includes a base material layer, a sealant layer provided on one side of the base material layer, and an antistatic layer provided on the other side of the base material layer. In the cover tape for packaging, the ratio of the surface resistance 値 of the surface of the antistatic layer measured at 23 ° C and 50% RH to the surface resistance 値 of the surface of the antistatic layer measured at 23 ° C and 30% RH As a design guide for improving the antistatic property accompanying the peeling of the carrier tape, it is effective to complete the present invention.

According to the present invention, there is provided a cover tape for packaging electronic parts, comprising: a base material layer; a sealant layer provided on one side of the base material layer; and a side provided on the opposite side to the one side of the base material layer Surface antistatic layer; Let the surface resistance of the surface of the aforementioned antistatic layer measured at 23 ° C and 50% RH be R ₅₀ , and the surface of the aforementioned antistatic layer measured at 23 ° C and 30% RH When the surface resistance 値 is R ₃₀ , the R ₅₀ / R ₃₀ is 0.35 or more and 2.8 or less.

The inventor of the present case considered other viewpoints and worked hard in order to achieve the above-mentioned subject. As a result, it was found that the substrate has a base material layer, a sealant layer provided on one side of the base material layer, and an antistatic layer provided on the other side of the base material layer. In the cover tape for packaging of electronic parts, the absolute value of the frictional band voltage on the surface of the antistatic layer measured under different humidity conditions is a measure of the rate of change of the time from 5kV to 50V (static voltage decay time) as a measure of The design guidelines for improving the antistatic property accompanying the peeling of the carrier tape are effective, and the present invention has been completed.

According to the present invention, there is provided a cover tape for packaging electronic parts, comprising: a base material layer; a sealant layer provided on one side of the base material layer; and a side provided on the opposite side to the one side of the base material layer The anti-static layer on the surface; The absolute voltage of the frictional voltage of the surface of the aforementioned anti-static layer decays from 5 kV to 50 V, and the time of the aforementioned electrostatic voltage decay measured at 23 ° C and 50% RH is S ₅₀ , when the 値 of the aforementioned electrostatic voltage decay time measured at 23 ° C. and 30% RH is S ₃₀ , the 値 of S ₅₀ / S ₃₀ is 0.7 or more and 1 or less. In addition, according to the present invention, there is provided a packaging body for electronic parts, which is composed of a component storage tape composed of a carrier tape and a cover tape, and the carrier tape is formed by arranging parts storage sections for storing electronic parts at predetermined intervals; the cover tape It is provided so as to cover and form the component storage portion of the carrier tape; the component storage tape can be wound into a reel shape, and the cover tape is the cover tape for electronic component packaging. [Effect of Invention]

According to the present invention, a cover tape for packaging electronic parts having excellent anti-friction charging properties can be provided.

FIG. 1 is a schematic cross-sectional view showing an example of a cover tape for packaging electronic parts according to this embodiment. As shown in FIG. 1, a cover tape 10 (hereinafter also referred to as a “cover tape”) for packaging electronic parts according to this embodiment includes: a base material layer 1; a sealant layer 2 provided on one side of the base material layer 1; and The antistatic layer 3 is provided on a surface opposite to the aforementioned surface of the base material layer 1. In addition, with this cover tape 10, the surface resistance of the surface of the antistatic layer 3 measured at 23 ° C and 50% RH is R ₅₀ , and the surface of the antistatic layer 3 measured at 23 ° C and 30% RH When the surface resistance 値 is R ₃₀ , the R ₅₀ / R ₃₀ is 0.35 or more and 2.8 or less. Thereby, a cover tape excellent in antistatic property accompanying peeling of the carrier tape can be achieved. The surface resistance 値 can be measured in accordance with IEC61340.

FIG. 2 is a diagram showing an example of a state in which a cover tape for packaging electronic parts according to this embodiment is sealed to a carrier tape. First, a method of using the cover tape will be described with reference to FIG. 2. As shown in FIG. 2, the cover tape 10 is used as a cover material of the carrier tape 20, and the carrier tape 20 is formed by continuously setting the concave bag portion 21 in accordance with the shape of the electronic component. Specifically, the cover tape 10 is used by being adhered (for example, heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening portion of the bag portion 21 of the carrier tape 20. The structure obtained by adhering the cover tape 10 and the carrier tape 20 to each other will be referred to as a packaging body 100 for electronic components and described later.

Actually, at the manufacturing site of the electronic equipment, the packaging body 100 for electronic parts is manufactured according to the following procedure. First, electronic components are contained in the bag portion 21 of the carrier tape 20. Secondly, the cover tape 10 is adhered to the surface of the carrier tape 20 in such a manner as to cover the entire opening of the bag portion 21 of the carrier tape 20, thereby obtaining a structure in which electronic components are hermetically contained in the packaging body 100. The structure formed by accommodating the electronic parts is transported to a work area for surface mounting of an electronic circuit board or the like in a state where the package 100 is wound on a paper or plastic reel. As described above, when the electronic component is transported while the package 100 is wound on a reel, the bottom surface 20 a of the carrier tape 20 and the surface 10 a of the cover tape 10 are brought into contact (friction).

In this embodiment, the packaging system for electronic parts is composed of a component storage tape composed of a carrier tape 20 and a cover tape 10. The carrier tape 20 is formed by arranging the component storage sections (bag sections 21) for storing electronic components at predetermined intervals. The cover tape Reference numeral 10 is provided so as to cover and form the component storage portion of the carrier tape 20. This part storage tape can be wound into a reel shape. In addition, the cover tape (cover tape 10) for packaging electronic parts of this embodiment may be a sheet shape or a roll shape which can be wound into a reel shape.

Here, the inventors of the present case conducted various studies and found the following. Specifically, when a conventional cover tape is used to transport a structure containing the manufactured electronic parts, the vibration during transportation may cause the surface to which the carrier tape and the cover tape are adhered, that is, the seal with the cover tape. The surface of the agent layer is the surface on the opposite side which generates static electricity due to friction. Static electricity caused by friction during transportation may cause problems such as failure of electronic components contained in the package body, or sticking during board mounting. Based on such findings, the inventors of the present invention have found that the conventional cover tape has room for improvement in electrostatic countermeasures on the surface on the opposite side from the surface of the sealant layer. For example, reducing the surface resistance 降低 is generally considered as an antistatic measure. However, even if the surface resistance 降低 is reduced, triboelectric charging may still occur. Based on such findings, it is considered that suppression of electrification depending on the working environment can suppress occurrence of frictional electrification.

After further in-depth research, it was found that most of the previous cover tapes would accompany the humidity change of the operating environment at the manufacturing site of the electronic equipment, and the surface resistance of the surface of the antistatic layer may vary greatly. Specifically, in the conventional cover tape, the rate of change of the surface resistance 値 R ₅₀ and the surface resistance 値 R ₃₀ is a ratio greater than 2.8 times. Therefore, the inventor of the present case has obtained the following insight: The conventional cover tape has a high possibility that the charges generated by the static electricity generated by friction will move through the moisture adhered to the surface of the antistatic layer, and thus focus on the characteristics Factors include humidity changes to find new design guidelines.

That is, as described above, the surface resistance of the surface of the antistatic layer 値 R ₅₀ measured at 23 ° C and 50% RH and the surface of the antistatic layer measured at 23 ° C and 30% RH as described above. The ratio of the surface resistance 値 R ₃₀ , which is the ratio of R ₅₀ / R ₃₀ , meets certain conditions. In this way, the static electricity generated due to the contact between the bottom surface of the carrier tape and the surface of the cover tape caused by the vibration when the electronic parts are transported can reduce the influence on the electronic parts contained in the packaging body composed of the carrier tape and the cover tape. Therefore, problems such as electrostatic damage to electronic parts caused by the static electricity caused by the contact between the bottom surface of the carrier tape and the surface of the cover tape caused by vibration during the transportation of electronic parts can be suppressed.

In the cover tape of this embodiment, the lower limit of the aforementioned R ₅₀ / R _{30 is} , for example, preferably 0.35 or more, more preferably 0.4 or more, and even more preferably 0.5 or more. On the other hand, the upper limit R of R ₅₀ / R _{30 is} , for example, preferably 2.8 or less, more preferably 2.5 or less, still more preferably 2 or less, and still more preferably 1.5 or less. Thereby, the antistatic property accompanying the peeling of the carrier tape can be further improved. In addition, most of the conventional representative cover tapes mentioned above have a ratio of R ₅₀ / R ₃₀ of about 0.06. In particular, when the 値 of R ₅₀ / R ₃₀ is equal to or smaller than the upper limit 値, a cover tape having excellent discharge characteristics can be achieved even if static electricity is generated by friction. In addition, the change in surface resistance due to changes in humidity is small, and it can be used as a cover tape with excellent storage stability. On the other hand, when the 値 of R ₅₀ / R ₃₀ is above the lower limit 値, even if the operating environment of the manufacturing site of the electronic equipment is in a dry state with a humidity of about 30 RH%, it can still be caused by friction between the cover tape and electronic parts during transportation A cover tape having excellent discharge characteristics, such as static electricity generated, static electricity generated when a cover tape is peeled from a carrier tape, static electricity generated from attached dust, and the contents. As in the cover tape of this embodiment, when the above-mentioned R ₅₀ / R ₃₀ meets certain conditions, that is, the rate of change of the surface resistance 伴随 accompanying the change in humidity of the operating environment at the manufacturing site of the electronic device is small, it is considered that it is caused by friction The generated electrostatic charges can move in the material forming the antistatic layer. Therefore, the conventional electrostatic tape can be prevented from moving through the moisture attached to the surface of the antistatic layer.

In addition, for the cover tape of this embodiment, the surface resistance of the surface of the antistatic layer measured at 23 ° C and 50% RH R ₅₀ and the surface resistance of the surface of the antistatic layer measured at 23 ° C and 12% RH The ratio of R ₁₂ , that is, the ratio of R ₅₀ / R ₁₂ , is preferably 0.1 or more and 10 or less, more preferably 0.125 or more and 8 or less, and most preferably 0.17 or more and 6 or less. As a result, it is possible to more closely control the humidity change accompanying the operating environment at the manufacturing site of the electronic device, which changes the surface resistance of the antistatic layer of the cover tape, so that it can become a cover tape with better antistatic properties accompanying the peeling of the carrier tape. .

Also, from another point of view, in this embodiment, the cover tape 10 is a time for the absolute value of the frictional band voltage on the surface of the antistatic layer 3 to decay from 5kV to 50V, that is, the electrostatic voltage decay time, which is 23 The 値 measured at ℃ and 50% RH is S _{50. When} the 値 measured at 23 ℃ and 30% RH is S ₃₀ , the _{50 of} S ₅₀ / S ₃₀ becomes 0.7 or more and 1 or less. Thereby, a cover tape excellent in antistatic property accompanying the peeling of the carrier tape can be achieved. In addition, as will be described later, the "static voltage decay time S" refers to the time during which the absolute value of the frictional band voltage on the surface of the antistatic layer 3 decays from 5 kV to 50 V, and is described.

In particular, most of the conventional cover tapes greatly change the frictional band voltage on the surface of the antistatic layer with the humidity change of the operating environment at the manufacturing site of the electronic device. Specifically, in the conventional cover tape, the sum of S ₅₀ / S ₃₀ calculated from the electrostatic voltage decay time S ₅₀ and the electrostatic voltage decay time S _{30 is} less than 0.7. As a result, the inventors of the present case have obtained the following knowledge: The conventional cover tape is highly likely to cause frictional charging due to the movement of the static electricity generated by friction due to the charge attached to the surface of the antistatic layer, focusing on characteristics including humidity Change and find new design guidelines.

That is, the cover tape of the present embodiment aspect, as described above, at from 23 ℃, 50% RH, measured decay time of the electrostatic voltage at S ₅₀ and 23 ℃, 30% RH was measured static voltage decay time of calculating the ₃₀ S S ₅₀ / S ₃₀ of which meets certain conditions. Therefore, the static electricity generated due to the contact between the bottom surface of the carrier tape and the surface of the cover tape due to the vibration when the electronic parts are transported can reduce the influence on the electronic parts contained in the packaging body composed of the carrier tape and the cover tape. Therefore, it is possible to suppress such problems as electrostatic damage to electronic parts caused by the contact between the bottom surface of the carrier tape and the surface of the cover tape caused by vibration during the transportation of electronic parts, or problems such as sticking during board mounting.

In the cover tape of this embodiment, the lower limit of the above S ₅₀ / S _{30 is} , for example, 0.7 or more, preferably 0.8 or more, and more preferably 0.9 or more. On the other hand, the upper limit 値 of S ₅₀ / S ₃₀ is not particularly limited, and may be, for example, 1 or less. Thereby, the antistatic property accompanying the peeling of the carrier tape can be further improved. Specifically, when the range of S ₅₀ / S ₃₀ meets the above range, even if the operating environment of the manufacturing site of the electronic equipment is a dry state with a humidity of about 30% RH, it can be achieved during transportation due to the friction between the cover tape and the electronic parts. A cover tape having excellent discharge characteristics, such as static electricity generated, static electricity generated when a cover tape is peeled from a carrier tape, static electricity generated from attached dust, and the contents.

Here, in order to measure the electrostatic voltage decay time S, the frictional band voltage on the surface of the antistatic layer to be implemented can be measured according to the following method, for example. First, the surface of the antistatic layer of the cover tape is brought into contact with, for example, a carrier tape and the surface of the object which is in contact with the surface of the antistatic layer of the cover tape, and the static electricity is removed. Then, the surface of the antistatic layer of the cover tape is brought into contact with the surface of the object at a speed of about 100 mm / s and a distance of about 50 mm twice in one direction, and the above-mentioned friction band voltage is measured using a known surface potentiometer. . The friction band voltage of this embodiment can be obtained by directly measuring the friction band voltage on the surface of the antistatic layer using a known surface potentiometer, or it can be obtained by measuring the friction band voltage on the surface of the object. Calculated result.

Further, aspect of this embodiment the cover tape, so that at 23 ℃, 50% RH, measured the static voltage decay Zhi of time S _50, at 23 ℃, 12% RH, measured the static voltage decay Zhi of time is ₁₂ S The ratio of S ₅₀ / S ₁₂ is preferably 0.2 or more and 1 or less, more preferably 0.4 or more and 1 or less, and most preferably 0.5 or more and 1 or less. As a result, the frictional charge amount of the antistatic layer of the cover tape can be more strictly controlled due to changes in the humidity of the operating environment at the manufacturing site of the electronic device, so it can be a cover tape with better antistatic properties accompanying the peeling of the carrier tape.

The lower limit of the total light transmittance of the cover tape of this embodiment is preferably 80% or more, and more preferably 85% or more. Thereby, the packaging body consisting of a cover tape and a carrier tape can be provided with the necessary degree of transparency which can check whether an electronic component is correctly accommodated in the bag part of the said carrier tape. In other words, if the total light transmittance of the base material layer is equal to or more than the above-mentioned lower limit, the electronic components contained in the package body can be seen and confirmed from the outside of the package body composed of the cover tape and the carrier tape. The upper limit 全 of the total light transmittance of the cover tape is not particularly limited, and may be, for example, 100% or less. The total light transmittance of the cover tape can be measured in accordance with JIS K7105 (1981).

The cover tape of this embodiment is a sheet made of a material made of polystyrene superimposed on the surface of the antistatic layer of the cover tape. The above-mentioned sheet is rubbed twice at a speed of 100 mm / s at 50 mm intervals. After three seconds, the frictional band voltage was measured under the conditions of 23 ° C and 50% RH. The frictional band voltage of such a cover tape is not particularly limited. For example, it is preferably -1800V or more and 1800V or less, more preferably -1500V or more and 1500V or less, more preferably -1000V or more and 1000V or less, and preferably -800V or more and 800V or less. Thereby, the influence of the static electricity generated by the contact between the bottom surface of the carrier tape and the surface of the cover tape due to the vibration when the electronic parts are transported on the electronic components contained in the packaging body composed of the carrier tape and the cover tape can be reduced. In addition, the surface of the antistatic layer of the cover tape is electrostatically removed from the surface of an object that is in contact with the surface of the antistatic layer of the cover tape, such as a carrier tape. Next, the surface of the antistatic layer of the cover tape was brought into contact with the surface of the object twice in one direction, and the above-mentioned friction band voltage was measured using a known surface potentiometer. In addition, the friction band voltage of this embodiment may be a result obtained by directly measuring the friction band voltage on the surface of the antistatic layer using a known surface potentiometer, or a result obtained by measuring the friction band voltage on the surface of the object. Calculated result.

The width of the cover tape of this embodiment is not particularly limited, and may be, for example, 2 mm or more and 100 mm or less, preferably 2 mm or more and 80 mm or less, and more preferably 2 mm or more and 50 mm or less.

The structure of each layer forming the cover tape of this embodiment will be described in detail below.

<Base material layer 1> As long as the material constituting the base material layer is an antistatic layer or a sealant layer for the base material layer, when the cover tape is produced, and when the cover tape is adhered to the carrier tape, it has a resistance to the use of the cover tape. The mechanical strength of the degree of the stress applied from the outside may be sufficient to withstand the heat resistance to the extent that the cover tape attaches to the heat history applied when the carrier tape is adhered. In addition, the form of the material constituting the base material layer is not particularly limited, and in view of the ease of processing, it may be a thin film.

Specific examples of the material constituting the base material layer include, for example, polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, and polyimide resins. Carbonate resin, ABS resin, etc. Among them, from the viewpoint of improving the mechanical strength of the cover tape, a polyester resin is preferable, and polyethylene terephthalate is more preferable. From the viewpoint of improving the mechanical strength and flexibility of the cover tape, nylon 6 may be used as a material constituting the base material layer. The material constituting the base material layer may contain a sliding material. These materials can be used alone or in combination of two or more.

The base material layer may be formed of a single-layer film containing the above-mentioned material, or may be formed using a multilayer film of each layer containing the above-mentioned material. The form of the film used to form the substrate layer may be an unstretched film or a film extending in a uniaxial direction or a biaxial direction. Considering the viewpoint of improving the mechanical strength of the cover tape, it is also possible to use Film extending in axial or biaxial direction.

The thickness of the substrate layer may be, for example, 9 μm or more and 25 μm or less, and preferably 9 μm or more and 16 μm or less. When the thickness of the base material layer is less than the above upper limit 値, the rigidity of the cover tape will not be too high. Even if the carrier tape after sealing is subjected to torsional stress, the cover tape will still follow the deformation of the carrier tape and can suppress peeling. In addition, when the thickness of the base material layer is at least the above upper limit ，, the mechanical strength of the cover tape can be good. Therefore, even when the cover tape is peeled from the carrier tape at a high speed, the cover tape can be suppressed from being broken.

The lower limit of the total light transmittance of the base material layer is preferably 80% or more, more preferably 85% or more. Thereby, the packaging body consisting of a cover tape and a carrier tape can be provided with the necessary degree of transparency which can check whether an electronic component is correctly accommodated in the bag part of the said carrier tape. In other words, if the total light transmittance of the base material layer is equal to or more than the above-mentioned lower limit, the electronic components contained in the package body can be seen and confirmed from the outside of the package body composed of the cover tape and the carrier tape. The upper limit 値 of the total light transmittance of the base material layer is not particularly limited, and may be, for example, 100% or less. The total light transmittance of the base material layer can be measured in accordance with JIS K7105 (1981).

<Sealant Layer 2> In the cover tape of this embodiment, the sealant layer is a layer provided on a surface opposite to the surface on which the antistatic layer of the base material layer is provided. The surface of the sealant layer contacts the carrier tape when the cover tape is used in the above method. In this embodiment, a multilayer structure including an antistatic layer, a base material layer, and a sealant layer can achieve a balance between the adhesiveness and peelability of the carrier tape, and can achieve electronic components with excellent antistatic properties. Cover tape for packaging.

As a material constituting the sealant layer, for example, a thermoplastic resin such as an acrylic resin, a polyester resin, or an antistatic agent can be used. Specific examples of the antistatic agent include materials selected from metal fillers such as tin oxide, zinc oxide, titanium oxide, and smectite, polyoxyethylene alkylamines, quaternary ammonium, and alkyl sulfonate. ) And other structured surfactants, polyoxyethylene alkylamines, quaternary ammonium, alkyl sulfonates, polyethers, etc., polymer-type antistatic agents, ionic liquids, polyethers that are incorporated in blocks or randomly Pyrrole, poly (3,4-ethylenedioxythiophene polyacetylene, polyaniline and its derivatives, conductive polymers, carbon, or one of the groups of carbon. Also, the above carbon Fillers of various shapes made of carbon, such as carbon black, white carbon, carbon fiber, and carbon tube, can be used. One of these can be used or two or more of them can be used in combination.

The material constituting the sealant layer may be selected from the group consisting of oxide particles containing silicon, magnesium, or calcium as the main component, inorganic particles such as silicon dioxide, and talc, and polyethylene, considering the viewpoint of preventing blocking during transportation. One or a mixture of organic particles such as particles, polyacrylate particles, and polystyrene particles.

The thickness of the sealant layer may be, for example, 1 μm or more and 15 μm or less, preferably 1 μm or more and 10 μm or less, and more preferably 1 μm or more and 5 μm or less from the viewpoint of improving the balance between the adhesiveness and the peelability of the carrier tape.

The surface resistance of the sealant layer is 値. Considering that the static electricity generated due to various reasons can be discharged to the outside with good efficiency, the conditions at 23 ° C and 50RH% may be, for example, 10 ⁴ Ω or more and 10 ¹¹ Ω or less, preferably 10 ⁵ Ω or more and 10 ¹⁰ Ω or less, more preferably 10 ⁵ Ω or more and 10 ⁹ Ω or less. The surface resistance 値 can be measured in accordance with IEC61340.

<Antistatic layer 3> In the cover tape of this embodiment, the antistatic layer is a layer provided on the side opposite to the surface of the base material layer on which the sealant layer is provided. As described above, the surface of the antistatic layer may come into contact with the bottom surface of the carrier tape when the electronic components are stored in a packaging body composed of a carrier tape and a cover tape.

The materials for forming the antistatic layer are described below.

The material forming the antistatic layer should preferably contain, for example, a material that forms an object that is in contact with the surface of the antistatic layer when the electronic component is contained and is transported when it is formed on the bottom surface of the carrier tape. The "positive compound" on the positive side; and the "negative compound" on the negative side of the galvanic electric sequence compared to the material forming the above object. This makes it possible to suppress generation of static electricity accompanied by friction when the surface of the antistatic layer contacts the object. Although the detailed mechanism is unknown, it is presumed that when the surface of the antistatic layer contacts the object, the positive compound contained in the material forming the antistatic layer is charged with positive polarity, and the negative compound is charged with negative polarity, so Can become electrically neutralized in the antistatic layer.

Here, the inventors of this case have found after researching that: using a specific material as an object in contact with the surface of the antistatic layer and using it as a reference, the antistatic frictional charge of the antistatic layer can be obtained stably when using a positive compound and a negative compound together Sex. After further research, it was found that by using cotton (100% cotton) as a reference, the influence of the positive and negative changes in the charge due to the friction material can be avoided, and the combination of positive and negative compounds in this embodiment can be obtained in a stable manner. The anti-friction charging property of the obtained anti-static layer. The method of measuring the positive and negative charge amounts is, for example, a method of measuring with a surface potentiometer after rubbing the surface of a resin sheet with cotton cloth (100% cotton) or the surface of a film coated with a resin sheet. In this case, a surface potentiometer such as StaticStatSensor 718 manufactured by 3M can be used.

The positive compound in this embodiment may be a compound that is positively charged with respect to cotton cloth, for example, styrene acrylate copolymer, ester acrylic copolymer, acrylic resin, vinyl alcohol, formaldehyde-modified nylon, and aziridinyl compound. , Epoxy compounds, carbodiimide compounds and other positive binder resins. These may be used singly or in combination of two or more.

In addition, as the positive compound, for example, the material forming the bottom surface of the carrier tape, and the material forming the object that contacts the surface of the antistatic layer when the electronic component is housed and is transported, the aziridinyl compound can also be used because it often contains polystyrene. And its ring-opening compounds. An aziridinyl compound generally refers to a compound having an aziridinyl group, and specific examples thereof include N, N'-hexamethylene-1,6-bis (1-aziridinylcarboxamide), N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate), N, N'-toluene -2,4-bis (1-aziridinecarboxamide), triethylenemelamine, trimethylolpropane-tri-β (2-methylaziridine) propionate, bis-m-xylylenedimethyl -1-2-methylaziridine, tri-1-aziridinylphosphine oxide, gins-2-methylaziridinylphosphine oxide, etc. In addition, as the aziridinyl compound, commercially available products such as Chemitite PZ-33 and DZ-22E manufactured by Nippon Catalytic Corporation may be used. The ring-opening compound of the aziridinyl compound refers to a compound in which the aziridinyl group in the aziridinyl compound is in a ring-opening state.

The content of the positive compound is preferably 0.2% by weight or more and 98% by weight or less, and more preferably 0.5% by weight or more and 90% by weight or less based on the total amount of the material forming the antistatic layer. As a result, the physical strength of the coating film is improved, and the antistatic agent is more resistant to slippage caused by contact.

The negative compound in this embodiment may be a compound that is negatively charged with respect to cotton cloth, for example, a negative binder resin such as a fluororesin or a polyester compound. These may be used singly or in combination of two or more.

In addition, as the negative compound, since the material forming the bottom surface of the carrier tape or the like that forms the object that comes into contact with the surface of the antistatic layer when the electronic component is contained and is transported often contains polystyrene, etc., an ester compound can also be used. The ester compound refers to a compound that is formed by the organic acid or inorganic acid and alcohol being bonded due to dehydration reaction. Specific examples include polyethylene terephthalate, polybutylene terephthalate, and polynaphthalene dicarboxylic acid. Glycol esters, derivatives thereof, etc.

The content of the negative compound is preferably 0.2% by weight or more and 98% by weight or less, more preferably 0.5% by weight or more and 90% by weight or less with respect to the total amount of the material forming the antistatic layer. Thereby, the physical strength of the coating film is improved, and the antistatic agent can be more resistant to slippage due to contact.

Here, as a result of research by the inventor of the present case, it has been found that by using the positive compound and the negative compound in combination, the antistatic frictional chargeability of the antistatic layer can be improved. Furthermore, in the antistatic layer in which the positive compound and the negative compound are sufficiently dispersed, characteristics such as surface resistance 値, static voltage decay time, and other factors taking humidity changes as factors can be appropriately controlled, and excellent anti-friction charging properties can be achieved. The detailed mechanism is unknown, but it is believed that the positive and negative compounds can neutralize the frictional charge generated by friction, and can appropriately control the characteristics including humidity change as a factor.

In addition, it can be seen that the blending amount of the positive compound and the negative compound can be determined based on the solid content, so that the combined use of these can be easily used to control the anti-friction electrification. Specifically, the lower limit of the content of the solid content of the negative compound is 値 100% by weight, preferably 50% by weight or more, and 60% by weight or more, relative to, for example, the total of the solid content of the positive compound and the solid content of the negative compound. More preferably, it is more preferably 70% by weight or more. The upper limit of the content of the solid content of the negative compound is not particularly limited. For example, relative to the total of the solid content of the positive compound and the solid content of the negative compound, 100% by weight may be 99% by weight or less, and 95% by weight or less. It may also be 90% by weight or less. In this way, by achieving the balance between the positive compound and the negative compound, it is possible to improve the manufacturing stability of the antistatic layer having excellent anti-friction charging properties.

The upper limit of the surface resistance 値 of the antistatic layer is at 23 ° C and 15RH%. For example, it is preferably less than 10 ¹¹ Ω, more preferably 10 ¹⁰ Ω or less, more preferably 10 ⁹ Ω or less, and more preferably 10 ⁷ Ω or less. . This can improve antistatic properties. The lower limit of the surface resistance 値 of the antistatic layer is not particularly limited at 23 ° C and 15RH%, and may be, for example, 10 ³ Ω or more, and preferably 10 ⁴ Ω or more. The surface resistance 値 can be measured in accordance with IEC61340.

The material forming the antistatic layer should preferably contain a conductive polymer in view of reducing the surface resistance 値 of the antistatic layer and suppressing the generation of static electricity accompanied by friction. Specific examples of the conductive polymer include polyaniline and polypyrrole. Among them, a polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) -based compound is preferably used. These may be used singly or in combination of two or more.

The material forming the antistatic layer should preferably contain a surfactant in consideration of the viewpoint of improving the moisture permeability and the flatness when the antistatic layer is formed. The surfactant may be a low-molecular type surfactant or a high-molecular type surfactant, and a surfactant containing a fluoroalkyl structure may be preferably used. These may be used singly or in combination of two or more.

The frictional voltage of the antistatic layer is preferably -1800V or more and 1800V or less, more preferably -1500V or more and 1500V or less, and still more preferably -1000V or more and 1000V or less under the conditions of 23 ° C and 50% RH. -800V to 800V, preferably -500V to 500V. In addition, the absolute friction voltage of the antistatic layer is 23 ° C and 50% RH. For example, it is preferably 1800V or less, more preferably 1500V or less, still more preferably 1000V or less, and preferably 800V or less. The optimum is 500V or less. This can prevent the electronic parts from being damaged due to static electricity caused by the charging due to the contact between the bottom surface of the carrier tape and the surface of the cover tape caused by the vibration when the electronic parts are transported, or problems caused when the substrate is mounted.

The lower limit of the film thickness of the antistatic layer in this embodiment is not particularly limited, and may be, for example, 1 nm or more, preferably 10 nm or more, and more preferably 20 nm or more. This can improve the mechanical strength of the antistatic layer. The upper limit 値 of the film thickness of the antistatic layer is not particularly limited, and may be, for example, 5 μm or less, preferably 4 μm or less, and more preferably 3 μm or less. Thereby, the flexibility of the whole cover tape laminated | stacked with an antistatic layer can be improved. In addition, the volume density of the cover tape per unit storage space can be increased.

<Other layers> In the cover tape of this embodiment, an intermediate layer (not shown) may be provided between the base material layer and the sealant layer. Thereby, the cushioning property of the entire cover tape can be improved, and at the same time, the adhesiveness between the carrier tape and the carrier tape to be adhered can be improved.

Examples of the material for forming the intermediate layer include olefin-based resins, styrene-based resins, and cyclic olefin-based resins. Among them, an olefin-based resin may be used from the viewpoint of improving the adhesion with the carrier tape to be adhered. These may be used singly or in combination of two or more.

The thickness of the intermediate layer may be, for example, 10 μm or more and 30 μm or less, and preferably 15 μm or more and 25 μm or less from the viewpoint of improving the adhesiveness of the carrier tape that is an adhesion target.

In the cover tape of this embodiment, an adhesive layer may be provided between the base material layer and the sealant layer or between the base material layer and the antistatic layer. This can improve the mechanical strength of the cover tape.

The material forming the adhesive layer contains a resin. Specific examples of this resin include urethane-based dry laminating adhesive resins and adhesive resins for tackifying coatings. In general, polyester compositions such as polyester polyols and polyether polyols, and isocyanates can be used. Compounds, polybutadiene, polyimide resin, etc.

Next, materials for forming an object that comes into contact with the surface of the antistatic layer when the electronic component is housed and transported will be described. As described above, the object may be the bottom surface of a carrier tape, but it is not limited as long as it may be in contact with the surface of the antistatic layer when the electronic component is accommodated and transported, or when the electronic component is mounted. Specific examples of the material forming the object include carrier tape-forming materials such as polystyrene, polyethylene terephthalate, and polycarbonate, and polyethylene and rubber (processed from natural rubber and synthetic rubber) And obtained materials) and so on.

Next, the manufacturing method of the cover tape of this embodiment is demonstrated. The manufacturing method of the cover tape in this embodiment is different from the conventional manufacturing method, and it is necessary to strictly control the manufacturing conditions described later. That is, the surface resistance of the surface of the antistatic layer 値 R ₅₀ measured at 23 ° C and 50% RH can be obtained by using a manufacturing method that strictly controls various factors of the following two conditions: The ratio of the surface resistance (R ₃₀₎ of the surface of the antistatic layer measured, that is, the cover tape that meets the above-mentioned specific conditions, that is, R ₅₀ / R ₃₀ . (1) Blended composition of the resin material forming the antistatic layer (2) Combination of the material forming the antistatic layer and the material forming the substrate layer

However, the cover tape in this embodiment is based on the premise that various factors of the above two conditions are strictly controlled, and various specific manufacturing conditions such as the temperature setting of the manufacturing apparatus can be used. In other words, the cover tape in this embodiment can be produced by a known method for aspects other than the various factors that strictly control the above two conditions. Among them, the antistatic layer can be used in combination with, for example, a positively charged positive compound and a negatively charged negative compound, and these are well dispersed, and the appropriate control including the surface resistance, such as the change in humidity, is The characteristics of the factors make the above-mentioned R ₅₀ , R ₃₀ , R ₅₀ / R ₃₀ the elements of the desired range. The following is an example of a method for manufacturing a cover tape that strictly controls various factors of the above two conditions. First, a predetermined material is coated on one side of the base material layer and dried to form an antistatic layer. Then, the sealant layer is laminated on the surface opposite to the surface on which the antistatic layer has been formed of the base material layer by an extrusion layer method. In this way, the cover tape of this embodiment can be produced. Alternatively, after the sealant layer is formed into a sheet by an extrusion process, the obtained sheet may be laminated on the side opposite to the surface on which the antistatic layer has been formed on the base layer.

In addition, the manufacturing method of the cover tape of this embodiment from another viewpoint is demonstrated. The manufacturing method of the cover tape in this embodiment is different from the conventional manufacturing method, and it is necessary to strictly control the manufacturing conditions described later. That is, by using a manufacturing method that strictly controls various factors of the following two conditions, the absolute value of the frictional band voltage of the surface of the antistatic layer measured at 23 ° C and 50% RH can be reduced from 5kV to 50V static electricity. Voltage decay time S ₅₀ , the absolute value of the frictional band voltage on the surface of the antistatic layer measured at 23 ° C, 30% RH. The electrostatic voltage decay time S ₃₀ , S ₅₀ / S ₃₀ from 5 kV to 50 V is in accordance with the above. Cover tape for specific conditions. (1) Blended composition of the resin material forming the antistatic layer (2) Combination of the material forming the antistatic layer and the material forming the substrate layer

However, the cover tape in this embodiment is based on the premise that various factors of the above two conditions are strictly controlled, and various specific manufacturing conditions such as the temperature setting of the manufacturing apparatus can be used. In other words, the cover tape in this embodiment can be produced by a known method, in addition to strictly controlling various factors of the above two conditions. Among these, for example, the positively charged positive compound and the negatively charged negative compound may be used in combination to make them well dispersed, etc., as appropriate to control characteristics including the change in humidity such as electrostatic voltage decay time as a factor of humidity Let the above-mentioned S ₅₀ , S ₃₀ , and S ₅₀ / S ₃₀ be the elements of the desired range. The following is an example of a method for manufacturing a cover tape on the premise that various factors of the above two conditions are strictly controlled. First, a predetermined material is coated on one side of the base material layer and dried to form an antistatic layer. Next, the sealant layer is laminated on the surface opposite to the surface on which the antistatic layer has been formed by the extrusion layer method. In this way, the cover tape of this embodiment can be produced. Alternatively, after the sealant layer is formed into a sheet by an extrusion processing method, the obtained sheet may be laminated on the side opposite to the surface on which the antistatic layer has been formed on the base layer.

When the intermediate layer is formed, the intermediate layer may be laminated with an extrusion layer on the side opposite to the surface on which the antistatic layer has been formed, or the intermediate layer may be laminated by an extrusion process. After the intermediate layer is formed into a sheet, the obtained sheet is laminated on the side opposite to the surface on which the antistatic layer has been formed of the base layer.

Moreover, when forming the said adhesive layer, the material of the adhesive layer can be apply | coated to the target surface using the conventionally well-known coating method.

The embodiments of the present invention have been described above, but these descriptions are examples of the present invention, and various configurations other than the above may be adopted. [Example]

Hereinafter, the present invention will be described using examples and comparative examples, but the present invention is not limited to these examples.

[Example A] In Example A and Comparative Example A, each raw material component used in the production of the antistatic layer and the sealant layer is shown below.

<Antistatic layer> (Antistatic agent) ・ Antistatic agent A1: Conductive polymer (Polyethylenedioxythiophene / polystyrenesulfonic acid (PEDOT / PSS))-based compound (Herarus Corporation, CLEVIOS P) ・Antistatic agent A2: Tin dioxide (manufactured by Diary Catalytic Corporation) • Antistatic agent A3: cationic low-molecular surfactant (manufactured by Nippon Oil Company, Elegan 264-30) • antistatic agent A4: cationic polymer interface Active agent (made by Taisei fine chemical, Akuri 1SX-1090)

(Dilution solvent) ・ Dilution solvent A1: isopropanol: water = 1: 1 ・ Dilution solvent A2: toluene: methyl ethyl ketone = 1: 1 ・ Dilution solvent A3: isopropanol

(Binder Resin) ・ Positive binder resin A1: carbodiimide (manufactured by Nisshinbo Chemical Co., Ltd., Carbodilite V-02-L2) ・ Positive binder resin A2: acrylic resin (manufactured by Toa Kasei Corporation, Aron S-1001) ・Negative binder resin A3: water-soluble polyester resin (Plascoat Z760, manufactured by Kyowa Chemical Co., Ltd.) ・ Negative binder resin A4: water-soluble polyester resin (Plascoat Z565, manufactured by Kyowa Chemical Co., Ltd.)

(Surfactant) ・ Surfactant A1: BYK Japan, BYK-3440 ・ Surfactant A2: Sannopco, SN Dispersant 9228

<Sealant layer>-Styrene- (meth) acrylate copolymer (Estyren MS-600, manufactured by Nippon Steel Chemical Co., Ltd., hereinafter referred to as "St-MMA".)-Ethylene-methyl acrylate copolymer (Manufactured by Dupont Mitsui polychemicals, Elvaloy AC 1820. Hereinafter also referred to as "EMA".) Polyether / polyolefin copolymer (manufactured by Sanyo Chemical Industries, Pelestat 212. Hereinafter also referred to as "PEG-PP".)

<Manufacture of a cover tape of Example A> First, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd .: E5102) having a thickness of 16 μm was prepared as a base material layer. The obtained substrate layer had a total light transmittance of 87.7%.

The materials for forming the antistatic layer were then prepared in the following manner. The blending composition of each test drug is shown in Table 1. The antistatic agent was stirred for 30 seconds while adding a diluted solvent. Then, in order to improve the adhesiveness and dispersion stability of the substrate, the binder resin and the surfactant were added and stirred for 30 seconds. In this way, a liquid-like antistatic layer-forming material is prepared.

Then, the obtained antistatic layer-forming material (liquid) was applied to one side of the base material layer using a bar coater or a gravure coater so that the wet film thickness became 4 μm. It was then dried at 100 ° C to prepare an antistatic layer.

Then, the surface of the base material layer on which the antistatic layer has been formed is the surface on the opposite side, and the sealant layer is laminated using the extrusion layer method. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. The thickness of the sealant layer was 5 μm.

The cover tapes of Examples A1 and A2 were made in the above manner. The width of the obtained cover tape was 8 mm.

<Production of the cover tape of Comparative Example A> The antistatic layer was prepared in the same manner as in Example A by using a mixed solution of an antistatic agent and a dilute solvent obtained without adding a binder resin and a surfactant as shown in Table 1. Cover tape.

The following evaluations were performed using each cover tape of Example A and Comparative Example A.

<Evaluation method> ・ Surface resistance of the surface of the antistatic layer 値: According to IEC61340, the surface resistance of the surface of the antistatic layer at 23 ° C and 50RH%, 30RH% and 12RH% of three humidity conditions was measured. The unit is Ω.

• Total light transmittance: The total light transmittance of the cover tape was measured in accordance with JIS K7105 (1981). The unit is%.

・ Friction band voltage: The friction band voltage measured at 23 ° C and 50% RH is measured in accordance with the methods (1) to (7) below with reference to FIG. 3. The unit is V.

(1) A plate-shaped rubber body 40 having a surface resistance 値 of 1.0 × 10 ¹³ Ω or more and a plate shape is provided on the base 30 with a wheel having a surface resistance 値 of less than 1.0 × 10 ¹¹ Ω. Then, two insulators 50 are provided on the rubber body 40 at predetermined intervals. In addition, the insulator 50 is a rectangular prism having a thickness of 10 mm or more and a surface resistance 値 of 1.0 × 10 ¹³ Ω or more. Then, the polystyrene sheet 70 (Clearen CST2401, manufactured by Denka Co., Ltd.) which had been cut to a width of 8 mm was fixed with a double-sided tape so as to contact both of the two insulators 50. The polystyrene-based sheet 70 is an object to be rubbed in contact with each cover tape in the measurement described later. In addition, the stand 30 with wheels is always in an earth state.

(2) The polystyrene-based sheet 70 is neutralized using an ionizer (BLH-H, manufactured by Kasuga Electric Corporation).

(3) Move the pedestal 30 with wheels, and move the polystyrene sheet 70 under the measurement probe 60 provided by a surface potentiometer (manufactured by TREK, MODEL 370), and confirm that the polystyrene sheet 70 is de-energized. . The distance between the polystyrene-based sheet 70 and the measurement probe 60 is 1 to 2 mm.

(4) The cover tape 10 is wound around the surface resistance 値 to 1.0 × 10 ⁹ Ω and the rod-shaped support 80 so that the antistatic layer becomes the surface layer. In order to reduce the effect of charging when held by a hand, the support 80 is made of a conductor made of a thin film mixed with carbon. In addition, the cover tape 10 is also neutralized in the same manner as the polystyrene-based sheet 70.

(5) Move the stand 30 with wheels to move the polystyrene sheet 70 from below the measuring probe 60, and rub the surface of the polystyrene sheet 70 with the antistatic layer wound around the cover tape 10 of the support 80. At this time, the friction of the cover tape 10 using the antistatic layer is in a state where the wheel base 30 is fixed, and the speed is 100 mm / s and 50 mm in a direction of the long side of the polystyrene sheet 70. Rub at intervals.

(6) Within 5 seconds after the friction between the antistatic layer of the cover tape 10 and the polystyrene sheet 70 starts, move the polystyrene sheet 70 under the measurement probe 60 and use the ionizer to measure the friction band voltage. .

(7) Calculate the frictional band voltage of the surface of the antistatic layer of the cover tape 10 from the frictional band voltage of the surface of the obtained polystyrene sheet 70. In addition, as for the polystyrene sheet 70 and the cover tape 10 used for the measurement of the friction band voltage, those whose static voltage was 0 V before being subjected to static elimination as described above were used. Therefore, when the frictional band voltage on the surface of the polystyrene sheet 70 is 100V, the frictional band voltage on the surface of the antistatic layer of the cover tape 10 can be calculated as 100V (= 0V-100V).

The evaluation results of the above evaluation items are shown in Table 1 below together with the blend composition of the antistatic layer.

【Table 1】

The cover tapes of Examples A1 and A2 were all those with good balance between the adhesiveness and peelability of the carrier tape, and excellent antistatic properties accompanying the peeling of the carrier tape. In particular, the cover tapes of Examples A1 and A2 contain both a positive binder resin and a negative binder resin, and an antistatic layer is formed using a conductive polymer-containing material, so triboelectric charging itself is unlikely to occur. On the other hand, the cover tapes of Comparative Examples A1 and A2 had moisture-dependent properties in terms of antistatic properties accompanying carrier tape peeling, and did not meet the required level. The obtained cover tape was rubbed against a polystyrene carrier tape, and the absolute value of the electrostatic voltage on the surface of the cover tape was measured. As a result, it was found that the anti-friction charging properties of Examples A1 and A2 were good. On the other hand, it was found that the frictional charge resistance of Comparative Examples A1 and A2 was not good. Further, the obtained cover tape was heat-sealed on a carrier tape, and then wound around a seal to obtain a package for an electronic component wound into a reel shape.

[Example B] In Example B and Comparative Example B, each raw material component used in the production of the antistatic layer and the sealant layer is shown below.

<Antistatic layer> (Antistatic agent) ・ Antistatic agent B1: Conductive polymer containing polyethylenedioxythiophene / polystyrenesulfonic acid (PEDOT / PSS) -based compound (Cera VIOS® P, manufactured by Herarus Corporation) ・Antistatic agent B2: Tin dioxide (manufactured by Diary Catalytic Corporation) • Antistatic agent B3: cationic low-molecular surfactant (manufactured by Nippon Oil Co., Ltd., Elegan 264-30) • antistatic agent B4: cationic polymer interface Active agent (made by Taisei fine chemical, Akuri 1SX-1090)

(Diluent Solvent) • Diluent Solvent B1: Isopropanol: Water = 1: 1 • Diluent Solvent B2: Toluene: Methyl Ethyl Ketone = 1: 1 • Diluent Solvent B3: Isopropanol

(Binder Resin) ・ Masame binder resin B1: carbodiimide (manufactured by Nisshinbo Chemical Co., Ltd., Carbodilite V-02-L2) ・ Masame binder resin B2: acrylic resin (manufactured by Toa Kasei Corporation, Aron S-1001) ・Negative binder resin B3: water-soluble polyester resin (Plascoat Z760, manufactured by Kyowa Chemical Co., Ltd.) ・ Negative binder resin B4: water-soluble polyester resin (Plascoat Z565, manufactured by Kyowa Chemical Co., Ltd.)

(Surfactant) ・ Surfactant B1: BYK Japan, BYK-3440 ・ Surfactant B2: Sannopco, SN Dispersant 9228

<Sealant layer>-Styrene- (meth) acrylate copolymer (Estyren MS-600, manufactured by Nippon Steel Chemical Co., Ltd., hereinafter referred to as "St-MMA".)-Ethylene-methyl acrylate copolymer (Manufactured by Dupont Mitsui polychemicals, Elvaloy AC 1820. Hereinafter also referred to as "EMA".) Polyether / polyolefin copolymer (manufactured by Sanyo Chemical Industries, Pelestat 212. Hereinafter also referred to as "PEG-PP".)

<Production of the cover tape of Example B> First, a biaxially stretched polyester film having a thickness of 16 μm as a base material layer (manufactured by Toyobo Co., Ltd .: E5102) was prepared. The obtained substrate layer had a total light transmittance of 87.7%.

Then, a material for forming an antistatic layer was prepared in the following manner. Table 2 shows the blending composition of each reagent. The antistatic agent was stirred for 30 seconds while adding a diluted solvent. Then, in order to improve the adhesiveness and dispersion stability of the substrate, the binder resin and the surfactant were added and stirred for 30 seconds. In this way, a liquid-like antistatic layer-forming material is prepared.

Then, the obtained antistatic layer-forming material (liquid) was applied on one side of the base material layer using a bar coater or a gravure coater so that the wet thickness was 4 μm. Thereafter, it was dried at 100 ° C to prepare an antistatic layer.

Then, the sealant layer is laminated on the side opposite to the surface on which the antistatic layer has been made of the base material layer by the extrusion layer method. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. The thickness of the sealant layer was 5 μm.

According to the above method, the cover tapes of Examples B1 and B2 were produced. The width of the obtained cover tape was 8 mm.

<Manufacture of a cover tape of Comparative Example B> As a material for forming an antistatic layer, a mixed solution of an antistatic agent and a dilute solvent obtained without adding a binder resin and a surfactant was used in accordance with Examples 1 and 2 Make the cover tape in the same way.

Using each cover tape of Example B and Comparative Example B, the following evaluations were performed.

<Evaluation method> ・ Static voltage decay time: At 23 ° C, under three humidity conditions of 50% RH, 30% RH, and 12% RH, measure the frictional band voltage on the surface of the antistatic layer measured by the method described below. The absolute time is from 5kV to 50V. The unit is second (s). In addition, in Table 1 below, the time until the friction band voltage decay from + 5kV to + 50V is S +, and the time between the friction band voltage decay from -5kV to -50V is S-.

-Friction band voltage: Referring to Fig. 3, the friction band voltage measured at 23 ° C and 50% RH was measured in the same manner as in Example A above. The unit is V.

• Total light transmittance: The total light transmittance of the cover tape is measured in accordance with JIS K7105 (1981). The unit is%.

The evaluation results of the above evaluation items are shown in Table 2 below together with the blend composition of the antistatic layer.

【Table 2】

The cover tapes of Examples B1 and B2 are excellent in the balance between the adhesiveness and the peelability of the carrier tape, and the antistatic properties accompanying the peeling of the carrier tape. In particular, the cover tapes of Examples 1B and B2 contain both a positive binder resin and a negative binder resin, and a conductive polymer-containing material is used to form the antistatic layer, so triboelectric charging itself is unlikely to occur. On the other hand, the cover tapes of Comparative Examples B1 and B2 had moisture-dependent properties in terms of antistatic properties accompanying carrier tape peeling, and did not meet the required level. The obtained cover tape was rubbed against a polystyrene carrier tape, and the absolute value of the electrostatic voltage on the surface of the cover tape was measured. As a result, it was found that the anti-friction electrification properties of Examples B1 and B2 were good. On the other hand, it was found that, in Comparative Examples B1 and B2, the anti-friction electrification property was not good. Furthermore, the obtained cover tape was heat-sealed on a carrier tape, and then wound around a seal to obtain a package for an electronic part wound into a reel shape.

[Example C] In Example C, the raw material components used in the preparation of the antistatic layer are shown below.

(Binder resin) ・ Positive compound C1: Acrylate copolymer resin (manufactured by Toa Kosei, Jurymer FC-80) ・ Negative compound C1: Water-soluble polyester resin (manufactured by Kyowa Chemical Co., Plascoat Z565)

(Antistatic agent) ・ Antistatic agent C1: Conductive polymer containing a compound of polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) (Organcon ICP1010, manufactured by Japan AGFA Materials)

(Others) ・ Diluent C1: Isopropanol ・ Diluent C2: Water ・ Neutralizer C1: Triethylamine (manufactured by Wako Pure Chemical Industries: TEA) ・ Surfactant C1: manufactured by BYK Japan, BYK-3440

<Production of the cover tape of Example C> First, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd .: E5102) having a thickness of 16 μm as a base material layer was prepared. The obtained substrate layer had a total light transmittance of 87.7%.

Then, a material for forming an antistatic layer was prepared in the following manner. The blending composition of the materials forming the antistatic layer is shown in Table 3. The antistatic agent was stirred for 30 seconds while adding a neutralizing agent and a diluted solvent. Then, in order to improve the adhesiveness and dispersion stability of the substrate, the binder resin and the surfactant were added and stirred for 30 seconds. In this way, a liquid-like antistatic layer-forming material is prepared.

Then, the obtained antistatic layer-forming material (liquid) was applied on one side of the base material layer using a bar coater or a gravure coater so that the wet thickness was 4 μm. Thereafter, it was dried at 100 ° C to prepare an antistatic layer.

Then, the sealant layer is laminated on the side opposite to the surface on which the antistatic layer has been made of the base material layer by the extrusion layer method. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. The thickness of the sealant layer was 5 μm.

According to the above method, the cover tapes of Examples C1 to C3 were manufactured. The width of the obtained cover tapes was 8 mm.

The following evaluations were performed using each cover tape of Example C.

・ Surface resistance 値: The surface resistance 抗 of the surface of the antistatic layer at 23 ° C and 3 humidity conditions of 50RH%, 30RH% and 12RH%, measured in accordance with IEC61340. The unit is Ω.

• Total light transmittance: The total light transmittance of the cover tape is measured in accordance with JIS K7105 (1981). The unit is%.

【table 3】

The obtained cover tape was rubbed against a polystyrene carrier tape, and the absolute value of the electrostatic voltage on the surface of the cover tape was measured. As a result, it can be seen that, for Examples C1 to C3, the anti-friction electrification property is good. Furthermore, the obtained cover tape was heat-sealed on a carrier tape, and then wound around a seal to obtain a package for electronic parts wound into a reel shape. The cover tapes of Examples C1 to C3 are all those having excellent anti-friction electrification properties against friction generated during transportation and the like, and excellent anti-static properties with carrier tape peeling.

[Example D] In Example D, each raw material component used in the production of the antistatic layer and the sealant layer is shown below.

<Antistatic layer> (Binder resin) ・ Positive compound D1: Acrylate copolymer resin (Aracoat CL910, manufactured by Arakawa Chemical Co., Ltd.) ・ Negative compound D1: Water-soluble polyester resin (Made by Chemical Co., Ltd., Plascoat Z565)

(Antistatic agent) ・ Antistatic agent D1: Conductive polymer containing polyethylenedioxythiophene / polystyrenesulfonic acid (PEDOT / PSS) -based compound (Aracoat ACS332, manufactured by Arakawa Chemical Co., Ltd.)

(Others) • Thinner D1: Isopropanol • Thinner D2: Water • Surfactant D1: Aracoat Chemical Co., Ltd., Aracoat ACS347

<Sealant layer>-Styrene- (meth) acrylate copolymer (Estyren MS-600, manufactured by Nippon Steel Chemical Co., Ltd., hereinafter referred to as "St-MMA".)-Ethylene-methyl acrylate copolymer (Manufactured by Dupont Mitsui polychemicals, Elvaloy AC 1820. Hereinafter also referred to as "EMA".) Polyether / polyolefin copolymer (manufactured by Sanyo Chemical Industries, Pelestat 212. Hereinafter also referred to as "PEG-PP".)

<Production of a cover tape for packaging electronic parts in Example D> First, a biaxially stretched polyester film having a thickness of 25 μm as a base material layer (manufactured by Toyobo Co., Ltd .: E5102) was prepared. The obtained substrate layer had a total light transmittance of 87.7%.

The materials for forming the antistatic layer were then prepared in the following manner. The blending composition of the materials forming the antistatic layer is shown in Table 4. The antistatic agent was stirred for 30 seconds while adding a diluted solvent in which isopropyl alcohol and water were mixed at a predetermined ratio. Then, in order to improve the adhesiveness and dispersion stability of the substrate, the binder resin and the surfactant were added and stirred for 30 seconds. In this way, a liquid antistatic layer-forming material is prepared.

Then, the obtained antistatic layer-forming material (liquid) was applied on one surface of the base material layer using a bar coater or a gravure coater so that the wet thickness became 4 μm. Then, it was made to dry at 100 degreeC for 1 minute, and the antistatic layer was produced.

The sealant layer is laminated on the side opposite to the surface on which the antistatic layer has been formed by the extrusion layer method. As a material for forming the sealant layer, a resin composition composed of 15 parts by weight of St-MMA, 65 parts by weight of EMA, and 20 parts by weight of PEG-PP was used. The thickness of the sealant layer was 5 μm.

The cover tape for packaging electronic parts of Examples D1 to D4 was manufactured according to the above method. The width of the obtained cover tapes was 8 mm.

The following evaluations were performed using each cover tape of Example D.

・ Surface resistance 値: The surface resistance 値 of the surface of the antistatic layer under the humidity conditions of 50RH%, 30RH% and 12RH% at 23 ° C is measured according to IEC61340. The unit is Ω.

• Total light transmittance: The total light transmittance of the cover tape is measured in accordance with JIS K7105 (1981). The unit is%.

【Table 4】

The obtained cover tape was rubbed against a polystyrene carrier tape, and the absolute value of the electrostatic voltage on the surface of the cover tape was measured. As a result, it was found that the anti-friction electrification properties of Examples D1 to D4 were good. Furthermore, the obtained cover tape was heat-sealed on a carrier tape, and then wound around a seal to obtain a package for electronic parts wound into a reel shape. The cover tapes of Examples D1 to D4 are all excellent in anti-friction charging property against friction generated during transportation and the like, regardless of the type of materials constituting the carrier tape, and antistatic properties accompanying the peeling of the carrier tape.

This application claims priority based on Japanese application Japanese Patent Application No. 2015-046796 filed on March 10, 2015 and Japanese Application Japanese Patent Application No. 2015-075142 filed on April 1, 2015, all of which are disclosed herein Included.

1‧‧‧ substrate layer

2‧‧‧ sealant layer

3‧‧‧Antistatic layer

10‧‧‧ cover tape

10a‧‧‧ surface

20‧‧‧ Carrier tape

20a‧‧‧Underside

21‧‧‧Bag

30‧‧‧ pedestal

40‧‧‧ rubber body

50‧‧‧ insulator

60‧‧‧ Probe

70‧‧‧ polystyrene series

80‧‧‧ support

100‧‧‧Packaging body for electronic parts (packaging body)

The above-mentioned objects, and other objects, features, and advantages can be made clearer from the following ideal embodiments and the following drawings.

[Fig. 1] A schematic cross-sectional view showing an example of a cover tape for packaging electronic parts according to this embodiment. [Fig. 2] A diagram showing an example of a state in which a cover tape for packaging electronic parts according to this embodiment is sealed to a carrier tape. [Fig. 3] A diagram for explaining a method for measuring a friction band voltage.

Claims (17)

A cover tape for packaging electronic parts, comprising: a base material layer; a sealant layer provided on one side of the base material layer; and an antistatic layer provided on the side opposite to the one side of the base material layer ; Let the surface resistance of the surface of the antistatic layer measured at 23 ° C and 50% RH be R ₅₀ , and the surface resistance of the surface of the antistatic layer measured at 23 ° C and 30% RH be 値When it is R ₃₀ , the ratio of R ₅₀ / R ₃₀ is 0.35 or more and 2.8 or less. For example, the cover tape for electronic component packaging in the scope of patent application item 1, where the surface resistance 値 of the surface of the antistatic layer measured at 23 ° C and 50% RH is R ₅₀ , at 23 ° C, 12% When the surface resistance 値 of the surface of the antistatic layer measured by RH is R ₁₂ , the 値 of R ₅₀ / R ₁₂ is 0.1 or more and 10 or less. A cover tape for packaging electronic parts, comprising: a base material layer; a sealant layer provided on one side of the base material layer; and an antistatic layer provided on the side opposite to the one side of the base material layer ; Zhi band for the absolute voltage of the friction surface of the antistatic layer from 5kV to attenuate the electrostatic voltage of 50V decay time, so that at 23 deg.] C, Zhi the electrostatic voltage of 50% RH, measured decay time of the S _50, at 23 When the 値 of the electrostatic voltage decay time measured at ℃ and 30% RH is S ₃₀ , the _{50 of} S ₅₀ / S ₃₀ is 0.7 or more and 1 or less. For example, for the cover tape for packaging electronic parts in the third item of the patent application, where 値 of the electrostatic voltage decay time measured at 23 ° C and 50% RH is S ₅₀ , and that measured at 23 ° C and 12% RH When the static voltage decay time is S ₁₂ , the S ₅₀ / S ₁₂ is 0.2 or more and 1 or less. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the application, wherein the total light transmittance of the cover tape for packaging electronic parts is 80% or more. For example, the cover tape for electronic component packaging of item 1 or 3 of the application, wherein the surface of the antistatic layer of the cover tape for electronic component is superposed with a sheet made of a material made of polystyrene, and the After the sheet was rubbed on the surface twice at a speed of 100 mm / s and 50 mm intervals for 5 seconds, the friction band voltage measured at 23 ° C. and 50% RH was −1800 V to 1800 V. For example, the cover tape for packaging electronic parts according to item 1 or 3, wherein the antistatic layer contains an ester compound. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the application, wherein the antistatic layer contains a positively charged compound and a negatively charged compound. For example, the cover tape for packaging electronic parts according to item 8 of the patent application, wherein the content of the solid content of the negative compound is 100% by weight relative to the total of the solid content of the positive compound and the solid content of the negative compound. 50% by weight or more. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the application, wherein the antistatic layer contains a conductive polymer. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the application, wherein the antistatic layer contains a surfactant. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the patent application, wherein the film thickness of the antistatic layer is 1 μm or more and 20 μm or less. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the patent application scope, wherein the surface resistance of the sealant layer is 23 ° C and 50RH%, and is 10 ⁵ Ω or more and 10 ¹¹ Ω or less. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the patent application, wherein the film thickness of the sealant layer is 1 μm or more and 15 μm or less. For example, the cover tape for packaging electronic parts according to item 1 or 3 of the application, wherein the base layer has a total light transmittance of 80% or more. For example, the cover tape for packaging electronic parts in item 1 or 3 of the patent application scope, wherein the width of the cover tape for packaging electronic parts is 2 mm or more and 100 mm or less. A packaging body for electronic parts is composed of a component storage tape composed of a carrier tape and a cover tape, and the carrier tape is formed by arranging the component storage sections for containing electronic components at predetermined intervals; the cover tape is formed by covering The component storage section of the carrier tape is provided in a manner; the component storage tape can be wound into a reel shape, and the cover tape is the cover tape for electronic component packaging according to any of claims 1 to 16 of the scope of patent application.