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TW200640098A - Semiconductor laser device and its manufacturing method - Google Patents

Semiconductor laser device and its manufacturing method

Info

Publication number
TW200640098A
TW200640098A TW095101050A TW95101050A TW200640098A TW 200640098 A TW200640098 A TW 200640098A TW 095101050 A TW095101050 A TW 095101050A TW 95101050 A TW95101050 A TW 95101050A TW 200640098 A TW200640098 A TW 200640098A
Authority
TW
Taiwan
Prior art keywords
semiconductor laser
laser element
manufacturing
laser device
emitting direction
Prior art date
Application number
TW095101050A
Other languages
English (en)
Chinese (zh)
Other versions
TWI300643B (ko
Inventor
Takeshi Yamamoto
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200640098A publication Critical patent/TW200640098A/zh
Application granted granted Critical
Publication of TWI300643B publication Critical patent/TWI300643B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
TW095101050A 2005-01-11 2006-01-11 Semiconductor laser device and its manufacturing method TW200640098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005003684A JP4165760B2 (ja) 2005-01-11 2005-01-11 半導体レーザ装置およびその製造方法

Publications (2)

Publication Number Publication Date
TW200640098A true TW200640098A (en) 2006-11-16
TWI300643B TWI300643B (ko) 2008-09-01

Family

ID=36677569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101050A TW200640098A (en) 2005-01-11 2006-01-11 Semiconductor laser device and its manufacturing method

Country Status (5)

Country Link
JP (1) JP4165760B2 (ko)
KR (1) KR100903709B1 (ko)
CN (1) CN101103502A (ko)
TW (1) TW200640098A (ko)
WO (1) WO2006075544A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012573A (zh) * 2015-03-27 2018-05-08 捷普有限公司 激光投影模块

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008263099A (ja) * 2007-04-13 2008-10-30 Shinko Electric Ind Co Ltd 光半導体素子用パッケージ及び光ピックアップ装置
JP2010098112A (ja) * 2008-10-16 2010-04-30 Shinko Electric Ind Co Ltd 光半導体用ステムおよび光半導体ステムの電解金めっき方法と、光半導体装置
CN103907249B (zh) 2011-11-30 2015-02-25 松下电器产业株式会社 氮化物半导体发光装置
CN104426050B (zh) * 2013-09-03 2018-07-06 中国科学院苏州纳米技术与纳米仿生研究所 半导体激光二极管及其封装方法
CN112805887B (zh) 2018-10-01 2024-05-10 罗姆股份有限公司 半导体激光装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898995A (ja) * 1981-12-09 1983-06-13 Nec Corp 光半導体装置
JPH0376286A (ja) * 1989-08-18 1991-04-02 Sony Corp 半導体レーザ装置とその組立方法
KR100251349B1 (ko) * 1996-12-30 2000-05-01 김영환 레이저 다이오드의 거울면 코팅 방법
JP4162363B2 (ja) * 1999-06-29 2008-10-08 ローム株式会社 半導体装置
TW449948B (en) * 1999-06-29 2001-08-11 Rohm Co Ltd Semiconductor device
US7280572B2 (en) * 2002-03-25 2007-10-09 Sanyo Electric Co., Ltd. Semiconductor laser beam device
JP4212845B2 (ja) * 2002-07-12 2009-01-21 三菱電機株式会社 光半導体素子モジュール
JP2004128378A (ja) * 2002-10-07 2004-04-22 Sharp Corp 半導体レーザ装置およびその製造方法
JP2004146468A (ja) * 2002-10-22 2004-05-20 Kyocera Corp 光モジュール及びそれを用いた光モジュールアセンブリ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012573A (zh) * 2015-03-27 2018-05-08 捷普有限公司 激光投影模块
CN108012573B (zh) * 2015-03-27 2021-09-03 捷普有限公司 激光投影模块

Also Published As

Publication number Publication date
JP4165760B2 (ja) 2008-10-15
CN101103502A (zh) 2008-01-09
WO2006075544A1 (ja) 2006-07-20
KR20070087055A (ko) 2007-08-27
JP2006196506A (ja) 2006-07-27
KR100903709B1 (ko) 2009-06-19
TWI300643B (ko) 2008-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees