JP2020073401A - Cover tape for packaging electronic parts - Google Patents

Abstract

To provide a cover tape for packaging electronic parts having excellent balance in an attachment property and detachment property onto a carrier tape and an excellent antistatic property on an attachment surface with the carrier tape.SOLUTION: There is provided a cover tape for packaging electronic parts, comprising a substrate layer 1 and a sealant layer 2 arranged on one surface side of the substrate layer 1. Onto a side surface of the substrate layer 1 of one of the cover tape for packaging electronic parts opposite to the surface onto which the sealant layer 2 is arranged, a surface of the sealant layer 2 of another cover tape for packaging electronic parts is superposed. When the one of the cover tape for packaging electronic parts and another cover tape for packaging electronic parts are used and a friction test is carried out at a speed of 100 mm/min under condition where 200 g of load is applied according to JIS K7125, dynamic coefficient friction is 0.1 or more and 1.5 or less on the surface of the substrate layer 1 of the one of the cover tape for packaging electronic parts opposite to the surface onto which the sealant layer 2 is arranged.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cover tape for packaging electronic parts.

  BACKGROUND ART Conventionally, electronic parts such as a transistor, a diode, a capacitor, and a piezoelectric element resistor are provided on a carrier tape in which a pocket capable of accommodating the electronic part is continuously formed at the manufacturing site of the electronic device, and the carrier tape. After being housed in a package consisting of a cover tape to be sealed and subjected to heat-sealing treatment, it is transported to a work area where surface mounting is performed on an electronic circuit board, etc., while being wound on a reel made of paper or plastic. There is. Then, after peeling off the cover tape of the package in the working area, the electronic component is taken out from the pocket formed in the carrier tape and surface-mounted on the electronic circuit board or the like. With the recent miniaturization of electronic devices, further miniaturization and high-level mounting of the electronic components are required. Therefore, recent electronic components tend to be more easily affected by static electricity.

  In view of such circumstances, in recent years, it has been required to improve various characteristics described later even in a cover tape used for carrying electronic components. First, the property required of the cover tape is a balance between the adhesiveness with the carrier tape and the releasability to the extent that static electricity can be prevented when peeling from the carrier tape. Secondly, the characteristic required for the cover tape is the transparency required to inspect the electronic components housed inside the package. Thirdly, the characteristics required of the cover tape are static electricity generated by friction between the cover tape and electronic components during transportation, static electricity generated when the cover tape is peeled from the carrier tape, and dust and contents attached. The antistatic property is required to the extent that it is possible to prevent the electronic parts housed in the package from breaking down (electrostatic destruction) due to static electricity or the like. In particular, regarding the technology for improving the antistatic property of the cover tape, the influence of static electricity caused by friction between the cover tape and electronic components during transportation and static electricity generated when the cover tape is peeled from the carrier tape is suppressed. From this point of view, various studies have been made so far.

  For example, in Patent Document 1, a sealant layer is provided on a base material layer in order to suppress electrification generated at the time of peeling from a carrier tape, and the sealant layer includes a polyolefin resin and a polyether / polyolefin copolymer. A cover tape including is disclosed.

  Patent Document 2 discloses a cover tape in which the surface resistance value of the sealant layer surface is controlled so as to satisfy a specific condition in order to suppress electrification and the like generated by friction between the cover tape and the electronic component.

JP, 2012-214252, A JP2012-30897A

As described above in the section of the background art, various studies have been made on improving the above-mentioned three characteristics even in the conventional cover tape. However, in recent years, the technical level required in terms of measures against static electricity of cover tapes has become higher and higher. The present inventor has found the following problems regarding the conventional cover tape.
Specifically, the present inventor uses the carrier tape and the cover tape when the cover tape for sealing the carrier tape is unwound or when the package containing the electronic components is conveyed in a state wound on a reel. Due to static electricity generated by friction on the surface that is adhered, that is, the surface of the cover tape opposite to the sealant layer surface, the electronic parts housed in the package may malfunction, or problems such as sticking during mounting on the board may occur. It has been found that it may cause. From this, the present inventor has found that the conventional cover tape has room for improvement in terms of measures against static electricity on the surface opposite to the surface of the sealant layer.

