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SE8300921L - Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort - Google Patents

Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort

Info

Publication number
SE8300921L
SE8300921L SE8300921A SE8300921A SE8300921L SE 8300921 L SE8300921 L SE 8300921L SE 8300921 A SE8300921 A SE 8300921A SE 8300921 A SE8300921 A SE 8300921A SE 8300921 L SE8300921 L SE 8300921L
Authority
SE
Sweden
Prior art keywords
pcb
heat
electronic components
conductive body
cooling device
Prior art date
Application number
SE8300921A
Other languages
English (en)
Other versions
SE8300921D0 (sv
SE435443B (sv
Inventor
P-O Nilsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE8300921A priority Critical patent/SE435443B/sv
Publication of SE8300921D0 publication Critical patent/SE8300921D0/sv
Priority to US06/576,123 priority patent/US4573103A/en
Publication of SE8300921L publication Critical patent/SE8300921L/sv
Publication of SE435443B publication Critical patent/SE435443B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE8300921A 1983-02-18 1983-02-18 Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort SE435443B (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE8300921A SE435443B (sv) 1983-02-18 1983-02-18 Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort
US06/576,123 US4573103A (en) 1983-02-18 1984-02-02 Cooling device for electronic components connected to a printed circuit board by a holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8300921A SE435443B (sv) 1983-02-18 1983-02-18 Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort

Publications (3)

Publication Number Publication Date
SE8300921D0 SE8300921D0 (sv) 1983-02-18
SE8300921L true SE8300921L (sv) 1984-08-19
SE435443B SE435443B (sv) 1984-09-24

Family

ID=20350104

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8300921A SE435443B (sv) 1983-02-18 1983-02-18 Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort

Country Status (2)

Country Link
US (1) US4573103A (sv)
SE (1) SE435443B (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116191A (ja) * 1983-11-29 1985-06-22 イビデン株式会社 電子部品搭載用基板の製造方法
DE3688962T2 (de) * 1985-10-04 1993-12-09 Fujitsu Ltd Kühlsystem für eine elektronische Schaltungsanordnung.
US5126919A (en) * 1985-10-04 1992-06-30 Fujitsu Limited Cooling system for an electronic circuit device
US4920574A (en) * 1985-10-04 1990-04-24 Fujitsu Limited Cooling system for an electronic circuit device
US4890194A (en) * 1985-11-22 1989-12-26 Texas Instruments Incorporated A chip carrier and mounting structure connected to the chip carrier
US5003429A (en) * 1990-07-09 1991-03-26 International Business Machines Corporation Electronic assembly with enhanced heat sinking
US5471367A (en) * 1994-03-15 1995-11-28 Composite Optics, Inc. Composite structure for heat transfer and radiation
US7410297B2 (en) * 2006-08-18 2008-08-12 General Electric Company Apparatus for controlling radiation in a radiation generator
US7992421B2 (en) 2007-12-07 2011-08-09 Allen-Vanguard Corporation Apparatus and method for measuring and recording data from violent events
JP2011060496A (ja) * 2009-09-08 2011-03-24 Yamaichi Electronics Co Ltd 電気接続装置
DE102018110754A1 (de) * 2018-05-04 2019-11-07 C. & E. Fein Gmbh Elektronikeinheit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
US4390220A (en) * 1981-04-02 1983-06-28 Burroughs Corporation Electrical connector assembly for an integrated circuit package
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics

Also Published As

Publication number Publication date
SE8300921D0 (sv) 1983-02-18
US4573103A (en) 1986-02-25
SE435443B (sv) 1984-09-24

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