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SG97232A1 - Adherent film recovering device and method of recovering adherent film - Google Patents

Adherent film recovering device and method of recovering adherent film

Info

Publication number
SG97232A1
SG97232A1 SG200201807A SG200201807A SG97232A1 SG 97232 A1 SG97232 A1 SG 97232A1 SG 200201807 A SG200201807 A SG 200201807A SG 200201807 A SG200201807 A SG 200201807A SG 97232 A1 SG97232 A1 SG 97232A1
Authority
SG
Singapore
Prior art keywords
recovering
adherent film
adherent
film
recovering device
Prior art date
Application number
SG200201807A
Other languages
English (en)
Inventor
Sawae Kiyoshi
Sakono Ikuo
Oka Hiroshi
Yamamoto Keizo
Sakuhana Yoshikazu
Ueno Mutsuhiro
Ueno Ryuzoh
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of SG97232A1 publication Critical patent/SG97232A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/002Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being a degassed liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
SG200201807A 2001-03-29 2002-03-30 Adherent film recovering device and method of recovering adherent film SG97232A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001097306A JP2002292346A (ja) 2001-03-29 2001-03-29 付着膜回収装置および付着膜の回収方法

Publications (1)

Publication Number Publication Date
SG97232A1 true SG97232A1 (en) 2003-07-18

Family

ID=18951109

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200201807A SG97232A1 (en) 2001-03-29 2002-03-30 Adherent film recovering device and method of recovering adherent film

Country Status (5)

Country Link
JP (1) JP2002292346A (zh)
KR (1) KR100447369B1 (zh)
CN (1) CN1223411C (zh)
SG (1) SG97232A1 (zh)
TW (1) TW531452B (zh)

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US20050028838A1 (en) * 2002-11-25 2005-02-10 Karl Brueckner Cleaning tantalum-containing deposits from process chamber components
US7964085B1 (en) 2002-11-25 2011-06-21 Applied Materials, Inc. Electrochemical removal of tantalum-containing materials
KR100629073B1 (ko) 2004-12-29 2006-09-26 엘지전자 주식회사 조립식 방착판
JP4895859B2 (ja) * 2007-02-23 2012-03-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
TWI479559B (zh) * 2007-06-28 2015-04-01 Quantum Global Tech Llc 以選擇性噴灑蝕刻來清潔腔室部件的方法和設備
KR101324131B1 (ko) * 2007-06-28 2013-11-01 삼성코닝정밀소재 주식회사 산화 주석 분말, 그 제조 방법 및 그 제조용 반응 장치
JP5180661B2 (ja) * 2008-04-18 2013-04-10 株式会社ディスコ スピンナ洗浄装置および加工装置
ITLE20100001A1 (it) * 2010-03-19 2010-06-18 Antonio Andrea Gentile Sistema a palette per la raccolta-recupero di metalli in apparati per deposizione di film sottili.
JP5726450B2 (ja) * 2010-07-16 2015-06-03 信越化学工業株式会社 反応炉洗浄装置および反応炉洗浄方法
CN103270186B (zh) 2010-12-23 2015-01-14 夏普株式会社 成膜材料的回收方法
WO2012090774A1 (ja) 2010-12-27 2012-07-05 シャープ株式会社 蒸着装置および回収装置
KR101260657B1 (ko) 2011-09-16 2013-05-10 주식회사 에스엠이씨 관절 로봇형 수직 승강장치
CN103302598B (zh) * 2012-03-09 2016-06-08 海纳微加工股份有限公司 真空压差式微加工装置及方法
JP5779132B2 (ja) * 2012-03-28 2015-09-16 株式会社日立産機システム クリーンシステム
KR102034763B1 (ko) * 2012-10-09 2019-10-22 삼성디스플레이 주식회사 공기압을 이용한 라미네이션 장치 및 이를 이용한 비접촉식 라미네이션 방법
CN103170486B (zh) * 2013-03-29 2016-01-06 北京七星华创电子股份有限公司 一种自清洗腔体
CN105834917B (zh) * 2016-04-28 2018-09-18 浙江工业大学 一种气液固三相磨粒流循环加工方法
DE102017208329A1 (de) * 2017-05-17 2018-11-22 Ejot Gmbh & Co. Kg Berührungsfreie Reinigungsvorrichtung
US11486042B2 (en) 2018-01-18 2022-11-01 Viavi Solutions Inc. Silicon coating on hard shields
CN108972363A (zh) * 2018-07-20 2018-12-11 合肥研新离合器有限公司 一种离合器连接盘用抛丸加工设备
CN109018578B (zh) * 2018-07-27 2024-05-03 江苏云天高胜机器人科技有限公司 蓄电池上外壳保护膜的去膜装置
CN111318969B (zh) * 2020-04-22 2024-09-24 东莞吉川机械科技股份有限公司 一种喷枪旋转式自动喷砂设备
CN113878501B (zh) * 2021-09-02 2023-12-19 宁海县勇昊汽车部件有限公司 一种基于电磁波监测的表面处理系统及控制方法
CN115138626A (zh) * 2022-07-28 2022-10-04 美的集团股份有限公司 物件的漆膜清理方法及装置
KR102549958B1 (ko) 2023-04-24 2023-06-30 신만영 공기 압축기용 수분분리장치
CN118061090B (zh) * 2024-04-16 2024-07-09 成都晨发泰达航空科技股份有限公司 一种用于apu燃烧室的热障涂层修复装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2912763A1 (de) * 1979-03-30 1980-10-09 Licentia Gmbh Verfahren zum abtrennen photoleitender schichten von schichttraegern
US5619898A (en) * 1991-07-12 1997-04-15 Witt; Georg Process and device for mechanically removing a layer from the substrate material of a disk-shaped information carrier

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JPS6118958A (ja) * 1984-07-04 1986-01-27 Mitsubishi Electric Corp 半導体装置用ガラスマスクの洗浄方法
JPS61113061A (ja) * 1984-11-07 1986-05-30 Mitsubishi Electric Corp マスク洗浄装置
JPH0594268U (ja) * 1992-05-22 1993-12-24 東芝硝子株式会社 薄膜形成装置
JPH06196465A (ja) * 1992-12-24 1994-07-15 Kawasaki Steel Corp 半導体ウエハの洗浄装置
JPH0747483A (ja) * 1993-08-05 1995-02-21 Nachi Fujikoshi Corp 産業用ロボット制御装置
JPH07153729A (ja) * 1993-08-18 1995-06-16 Air Prod And Chem Inc 固体表面の洗浄装置
JP3351082B2 (ja) * 1994-01-14 2002-11-25 ソニー株式会社 基板乾燥方法と、基板乾燥槽と、ウェーハ洗浄装置および半導体装置の製造方法
JP3298326B2 (ja) * 1994-09-19 2002-07-02 富士通株式会社 石英上のリンを含有するシリコン酸化膜の除去方法
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
JPH09289185A (ja) * 1996-04-22 1997-11-04 Hitachi Ltd 半導体ウェハ洗浄装置
JP3394143B2 (ja) * 1996-12-16 2003-04-07 大日本スクリーン製造株式会社 基板洗浄方法及びその装置
US6120614A (en) * 1997-11-14 2000-09-19 Ez Environmental Solutions Corporation Method and apparatus for pressure washing
JP3013932B2 (ja) * 1997-12-26 2000-02-28 キヤノン株式会社 半導体部材の製造方法および半導体部材
JPH11297652A (ja) * 1998-04-14 1999-10-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11340144A (ja) * 1998-05-22 1999-12-10 Hitachi Ltd 半導体装置の製造方法
JP3772056B2 (ja) * 1998-10-12 2006-05-10 株式会社東芝 半導体基板の洗浄方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2912763A1 (de) * 1979-03-30 1980-10-09 Licentia Gmbh Verfahren zum abtrennen photoleitender schichten von schichttraegern
US5619898A (en) * 1991-07-12 1997-04-15 Witt; Georg Process and device for mechanically removing a layer from the substrate material of a disk-shaped information carrier

Also Published As

Publication number Publication date
TW531452B (en) 2003-05-11
CN1396042A (zh) 2003-02-12
KR20020077165A (ko) 2002-10-11
CN1223411C (zh) 2005-10-19
KR100447369B1 (ko) 2004-09-08
JP2002292346A (ja) 2002-10-08

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