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TW200727971A - Cleaning apparatus of exhaust gas produced from semiconductor production process and method thereof - Google Patents

Cleaning apparatus of exhaust gas produced from semiconductor production process and method thereof

Info

Publication number
TW200727971A
TW200727971A TW095109435A TW95109435A TW200727971A TW 200727971 A TW200727971 A TW 200727971A TW 095109435 A TW095109435 A TW 095109435A TW 95109435 A TW95109435 A TW 95109435A TW 200727971 A TW200727971 A TW 200727971A
Authority
TW
Taiwan
Prior art keywords
exhaust gas
manufacturing process
gas inlet
gas produced
supplying
Prior art date
Application number
TW095109435A
Other languages
Chinese (zh)
Other versions
TWI288655B (en
Inventor
Do-Hee Lee
Ung-Gi Hong
Jihn-Koo Lee
Won-Chul Chang
Du-Soung Kim
Original Assignee
Kocat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kocat Inc filed Critical Kocat Inc
Publication of TW200727971A publication Critical patent/TW200727971A/en
Application granted granted Critical
Publication of TWI288655B publication Critical patent/TWI288655B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86—Catalytic processes
    • B01D53/8659—Removing halogens or halogen compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Biomedical Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Treating Waste Gases (AREA)
  • Exhaust Gas Treatment By Means Of Catalyst (AREA)
  • Catalysts (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)

Abstract

Disclosed is an apparatus for treating exhaust gas produced in a semiconductor manufacturing process, including an exhaust gas inlet (2) for supplying exhaust gas; an air injection port (32) connected to the exhaust gas inlet (2) for supplying air; an adsorption part (4) connected to the exhaust gas inlet (2) and having an adsorption layer for adsorbing the exhaust gas supplied via the exhaust gas inlet (2); a catalysis part (6) connected to the adsorption part (4) and having a catalyst layer (18) for catalytically treating the exhaust gas supplied from the adsorption part (4); and a water supply port (26) connected to a flow path of the exhaust gas flowing to the catalysis part (6) for supplying water. According to this invention, from the exhaust gas produced in a semiconductor manufacturing process or an LCD manufacturing process, recalcitrant decomposable perfluorocompounds can be removed at 800 DEG C or less, and the exhaust gas containing the perfluorocompounds at large amounts and/or high concentrations can be treated depending on the amount of charged catalyst.
TW095109435A 2006-01-26 2006-03-20 Cleaning apparatus of exhaust gas produced from semiconductor production process and method thereof TWI288655B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060008037A KR100654922B1 (en) 2006-01-26 2006-01-26 Flue gas treatment apparatus and method generated from semiconductor manufacturing process

Publications (2)

Publication Number Publication Date
TW200727971A true TW200727971A (en) 2007-08-01
TWI288655B TWI288655B (en) 2007-10-21

Family

ID=37732414

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109435A TWI288655B (en) 2006-01-26 2006-03-20 Cleaning apparatus of exhaust gas produced from semiconductor production process and method thereof

Country Status (5)

Country Link
JP (1) JP4768470B2 (en)
KR (1) KR100654922B1 (en)
CN (1) CN100540120C (en)
TW (1) TWI288655B (en)
WO (1) WO2007086624A1 (en)

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KR101178918B1 (en) 2010-05-27 2012-09-03 주식회사 세미라인 An apparatus for treatment of Fluorine compound and method of treating for Fluorine compound gas
CN101898067A (en) * 2010-07-19 2010-12-01 北京雪迪龙科技股份有限公司 Gas purifier and regeneration method of molecular sieve thereof
CN102163643B (en) * 2010-10-09 2013-01-02 浙江哈氟龙新能源有限公司 Waste gas treatment thermal cycle drying system
KR101229946B1 (en) 2011-04-22 2013-02-05 주식회사 이엔 Fabrication method of catalyst based on the nano-silica to decompose PFC gaseous from semiconductor process, and Catalyst based on the nano-silicate to decompose the PFC manufactured by the same
KR101406198B1 (en) 2011-05-31 2014-06-12 주식회사 코캣 Catalyst for removing SF6 and preparatio method thereof
CN102294170B (en) * 2011-06-29 2013-04-17 宝纳资源控股(集团)有限公司 Titanium high temperature electrolytic furnace special-purpose tail gas processing system
KR20140092335A (en) * 2011-10-19 2014-07-23 쇼와 덴코 가부시키가이샤 Perfluoride decomposition treatment method and treatment device
KR101407115B1 (en) * 2012-03-26 2014-06-13 (주) 세라컴 Method for treating hazardous gas generated in semiconductor manufacturing process
KR101387611B1 (en) 2012-04-23 2014-05-07 주식회사 글로벌스탠다드테크놀로지 Apparatus and method of treating perfluoro compounds
CN104548927B (en) * 2015-01-07 2017-01-25 黎明化工研究设计院有限责任公司 Process for removing trace nitrogen trifluoride in carbon tetrafluoride
KR101670461B1 (en) * 2015-06-11 2016-11-01 주식회사 테라세미콘 Apparatus for treating exhaust gas comprising hydrogen
KR101866994B1 (en) * 2015-10-30 2018-06-15 한국생산기술연구원 Method for Treating Perfluorinated compounds Using Liquid Metal
CN108290113A (en) * 2015-12-01 2018-07-17 昭和电工株式会社 The processing method of exhaust gas containing fluorine element
KR101802167B1 (en) * 2016-06-21 2017-12-04 선문대학교 산학협력단 Exhaust Line Structure in Apparatus for Semiconductor Processing
CN106179263A (en) * 2016-07-08 2016-12-07 常州天兴环保科技有限公司 A kind of TX GF JH 6 type boron chloride, lithium boron waste gas purification adsorbent
KR101825825B1 (en) * 2016-08-02 2018-02-06 주식회사 에코프로 INTEGRATED ABATEMENT SYSTEM FOR COMPLEX WASTE GAS INCLUDING NOx, NITROUS OXIDE, CHLOROFLUOROCARBONS, HYDROCHLOROFLUOROCARBONS, HYDROFLUOROCARBONS, AND PERFLUOROCOMPOUNDS
KR102041555B1 (en) * 2017-10-27 2019-11-06 (주)명성씨.엠.아이 Toxic gas treating system
KR20190053556A (en) 2017-11-10 2019-05-20 주식회사 에코프로 Method of removing nitrogen trifluoride(nf3) in waste gas-disposing apparatus
CN108525507A (en) * 2018-04-20 2018-09-14 苏州宏久航空防热材料科技有限公司 A kind of sulphur removal removes nitre integration filter pipe
CN109432946A (en) * 2018-11-13 2019-03-08 福建博纯材料有限公司 A kind of vent gas treatment bucket of arsine
KR102129988B1 (en) * 2020-03-06 2020-07-03 주식회사 퓨어스피어 Apparatus for treating waste gas in producing semiconductor and method for treating waste gas
CN111537293A (en) * 2020-05-13 2020-08-14 西安热工研究院有限公司 A system and method for sampling and measuring HCl and/or HBr
CN112076608B (en) * 2020-08-05 2022-08-12 清华大学无锡应用技术研究院 Gallium nitride production furnace waste ammonia recovery unit
CN112619456A (en) * 2020-12-08 2021-04-09 南京理工大学 Smoke dust generating device with strip-shaped outlet
KR102498427B1 (en) 2021-02-01 2023-02-13 주식회사 비에이치피 Catalyst for Treating Hazardous Gas Generated in Semiconductor Manufacturing Process Using Metal Foam and Preparation Methods Thereof
KR102498425B1 (en) 2021-02-01 2023-02-13 주식회사 비에이치피 Catalyst for Treating Hazardous Gas Generated in Semiconductor Manufacturing Process and Preparation Methods Thereof
KR102588533B1 (en) * 2021-06-04 2023-10-12 엠에이티플러스 주식회사 Apparatus for treating waste gas of electronics industry
CN113578285B (en) * 2021-08-06 2022-04-19 福建德尔科技有限公司 High-cohesive-energy fluoride adsorbent, preparation and application
CN113648806B (en) * 2021-08-11 2023-09-22 上海协微环境科技有限公司 Device for purifying fluoride in waste gas of semiconductor manufacturing process
CN114797449B (en) * 2022-04-13 2023-06-27 中南大学 A method for recycling CF4 and HF by-products in electrolytic aluminum flue gas based on θ-Al2O3 catalyst
CN114950339A (en) * 2022-05-27 2022-08-30 常州诚鉺正环保技术有限公司 Adsorbent for fluorine-containing gas and preparation method thereof
WO2023235397A1 (en) * 2022-06-03 2023-12-07 Entegris, Inc. Filtration in a vapor delivery system
KR20240032247A (en) * 2022-09-01 2024-03-12 주식회사 에코프로에이치엔 Perfluorinated compounds reduction system
KR102750033B1 (en) 2022-10-04 2025-01-03 주식회사 에스엠티 Device for connecting fluid pipes for semiconductor equipment
CN115999341B (en) * 2023-01-31 2025-03-18 国网江苏省电力有限公司 A device and method for deep decomposition and adsorption of SF6 gas in a limited space
CN115826548B (en) * 2023-02-22 2023-06-13 中国电子工程设计院有限公司 Method and device for dynamically simulating waste gas treatment of semiconductor production system
KR102724340B1 (en) 2023-10-30 2024-10-31 박선혜 Cleaning apparatus of exhaust gas produced from semiconductor production process

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Also Published As

Publication number Publication date
CN101007237A (en) 2007-08-01
CN100540120C (en) 2009-09-16
JP4768470B2 (en) 2011-09-07
TWI288655B (en) 2007-10-21
JP2007196204A (en) 2007-08-09
KR100654922B1 (en) 2006-12-06
WO2007086624A1 (en) 2007-08-02

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