  Therefore, the present invention provides a cover tape for packaging electronic parts, which is excellent in the balance between the adhesiveness to the carrier tape and the releasability, and the antistatic property on the adhesive surface to the carrier tape.

  The present inventor has conducted extensive studies in order to achieve the above-mentioned object, and as a result, in a cover tape having a base material layer and a sealant layer provided on one surface side of the base material layer, one of the cover tapes described above is used. The sealant layer in the base material layer, which was measured when a friction test was performed by superposing the surface of the sealant layer of another cover tape on the surface opposite to the surface provided with the sealant layer, was provided. The present invention has been completed based on the finding that the scale of the dynamic friction coefficient of the surface opposite to the surface is effective as a design guideline for improving the antistatic property of the adhesive surface to the carrier tape.

According to the present invention, a substrate layer,
A cover tape for packaging electronic parts, comprising a sealant layer provided on one surface side of the base material layer,
One surface of the sealant layer of the other cover tape for packaging electronic parts is superposed on a surface of the base material layer of the cover tape for packaging electronic parts opposite to the surface on which the sealant layer is provided. In addition, a friction test was performed at a speed of 100 mm / min with a load of 200 g according to JIS K7125, using the one cover tape for packaging electronic parts and the other cover tape for packaging electronic parts. When carried out, the coefficient of dynamic friction of the surface of the base material layer of the one cover tape for packaging electronic parts opposite to the surface on which the sealant layer is provided is 0.1 or more and 1.5 or less, A cover tape for packaging electronic components is provided.

  According to the present invention, it is possible to provide a cover tape for packaging electronic parts, which is excellent in the balance between the adhesiveness to the carrier tape and the releasability, and the antistatic property on the adhesive surface to the carrier tape.

It is a schematic sectional drawing which shows an example of the cover tape for electronic component packaging which concerns on this embodiment. It is a figure which shows an example of the state which sealed the cover tape for electronic component packaging which concerns on this embodiment with the carrier tape.

FIG. 1 is a schematic cross-sectional view showing an example of an electronic component packaging cover tape according to this embodiment.
As shown in FIG. 1, a cover tape 10 for electronic component packaging (hereinafter, also referred to as “cover tape”) according to the present embodiment is provided on a base material layer 1 and one surface side of the base material layer 1. And a sealant layer 2. The cover tape 10 has a surface opposite to the surface of the base material layer 1 of the cover tape 10 opposite to the surface on which the sealant layer 2 is provided. And one of the cover tapes 10 and the other of the cover tapes 10 are used, and a friction test is performed at a speed of 100 mm / min under a load of 200 g according to JIS K7125 (hereinafter, in the present embodiment. Such a friction test is also performed.), The dynamic friction coefficient of the surface of the base material layer 1 of the one cover tape 10 opposite to the surface on which the sealant layer 2 is provided is 0.1 or more and 1.5 or more. It is below. By doing so, it is possible to realize a cover tape that is excellent in the balance between the adhesiveness to the carrier tape and the releasability and the antistatic property that accompanies the peeling of the carrier tape.

First, a method of using the cover tape will be described with reference to FIG.
As shown in FIG. 2, the cover tape 10 is used as a lid material for a carrier tape 20 in which concave pockets 21 are continuously provided in accordance with the shape of an electronic component. Specifically, the cover tape 10 is used by being adhered (for example, heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. In the following description, the structure obtained by adhering the cover tape 10 and the carrier tape 20 to each other will be referred to as a package 100 for electronic parts.

  In fact, at the manufacturing site of electronic equipment, the package 100 for electronic parts is manufactured by the following procedure. First, the electronic component is housed in the pocket 21 of the carrier tape 20. Next, the cover tape 10 is adhered to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20 to obtain a structure in which electronic components are hermetically housed in the package 100. You can As described in the above-mentioned background art, the structure containing such electronic components is a work for surface mounting on the electronic circuit board or the like with the package 100 wound around the reel made of paper or plastic. It is transported to the area. When the package 100 is wound around the above-described reel and the electronic component is transported, the bottom surface 20a of the carrier tape 20 is in contact (friction) with the surface 10a of the cover tape 10.

  The inventor of the present invention, when the surface of the sealant layer of the cover tape and the surface on the opposite side of the cover tape are separated from each other when the structure including the electronic component produced using the conventional cover tape is produced, or the conventional cover tape. When a structure containing electronic components manufactured by using the above is conveyed in a state of being wound on a reel, a surface bonding the carrier tape and the cover tape by vibration during conveyance, that is, a sealant in the cover tape. It was found that the static electricity generated by the friction on the surface opposite to the layer surface may cause troubles such as electronic components contained in the package or sticking at the time of mounting on the substrate. Therefore, the conventional cover tape has room for improvement in terms of measures against static electricity on the surface opposite to the surface of the sealant layer.

  In particular, most conventional cover tapes have a large dynamic friction coefficient between the surface of the base material layer opposite to the surface on which the sealant layer is provided and the surface of the sealant layer. Specifically, in the conventional cover tape, the dynamic friction coefficient of the surface of the base material layer opposite to the surface on which the sealant layer is provided has a value of more than 1.5. From this, in the conventional cover tape, the present inventor has found that the surface of the base material layer opposite to the surface on which the sealant layer is provided and the static electricity generated by the contact and friction between the surface of the sealant layer. The design guideline for reducing the electric charge derived from the above was thoroughly studied, and the design guideline of the cover tape 10 was found.

  The cover tape 10 according to the present embodiment is opposite to the surface of the base material layer 1 which is in contact with the sealant layer 2 when the friction test according to the present embodiment is performed as described above, on which the sealant layer 2 is provided. The coefficient of dynamic friction of the side surface is 0.1 or more and 1.5 or less. When the value of the dynamic friction coefficient is within the above numerical range, static electricity generated by contact between the bottom surface of the carrier tape and the surface of the cover tape 10 due to vibration during transportation of the electronic component is generated between the carrier tape and the cover tape 10. It is possible to reduce the influence on the electronic components housed in the package made of. Therefore, due to the vibration generated when the electronic component is transported, the bottom surface of the carrier tape comes into contact with the surface of the cover tape 10, and the electronic component is electrostatically destroyed by the electrostatic charge. It is possible to suppress the inconvenience of causing

  In the cover tape 10 according to the present embodiment, the value of the dynamic friction coefficient of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is 0.1 or more and 1.5 or less, but is preferable. Is 0.15 or more and 1.45 or less, and more preferably 0.2 or more and 1.4 or less. When the value of the dynamic friction coefficient is within the above numerical range, the antistatic property due to peeling of the carrier tape can be further improved. In most of the conventional representative cover tapes, the surface of the base material layer opposite to the surface on which the sealant layer 2 is provided has a coefficient of dynamic friction of about 2.0. In particular, in the cover tape 10 according to the present embodiment, when the value of the dynamic friction coefficient of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is equal to or less than the upper limit value, static electricity is generated by friction. The cover tape 10 having excellent discharge characteristics can be realized even in the case of occurrence of. Further, when the value of the dynamic friction coefficient of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is equal to or more than the lower limit value, the cover tape 10 and the electronic component rub during conveyance. It is possible to realize the cover tape 10 having excellent discharge characteristics such as static electricity generated by the above, static electricity generated when the cover tape 10 is peeled from the carrier tape, static electricity generated by the attached dust or contents, and the like.

  The total light transmittance of the cover tape 10 according to the present embodiment is preferably 80% or more, more preferably 85% or more. When the value of the total light transmittance of the cover tape 10 is within the above numerical range, it is determined whether or not the electronic component is correctly accommodated in the pocket of the carrier tape in the package including the cover tape 10 and the carrier tape. The required transparency can be provided to the extent that it can be inspected. In other words, by setting the total light transmittance of the base material layer 1 to be equal to or more than the above lower limit value, the electronic component housed inside the package formed of the cover tape 10 and the carrier tape can be visually recognized from the outside of the package. It becomes possible to confirm. The total light transmittance of the cover tape 10 can be measured according to JIS K7105 (1981).

  The width of the cover tape 10 according to the present embodiment is preferably 2 mm or more and 100 mm or less, more preferably 2 mm or more and 80 mm or less, and most preferably 2 mm or more and 50 mm or less.

  Further, the cover tape 10 according to the present embodiment has a surface opposite to the surface on which the sealant layer 2 is provided in the base material layer 1 of the one cover tape 10 when the friction test according to the present embodiment is performed. The coefficient of static friction is preferably 0.5 or more and 1.7 or less, more preferably 0.55 or more and 1.65 or less, and still more preferably 0.6 or more and 1.6 or less. When the value of the coefficient of static friction is within the above numerical range, the antistatic property associated with peeling of the carrier tape can be further improved. In particular, when the value of the coefficient of static friction of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is less than or equal to the above upper limit, excellent discharge characteristics are obtained even when static electricity is generated by friction. The cover tape 10 can be realized. When the value of the coefficient of static friction of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is equal to or more than the above lower limit value, the cover tape 10 and the electronic component rub against each other during transportation. It is possible to realize the cover tape 10 having excellent discharge characteristics such as static electricity generated by the above, static electricity generated when the cover tape 10 is peeled from the carrier tape, static electricity generated from attached dust or contents, and the like.

  Hereinafter, the structure of each layer forming the cover tape 10 according to the present embodiment will be described in detail.

<Base material layer>
The material constituting the base material layer 1 is used when the cover tape 10 is manufactured by laminating the sealant layer 2 and the like on the base material layer 1 and when the cover tape 10 is adhered to the carrier tape. Had a mechanical strength sufficient to withstand an externally applied stress when used, and a heat resistance sufficient to withstand a heat history applied when the cover tape 10 is bonded to the carrier tape. Anything will do. The form of the material forming the base material layer 1 is not particularly limited, but is preferably processed into a film from the viewpoint of easy processing.

  Specific examples of the material forming the base material layer 1 include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin and the like. Be done. Among them, polyester resin is preferable and polyethylene terephthalate is more preferable from the viewpoint of improving the mechanical strength of the cover tape 10. Further, from the viewpoint of improving the mechanical strength and flexibility of the cover tape 10, nylon 6 may be used as the material forming the base material layer 1. In addition, a lubricant may be included in the material forming the base material layer 1.

  The base material layer 1 may be formed by a single layer film containing the above-mentioned material, or may be formed by using a multilayer film containing the above-mentioned material in each layer. The form of the film used to form the base material layer 1 may be an unstretched film or a uniaxially or biaxially stretched film. From the viewpoint of improving mechanical strength, the film is preferably a uniaxially or biaxially stretched film.

  The thickness of the base material layer 1 is preferably 9 μm or more and 25 μm or less, and more preferably 9 μm or more and 16 μm or less. When the thickness of the base material layer 1 is less than or equal to the above upper limit, the rigidity of the cover tape 10 does not become too high, and even if a twist stress is applied to the carrier tape after sealing, the cover tape 10 is It is possible to follow the deformation of the carrier tape and suppress the peeling. Further, when the thickness of the base material layer 1 is equal to or more than the above upper limit value, the mechanical strength of the cover tape 10 can be made good, and therefore the case where the cover tape 10 is peeled from the carrier tape at a high speed. However, it is possible to prevent the cover tape 10 from breaking.

  The total light transmittance of the base material layer 1 is preferably 80% or more, and more preferably 85% or more. When the value of the total light transmittance of the base material layer 1 is within the above numerical range, whether or not the electronic component is correctly accommodated in the pocket of the carrier tape in the package including the cover tape 10 and the carrier tape. The required transparency can be imparted to the extent that it can be inspected. In other words, by setting the total light transmittance of the base material layer 1 to be equal to or more than the above lower limit value, the electronic component housed inside the package formed of the cover tape 10 and the carrier tape can be visually recognized from the outside of the package. It becomes possible to confirm. The total light transmittance of the base material layer 1 can be measured according to JIS K7105 (1981).

The surface resistance value of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is set to 23 ° C. and 30% RH from the viewpoint of efficiently discharging static electricity generated by various factors to the outside. And preferably 1 × 10 ⁷ Ω / □ or more and 5 × 10 ¹³ Ω / □ or less, and more preferably 1 × 10 ⁷ Ω / □ or more from the viewpoint of improving the antistatic property of the cover tape 10. It is 1 × 10 ¹⁰ Ω / □ or less, and most preferably 2 × 10 ⁷ Ω / □ or more and 5 × 10 ⁹ Ω / □ or less.

<Sealant layer>
The surface of the sealant layer 2 in the cover tape 10 according to the present embodiment comes into contact with the carrier tape when the cover tape 10 is used by the method described above.

  As a material forming the sealant layer 2, a material containing a thermoplastic resin such as an acrylic resin or a polyester resin and an antistatic agent can be used. Specific examples of the antistatic agent include tin oxide, zinc oxide, titanium oxide, metal fillers such as smectite, surfactants such as polyoxyethylene alkylamine, quaternary ammonium and alkyl sulfonate, and selected from the group consisting of carbon. One of them or a mixture thereof. As the carbon, it is possible to use fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube.

  The material forming the sealant layer 2 includes oxide particles containing silicon, magnesium or calcium as a main component, inorganic particles such as silica and talc, polyethylene particles, and polyacrylate particles from the viewpoint of preventing blocking during transportation. And one kind selected from the group consisting of organic particles such as polystyrene particles or alloys thereof.

  The thickness of the sealant layer 2 is preferably 1 μm or more and 15 μm or less, more preferably 1 μm or more and 10 μm or less, and most preferably, from the viewpoint of improving the balance between the adhesiveness to the carrier tape and the releasability. It is 1 μm or more and 5 μm or less.

The surface resistance value of the sealant layer 2 should be 10 ⁴ Ω / □ or more and 10 ¹² Ω / □ or less under the conditions of 23 ° C. and 50% RH from the viewpoint of efficiently discharging static electricity generated by various factors to the outside. Is preferred.

<Antistatic layer>
The cover tape 10 according to the present embodiment is provided with the sealant layer 2 in the base material layer 1 from the viewpoint of reducing the amount of charge generated due to peeling of the carrier tape when the cover tape 10 is used in the above-described method. It is preferable to have the antistatic layer 3 on the surface opposite to the surface provided (see FIG. 1). The surface of the antistatic layer 3 has a possibility of coming into contact with the bottom surface of the carrier tape when the electronic component is housed and conveyed in the packaging body including the carrier tape and the cover tape 10.
Hereinafter, the cover tape 10 according to the present embodiment will be described by taking as an example the one having the antistatic layer 3 on the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided.

  As a material for forming the antistatic layer 3, a material that can be dispersed or dissolved in a diluting solvent is preferable, and examples thereof include an acrylic compound, an ester compound, a vinyl alcohol compound, and a polyether compound. Above all, it is preferable to blend a material containing an ester compound as a binder resin from the viewpoint of abrasion resistance and transparency. The ester compound refers to a compound formed by binding an organic acid or an inorganic acid and an alcohol by a dehydration reaction, and specific examples thereof include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate and derivatives thereof. Etc.

  The content of the material (binder resin) containing the above-mentioned ester compound is preferably 0.2% by mass or more and 98% by mass or less, and 0.5% by mass, with respect to the total amount of the material forming the antistatic layer 3. More preferably, it is 90% by mass or less. By doing so, the physical strength of the coating film increases and the antistatic agent slips off due to contact.

  The material forming the antistatic layer 3 includes a low-molecular surfactant type, a high-molecular surfactant type, a conductive polymer type, a metal filler, etc., which lowers the surface resistance value of the antistatic layer 3 and causes friction. Among them, the conductive polymer type is preferable from the viewpoint of suppressing the generation of static electricity. Among the conductive polymer types, a polyethylene dioxythiophene / polyanion poly (styrene sulfonate) -based (PEDOT / PSS) conductive polymer is preferable in order to improve antistatic performance.

  The material forming the antistatic layer 3 preferably contains a surfactant from the viewpoint of improving wettability and leveling property when the antistatic layer 3 is formed. The surfactant may be a low-molecular type surfactant or a high-molecular type surfactant, but a surfactant containing a fluoroalkyl structure can be preferably used.

  In addition, the material forming the antistatic layer 3 is highly polar from the viewpoint of further effectively reducing the amount of charge generated due to peeling of the carrier tape when the cover tape 10 is used in the method described above. It is preferable that an organic solvent having a high boiling point be present as a conduction aid. By doing so, the crystal structure of the antistatic agent is adjusted, and as a result, the surface resistance value of the antistatic layer 3 can be reduced. In addition, examples of such a highly polar organic solvent having a high boiling point include dimethyl sulfoxide, N-methylpyrrolidone, and ethylene glycol.

The surface resistance value of the antistatic layer 3 is preferably 1 × 10 ⁷ Ω / under conditions of 23 ° C. and 30% RH from the viewpoint of further effectively reducing the amount of charge generated when the carrier tape is peeled off. □ or more and 1 × 10 ¹⁰ Ω / □ or less, more preferably 2 × 10 ⁷ Ω / □ or more and 5 × 10 ⁹ Ω / □ or less.

  In addition, the material forming the antistatic layer 3 may contain components such as a lubricant and a neutralizing agent, if necessary.

<Other layers>
The cover tape 10 according to the present embodiment may include an intermediate layer (not shown) between the base material layer 1 and the sealant layer 2. By doing so, it is possible to improve the cushioning property of the entire cover tape 10 and improve the adhesion to the carrier tape to be bonded.

  Examples of the material forming the intermediate layer include olefin resins, styrene resins, cyclic olefin resins, and the like. Above all, it is preferable to contain an olefin resin from the viewpoint of improving the adhesion to the carrier tape to be bonded.

  The thickness of the intermediate layer is preferably 10 μm or more and 30 μm or less, and more preferably 15 μm or more and 25 μm or less from the viewpoint of improving the adhesion to the carrier tape to be bonded.

  The cover tape 10 according to the present embodiment may be provided with an adhesive layer (not shown) between the base material layer 1 and the sealant layer 2 or between the base material layer 1 and the antistatic layer 3. By doing so, the mechanical strength of the cover tape 10 can be improved.

  The material forming the adhesive layer described above contains a resin. Specific examples of such a resin include urethane-based adhesive resin for dry lamination, adhesive resin for anchor coat and the like, and generally, those obtained by combining a polyester composition such as polyester polyol or polyether polyol with an isocyanate compound. Can be used.

  Next, a material that forms an object that comes into contact with the surface of the antistatic layer 3 when the electronic component is housed and conveyed will be described. As described above, examples of the object include the bottom surface of the carrier tape and the like, but there is a possibility that the object may come into contact with the surface of the antistatic layer 3 when accommodating and transporting the electronic component or mounting the electronic component. It is not limited as long as it is done. Specific examples of the material forming the object include polystyrene, polyethylene terephthalate, polycarbonate, and other carrier tape forming materials, polyethylene, rubber (natural rubber, synthetic rubber, and other processed materials). ..

Next, a method of manufacturing the cover tape 10 according to this embodiment will be described.
The method for manufacturing the cover tape 10 in this embodiment is different from the conventional manufacturing method, and it is necessary to highly control the manufacturing conditions described later. That is, when the friction test according to the present embodiment is performed for the first time by the manufacturing method in which various factors related to the following two conditions are highly controlled, the sealant layer 2 in the base material layer 1 that is in contact with the sealant layer 2 is It is possible to obtain the cover tape 10 in which the value of the dynamic friction coefficient of the surface opposite to the provided surface satisfies the above-mentioned specific condition.
(1) Combination of a resin material forming the base material layer 1 and a material forming the sealant layer 2 (2) Surface state of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided (surface (Resistance value and composition of materials forming such surface)

However, the cover tape 10 in the present embodiment employs various specific manufacturing conditions such as temperature setting of the manufacturing apparatus, for example, on the assumption that various factors related to the above two conditions are highly controlled. be able to. In other words, the cover tape 10 in the present embodiment can be manufactured by using a known method except for highly controlling various factors related to the above two conditions. Hereinafter, an example of a method for manufacturing the cover tape 10 will be described on the assumption that various factors related to the above two conditions are highly controlled.
First, the antistatic layer 3 is formed by applying a predetermined material to one surface of the base material layer 1 and drying it. Next, the sealant layer 2 is extruded and laminated on the surface of the base material layer 1 opposite to the surface on which the antistatic layer 3 is formed by extrusion. In this way, the cover tape 10 according to the present embodiment can be manufactured. In addition, after the sealant layer 2 is formed into a sheet by an extrusion method, the obtained sheet may be laminated on the surface of the base material layer 1 opposite to the surface on which the antistatic layer 3 is formed.

  When the above-mentioned intermediate layer is formed, the intermediate layer may be laminated on the surface of the base material layer 1 opposite to the surface on which the antistatic layer 3 is formed by extrusion laminating. After the layer is formed into a sheet by an extrusion method, the obtained sheet may be laminated on the surface of the base material layer 1 opposite to the surface on which the antistatic layer 3 is formed.

  When forming the above-mentioned adhesive layer, the material of the adhesive layer may be applied to the target surface by a conventionally known application method.

  The embodiments of the present invention have been described above, but these are examples of the present invention, and various configurations other than the above can be adopted.

  Hereinafter, the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

  The respective raw material components used in the preparation of the antistatic layer, the sealant layer and the base material layer in each example and each comparative example are shown below.

<Antistatic layer>
(Antistatic agent)
-A conductive polymer containing a compound of polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) (WED-SM manufactured by Soken Chemical Industry Co., Ltd.)
(Diluting solvent)
-Diluting solvent: isopropyl alcohol: water = 1: 1
(Neutralizer)
・ Triethylamine (Wako Pure Chemical Industries)
(Surfactant)
・ Surfactant: BYK-3440, manufactured by Big Chemie Japan

(Binder resin)
・ Water-soluble polyester resin (Plus Coat Z565, manufactured by Kyosho Chemical Co., Ltd.)
(Conductive agent)
·ethylene glycol

(Lubricant)
-Lubricant 1: Paraffin wax (AQUACER539, manufactured by BYK)
-Lubricant 2: polyethylene wax (AQUACER531, manufactured by BYK)
-Lubricant 3: Polypropylene wax (AQUACER593, manufactured by BYK)
・ Lubricant 4: Silica (manufactured by Nissan Chemical Industries, IPA-ST, average particle size: 10 μm)
-Lubricant 5: Silica (IPA-ST-L, manufactured by Nissan Kagaku Co., average particle size: 40 μm)
・ Lubricant 6: Silica (manufactured by JGC Catalysts & Chemicals, Spherica slurry 140, average particle size: 140 μm)

<Sealant layer>
Styrene- (meth) methyl acrylate copolymer (Esstyrene MS-600 manufactured by Nippon Steel Chemical Co., Ltd .; hereinafter also referred to as "St-MMA")
-Ethylene-methyl acrylate copolymer (Elvalloy AC 1820, manufactured by Mitsui-DuPont Polychemical Co., Ltd., hereinafter also referred to as "EMA")
-Polyether / polyolefin copolymer (manufactured by Sanyo Chemical Industry Co., Ltd., Pelestat 212. Also referred to as "PEG-PP" hereinafter)

<Base material layer>
Base material layer 1: biaxially stretched polyester film having a thickness of 16 μm (manufactured by Toyobo Co., Ltd .: E5102)
Base material layer 2: biaxially stretched polyester film having a thickness of 16 μm (manufactured by Toyobo Co., Ltd .: T4100)

<Production of cover tapes according to Examples 1 to 7>
First, as a base material layer, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd .: E5102) having a thickness of 16 μm was prepared.

Next, the material for forming the antistatic layer was prepared by the following method. The composition of each reagent is as shown in Table 1.
A diluent solvent was added to the dispersion liquid containing the antistatic agent, and the mixture was stirred for 30 seconds while using a neutralizing agent. Next, in order to improve the substrate adhesion and the dispersion stability, the binder resin, the surfactant and the lubricant were added and stirred for 30 seconds. In this way, a material for forming a liquid antistatic layer was prepared.

Next, the material (in liquid form) for forming the obtained antistatic layer was applied to one surface of the base material layer using a gravure coater. Then, the antistatic layer was formed by drying at 100 ° C. The wet amount of the material forming the antistatic layer was set to 2 g / m ² . The wet film thickness of the material forming the antistatic layer applied using a gravure coater was set to 4 μm.

  Next, a sealant layer was laminated on the surface of the base material layer opposite to the surface on which the antistatic layer was formed, by an extrusion laminating method. As a material for forming such a sealant layer, a resin composition consisting of 15 parts by weight of St-MMA, 65 parts by weight of EMA and 20 parts by weight of PEG-PP was used. The thickness of the sealant layer was 5 μm.

The cover tapes according to Examples 1 to 7 were produced by the above method. The width of the obtained cover tape was 8 mm.

<Production of cover tape according to Example 8>
The same method as in Examples 1 to 7 except that a biaxially stretched polyester film having a thickness of 16 μm (manufactured by Toyobo Co., Ltd .: T4100) was prepared as the base material layer and no antistatic layer was provided. A cover tape was produced.

<Production of Cover Tape According to Comparative Example 1>
A cover tape was produced in the same manner as in Examples 1 to 7 except that the antistatic layer was not provided.

<Production of Cover Tape According to Comparative Example 2>
Cover tapes were produced in the same manner as in Examples 1 to 4 except that the mixed solution obtained without adding a lubricant was used as the material for forming the antistatic layer.

  The following evaluations were performed using the cover tapes of Examples and Comparative Examples.

<Evaluation method>
-Dynamic friction coefficient of the antistatic layer surface with respect to the sealant layer: The surface of the antistatic layer of one cover tape is overlaid with the surface of the sealant layer of another cover tape, and one cover tape and another cover tape are attached. According to JIS K7125, a friction test was carried out at a speed of 100 mm / min under a load of 200 g, and the dynamic friction coefficient of the surface of the antistatic layer in the one cover tape was measured. The measurement environmental conditions were 23 ° C. and 50% RH.

-Static friction coefficient of the antistatic layer surface to the sealant layer: The surface of the antistatic layer of one cover tape is overlaid with the surface of the sealant layer of another cover tape, and the one cover tape and the other cover tape are attached. According to JIS K7125, a friction test was carried out at a speed of 100 mm / min under a load of 200 g, and the coefficient of static friction of the surface of the antistatic layer in the one cover tape was measured. The measurement environmental conditions were 23 ° C. and 50% RH.

Surface resistance value on the surface of the base material layer: The surface resistance value on the surface of the base material layer under the conditions of 23 ° C. and 30% RH was measured according to IEC 61340. The unit is Ω / □.

-Total light transmittance: The total light transmittance of the cover tape was measured according to JIS K7105 (1981). The unit is%.

  The evaluation results regarding the above evaluation items are shown in Table 1 below together with the compounding composition of the antistatic layer.

  Each of the cover tapes of the examples was excellent in the balance between the adhesiveness to the carrier tape and the releasability, and the antistatic property due to the peeling of the carrier tape. On the other hand, the cover tape of the comparative example did not satisfy the required level, particularly in terms of antistatic property due to peeling of the carrier tape.

1 Base Material Layer 2 Sealant Layer 3 Antistatic Layer 10 Cover Tape for Electronic Component Packaging (Cover Tape)
10a Surface of cover tape (surface of antistatic layer)
20 Carrier Tape 20a Bottom of Carrier Tape 21 Pocket 100 Package

Claims (6)

A base material layer,
A cover tape for packaging electronic parts, comprising a sealant layer provided on one surface side of the base material layer,
One surface of the sealant layer of the other cover tape for packaging electronic parts is superposed on a surface of the base material layer of the cover tape for packaging electronic parts opposite to the surface on which the sealant layer is provided. In addition, a friction test was performed at a speed of 100 mm / min with a load of 200 g according to JIS K7125, using the one cover tape for packaging electronic parts and the other cover tape for packaging electronic parts. When carried out, the coefficient of dynamic friction of the surface of the base material layer of the one cover tape for packaging electronic parts opposite to the surface on which the sealant layer is provided is 0.1 or more and 1.5 or less, Cover tape for packaging electronic parts.   The cover tape for packaging electronic components according to claim 1, wherein the cover tape for packaging electronic components has a total light transmittance of 80% or more.   The cover tape for packaging electronic components according to claim 1 or 2, wherein the width of the cover tape for packaging electronic components is 2 mm or more and 100 mm or less. The surface resistance value of the surface of the base material layer opposite to the surface provided with the sealant layer measured at 23 ° C. and 30% RH is 1 × 10 ⁷ Ω / □ or more and 5 × 10 ¹³ Ω / □ or less. The cover tape for packaging electronic parts according to any one of claims 1 to 3, which is   The cover tape for packaging electronic parts according to claim 1, further comprising an antistatic layer on a surface of the base material layer opposite to a surface on which the sealant layer is provided.   The cover tape for packaging electronic parts according to claim 5, wherein the antistatic layer is formed of a material containing an ester compound.

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