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SG10201604762UA - Environmental system including vacuum scavange for an immersion lithography apparatus - Google Patents

Environmental system including vacuum scavange for an immersion lithography apparatus

Info

Publication number
SG10201604762UA
SG10201604762UA SG10201604762UA SG10201604762UA SG10201604762UA SG 10201604762U A SG10201604762U A SG 10201604762UA SG 10201604762U A SG10201604762U A SG 10201604762UA SG 10201604762U A SG10201604762U A SG 10201604762UA SG 10201604762U A SG10201604762U A SG 10201604762UA
Authority
SG
Singapore
Prior art keywords
scavange
system including
lithography apparatus
immersion lithography
including vacuum
Prior art date
Application number
SG10201604762UA
Inventor
Andrew J Hazelton
Michael Sogard
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of SG10201604762UA publication Critical patent/SG10201604762UA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H10P76/2041—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
SG10201604762UA 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus SG10201604762UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46211203P 2003-04-10 2003-04-10
US48447603P 2003-07-01 2003-07-01

Publications (1)

Publication Number Publication Date
SG10201604762UA true SG10201604762UA (en) 2016-08-30

Family

ID=33162259

Family Applications (6)

Application Number Title Priority Date Filing Date
SG200800251-1A SG141426A1 (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2014015176A SG2014015176A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG200800250-3A SG141425A1 (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG10201604762UA SG10201604762UA (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2012050829A SG2012050829A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2014015184A SG2014015184A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus

Family Applications Before (3)

Application Number Title Priority Date Filing Date
SG200800251-1A SG141426A1 (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2014015176A SG2014015176A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG200800250-3A SG141425A1 (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG2012050829A SG2012050829A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2014015184A SG2014015184A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus

Country Status (7)

Country Link
US (13) US7321415B2 (en)
EP (7) EP2950148B1 (en)
JP (10) JP4775256B2 (en)
KR (13) KR101469405B1 (en)
CN (7) CN101061429B (en)
SG (6) SG141426A1 (en)
WO (1) WO2004090634A2 (en)

Families Citing this family (215)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101424881B (en) 2002-11-12 2011-11-30 Asml荷兰有限公司 Lithography projection apparatus
US7372541B2 (en) 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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WO2006080516A1 (en) 2005-01-31 2006-08-03 Nikon Corporation Exposure apparatus and method for manufacturing device
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
CN101128775B (en) 2005-02-10 2012-07-25 Asml荷兰有限公司 Immersion liquid, exposure device and exposure method
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7282701B2 (en) 2005-02-28 2007-10-16 Asml Netherlands B.V. Sensor for use in a lithographic apparatus
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
JP4262252B2 (en) * 2005-03-02 2009-05-13 キヤノン株式会社 Exposure equipment
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
EP1876635A4 (en) 2005-04-25 2010-06-30 Nikon Corp EXPOSURE METHOD, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4708860B2 (en) * 2005-05-23 2011-06-22 キヤノン株式会社 Immersion exposure equipment
WO2006130338A1 (en) * 2005-06-01 2006-12-07 Nikon Corporation Immersion fluid containment system and method for immersion lithography
US7385673B2 (en) * 2005-06-10 2008-06-10 International Business Machines Corporation Immersion lithography with equalized pressure on at least projection optics component and wafer
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007005731A (en) * 2005-06-27 2007-01-11 Jsr Corp Liquid for immersion exposure and purification method thereof
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007020067A1 (en) * 2005-08-16 2007-02-22 Carl Zeiss Smt Ag Immersion lithography objective
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7580112B2 (en) * 2005-08-25 2009-08-25 Nikon Corporation Containment system for immersion fluid in an immersion lithography apparatus
US20090130604A1 (en) * 2005-08-29 2009-05-21 Mitsui Chemicals, Inc. Solution for immersion exposure and immersion exposure method
KR101371874B1 (en) * 2005-10-05 2014-03-07 가부시키가이샤 니콘 Exposure apparatus and exposure method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US7782442B2 (en) 2005-12-06 2010-08-24 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device producing method
US7420194B2 (en) 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
KR20080088579A (en) 2005-12-28 2008-10-02 가부시키가이샤 니콘 Exposure apparatus, exposure method, device manufacturing method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20080102192A (en) 2006-02-16 2008-11-24 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device manufacturing method
EP1986222A4 (en) 2006-02-16 2010-09-01 Nikon Corp Exposure apparatus, exposing method, and device manufacturing method
KR101346581B1 (en) * 2006-02-21 2014-01-02 가부시키가이샤 니콘 Pattern forming apparatus, pattern forming method, mobile object driving system, mobile body driving method, exposure apparatus, exposure method and device manufacturing method
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
JP4889331B2 (en) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
EP2535744A3 (en) 2006-04-03 2013-10-09 Nikon Corporation Incidence surfaces and optical windows that are solvophobic to immersion liquids used in an immersion microlithography system
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102006021797A1 (en) 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optical imaging device with thermal damping
CN101438385B (en) * 2006-05-10 2011-02-16 尼康股份有限公司 Exposure apparatus and device manufacturing method
US8144305B2 (en) * 2006-05-18 2012-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7656502B2 (en) * 2006-06-22 2010-02-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7866637B2 (en) 2007-01-26 2011-01-11 Asml Netherlands B.V. Humidifying apparatus, lithographic apparatus and humidifying method
US8237911B2 (en) 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8011377B2 (en) * 2007-05-04 2011-09-06 Asml Netherlands B.V. Cleaning device and a lithographic apparatus cleaning method
US7900641B2 (en) 2007-05-04 2011-03-08 Asml Netherlands B.V. Cleaning device and a lithographic apparatus cleaning method
US7866330B2 (en) * 2007-05-04 2011-01-11 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US7576833B2 (en) 2007-06-28 2009-08-18 Nikon Corporation Gas curtain type immersion lithography tool using porous material for fluid removal
JP4533416B2 (en) * 2007-09-25 2010-09-01 キヤノン株式会社 Exposure apparatus and device manufacturing method
NL1036009A1 (en) * 2007-10-05 2009-04-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
WO2009076598A1 (en) * 2007-12-12 2009-06-18 Children's Hospital & Research Center At Oakland Use of unsaturated sphingosine compounds as chemotherapeutic agents for the treatment of cancer
JP5097166B2 (en) 2008-05-28 2012-12-12 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and method of operating the apparatus
TWI457714B (en) * 2008-09-17 2014-10-21 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus
NL2003392A (en) 2008-09-17 2010-03-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
US8047354B2 (en) * 2008-09-26 2011-11-01 Corning Incorporated Liquid-ejecting bearings for transport of glass sheets
EP2172766A1 (en) * 2008-10-03 2010-04-07 ASML Netherlands B.V. Lithographic apparatus and humidity measurement system
US8511461B2 (en) 2008-11-25 2013-08-20 Corning Incorporated Gas-ejecting bearings for transport of glass sheets
NL2003638A (en) * 2008-12-03 2010-06-07 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2004497A (en) 2009-05-01 2010-11-02 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
JP5016705B2 (en) 2009-06-09 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． Fluid handling structure
NL2005207A (en) 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US9120700B2 (en) 2010-03-26 2015-09-01 Corning Incorporated Non-contact etching of moving glass sheets
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
NL2008199A (en) * 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
US8715518B2 (en) 2011-10-12 2014-05-06 Intermolecular, Inc. Gas barrier with vent ring for protecting a surface region from liquid
US8728334B2 (en) 2011-11-29 2014-05-20 Intermolecular, Inc. Dynamic gas flow control of touchless reactor cells
US8617409B2 (en) 2011-11-22 2013-12-31 Intermolecular, Inc. Magnetically levitated gas cell for touchless site-isolated wet processing
US9016289B2 (en) 2011-11-28 2015-04-28 Intermolecular, Inc. System and method for reducing particles and marks on wafer surface following reactor processing
US8690136B2 (en) 2011-11-29 2014-04-08 Intermolecular, Inc. Internal rinsing in touchless interstitial processing
US8883607B2 (en) 2011-12-27 2014-11-11 Intermolecular, Inc. Full wafer processing by multiple passes through a combinatorial reactor
US9268231B2 (en) * 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
CN106575084B (en) 2014-07-04 2019-11-01 Asml荷兰有限公司 Lithographic apparatus and method of manufacturing devices using the lithographic apparatus
US9405287B1 (en) * 2015-07-22 2016-08-02 Applied Materials, Inc. Apparatus and method for optical calibration of wafer placement by a robot
CN109143768A (en) * 2018-09-13 2019-01-04 杭州行开科技有限公司 A kind of naked eye 3D display system suitable for laser projection
WO2021094057A1 (en) 2019-11-14 2021-05-20 Asml Netherlands B.V. Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate
JP7414276B2 (en) * 2020-06-29 2024-01-16 株式会社ブイ・テクノロジー Focused energy beam device
KR20220011903A (en) 2020-07-22 2022-02-03 삼성전자주식회사 Dishwasher
US12455512B2 (en) 2021-02-03 2025-10-28 Applied Materials, Inc. Pneumatic controlled flexure system for stabilizing a projection device
US11543754B1 (en) * 2021-06-16 2023-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Extractor piping on outermost sidewall of immersion hood apparatus

Family Cites Families (228)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US273683A (en) * 1883-03-06 John f
US279795A (en) * 1883-06-19 Paper-weight
US181859A (en) * 1876-09-05 Improvement in warming floors
GB1242527A (en) 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
DE2102922C3 (en) * 1971-01-22 1978-08-24 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Arrangement for automatic focusing on objects to be viewed in optical devices
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS5822299A (en) * 1981-07-29 1983-02-09 日産自動車株式会社 Forklift
JPS58202448A (en) 1982-05-21 1983-11-25 Hitachi Ltd exposure equipment
JPS5919912A (en) 1982-07-26 1984-02-01 Hitachi Ltd Immersion distance holding device
US4441808A (en) * 1982-11-15 1984-04-10 Tre Semiconductor Equipment Corp. Focusing device for photo-exposure system
DD242880A1 (en) * 1983-01-31 1987-02-11 Kuch Karl Heinz DEVICE FOR PHOTOLITHOGRAPHIC STRUCTURAL TRANSMISSION
DD221563A1 (en) * 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech IMMERSIONS OBJECTIVE FOR THE STEP-BY-STEP PROJECTION IMAGING OF A MASK STRUCTURE
DD224448A1 (en) * 1984-03-01 1985-07-03 Zeiss Jena Veb Carl DEVICE FOR PHOTOLITHOGRAPHIC STRUCTURAL TRANSMISSION
JPS6265326A (en) 1985-09-18 1987-03-24 Hitachi Ltd Exposure device
JPS63157419A (en) 1986-12-22 1988-06-30 Toshiba Corp Fine pattern transfer apparatus
US4837443A (en) 1987-10-15 1989-06-06 The Perkin-Elmer Corporation Guard ring for a differentially pumped seal apparatus
JPH04305917A (en) 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JPH04305915A (en) 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JPH0562877A (en) 1991-09-02 1993-03-12 Yasuko Shinohara Optical system for lsi manufacturing contraction projection aligner by light
JP3374413B2 (en) * 1992-07-20 2003-02-04 株式会社ニコン Projection exposure apparatus, projection exposure method, and integrated circuit manufacturing method
JP3246615B2 (en) 1992-07-27 2002-01-15 株式会社ニコン Illumination optical device, exposure apparatus, and exposure method
JPH06188169A (en) 1992-08-24 1994-07-08 Canon Inc Imaging method, exposure apparatus using the method, and device manufacturing method using the method
JPH06124873A (en) * 1992-10-09 1994-05-06 Canon Inc Immersion projection exposure system
JP2753930B2 (en) 1992-11-27 1998-05-20 キヤノン株式会社 Immersion type projection exposure equipment
JP3747958B2 (en) 1995-04-07 2006-02-22 株式会社ニコン Catadioptric optics
JP3212199B2 (en) 1993-10-04 2001-09-25 旭硝子株式会社 Flat cathode ray tube
JPH07220990A (en) 1994-01-28 1995-08-18 Hitachi Ltd Pattern forming method and exposure apparatus thereof
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08136475A (en) 1994-11-14 1996-05-31 Kawasaki Steel Corp Plate material surface observation device
JPH08171054A (en) 1994-12-16 1996-07-02 Nikon Corp Catadioptric system
JPH08316124A (en) 1995-05-19 1996-11-29 Hitachi Ltd Projection exposure method and exposure apparatus
JPH08316125A (en) 1995-05-19 1996-11-29 Hitachi Ltd Projection exposure method and exposure apparatus
JPH09148235A (en) * 1995-11-22 1997-06-06 Nikon Corp Scanning projection exposure equipment
US5707535A (en) 1996-01-11 1998-01-13 Harris; Ronald B. Vacuum loadable divided phase separator for liquid/solid separation
JPH103039A (en) 1996-06-14 1998-01-06 Nikon Corp Catoptric system
JPH1020195A (en) 1996-06-28 1998-01-23 Nikon Corp Catoptric system
JP3227595B2 (en) 1996-08-20 2001-11-12 東京エレクトロン株式会社 Development processing method and development processing apparatus
WO1998009278A1 (en) 1996-08-26 1998-03-05 Digital Papyrus Technologies Method and apparatus for coupling an optical lens to a disk through a coupling medium having a relatively high index of refraction
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JP4029182B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Exposure method
IL130137A (en) 1996-11-28 2003-07-06 Nikon Corp Exposure apparatus and an exposure method
JP4029183B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Projection exposure apparatus and projection exposure method
JP3728613B2 (en) 1996-12-06 2005-12-21 株式会社ニコン Method for adjusting scanning exposure apparatus and scanning exposure apparatus using the method
DE69717975T2 (en) 1996-12-24 2003-05-28 Asml Netherlands B.V., Veldhoven POSITIONER BALANCED IN TWO DIRECTIONS, AND LITHOGRAPHIC DEVICE WITH SUCH A POSITIONER
DE69829614T2 (en) 1997-03-10 2006-03-09 Asml Netherlands B.V. LITHOGRAPHY DEVICE WITH A POSITIONING DEVICE WITH TWO OBJECTS
JPH10255319A (en) 1997-03-12 1998-09-25 Hitachi Maxell Ltd Master exposure apparatus and method
JP3747566B2 (en) * 1997-04-23 2006-02-22 株式会社ニコン Immersion exposure equipment
JP3817836B2 (en) * 1997-06-10 2006-09-06 株式会社ニコン EXPOSURE APPARATUS, ITS MANUFACTURING METHOD, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
US20010003028A1 (en) 1997-09-19 2001-06-07 Nikon Corporation Scanning Exposure Method
JP4210871B2 (en) 1997-10-31 2009-01-21 株式会社ニコン Exposure equipment
JPH11176727A (en) * 1997-12-11 1999-07-02 Nikon Corp Projection exposure equipment
JPH11260791A (en) 1998-03-10 1999-09-24 Toshiba Mach Co Ltd Drying method of semiconductor wafer and drying equipment
AU2747999A (en) * 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
US5997963A (en) * 1998-05-05 1999-12-07 Ultratech Stepper, Inc. Microchamber
JP2000058436A (en) * 1998-08-11 2000-02-25 Nikon Corp Projection exposure apparatus and exposure method
JP2000076707A (en) * 1998-08-31 2000-03-14 Sony Corp Master recording device for producing optical recording media
EP1143492A4 (en) * 1998-09-03 2004-06-02 Nikon Corp Exposure apparatus and exposure method, and device and method for producing the same
EP1052552A3 (en) 1999-04-19 2003-03-12 ASML Netherlands B.V. Gas bearings for use with vacuum chambers and their application in lithographic projection apparatus
JP3653198B2 (en) 1999-07-16 2005-05-25 アルプス電気株式会社 Nozzle for drying, drying apparatus and cleaning apparatus using the same
JP2001118773A (en) 1999-10-18 2001-04-27 Nikon Corp Stage device and exposure device
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
TWI264617B (en) * 1999-12-21 2006-10-21 Asml Netherlands Bv Balanced positioning system for use in lithographic apparatus
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
JP3630054B2 (en) 2000-01-11 2005-03-16 松下電器産業株式会社 Printed wiring board manufacturing apparatus and printed wiring board manufacturing method using the same
TW579664B (en) 2000-01-11 2004-03-11 Matsushita Electric Industrial Co Ltd Apparatus and method for manufacturing printed circuit board
US7000622B2 (en) 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
US6488040B1 (en) * 2000-06-30 2002-12-03 Lam Research Corporation Capillary proximity heads for single wafer cleaning and drying
TW591653B (en) 2000-08-08 2004-06-11 Koninkl Philips Electronics Nv Method of manufacturing an optically scannable information carrier
JPWO2002025711A1 (en) * 2000-09-21 2004-01-29 株式会社ニコン Measurement method of exposure characteristics and exposure method
JP2002134384A (en) * 2000-10-20 2002-05-10 Nikon Corp Exposure method and apparatus, and device manufacturing method
KR100866818B1 (en) 2000-12-11 2008-11-04 가부시키가이샤 니콘 Projection optical system and exposure apparatus comprising the same
US20020080339A1 (en) * 2000-12-25 2002-06-27 Nikon Corporation Stage apparatus, vibration control method and exposure apparatus
US6731372B2 (en) 2001-03-27 2004-05-04 Nikon Corporation Multiple chamber fluid mount
WO2002091078A1 (en) 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US7032658B2 (en) 2002-01-31 2006-04-25 Smart Drilling And Completion, Inc. High power umbilicals for electric flowline immersion heating of produced hydrocarbons
JP2003124180A (en) 2001-10-16 2003-04-25 Ebara Corp Substrate processing equipment
US6811613B2 (en) 2001-11-26 2004-11-02 Tokyo Electron Limited Coating film forming apparatus
US6764386B2 (en) * 2002-01-11 2004-07-20 Applied Materials, Inc. Air bearing-sealed micro-processing chamber
WO2003065427A1 (en) * 2002-01-29 2003-08-07 Nikon Corporation Exposure device and exposure method
CN1638882B (en) 2002-02-06 2010-05-26 艾奎昂技术股份有限公司 Apparatus and method for drying at least one substrate
DE10210899A1 (en) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refractive projection lens for immersion lithography
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10229818A1 (en) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Focus detection method and imaging system with focus detection system
JP2004029063A (en) * 2002-06-21 2004-01-29 Adtec Engineeng Co Ltd Contact type exposure equipment
EP1532489A2 (en) 2002-08-23 2005-05-25 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US7198055B2 (en) 2002-09-30 2007-04-03 Lam Research Corporation Meniscus, vacuum, IPA vapor, drying manifold
US7520285B2 (en) 2002-09-30 2009-04-21 Lam Research Corporation Apparatus and method for processing a substrate
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100470367C (en) 2002-11-12 2009-03-18 Asml荷兰有限公司 Photolithography apparatus and device manufacturing method
TWI251127B (en) 2002-11-12 2006-03-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP2495613B1 (en) * 2002-11-12 2013-07-31 ASML Netherlands B.V. Lithographic apparatus
DE60335595D1 (en) 2002-11-12 2011-02-17 Asml Netherlands Bv Immersion lithographic apparatus and method of making a device
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420300B1 (en) * 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101424881B (en) 2002-11-12 2011-11-30 Asml荷兰有限公司 Lithography projection apparatus
EP1420299B1 (en) * 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (en) 2002-11-18 2004-06-03 Infineon Technologies Ag Optical arrangement used in the production of semiconductor components comprises a lens system arranged behind a mask, and a medium having a specified refractive index lying between the mask and the lens system
DE10258718A1 (en) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projection lens, in particular for microlithography, and method for tuning a projection lens
AU2003289271A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Exposure apparatus, exposure method and method for manufacturing device
EP1429190B1 (en) 2002-12-10 2012-05-09 Canon Kabushiki Kaisha Exposure apparatus and method
CN101872135B (en) 2002-12-10 2013-07-31 株式会社尼康 Exposure system and device producing method
SG158745A1 (en) 2002-12-10 2010-02-26 Nikon Corp Exposure apparatus and method for producing device
JP4184346B2 (en) 2002-12-13 2008-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Liquid removal in a method and apparatus for irradiating a spot on a layer
EP1732075A3 (en) 2002-12-19 2007-02-21 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
AU2003295177A1 (en) 2002-12-19 2004-07-14 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US6781670B2 (en) * 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
JP4352930B2 (en) 2003-02-26 2009-10-28 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
TWI621923B (en) 2003-02-26 2018-04-21 尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
EP1610361B1 (en) 2003-03-25 2014-05-21 Nikon Corporation Exposure system and device production method
WO2004090956A1 (en) 2003-04-07 2004-10-21 Nikon Corporation Exposure apparatus and method for manufacturing device
KR20110104084A (en) 2003-04-09 2011-09-21 가부시키가이샤 니콘 Immersion Lithography Fluid Control System
EP3352010A1 (en) 2003-04-10 2018-07-25 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
EP1611486B1 (en) 2003-04-10 2016-03-16 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
WO2004090633A2 (en) 2003-04-10 2004-10-21 Nikon Corporation An electro-osmotic element for an immersion lithography apparatus
EP2950148B1 (en) 2003-04-10 2016-09-21 Nikon Corporation Environmental system including vaccum scavenge for an immersion lithography apparatus
SG10201803122UA (en) 2003-04-11 2018-06-28 Nikon Corp Immersion lithography apparatus and device manufacturing method
CN101980087B (en) 2003-04-11 2013-03-27 株式会社尼康 Immersion exposure appratus and method
JP4582089B2 (en) 2003-04-11 2010-11-17 株式会社ニコン Liquid jet recovery system for immersion lithography
JP2006523958A (en) 2003-04-17 2006-10-19 株式会社ニコン Optical structure of an autofocus element for use in immersion lithography
JP2004321968A (en) * 2003-04-25 2004-11-18 Nec Corp Waste processing system and waste processing method
JP4146755B2 (en) 2003-05-09 2008-09-10 松下電器産業株式会社 Pattern formation method
JP4025683B2 (en) 2003-05-09 2007-12-26 松下電器産業株式会社 Pattern forming method and exposure apparatus
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1477856A1 (en) 2003-05-13 2004-11-17 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI612557B (en) 2003-05-23 2018-01-21 Nikon Corporation Exposure method and exposure apparatus and component manufacturing method
JP2004349645A (en) 2003-05-26 2004-12-09 Sony Corp Immersion differential drainage static pressure floating pad, master exposure apparatus and exposure method using immersion differential drainage
DE10324477A1 (en) 2003-05-30 2004-12-30 Carl Zeiss Smt Ag Microlithographic projection exposure system
TWI442694B (en) * 2003-05-30 2014-06-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4084710B2 (en) 2003-06-12 2008-04-30 松下電器産業株式会社 Pattern formation method
