TW200701459A - Group iii nitride semiconductor device and epitaxial substrate - Google Patents
Group iii nitride semiconductor device and epitaxial substrateInfo
- Publication number
- TW200701459A TW200701459A TW095108455A TW95108455A TW200701459A TW 200701459 A TW200701459 A TW 200701459A TW 095108455 A TW095108455 A TW 095108455A TW 95108455 A TW95108455 A TW 95108455A TW 200701459 A TW200701459 A TW 200701459A
- Authority
- TW
- Taiwan
- Prior art keywords
- epitaxial layer
- semiconductor device
- group iii
- nitride semiconductor
- iii nitride
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02389—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005084378 | 2005-03-23 | ||
JP2006019473A JP5135686B2 (ja) | 2005-03-23 | 2006-01-27 | Iii族窒化物半導体素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200701459A true TW200701459A (en) | 2007-01-01 |
Family
ID=37023571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095108455A TW200701459A (en) | 2005-03-23 | 2006-03-13 | Group iii nitride semiconductor device and epitaxial substrate |
Country Status (8)
Country | Link |
---|---|
US (1) | US8410524B2 (zh) |
EP (1) | EP1863075A4 (zh) |
JP (1) | JP5135686B2 (zh) |
KR (1) | KR20070113094A (zh) |
CN (1) | CN1969380B (zh) |
CA (1) | CA2564424A1 (zh) |
TW (1) | TW200701459A (zh) |
WO (1) | WO2006100897A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101495381B1 (ko) * | 2007-11-21 | 2015-02-24 | 미쓰비시 가가꾸 가부시키가이샤 | 질화물 반도체의 결정 성장 방법 |
JP5453780B2 (ja) | 2008-11-20 | 2014-03-26 | 三菱化学株式会社 | 窒化物半導体 |
JP5564842B2 (ja) | 2009-07-10 | 2014-08-06 | サンケン電気株式会社 | 半導体装置 |
KR20120027988A (ko) | 2010-09-14 | 2012-03-22 | 삼성엘이디 주식회사 | 질화갈륨계 반도체소자 및 그 제조방법 |
PL398149A1 (pl) * | 2012-02-17 | 2013-08-19 | Isos Technologies Sarl | Heterostruktura tranzystora HEMT i sposób wytwarzania heterostruktury tranzystora HEMT |
KR101922117B1 (ko) | 2012-08-16 | 2018-11-26 | 삼성전자주식회사 | 트랜지스터를 포함하는 전자소자 및 그 동작방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4033519B2 (ja) * | 1997-06-27 | 2008-01-16 | シャープ株式会社 | 窒化ガリウム系化合物半導体発光素子 |
US6372041B1 (en) * | 1999-01-08 | 2002-04-16 | Gan Semiconductor Inc. | Method and apparatus for single crystal gallium nitride (GaN) bulk synthesis |
US6592663B1 (en) * | 1999-06-09 | 2003-07-15 | Ricoh Company Ltd. | Production of a GaN bulk crystal substrate and a semiconductor device formed on a GaN bulk crystal substrate |
JP3836697B2 (ja) * | 2000-12-07 | 2006-10-25 | 日本碍子株式会社 | 半導体素子 |
JP2002289528A (ja) | 2001-03-23 | 2002-10-04 | Yasuhiko Arakawa | 窒化ガリウム系化合物半導体の結晶成長法、および窒化ガリウム系化合物半導体を備えた電子デバイス |
JP4906023B2 (ja) * | 2001-08-14 | 2012-03-28 | 古河電気工業株式会社 | GaN系半導体装置 |
EP1502303B1 (en) * | 2002-04-30 | 2011-12-21 | Cree, Inc. | High voltage switching devices and process for forming same |
JP2004327882A (ja) | 2003-04-28 | 2004-11-18 | Ngk Insulators Ltd | エピタキシャル基板、半導体素子および高電子移動度トランジスタ |
US20070184671A1 (en) | 2003-05-30 | 2007-08-09 | Showa Denko K.K. | Method for production of group lll nitride semiconductor device |
JP2005244207A (ja) * | 2004-01-30 | 2005-09-08 | Showa Denko Kk | 窒化ガリウム系化合物半導体発光素子 |
US7687827B2 (en) * | 2004-07-07 | 2010-03-30 | Nitronex Corporation | III-nitride materials including low dislocation densities and methods associated with the same |
-
2006
- 2006-01-27 JP JP2006019473A patent/JP5135686B2/ja not_active Expired - Fee Related
- 2006-03-06 CA CA002564424A patent/CA2564424A1/en not_active Abandoned
- 2006-03-06 KR KR1020067024397A patent/KR20070113094A/ko not_active Application Discontinuation
- 2006-03-06 CN CN200680000315XA patent/CN1969380B/zh not_active Expired - Fee Related
- 2006-03-06 WO PCT/JP2006/304262 patent/WO2006100897A1/ja active Application Filing
- 2006-03-06 EP EP06715282A patent/EP1863075A4/en not_active Ceased
- 2006-03-06 US US11/569,500 patent/US8410524B2/en active Active
- 2006-03-13 TW TW095108455A patent/TW200701459A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN1969380B (zh) | 2012-08-22 |
WO2006100897A1 (ja) | 2006-09-28 |
JP5135686B2 (ja) | 2013-02-06 |
CA2564424A1 (en) | 2006-09-28 |
KR20070113094A (ko) | 2007-11-28 |
EP1863075A1 (en) | 2007-12-05 |
US8410524B2 (en) | 2013-04-02 |
EP1863075A4 (en) | 2009-04-29 |
US20090189186A1 (en) | 2009-07-30 |
CN1969380A (zh) | 2007-05-23 |
JP2006303439A (ja) | 2006-11-02 |
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