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KR880700616A - 다층 프린트 기판 - Google Patents

다층 프린트 기판

Info

Publication number
KR880700616A
KR880700616A KR1019860700464A KR860700464A KR880700616A KR 880700616 A KR880700616 A KR 880700616A KR 1019860700464 A KR1019860700464 A KR 1019860700464A KR 860700464 A KR860700464 A KR 860700464A KR 880700616 A KR880700616 A KR 880700616A
Authority
KR
South Korea
Prior art keywords
retrofit
multilayer printed
pattern
circuit board
printed circuit
Prior art date
Application number
KR1019860700464A
Other languages
English (en)
Inventor
기요시 구와바라
미끼오 니시하라
Original Assignee
야마모도 다꾸마
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마모도 다꾸마, 후지쓰 가부시끼가이샤 filed Critical 야마모도 다꾸마
Publication of KR880700616A publication Critical patent/KR880700616A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

다층 프린트 기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명이 다층 프린트 기판을 설명하기 위한 측단면 사시도.

Claims (5)

  1. 내층에 개조용 패턴을 가지고, 기판의 표면에서 관통공을 통하여 상기 개조용 패턴과 함께 접속되는 개조용 본딩페드를 포함하는 것을 특징으로 하는 다층 패드.
  2. 청구범위 제 1 항에 있어서, 상기 개조용 패턴이 기판의 표면에 가장 가까운 내층에 제공되는 다층 프린트 기판.
  3. 청구범위 제 2 항에 있어서, 상기 개조용 패턴과 개조용 본딩 패드를 접속하기 위하여 사용된 관통공이 브라인드 관통공인 다층 프린트 기판.
  4. 청구범위 제 3 항에 있어서, 상기 개조용 본딩패드는 회로부품 리드단자가 접속되는 본딩패드 가까이 제공되는 다층 프린트 기판.
  5. 청구범위 제 3 항에 있어서, 상기 개조용 패턴이 다수의 브라인드 관통공과 개조용 관통공을 통하여 직렬로 접속되는 다층 프린트 기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860700464A 1984-11-29 1985-11-28 다층 프린트 기판 KR880700616A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP253561 1984-11-29
JP59253561A JPS61131497A (ja) 1984-11-29 1984-11-29 多層プリント基板
PCT/JP1985/000660 WO1986003364A1 (en) 1984-11-29 1985-11-28 Multi-layer substrate for printed circuit

Publications (1)

Publication Number Publication Date
KR880700616A true KR880700616A (ko) 1988-03-15

Family

ID=17253076

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860700464A KR880700616A (ko) 1984-11-29 1985-11-28 다층 프린트 기판

Country Status (6)

Country Link
EP (1) EP0203203A4 (ko)
JP (1) JPS61131497A (ko)
KR (1) KR880700616A (ko)
AU (2) AU5193786A (ko)
BR (1) BR8507079A (ko)
WO (1) WO1986003364A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131498A (ja) * 1984-11-29 1986-06-19 富士通株式会社 終端回路配線構造
JPS62239596A (ja) * 1986-04-11 1987-10-20 株式会社日立製作所 配線基板
JPS6310591A (ja) * 1986-07-02 1988-01-18 株式会社日立製作所 論理配線基板
JPH0648906Y2 (ja) * 1988-08-04 1994-12-12 富士通株式会社 多層基板のパターン構造
JP4063796B2 (ja) 2004-06-30 2008-03-19 日本電気株式会社 積層型半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5276680A (en) * 1976-10-26 1977-06-28 Fujitsu Ltd Multiilayer printed board
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
JPS59769Y2 (ja) * 1979-12-21 1984-01-10 富士通株式会社 多層プリント基板
JPS59198747A (ja) * 1983-04-26 1984-11-10 Nec Corp 高密度多層配線基板

Also Published As

Publication number Publication date
JPH0226398B2 (ko) 1990-06-08
JPS61131497A (ja) 1986-06-19
EP0203203A4 (en) 1987-08-03
WO1986003364A1 (en) 1986-06-05
BR8507079A (pt) 1987-03-31
AU2562688A (en) 1989-02-23
EP0203203A1 (en) 1986-12-03
AU5193786A (en) 1986-06-18

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