JP4054285B2 (en) 2003-06-12 2008-02-27 松下電器産業株式会社 Pattern formation method
US6867844B2 (en) * 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
TWI564933B (en) * 2003-06-19 2017-01-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
JP4084712B2 (en) 2003-06-23 2008-04-30 松下電器産業株式会社 Pattern formation method
JP4029064B2 (en) 2003-06-23 2008-01-09 松下電器産業株式会社 Pattern formation method
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP3862678B2 (en) 2003-06-27 2006-12-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
US7236232B2 (en) 2003-07-01 2007-06-26 Nikon Corporation Using isotopically specified fluids as optical elements
US6919647B2 (en) * 2003-07-03 2005-07-19 American Semiconductor, Inc. SRAM cell
CN102854755A (en) 2003-07-09 2013-01-02 株式会社尼康 Exposure apparatus
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR101238114B1 (en) 2003-09-03 2013-02-27 가부시키가이샤 니콘 Apparatus and method for providing fluid for immersion lithography
JP4378136B2 (en) 2003-09-04 2009-12-02 キヤノン株式会社 Exposure apparatus and device manufacturing method
US20050069499A1 (en) * 2003-09-25 2005-03-31 Moshe Arkin Foamable compositions, processes of preparing same and uses thereof
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
EP1519230A1 (en) 2003-09-29 2005-03-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4513299B2 (en) 2003-10-02 2010-07-28 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP4515209B2 (en) 2003-10-02 2010-07-28 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
JP2005159322A (en) 2003-10-31 2005-06-16 Nikon Corp Surface plate, stage apparatus, exposure apparatus and exposure method
JP2007525824A (en) 2003-11-05 2007-09-06 ディーエスエム アイピー アセッツ ビー．ブイ． Method and apparatus for manufacturing a microchip
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1695148B1 (en) 2003-11-24 2015-10-28 Carl Zeiss SMT GmbH Immersion objective
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
JP2007516613A (en) 2003-12-15 2007-06-21 カール・ツアイス・エスエムテイ・アーゲー Objective lens as a microlithographic projection objective comprising at least one liquid lens
WO2005059617A2 (en) 2003-12-15 2005-06-30 Carl Zeiss Smt Ag Projection objective having a high aperture and a planar end surface
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
WO2005059645A2 (en) 2003-12-19 2005-06-30 Carl Zeiss Smt Ag Microlithography projection objective with crystal elements
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
JP2005183744A (en) 2003-12-22 2005-07-07 Nikon Corp Exposure apparatus and device manufacturing method
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (en) 2004-01-06 2009-11-25 キヤノン株式会社 Exposure equipment
JP4429023B2 (en) 2004-01-07 2010-03-10 キヤノン株式会社 Exposure apparatus and device manufacturing method
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
WO2005069055A2 (en) 2004-01-14 2005-07-28 Carl Zeiss Smt Ag Catadioptric projection objective
KR101233879B1 (en) 2004-01-16 2013-02-15 칼 짜이스 에스엠티 게엠베하 Polarization-modulating optical element
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
KR101135232B1 (en) 2004-01-20 2012-04-12 칼 짜이스 에스엠테 게엠베하 Microlithographic projection exposure apparatus
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
KR20070039869A (en) 2004-02-03 2007-04-13 브루스 더블유. 스미스 Photolithography Method Using Solution and Related Systems
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1716454A1 (en) 2004-02-09 2006-11-02 Carl Zeiss SMT AG Projection objective for a microlithographic projection exposure apparatus
US20070165198A1 (en) 2004-02-13 2007-07-19 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
JP2007523383A (en) 2004-02-18 2007-08-16 コーニング インコーポレイテッド Catadioptric imaging optics for large numerical aperture imaging with deep ultraviolet light
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7091502B2 (en) 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1756663B1 (en) 2004-06-17 2015-12-16 Nikon Corporation Fluid pressure compensation for immersion lithography lens
US7057702B2 (en) * 2004-06-23 2006-06-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1761822A4 (en) 2004-07-01 2009-09-09 Nikon Corp A dynamic fluid control system for immersion lithography
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7355674B2 (en) 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7265813B2 (en) 2004-12-28 2007-09-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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