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KR870004649A - 납땜 장치 - Google Patents

납땜 장치 Download PDF

Info

Publication number
KR870004649A
KR870004649A KR1019860003424A KR860003424A KR870004649A KR 870004649 A KR870004649 A KR 870004649A KR 1019860003424 A KR1019860003424 A KR 1019860003424A KR 860003424 A KR860003424 A KR 860003424A KR 870004649 A KR870004649 A KR 870004649A
Authority
KR
South Korea
Prior art keywords
soldering
flexure
soldering device
vessel
solder bath
Prior art date
Application number
KR1019860003424A
Other languages
English (en)
Inventor
모리쓰요시
도시아끼 데라바야시
Original Assignee
가다오까 가쓰다로오
알프스 덴기 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가다오까 가쓰다로오, 알프스 덴기 가부시기가이샤 filed Critical 가다오까 가쓰다로오
Publication of KR870004649A publication Critical patent/KR870004649A/ko
Priority to KR2019900009031U priority Critical patent/KR900008751Y1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

내용 없음

Description

납땜 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 납땜 장치 전체의 종단면도.
* 도면의 주요부분에 대한 부호의 설명
3 : 프린트 기판 4 : 제1의 플렉서
6 : 예비 가열장치 8 : 제1의 납땜조
10 : 제2의 납땜조 13 : 제2의 플렉서 장치

Claims (1)

  1. 전자부품이 장착된 프린트 기판을 납땜하는 납땜 장치에 있어서, 제1의 플렉서 장치와 예비 가열장치와 제1의 납땜조와 제2의 플렉서 장치와 제2의 납땜조가 연속 설치되고, 제1, 제2의 납땜조 사이에 플렉서 장치가 인접 설치되어 있는 것을 특징으로 하는 납땜장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860003424A 1985-10-02 1986-05-01 납땜 장치 KR870004649A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900009031U KR900008751Y1 (ko) 1985-10-02 1990-06-26 납땜장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP85-219956 1985-10-02
JP60219956A JPS6281264A (ja) 1985-10-02 1985-10-02 半田付装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019900009031U Division KR900008751Y1 (ko) 1985-10-02 1990-06-26 납땜장치

Publications (1)

Publication Number Publication Date
KR870004649A true KR870004649A (ko) 1987-05-11

Family

ID=16743668

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860003424A KR870004649A (ko) 1985-10-02 1986-05-01 납땜 장치

Country Status (3)

Country Link
JP (1) JPS6281264A (ko)
KR (1) KR870004649A (ko)
GB (1) GB2181084B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258370A (ja) * 1991-02-06 1992-09-14 Matsushita Electric Ind Co Ltd ディップ半田付装置及びディップ半田付工法
US5876499A (en) * 1991-05-08 1999-03-02 Lymn; Peter P. Solder spray leveller
GB9109899D0 (en) * 1991-05-08 1991-07-03 Lymn Peter P A Solder leveller
JPH0734989B2 (ja) * 1992-09-04 1995-04-19 大阪アサヒ化学株式会社 噴流ハンダ付けにおける無洗浄化方法
JPH06296074A (ja) * 1993-04-09 1994-10-21 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
US5507882A (en) * 1994-02-28 1996-04-16 Delco Electronics Corporation Low residue water-based soldering flux and process for soldering with same
DE69635203T2 (de) * 1995-07-11 2006-06-29 Delphi Technologies, Inc., Troy Beschichtungen und Verfahren, insbesondere für Leiterplatten
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
JP3420917B2 (ja) * 1997-09-08 2003-06-30 富士通株式会社 半導体装置
JP2000244108A (ja) * 1999-02-22 2000-09-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置
CN100425382C (zh) * 2005-06-17 2008-10-15 杨国金 喷射流焊接方法及其装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057944B2 (ja) * 1982-05-07 1985-12-17 権士 近藤 噴流式はんだ槽

Also Published As

Publication number Publication date
GB8622861D0 (en) 1986-10-29
GB2181084A (en) 1987-04-15
JPS6281264A (ja) 1987-04-14
GB2181084B (en) 1989-09-13

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Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19860501

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Patent event code: PE09021S01D

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Patent event code: PE06011S01I