JP4162961B2 - Cover tape for packaging electronic parts - Google Patents

Description

【００１４】
表１中の記号は以下の通りである。
ＰＥＴ ：ポリエチレンテレフタレート
ＰＰ ：ポリプロピレン
Ｎｙ ：ナイロン
ＰＣ ：ポリカーボネート
Ｏ− ：二軸延伸の意味。
ＬＤＰＥ ：低密度ポリエチレン
ＭＬＤＰＥ：メタロセン系触媒を使用して合成した低密度ポリエチレン
ＥＶＡ ：エチレン−酢酸ビニル共重合体
ＥＥＡ ：エチレン−エチルアクリレート共重合体
ＥＭＭＡ ：エチレン−メチルメタクリレート共重合体
ＩＯＮ ：アイオノマー
【００１５】
【発明の効果】
本発明に従うと、実装工程における静電気トラブルを防止し更に、相対湿度１２％といった低湿度の環境下においても該静電気トラブルを防止できる。
全光線透過率が８０％以上、曇度が７０％以下になる様、積層されている為、電子部品包装後の内容物の確認が容易になる。
【図面の簡単な説明】
【図１】本発明のカバーテープの層構成を示す断面図である。
【図２】本発明の実施例にあげたカバーテープの層構成を示す断面図である。
【図３】本発明のカバーテープをキャリアテープに接着し、その使用状態を示す断面図である。
【符号の説明】
１：カバーテープ
２：層Ａ
３：層Ｂ
４：層Ｄ
５：ポリウレタン系接着剤層
６：シールされる部分
７：キャリアテープ
８：層Ｃ[0001]
[Technical field to which the invention belongs]
The present invention relates to a plastic carrier in which a storage pocket is formed, out of a package having a function of protecting electronic components from contamination and arranging and taking them out for mounting on an electronic circuit board when storing, transporting and mounting the electronic components. The present invention relates to a cover tape that can be sealed to the tape.
[0002]
[Prior art]
In recent years, surface mount electronic components such as ICs, transistors, diodes, capacitors, piezoelectric element resistors, etc., are made of plastic with a continuous embossed pocket that can be accommodated according to the shape of the electronic components. The carrier tape and the cover tape that can be sealed with the carrier tape are packaged and supplied. The electronic components of the contents are automatically taken out after the cover tape of the package is peeled off and mounted on the surface of the electronic circuit board.
A carrier tape that wraps electronic components is usually wound on a reel made of paper or plastic, and the state is maintained until the mounting process.
At the time of mounting, the reel is housed in a feeder cassette provided in the mounting machine, but the feeder cassette is moved to a predetermined position before the cover tape is peeled off from the carrier tape. Repeated movements, that is, when static electricity generated by friction accumulates on the surface of the reel and the cover tape and the cover tape is peeled off, the static electricity flows into the electronic components that are the contents, causing trouble that destroys the internal circuit. .
The trouble is unlikely to occur in an environment where the relative humidity is controlled to 60% or more, but the probability of occurrence is very high when the relative humidity is 50% or less, and when the relative humidity is 12% or less. In order to cope with such a phenomenon, it is described in Patent Documents 1 to 3 that a surfactant is added to the cover tape. However, when the cover tape is stored for several days, the surfactant layer peels off partially. In some cases, the surface resistivity may be 1 × 10 ¹² Ω / □ or more, and no fundamental solution has been achieved.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-17015 [Patent Document 2]
JP 2000-128117 A [Patent Document 3]
Japanese Patent Laid-Open No. 2000-142786
[Problems to be solved by the invention]
The present invention provides a cover tape capable of preventing the above-described static electricity trouble and preventing the static electricity trouble even in a low humidity environment such as a relative humidity of 12%.
[0005]
[Means for Solving the Problems]
The present invention is [1] a cover tape that can be heat-sealed to a plastic carrier tape in which storage pockets for storing electronic components are continuously formed, and the cover tape is at least heated from the side heat-sealed to the carrier tape. It consists of three layers: a sealing material layer (hereinafter abbreviated as layer B), a base material layer (hereinafter abbreviated as layer A) and a surface layer (hereinafter abbreviated as layer C). It is composed of a (meth) acrylic acid-poly (meth) acrylic acid copolymer, and the surface resistivity of the layer C after standing at 23 ° C. and 50% RH for 24 hours is 1 × 10 ¹² Ω / □ or less. Cover tape for packaging electronic parts,
[2] The cover tape for packaging electronic parts according to [1], wherein the surface resistivity of the layer C after being allowed to stand at 23 ° C. and 12% RH for 24 hours is 1 × 10 ¹² Ω / □ or less,
[3] Between layer A and layer B, one or more layers selected from the group consisting of a polyester layer, a nylon layer, a polypropylene layer, a polyethylene layer, and an ethylene copolymer layer (hereinafter abbreviated as layer D). The cover tape for packaging electronic parts according to claim 1 or 2, wherein
(4) The main component of layer B is an ethylene copolymer, and the copolymer component is one selected from the group consisting of vinyl acetate, acrylic acid, acrylic ester, methacrylic acid, methacrylic ester and ionomer. The cover tape for electronic component packaging according to any one of (1) to (3),
(5) The cover tape for electronic component packaging according to any one of (1) to (4), wherein the total light transmittance is 80% or more and the haze is 70% or less,
It is.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
An example of components of the cover tape 1 of the present invention will be described with reference to FIG. Layer A is a base material layer and is preferably a transparent and highly rigid film having a thickness of 6 to 100 μm. The thermoplastic resin used for layer A is a thermoplastic resin having a deflection temperature under load of 1.82 MPa (ASTM D-648) such as polycarbonate, polyethersulfone, polyetherimide, polyimide, nylon or polyester, which is 60 ° C. or higher. Things are preferable.
In order to increase the mechanical strength of the cover tape, two or more films may be laminated.
[0007]
The layer B is not particularly limited as long as it can be heat-sealed to the corresponding carrier tape and can always obtain a stable peel strength, but after the heat-sealing with the carrier tape, the peel strength of the cover tape when peeled from the carrier tape In order to make the difference between the maximum value and the minimum value 0.01 to 0.4 N per 1 mm width, the main component of the layer B is an ethylene copolymer, and the copolymer component is vinyl acetate, acrylic acid, acrylate ester, It is one selected from the group consisting of methacrylic acid, methacrylic acid esters and ionomers, and the subcomponent of layer B is polystyrene, styrene-methacrylic acid ester copolymer, styrene-butadiene copolymer, styrene-hydrogenated butadiene copolymer. Polymer, styrene-isoprene copolymer, styrene-hydrogenated isoprene copolymer, thermoplastic tree which is polyethylene It is preferably a mixture of.
A polyester layer, nylon layer or polypropylene layer may be provided between layer A and layer B to increase the mechanical strength of the substrate, and between layer A and layer B to increase the adhesion strength with the substrate. You may provide a polyethylene layer and a polyethylene-type copolymer layer. In the present invention, these layers are referred to as layer D. Furthermore, a polyurethane adhesive layer or an epoxy adhesive layer may be provided between the layer A and the layer B or between the layer A and the layer D.
[0008]
Layer C, which is a surface layer disposed on the surface of layer A, is composed of an amino-modified poly (meth) acrylic acid-poly (meth) acrylic acid copolymer. Examples of amino-modified poly (meth) acrylic acid-poly (meth) acrylic acid copolymers include amino-modified polymethyl methacrylate butyl methacrylate copolymer, amino-modified polymethyl methacrylate hexyl methacrylate copolymer, amino-modified polymethyl acrylate Examples thereof include a butyl methacrylate copolymer and an amino-modified polymethyl acrylate hexyl methacrylate copolymer. The surface resistivity of the surface of layer C is 1 × 10 ¹² Ω / □ or less after leaving the cover tape at 23 ° C. and 50% RH for 24 hours, and even after leaving the cover tape at 23 ° C. and 12% RH for 24 hours. It is preferably 1 × 10 ¹² Ω / □ or less.
[0009]
The cover tape of the present invention prevents troubles such as the electronic component to be packaged is destroyed by static electricity, or the cover tape is peeled off during the mounting process due to the small size of the electronic component, and is attached to the cover tape by static electricity. Therefore, the layer B may be subjected to antistatic treatment.
As a typical antistatic formulation, there are a method of mixing an antistatic agent in the layer B and a method of providing an antistatic layer on the surface.
Antistatic agents used as these antistatic formulations include conductive fine powders and / or surfactants and / or amino-modified polyacrylic acid or polymethacrylic acid copolymers mentioned in the claims of the present invention. . Examples of the conductive fine powder include tin oxide, zinc oxide, titanium oxide, and carbon black. Even if these are used alone, the effect can be obtained, but two or more of these may be used in combination. Moreover, you may add surfactant to these. A surfactant may be used alone.
[0010]
The cover tape must be laminated so that the total light transmittance is 80% or more and the haze is 70% or less. If the total light transmittance is less than 80% and the haze is 70% or more, although it depends on the inspector, it is difficult to inspect whether the contents are correctly inserted after packaging the electronic component with the cover tape.
[0011]
【Example】
Examples of the present invention are shown below, but the present invention is not limited to these examples.
<< Examples 1-4 and Comparative Examples 1-3 >>
The first layer listed in Table 1 (= corresponding to the layer C of the present invention) is provided on the surface of the second layer (= corresponding to the layer A of the present invention) by gravure coating so that the thickness becomes 1 μm. On the opposite side, a polyurethane adhesive layer, a third layer (= corresponding to the layer D of the present invention) and a fourth layer (= corresponding to the layer B of the present invention) were provided by an extrusion laminating method and shown in FIG. A layered cover tape was obtained. The polyurethane adhesive layer is provided to increase the adhesion strength between the second layer and the third layer.
The thickness of each layer was 12 μm for the second layer, 1 μm for the polyurethane adhesive layer, 15 μm for the third layer, and 10 μm for the fourth layer.
[0012]
The surface resistivity was measured according to JIS K6911, and the total light transmittance and haze were measured according to JIS K7105.
The surface resistivity of the layer C was measured after leaving the sample in a cover tape state for 24 hours in a room with a room temperature of 23 ° C. and a relative humidity of 50%. The sample was then allowed to stand in a room with a room temperature of 23 ° C. and a relative humidity of 12% for 24 hours, and then the surface of layer C was measured again.
Next, the sample was allowed to stand in a room with a room temperature of 60 ° C. and a relative humidity of 10% or less for 24 hours, and then the sample was left in a room with a room temperature of 23 ° C. and a relative humidity of 50% for 24 hours, and then the surface of layer C was measured. Are listed in Table 1 as “after storage”.
[0013]
[Table 1]

[0014]
The symbols in Table 1 are as follows.
PET: Polyethylene terephthalate PP: Polypropylene Ny: Nylon PC: Polycarbonate O-: Biaxial stretching.
LDPE: Low density polyethylene MLDPE: Low density polyethylene synthesized using metallocene catalyst EVA: Ethylene-vinyl acetate copolymer EEA: Ethylene-ethyl acrylate copolymer EMMA: Ethylene-methyl methacrylate copolymer ION: Ionomer 0015
【The invention's effect】
According to the present invention, static electricity troubles in the mounting process can be prevented, and further, the static electricity troubles can be prevented even in a low humidity environment such as a relative humidity of 12%.
Since it is laminated so that the total light transmittance is 80% or more and the haze is 70% or less, it is easy to confirm the contents after packaging the electronic parts.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a layer structure of a cover tape of the present invention.
FIG. 2 is a cross-sectional view showing a layer structure of a cover tape exemplified in an embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a use state of the cover tape of the present invention adhered to a carrier tape.
[Explanation of symbols]
1: Cover tape 2: Layer A
3: Layer B
4: Layer D
5: polyurethane adhesive layer 6: part to be sealed 7: carrier tape 8: layer C

Claims (4)

A heat sealing material layer (hereinafter abbreviated as layer B) and a base material layer (hereinafter referred to as layer B) are provided from the side that is heat-sealed and heat-sealed by a plastic carrier tape in which storage pockets for storing electronic components are continuously formed. , And a surface tape (hereinafter abbreviated as layer C) having at least three layers, the layer C being an amino-modified (meth) acrylic acid-poly (meta) ) It consists of an acrylic acid copolymer, and the surface resistivity of the layer C after leaving the cover tape in a 23 ° C., 50% RH or 23 ° C. × 12% RH environment for 24 hours is 1 × 10 ¹² Ω / □ Electronic component packaging cover tape characterized by: Between layer A and layer B, polyester layer, nylon layer, polypropylene layer, polyethylene layer,
The cover tape for electronic component packaging according to claim 1, wherein at least one layer selected from the group consisting of ethylene copolymer layers (hereinafter abbreviated as layer D) is laminated.   The main component of layer B is an ethylene copolymer, and the copolymer component thereof is one selected from the group consisting of vinyl acetate, acrylic acid, acrylic acid ester, methacrylic acid, methacrylic acid ester and ionomer. 2. Cover tape for packaging electronic parts according to 2.   The cover tape for electronic component packaging according to any one of claims 1 to 3, wherein the total light transmittance is 80% or more and the haze is 70% or less.

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