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TW200640098A - Semiconductor laser device and its manufacturing method - Google Patents

Semiconductor laser device and its manufacturing method

Info

Publication number
TW200640098A
TW200640098A TW095101050A TW95101050A TW200640098A TW 200640098 A TW200640098 A TW 200640098A TW 095101050 A TW095101050 A TW 095101050A TW 95101050 A TW95101050 A TW 95101050A TW 200640098 A TW200640098 A TW 200640098A
Authority
TW
Taiwan
Prior art keywords
semiconductor laser
laser element
manufacturing
laser device
emitting direction
Prior art date
Application number
TW095101050A
Other languages
Chinese (zh)
Other versions
TWI300643B (en
Inventor
Takeshi Yamamoto
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200640098A publication Critical patent/TW200640098A/en
Application granted granted Critical
Publication of TWI300643B publication Critical patent/TWI300643B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

To provide a semiconductor laser device where heat dissipation from a semiconductor laser element is improved and high output is realized, and to provide the manufacturing method of the device. The semiconductor laser device A is provided with the semiconductor laser element 2 emitting a laser beam, a block 1B where the semiconductor laser element 2 is arranged, a stem 1 comprising a base 1A positioned on the opposite side of the emitting direction of the laser beam with respect to the block 1B, a lead 4A which passes through the base 1A in the emitting direction and conducts the semiconductor laser element 2, and a cap 5 surrounding the semiconductor laser element 2 and one end 4Aa of the lead 4A. An opening 5d inserted into the emitting direction is formed in the cap 5, and it is opened from the semiconductor laser element 2 to the emitting direction.
TW095101050A 2005-01-11 2006-01-11 Semiconductor laser device and its manufacturing method TW200640098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005003684A JP4165760B2 (en) 2005-01-11 2005-01-11 Semiconductor laser device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200640098A true TW200640098A (en) 2006-11-16
TWI300643B TWI300643B (en) 2008-09-01

Family

ID=36677569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101050A TW200640098A (en) 2005-01-11 2006-01-11 Semiconductor laser device and its manufacturing method

Country Status (5)

Country Link
JP (1) JP4165760B2 (en)
KR (1) KR100903709B1 (en)
CN (1) CN101103502A (en)
TW (1) TW200640098A (en)
WO (1) WO2006075544A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012573A (en) * 2015-03-27 2018-05-08 捷普有限公司 Laser projection module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008263099A (en) * 2007-04-13 2008-10-30 Shinko Electric Ind Co Ltd Package for optical semiconductor element and optical pickup device
JP2010098112A (en) * 2008-10-16 2010-04-30 Shinko Electric Ind Co Ltd Stem for optical semiconductor, method of electrolytic gold plating semiconductor stem, and optical semiconductor device
CN103907249B (en) 2011-11-30 2015-02-25 松下电器产业株式会社 Nitride semiconductor light-emitting device
CN104426050B (en) * 2013-09-03 2018-07-06 中国科学院苏州纳米技术与纳米仿生研究所 Semiconductor laser diode and its packaging method
CN112805887B (en) 2018-10-01 2024-05-10 罗姆股份有限公司 Semiconductor laser device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898995A (en) * 1981-12-09 1983-06-13 Nec Corp Photosemiconductor device
JPH0376286A (en) * 1989-08-18 1991-04-02 Sony Corp Semiconductor laser device and assembly thereof
KR100251349B1 (en) * 1996-12-30 2000-05-01 김영환 Mirror coating method of laser diode
JP4162363B2 (en) * 1999-06-29 2008-10-08 ローム株式会社 Semiconductor device
TW449948B (en) * 1999-06-29 2001-08-11 Rohm Co Ltd Semiconductor device
US7280572B2 (en) * 2002-03-25 2007-10-09 Sanyo Electric Co., Ltd. Semiconductor laser beam device
JP4212845B2 (en) * 2002-07-12 2009-01-21 三菱電機株式会社 Optical semiconductor element module
JP2004128378A (en) * 2002-10-07 2004-04-22 Sharp Corp Semiconductor laser device and manufacturing method thereof
JP2004146468A (en) * 2002-10-22 2004-05-20 Kyocera Corp Optical module and optical module assembly using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012573A (en) * 2015-03-27 2018-05-08 捷普有限公司 Laser projection module
CN108012573B (en) * 2015-03-27 2021-09-03 捷普有限公司 Laser projection module

Also Published As

Publication number Publication date
JP4165760B2 (en) 2008-10-15
CN101103502A (en) 2008-01-09
WO2006075544A1 (en) 2006-07-20
KR20070087055A (en) 2007-08-27
JP2006196506A (en) 2006-07-27
KR100903709B1 (en) 2009-06-19
TWI300643B (en) 2008-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees