JP2004025483A - Cover tape for packaging electronic component - Google Patents
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- JP2004025483A JP2004025483A JP2002181553A JP2002181553A JP2004025483A JP 2004025483 A JP2004025483 A JP 2004025483A JP 2002181553 A JP2002181553 A JP 2002181553A JP 2002181553 A JP2002181553 A JP 2002181553A JP 2004025483 A JP2004025483 A JP 2004025483A
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- 238000004806 packaging method and process Methods 0.000 title claims description 25
- 239000002216 antistatic agent Substances 0.000 claims abstract description 11
- 229920003023 plastic Polymers 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000009751 slip forming Methods 0.000 claims abstract description 4
- 239000012775 heat-sealing material Substances 0.000 claims abstract 3
- -1 polypropylene Polymers 0.000 claims description 20
- 229920001577 copolymer Polymers 0.000 claims description 16
- 239000004793 Polystyrene Substances 0.000 claims description 12
- 229920001038 ethylene copolymer Polymers 0.000 claims description 9
- 229920002223 polystyrene Polymers 0.000 claims description 9
- 239000004698 Polyethylene Substances 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003945 anionic surfactant Substances 0.000 claims description 6
- 239000003093 cationic surfactant Substances 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920001778 nylon Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 150000008051 alkyl sulfates Chemical class 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 229920000554 ionomer Polymers 0.000 claims description 3
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 150000005621 tetraalkylammonium salts Chemical group 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 2
- 125000005227 alkyl sulfonate group Chemical group 0.000 claims description 2
- 230000005611 electricity Effects 0.000 abstract description 6
- 230000003068 static effect Effects 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 55
- 238000000034 method Methods 0.000 description 6
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 239000012793 heat-sealing layer Substances 0.000 description 1
- 239000012968 metallocene catalyst Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229920003066 styrene-(meth)acrylic acid ester copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
Images
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- Packages (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】
【発明が属する技術分野】
本発明は、電子部品の保管、輸送、装着に際し、電子部品を汚染から保護し、電子回路基板に実装するために整列させ、取り出せる機能を有する包装体のうち、収納ポケットを形成したプラスチック製キャリアテープにシールされ得るカバーテープに関するものである
【０００２】
【従来の技術】
近年、ＩＣを始めとして、トランジスター、ダイオード、コンデンサー、圧電素子レジスター、などの表面実装用電子部品は、電子部品の形状に合わせて、収納しうるエンボス成形されたポケットを連続的に形成したプラスチック製キャリアテープとキャリアテープにシールし得るカバーテープとからなる包装体に包装されて供給されている。内容物の電子部品は包装体のカバーテープを剥離した後、自動的に取り出され電子回路基板に表面実装されている。その際、剥離強度の最大値と最小値の差が大きいとキャリアテープが波打ち電子部品が飛び出したり、剥離強度が強すぎるとカバーテープが切れたりする場合がある。また、弱すぎると実装工程に至る迄にカバーテープが剥がれてしまい電子部品が脱落する。
電子部品の中には静電気により内部回路が破壊され易いものやカバーテープを剥離した時に発生する静電気によりカバーテープに付着してしまうものがある。その為、実装工程においてキャリアテープから電子部品をうまく取り出せないトラブルが発生する。
【０００３】
【発明が解決しようとする課題】
本発明は、前述のトラブルを防止すべく剥離強度が強すぎず弱すぎず、剥離強度の最大値と最小値の差が小さく且つ静電気特性に優れたカバーテープを提供する。
【０００４】
【課題を解決するための手段】
本発明は
（１） 電子部品を収納する収納ポケットを連続的に形成したプラスチック製キャリアテープに、熱シールしうるカバーテープであって、該カバーテープはキャリアテープに熱シールされる側から少なくとも熱シール材層（以下、層Ｂと略す。）、基材層（以下、層Ａと略す。）の２層からなり層Ｂの上に帯電防止剤層を備え該表面の表面抵抗値が１×１０１２Ω／□以下である事を特徴とする電子部品包装用カバーテープ、
（２） 層Ａと層Ｂとの間に、ポリエステル層、ナイロン層、ポリプロピレン層、ポリエチレン層、エチレン共重合体層からなる群より選ばれた１種以上の層が積層されてなる（１）項記載の電子部品包装用カバーテープ、
（３） 層Ｂの主成分がエチレン共重合体でありその共重合成分が、酢酸ビニル、アクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステル及びアイオノマーからなる群より選ばれた１種である（１）または（２）項記載の電子部品包装用カバーテープ、
（４） 層Ｂの副成分がポリスチレン、スチレン−メタクリル酸エステル共重合体、スチレン−ブタジエン共重合体、スチレン−水素添加ブタジエン共重合体、スチレン−イソプレン共重合体、スチレン−水素添加イソプレン共重合体、ポリエチレンである（１）、（２）または（３）項記載の電子部品包装用カバーテープ、
（５） 帯電防止剤層が酸化錫、酸化亜鉛、酸化チタン、カーボンブラックのいずれか又はこれらの組合せから成る導電性微粉末及び／または界面活性剤を分散させてなる（１）〜（４）項のいずれかに記載の電子部品包装用カバーテープ、
（６） 界面活性剤がカチオン系界面活性剤又はアニオン系界面活性剤である（５）項に記載の電子部品包装用カバーテープ、
（７） カチオン系界面活性剤がテトラアルキルアンモニウム塩或いはトリアルキルベンジルアンモニウム塩である（６）項に記載の電子部品包装用カバーテープ、
（８） アニオン系界面活性剤がアルキルスルホン酸塩、アルキルベンゼンスルホン酸塩、アルキルサルフェート、アルキルホスフェートである（６）項に記載の電子部品包装用カバーテープ、
（９） 該カバーテープをキャリアテープと熱シールした後、カバーテープをキャリアテープから剥離される時の強度が０．１〜１．３Ｎである（１）〜（８）項のいずれかに記載の電子部品包装用カバーテープ、
（１０） 全光線透過率が８０％以上で曇度が７０％以下である（１）〜（９）項のいずれかに記載の電子部品包装用カバーテープ、
（１１） 該カバーテープをキャリアテープと熱シールした後、カバーテープをキャリアテープから剥離される時の剥離強度の最大値と最小値の差が１ｍｍ巾当たり０．０１〜０．４Ｎである（１）〜（１０）項のいずれかに記載の電子部品包装用カバーテープ
である。
【０００５】
【発明の実施の形態】
本発明のカバーテープ１の構成要素の一例を図１で説明すると、層Ａ２が基材層であり、厚みが６〜１００μｍの透明で剛性の高いフィルムである。層Ａ２に用いる熱可塑性樹脂としてはポリカーボネート、ポリエーテルスルフォン、ポリエーテルイミド、ポリイミド、ナイロン又はポリエステルなどの１．８２ＭＰａ負荷における荷重たわみ温度（ＡＳＴＭ Ｄ−６４８）が６０℃以上である熱可塑性樹脂である事が好ましい。
カバーテープの機械強度を上げる為に二層以上、該フィルムを積層してもよい。
【０００６】
層Ｂ３は該当するキャリアテープに熱シールでき常に安定した剥離強度が得られる樹脂であれば特に限定しないが、キャリアテープと熱シールした後、カバーテープをキャリアテープから剥離される時の剥離強度の最大値と最小値の差が１ｍｍ巾当たり０．０１〜０．４Ｎにする為には層Ｂ３の主成分がエチレン共重合体でありその共重合成分が、酢酸ビニル、アクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステル及びアイオノマーからなる群より選ばれた１種であり、層Ｂ３の副成分がポリスチレン、スチレン−メタクリル酸エステル共重合体、スチレンーブタジエン共重合体、スチレンー水素添加ブタジエン共重合体、スチレンーイソプレン共重合体、スチレンー水素添加イソプレン共重合体、ポリエチレンである熱可塑性樹脂の混合物である事が好ましい。
基材の機械強度を上げる為に層Ａと層Ｂの間にポリエステル層、ナイロン層又はポリプロピレン層を設けてもよく、また基材との密着強度を上げる為に層Ａと層Ｂの間にポリエチレン、ポリエチレン系共重合体、ポリウレタン系接着剤或いはエポキシ系接着剤を設けてもよい。
【０００７】
本発明の層Ｂ３に用いる副成分にポリスチレンを用いる場合、ポリスチレンはゴム成分を含み耐衝撃性を上げたハイインパクトポリスチレン（ＨＩＰＳ）等、種々選択できるが透明性、熱安定性の面から一般用ポリスチレン（ＧＰＰＳ）が更に望ましい。
【０００８】
本発明のカバーテープは、包装される電子部品が静電気により破壊されたり、電子部品の大きさが小さい為に実装工程でカバーテープが剥がされる時に静電気でカバーテープに付着するなどのトラブルを防止する為に層Ｂの表面に帯電防止剤層を設ける。。
帯電防止処方の一つとして層Ｂに帯電防止剤を混合する方法があるが１×１０８〜１×１０１２Ω／□と言った低い表面抵抗値を得る為に、本発明では層Ｂの表面に帯電防止剤層を設けるものである。
本発明の帯電防止剤層に用いる帯電防止剤としては、導電性微粉末及び／又は界面活性剤が挙げられる。導電性微粉末としては酸化錫、酸化亜鉛、酸化チタン、カーボンブラックがあげられる。これらを単体で使用しても効果は得られるがこれら２種以上を組み合わせて使用しても差し支えない。また、これらに界面活性剤を添加してもよい。また、界面活性剤を単独で使用しても良い。
【０００９】
界面活性剤は両性或いは非イオン系の界面活性剤を用いた場合、１×１０１２Ω／□と言った低い表面抵抗値を得る為には３ｍｇ／ｍ２以上の塗布量が必要になり剥離強度の低下が著しくなるのでカチオン系或いはアニオン系界面活性剤を用いる事が好ましい。
カチオン系界面活性剤としてはテトラアルキルアンモニウム塩或いはトリアルキルベンジルアンモニウム塩が好ましい。アニオン系界面活性剤としてはアルキルスルホン酸塩、アルキルベンゼンスルホン酸塩、アルキルサルフェート、アルキルホスフェートが好ましい。
【００１０】
該カバーテープは全光線透過率は８０％以上、曇度は７０％以下になる様、積層しなければならない。全光線透過率が８０％未満、曇度が７０％以上になると検査員にもよるがカバーテープで電子部品を包装した後に内容物が正しく挿入されているかどうか検査する際、困難になる。
【００１１】
【実施例】
本発明の実施例を以下に示すがこれらの実施例によって本発明は何ら限定されるものではない。
《実施例１〜４及び比較例１〜３》
表１にあげた第１層（＝本発明の層Ａに相当する）と、表１にあげた第２層〜第７層及び熱シール層（本発明の層Ａの一部、中間層、層Ｂに相当する）を共押出法により製膜したフィルムとをドライラミネートした。更に層Ｂ表面に帯電防止剤を厚みが５ｎｍとなる様、グラビュアコーティングにより設け、図２に示した層構成のカバーテープを得た。
得られたカバーテープを５．５ｍｍ巾にスリット後、８ｍｍ巾のポリスチレン製キャリアテープとシール温度１６０℃でシールを行い、剥離強度を測定した。表面抵抗値はＳＩＭＣＯ製ワークサーフェイステスターにより、全光線透過率、曇度はＪＩＳ Ｋ７１０５に従って測定した。
【００１２】
実施例及び比較例について表１に示した。
各層の右数字は各層の厚み（単位：μｍ）を、熱シール層枠内のエチレン共重合体欄は、エチレン共重合体の共重合成分を示す。ポリスチレン欄のＰＳの下数字はエチレン共重合体１００重量部に対する添加材（ＰＳ）の添加重量部を意味する。括弧内数字はエチレン共重合体の共重合比率を意味する。全光線透過率以下の右枠内の記号はそれぞれの単位を意味する。
【００１３】
【表１】
表１中の記号は以下の通りである。
ＰＥＴ ：ポリエチレンテレフタレート
ＰＰ ：ポリプロピレン
Ｎｙ ：ナイロン
ＰＣ ：ポリカーボネート
Ｏ− ：二軸延伸の意味。
ＬＤＰＥ ：低密度ポリエチレン
ＭＬＤＰＥ：メタロセン系触媒を使用して合成した低密度ポリエチレン
ＰＳ ：ポリスチレン
ＰＳ−ＭＭＡ：ポリスチレンーメチルメタクリレート共重合体
ＥＶＡ ：エチレンー酢酸ビニル共重合体
ＥＥＡ ：エチレンーエチルアクリレート共重合体
ＥＭＭＡ ：エチレンーメチルメタクリレート共重合体
ＳＥＢＳ ：スチレンーエチレンーブチレンースチレンブロック共重合体
ＡＤ ：接着性樹脂（ポリエチレン酸変性物）
ＤＬ ：ドライラミネート接着剤層
【００１５】
【発明の効果】
本発明に従うと、剥離強度が強すぎず弱すぎず、また、剥離強度の最大値と最小値の差が小さくなる様、制御できる為、実装工程における剥離強度によるトラブルを防止できる。
また、シール面の表面抵抗値が１×１０１２Ω／□以下である為、該工程における静電気によるトラブルを防止できる。
全光線透過率が８０％以上、曇度が７０％以下になる様、積層されている為、電子部品包装後の内容物の確認が容易になる。
【図面の簡単な説明】
【図１】本発明のカバーテープの層構成を示す断面図である。
【図２】本発明の実施例にあげたカバーテープの層構成を示す断面図である。
【図３】本発明のカバーテープをキャリアテープに接着し、その使用状態を示す断面図である。
【符号の説明】
１：カバーテープ
２：層Ａ
３：層Ｂ
４：層Ｂを除く共押出層
５：ポリウレタン系接着剤層
６：シールされる部分
７：キャリアテープ
８：帯電防止剤層[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plastic carrier in which a storage pocket is formed in a package having a function of protecting electronic components from contamination, aligning and mounting the electronic components on an electronic circuit board when storing, transporting, and mounting the electronic components. The present invention relates to a cover tape that can be sealed to a tape.
[Prior art]
In recent years, electronic components for surface mounting, such as ICs, transistors, diodes, capacitors, piezoelectric element registers, etc., are made of plastic in which embossed pockets that can be accommodated are continuously formed according to the shape of the electronic components. It is supplied by being packaged in a package consisting of a carrier tape and a cover tape that can be sealed to the carrier tape. After peeling off the cover tape of the package, the electronic components of the contents are automatically taken out and surface-mounted on the electronic circuit board. At this time, if the difference between the maximum value and the minimum value of the peel strength is large, the carrier tape may undulate and the electronic component may jump out. If the peel strength is too strong, the cover tape may be cut. On the other hand, if it is too weak, the cover tape will peel off before the mounting process, and the electronic components will fall off.
Some of the electronic components are such that the internal circuit is easily broken by static electricity, and those that adhere to the cover tape due to static electricity generated when the cover tape is peeled off. Therefore, a trouble occurs in which the electronic components cannot be taken out of the carrier tape in the mounting process.
[0003]
[Problems to be solved by the invention]
The present invention provides a cover tape that has a peel strength that is not too strong or too weak to prevent the above-mentioned troubles, has a small difference between the maximum value and the minimum value of the peel strength, and is excellent in electrostatic characteristics.
[0004]
[Means for Solving the Problems]
The present invention provides (1) a cover tape that can be heat-sealed to a plastic carrier tape in which storage pockets for housing electronic components are continuously formed, wherein the cover tape is at least heat-sealed from the side that is heat-sealed to the carrier tape. An antistatic agent layer is provided on layer B consisting of a sealing material layer (hereinafter abbreviated as layer B) and a base material layer (hereinafter abbreviated as layer A). The surface resistance of the surface is 1 ×. A cover tape for packaging electronic parts, wherein the cover tape is 10 12 Ω / □ or less;
(2) One or more layers selected from the group consisting of a polyester layer, a nylon layer, a polypropylene layer, a polyethylene layer, and an ethylene copolymer layer are laminated between the layer A and the layer B (1) Cover tape for packaging electronic components according to the item,
(3) The main component of the layer B is an ethylene copolymer, and the copolymer component is one selected from the group consisting of vinyl acetate, acrylic acid, acrylic acid ester, methacrylic acid, methacrylic acid ester and ionomer. (1) The cover tape for packaging electronic parts according to (2),
(4) The subcomponent of layer B is polystyrene, styrene-methacrylate copolymer, styrene-butadiene copolymer, styrene-hydrogenated butadiene copolymer, styrene-isoprene copolymer, styrene-hydrogenated isoprene copolymer. (1), (2) or (3), wherein the cover tape is for packaging electronic parts;
(5) The antistatic agent layer is formed by dispersing a conductive fine powder and / or a surfactant composed of any one of tin oxide, zinc oxide, titanium oxide and carbon black or a combination thereof. The cover tape for packaging electronic components according to any of the items,
(6) The cover tape for packaging electronic parts according to (5), wherein the surfactant is a cationic surfactant or an anionic surfactant.
(7) The cover tape for packaging electronic parts according to (6), wherein the cationic surfactant is a tetraalkylammonium salt or a trialkylbenzylammonium salt.
(8) The cover tape for packaging electronic parts according to (6), wherein the anionic surfactant is an alkyl sulfonate, an alkylbenzene sulfonate, an alkyl sulfate, or an alkyl phosphate.
(9) The heat-sealing of the cover tape with the carrier tape, and the strength at which the cover tape is peeled off from the carrier tape is 0.1 to 1.3 N, according to any one of (1) to (8). Cover tape for electronic parts packaging,
(10) The cover tape for packaging electronic parts according to any one of (1) to (9), wherein the total light transmittance is 80% or more and the haze is 70% or less.
(11) After the cover tape is heat-sealed with the carrier tape, the difference between the maximum value and the minimum value of the peel strength when the cover tape is peeled off from the carrier tape is 0.01 to 0.4 N per 1 mm width ( A cover tape for packaging electronic components according to any one of 1) to (10).
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
One example of the components of the cover tape 1 of the present invention will be described with reference to FIG. 1. The layer A2 is a base material layer, and is a transparent and highly rigid film having a thickness of 6 to 100 μm. As the thermoplastic resin used for the layer A2, a thermoplastic resin having a deflection temperature under load (ASTM D-648) at a load of 1.82 MPa, such as polycarbonate, polyether sulfone, polyether imide, polyimide, nylon or polyester, of 60 ° C. or more is used. Preferably it is.
The film may be laminated in two or more layers in order to increase the mechanical strength of the cover tape.
[0006]
The layer B3 is not particularly limited as long as it is a resin that can be heat-sealed to the corresponding carrier tape and can always obtain a stable peel strength. In order for the difference between the maximum value and the minimum value to be 0.01 to 0.4 N per 1 mm width, the main component of the layer B3 is an ethylene copolymer and the copolymer component is vinyl acetate, acrylic acid, acrylate ester. Methacrylic acid, a methacrylic acid ester and an ionomer, wherein the subcomponent of the layer B3 is polystyrene, a styrene-methacrylic acid ester copolymer, a styrene butadiene copolymer, a styrene-hydrogenated butadiene copolymer. Polymer, styrene-isoprene copolymer, styrene-hydrogenated isoprene copolymer, polyethylene It is preferably a mixture of plastic resin.
A polyester layer, a nylon layer or a polypropylene layer may be provided between layer A and layer B to increase the mechanical strength of the substrate, and between layer A and layer B to increase the adhesion strength with the substrate. Polyethylene, a polyethylene copolymer, a polyurethane adhesive, or an epoxy adhesive may be provided.
[0007]
When polystyrene is used as the secondary component used in the layer B3 of the present invention, polystyrene can be variously selected from high impact polystyrene (HIPS) containing a rubber component and having improved impact resistance, but is generally used in terms of transparency and thermal stability. Polystyrene (GPPS) is more desirable.
[0008]
The cover tape of the present invention prevents troubles such as the electronic components to be packaged being destroyed by static electricity and the electronic components being small in size and being attached to the cover tape by static electricity when the cover tape is peeled off during the mounting process. For this purpose, an antistatic agent layer is provided on the surface of the layer B. .
As one of the antistatic prescriptions, there is a method of mixing an antistatic agent into the layer B. In order to obtain a low surface resistance value of 1 × 10 8 to 1 × 10 12 Ω / □, in the present invention, the layer B is used. An antistatic agent layer is provided on the surface.
Examples of the antistatic agent used in the antistatic agent layer of the present invention include a conductive fine powder and / or a surfactant. Examples of the conductive fine powder include tin oxide, zinc oxide, titanium oxide, and carbon black. The effect can be obtained by using these alone, but they can be used in combination of two or more. Further, a surfactant may be added to these. Further, the surfactant may be used alone.
[0009]
When an amphoteric or nonionic surfactant is used, a coating amount of 3 mg / m 2 or more is required to obtain a low surface resistance value of 1 × 10 12 Ω / □, and peeling is performed. It is preferable to use a cationic or anionic surfactant because the strength is significantly reduced.
As the cationic surfactant, a tetraalkylammonium salt or a trialkylbenzylammonium salt is preferable. As the anionic surfactant, an alkyl sulfonate, an alkylbenzene sulfonate, an alkyl sulfate, and an alkyl phosphate are preferable.
[0010]
The cover tape must be laminated so that the total light transmittance is 80% or more and the haze is 70% or less. When the total light transmittance is less than 80% and the haze is 70% or more, it becomes difficult to inspect whether the contents are correctly inserted after packaging the electronic component with a cover tape, depending on the inspector.
[0011]
【Example】
Examples of the present invention are shown below, but the present invention is not limited by these examples.
<< Examples 1-4 and Comparative Examples 1-3 >>
The first layer (corresponding to the layer A of the present invention) shown in Table 1 and the second to seventh layers and the heat sealing layer shown in Table 1 (a part of the layer A of the present invention, an intermediate layer, (Equivalent to layer B) was dry-laminated with a film formed by a co-extrusion method. Further, an antistatic agent was provided on the surface of the layer B by gravure coating so as to have a thickness of 5 nm to obtain a cover tape having a layer structure shown in FIG.
After slitting the obtained cover tape to 5.5 mm width, it was sealed with a 8 mm wide polystyrene carrier tape at a sealing temperature of 160 ° C., and the peel strength was measured. The surface resistance was measured by a work surface tester manufactured by SIMCO, and the total light transmittance and the haze were measured in accordance with JIS K7105.
[0012]
Table 1 shows Examples and Comparative Examples.
The numbers on the right of each layer indicate the thickness (unit: μm) of each layer, and the ethylene copolymer column in the heat seal layer frame indicates the copolymer component of the ethylene copolymer. The lower number of PS in the polystyrene column means the added part by weight of the additive (PS) with respect to 100 parts by weight of the ethylene copolymer. The number in parentheses means the copolymerization ratio of the ethylene copolymer. Symbols in the right frame below the total light transmittance mean respective units.
[0013]
[Table 1]
The symbols in Table 1 are as follows.
PET: Polyethylene terephthalate PP: Polypropylene Ny: Nylon PC: Polycarbonate O-: Meaning of biaxial stretching.
LDPE: low density polyethylene MLDPE: low density polyethylene synthesized using a metallocene catalyst PS: polystyrene PS-MMA: polystyrene-methyl methacrylate copolymer EVA: ethylene-vinyl acetate copolymer EEA: ethylene-ethyl acrylate copolymer EMMA: Ethylene-methyl methacrylate copolymer SEBS: Styrene-ethylene butylene-styrene block copolymer AD: Adhesive resin (modified with polyethylene acid)
DL: dry laminate adhesive layer
【The invention's effect】
According to the present invention, since the peel strength is not too strong or too weak, and the difference between the maximum value and the minimum value of the peel strength can be controlled to be small, trouble due to the peel strength in the mounting process can be prevented.
Further, since the surface resistance of the sealing surface is 1 × 10 12 Ω / □ or less, troubles due to static electricity in the process can be prevented.
Since the layers are laminated so that the total light transmittance is 80% or more and the haze is 70% or less, it is easy to confirm the contents after packaging the electronic parts.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a layer structure of a cover tape of the present invention.
FIG. 2 is a sectional view showing a layer structure of a cover tape according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a state in which the cover tape of the present invention is adhered to a carrier tape and used.
[Explanation of symbols]
1: Cover tape 2: Layer A
3: Layer B
4: Co-extruded layer excluding layer B 5: Polyurethane adhesive layer 6: Sealed portion 7: Carrier tape 8: Antistatic agent layer
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002181553A JP2004025483A (en) | 2002-06-21 | 2002-06-21 | Cover tape for packaging electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002181553A JP2004025483A (en) | 2002-06-21 | 2002-06-21 | Cover tape for packaging electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004025483A true JP2004025483A (en) | 2004-01-29 |
Family
ID=31178356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002181553A Pending JP2004025483A (en) | 2002-06-21 | 2002-06-21 | Cover tape for packaging electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004025483A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006182418A (en) * | 2004-12-28 | 2006-07-13 | Shin Etsu Polymer Co Ltd | Cover tape and electronic component packaging |
| CN101973150A (en) * | 2010-08-25 | 2011-02-16 | 浙江洁美电子科技有限公司 | Gluing belt used for packaging carrier of electronic element and preparation method thereof |
| US20130089746A1 (en) * | 2010-06-15 | 2013-04-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover tape |
-
2002
- 2002-06-21 JP JP2002181553A patent/JP2004025483A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006182418A (en) * | 2004-12-28 | 2006-07-13 | Shin Etsu Polymer Co Ltd | Cover tape and electronic component packaging |
| US20130089746A1 (en) * | 2010-06-15 | 2013-04-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover tape |
| KR20130112027A (en) * | 2010-06-15 | 2013-10-11 | 덴키 가가쿠 고교 가부시기가이샤 | Cover tape |
| KR101685749B1 (en) | 2010-06-15 | 2016-12-12 | 덴카 주식회사 | Cover tape |
| US9662866B2 (en) * | 2010-06-15 | 2017-05-30 | Denka Company Limited | Cover tape |
| CN101973150A (en) * | 2010-08-25 | 2011-02-16 | 浙江洁美电子科技有限公司 | Gluing belt used for packaging carrier of electronic element and preparation method thereof |
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