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DE3689149D1 - Integrierte schaltungspackungen für oberflächenmontierung mit löttragenden leitern. - Google Patents

Integrierte schaltungspackungen für oberflächenmontierung mit löttragenden leitern.

Info

Publication number
DE3689149D1
DE3689149D1 DE86905560T DE3689149T DE3689149D1 DE 3689149 D1 DE3689149 D1 DE 3689149D1 DE 86905560 T DE86905560 T DE 86905560T DE 3689149 T DE3689149 T DE 3689149T DE 3689149 D1 DE3689149 D1 DE 3689149D1
Authority
DE
Germany
Prior art keywords
ladders
soldering
integrated circuit
surface mounting
circuit packs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE86905560T
Other languages
English (en)
Other versions
DE3689149T2 (de
Inventor
Paul Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE3689149D1 publication Critical patent/DE3689149D1/de
Application granted granted Critical
Publication of DE3689149T2 publication Critical patent/DE3689149T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE86905560T 1985-10-31 1986-08-25 Integrierte schaltungspackungen für oberflächenmontierung mit löttragenden leitern. Expired - Fee Related DE3689149T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/793,414 US4661887A (en) 1985-10-31 1985-10-31 Surface mountable integrated circuit packages having solder bearing leads

Publications (2)

Publication Number Publication Date
DE3689149D1 true DE3689149D1 (de) 1993-11-11
DE3689149T2 DE3689149T2 (de) 1994-02-03

Family

ID=25159866

Family Applications (1)

Application Number Title Priority Date Filing Date
DE86905560T Expired - Fee Related DE3689149T2 (de) 1985-10-31 1986-08-25 Integrierte schaltungspackungen für oberflächenmontierung mit löttragenden leitern.

Country Status (6)

Country Link
US (1) US4661887A (de)
EP (1) EP0242369B1 (de)
JP (1) JPH0736434B2 (de)
KR (1) KR930004576B1 (de)
DE (1) DE3689149T2 (de)
WO (1) WO1987002860A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085602A (en) * 1987-02-18 1992-02-04 Sanders Associates, Inc. Electrical circuit board mounting apparatus and method
JPS6450444U (de) * 1987-09-22 1989-03-29
JP2573016B2 (ja) * 1988-02-27 1997-01-16 アンプ インコーポレーテッド マイクロ入出力ピンおよびその製造方法
US4903889A (en) * 1988-11-14 1990-02-27 Raychem Corporation Connection to a component for use in an electronics assembly
US5024623A (en) * 1989-08-11 1991-06-18 Sanders Associates, Inc. Electrical circuit board mounting method
JP2822496B2 (ja) * 1989-10-18 1998-11-11 富士通株式会社 プリント配線板へのリードピンの半田付け方法
EP0437312B1 (de) * 1990-01-08 1994-10-26 Nec Corporation Elektronisches Bauteil auf der Oberfläche einer gedruckten Schaltplatine montierbar und Verfahren zur Montage
EP0448266B1 (de) * 1990-03-23 1996-06-05 Motorola, Inc. Oberflächenmontierbare Halbleitervorrichtung mit selbstbeladenen Lötverbindungen
US5343366A (en) * 1992-06-24 1994-08-30 International Business Machines Corporation Packages for stacked integrated circuit chip cubes
US5886396A (en) * 1995-06-05 1999-03-23 Motorola, Inc. Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package
JP2001267733A (ja) * 2000-03-17 2001-09-28 Mitsumi Electric Co Ltd はんだ付け方法
US7214881B2 (en) * 2004-04-01 2007-05-08 Delphi Technologies, Inc. High temperature electrical connection
JP4894464B2 (ja) * 2006-11-01 2012-03-14 山一電機株式会社 半田付き接触子及びその製造方法
CN101918170B (zh) * 2008-01-03 2015-09-02 怡德乐纳斯公司 焊料线缆结构
CN102364679A (zh) * 2011-10-10 2012-02-29 常熟市广大电器有限公司 一种芯片封装结构

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US405302A (en) * 1889-06-18 Wesley c
US1702234A (en) * 1925-10-06 1929-02-12 Bead Chain Mfg Co Method of wiring contact pins
US3842190A (en) * 1969-12-15 1974-10-15 Computer Ind Inc Wire routing system
US4056302A (en) * 1976-06-04 1977-11-01 International Business Machines Corporation Electrical connection structure and method
US4274699A (en) * 1978-04-27 1981-06-23 E. I. Du Pont De Nemours And Company Press fit terminal with spring arm contact for edgecard connector
US4302067A (en) * 1980-04-18 1981-11-24 Western Electric Company, Incorporated Edge connectors for circuit cards and methods of assembly
JPS5889850A (ja) * 1981-11-24 1983-05-28 Hitachi Ltd 面実装型半導体装置
JPS5947747A (ja) * 1982-09-10 1984-03-17 Hitachi Ltd 半導体装置
US4463407A (en) * 1982-09-27 1984-07-31 Northern Telecom Limited Surface mounted electronic components having pre-applied solder
US4513355A (en) * 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device

Also Published As

Publication number Publication date
EP0242369B1 (de) 1993-10-06
EP0242369A4 (de) 1989-09-26
WO1987002860A1 (en) 1987-05-07
DE3689149T2 (de) 1994-02-03
EP0242369A1 (de) 1987-10-28
JPS63501254A (ja) 1988-05-12
US4661887A (en) 1987-04-28
JPH0736434B2 (ja) 1995-04-19
KR880700621A (ko) 1988-03-15
KR930004576B1 (ko) 1993-06-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee