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KR890004595A - 전자 부품 내장 구조 - Google Patents

전자 부품 내장 구조 Download PDF

Info

Publication number
KR890004595A
KR890004595A KR1019880009902A KR880009902A KR890004595A KR 890004595 A KR890004595 A KR 890004595A KR 1019880009902 A KR1019880009902 A KR 1019880009902A KR 880009902 A KR880009902 A KR 880009902A KR 890004595 A KR890004595 A KR 890004595A
Authority
KR
South Korea
Prior art keywords
electronic components
electronic component
circuit board
printed circuit
flexible substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019880009902A
Other languages
English (en)
Inventor
찌하루 와까마쯔
Original Assignee
시기 모리야
미쓰비시덴기 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시덴기 가부시기가이샤 filed Critical 시기 모리야
Publication of KR890004595A publication Critical patent/KR890004595A/ko
Priority to KR2019910006884U priority Critical patent/KR910007302Y1/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

내용 없음.

Description

전자 부품 내장 구조
제1도 내지 제4도는 본 발명의 전자 부품 내장구조의 1실시예를 도시한 것으로, 제1도는 전체 구성도.

Claims (1)

  1. 전자 부품(11)을 내장한 다층 플렉시블 기판(12)를 프린트 기판(2)위에 내장하고, 상기 다층 플렉시블 기판(12)에는 상기 프린트 기판(2)에 있어서의 배선 패턴의 일부가 형성되어 있는 것을 특징으로 하는 전자부품 내장 구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880009902A 1987-08-28 1988-08-03 전자 부품 내장 구조 Withdrawn KR890004595A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910006884U KR910007302Y1 (ko) 1987-08-28 1991-05-15 전자부품 내장구조

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62214508A JPS6457789A (en) 1987-08-28 1987-08-28 Electronic component mounting structure
JP62-214508 1987-08-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019910006884U Division KR910007302Y1 (ko) 1987-08-28 1991-05-15 전자부품 내장구조

Publications (1)

Publication Number Publication Date
KR890004595A true KR890004595A (ko) 1989-04-22

Family

ID=16656877

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880009902A Withdrawn KR890004595A (ko) 1987-08-28 1988-08-03 전자 부품 내장 구조

Country Status (5)

Country Link
US (1) US5048166A (ko)
JP (1) JPS6457789A (ko)
KR (1) KR890004595A (ko)
CN (1) CN1031236C (ko)
DE (1) DE3829153A1 (ko)

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US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
DE4015788C2 (de) * 1990-05-16 1994-06-23 Siemens Nixdorf Inf Syst Baugruppe
US5065227A (en) * 1990-06-04 1991-11-12 International Business Machines Corporation Integrated circuit packaging using flexible substrate
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5178318A (en) * 1990-10-12 1993-01-12 Compaq Computer Corp. Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
JP3209772B2 (ja) * 1991-07-08 2001-09-17 株式会社フジクラ リジッドフレックス配線板の製造方法
US5249098A (en) * 1991-08-22 1993-09-28 Lsi Logic Corporation Semiconductor device package with solder bump electrical connections on an external surface of the package
US5210683A (en) * 1991-08-22 1993-05-11 Lsi Logic Corporation Recessed chip capacitor wells with cleaning channels on integrated circuit packages
US5214000A (en) * 1991-12-19 1993-05-25 Raychem Corporation Thermal transfer posts for high density multichip substrates and formation method
US5241454A (en) * 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
JP2983405B2 (ja) * 1993-03-23 1999-11-29 三菱電機株式会社 電動式パワーステアリング回路装置
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5644839A (en) * 1994-06-10 1997-07-08 Xetel Corporation Surface mountable substrate edge terminal
DE19605966A1 (de) * 1996-02-17 1997-08-21 Bosch Gmbh Robert Vorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät
US6400575B1 (en) * 1996-10-21 2002-06-04 Alpine Microsystems, Llc Integrated circuits packaging system and method
AU5238898A (en) * 1996-11-08 1998-05-29 W.L. Gore & Associates, Inc. Method for reducing via inductance in an electronic assembly and device
DE69730629T2 (de) * 1996-12-26 2005-02-03 Matsushita Electric Industrial Co., Ltd., Kadoma Leiterplatte und Elektronikkomponente
US6299055B1 (en) * 1997-05-09 2001-10-09 Lear Automotive Dearborn, Inc. Manufacturing processes of service boxes and their parts
US6026564A (en) * 1998-04-10 2000-02-22 Ang Technologies Inc. Method of making a high density multilayer wiring board
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6175088B1 (en) * 1998-10-05 2001-01-16 Avaya Technology Corp. Multi-layer printed-wiring boards with inner power and ground layers
US6264093B1 (en) * 1998-11-02 2001-07-24 Raymond W. Pilukaitis Lead-free solder process for printed wiring boards
US6595405B2 (en) * 2000-02-23 2003-07-22 Fujikura, Ltd. Connection structure and method for connecting printed circuit and metal terminal, and reinforcing structure and method for reinforcing junction therebetween
US6580031B2 (en) * 2000-03-14 2003-06-17 Amerasia International Technology, Inc. Method for making a flexible circuit interposer having high-aspect ratio conductors
JP2001345549A (ja) * 2000-06-01 2001-12-14 Fujitsu Ltd 実装用基板の製造方法及び部品実装方法並びに実装用基板製造装置
JP4583581B2 (ja) * 2000-11-07 2010-11-17 ルネサスエレクトロニクス株式会社 固体撮像装置の製造方法
JP2010186848A (ja) * 2009-02-12 2010-08-26 Fujitsu Ltd 電子部品ユニットの製造方法
WO2015151292A1 (ja) * 2014-04-04 2015-10-08 三菱電機株式会社 プリント配線板ユニット
TW201611675A (zh) * 2014-09-01 2016-03-16 廣達電腦股份有限公司 電路板結構之改良方法
WO2020214148A1 (en) * 2019-04-15 2020-10-22 Hewlett-Packard Development Company, L.P. Printed circuit boards with electrical contacts and solder joints of higher melting temperatures

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DE1591513A1 (de) * 1967-07-10 1970-02-12 Siemens Ag Anordnung zur Verbindung gedruckter Schaltungsplatten
FR2212740B1 (ko) * 1972-12-28 1977-02-25 Honeywell Bull
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JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
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Also Published As

Publication number Publication date
US5048166A (en) 1991-09-17
DE3829153A1 (de) 1989-03-16
CN1031236C (zh) 1996-03-06
JPS6457789A (en) 1989-03-06
DE3829153C2 (ko) 1992-10-15
CN1031636A (zh) 1989-03-08

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Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19880803

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19880803

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19901128

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19910415

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19901128

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

PC1205 Withdrawal of application forming a basis of a converted application
WICV Withdrawal of application forming a basis of a converted application