DE3582091D1 - Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern. - Google Patents

Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern.

Info

Publication number: DE3582091D1
Authority: DE; Germany
Prior art keywords: package; electronic components; shaped electronic; assembly arrangement; flat connecting
Prior art date: 1984-07-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE8585401518T

Other languages

English (en)

Inventor

Tsuyoshi Fujitsu Daiy Yamamoto

Nobuhide Okada

Yasuo Kawamura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujitsu Ltd

Original Assignee

Fujitsu Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-07-24

Filing date

1985-07-23

Publication date

1991-04-18

1985-07-23 Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd

1991-04-18 Application granted granted Critical

1991-04-18 Publication of DE3582091D1 publication Critical patent/DE3582091D1/de

2005-07-24 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Lead Frames For Integrated Circuits (AREA)
Coupling Device And Connection With Printed Circuit (AREA)

DE8585401518T 1984-07-24 1985-07-23 Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern. Expired - Lifetime DE3582091D1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP15340384A JPS6132490A (ja)	1984-07-24	1984-07-24	フラツトリ−ドパツケ−ジ型電子部品の取付け構造

Publications (1)

Publication Number	Publication Date
DE3582091D1 true DE3582091D1 (de)	1991-04-18

Family

ID=15561725

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE8585401518T Expired - Lifetime DE3582091D1 (de)	1984-07-24	1985-07-23	Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern.

Country Status (9)

Country	Link
US (1)	US4703393A (de)
EP (1)	EP0169788B1 (de)
JP (1)	JPS6132490A (de)
KR (1)	KR910000996B1 (de)
AU (1)	AU565047B2 (de)
BR (1)	BR8503495A (de)
CA (1)	CA1233910A (de)
DE (1)	DE3582091D1 (de)
ES (1)	ES8609873A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5917707A (en)	1993-11-16	1999-06-29	Formfactor, Inc.	Flexible contact structure with an electrically conductive shell
JP2726042B2 (ja) *	1987-02-03	1998-03-11	三菱電機株式会社	半導体装置
US4862247A (en) *	1987-11-24	1989-08-29	Texas Instruments Incorporated	Contact joint for semiconductor chip carriers
DE3853197T2 (de) *	1987-12-07	1995-06-29	Nippon Electric Co	Kühlungssystem für integrierte Schaltungspackung.
US4827611A (en) *	1988-03-28	1989-05-09	Control Data Corporation	Compliant S-leads for chip carriers
JPH01313969A (ja) *	1988-06-13	1989-12-19	Hitachi Ltd	半導体装置
US5191404A (en) *	1989-12-20	1993-03-02	Digital Equipment Corporation	High density memory array packaging
JP3187106B2 (ja) *	1991-12-27	2001-07-11	ローム株式会社	電気回路素子のパッケージ構造
US5820014A (en)	1993-11-16	1998-10-13	Form Factor, Inc.	Solder preforms
US20020053734A1 (en)	1993-11-16	2002-05-09	Formfactor, Inc.	Probe card assembly and kit, and methods of making same
US7073254B2 (en)	1993-11-16	2006-07-11	Formfactor, Inc.	Method for mounting a plurality of spring contact elements
US5455386A (en) *	1994-01-14	1995-10-03	Olin Corporation	Chamfered electronic package component
US5969259A (en) *	1995-04-07	1999-10-19	Sensym, Inc.	Side port package for micromachined fluid sensor
US5610436A (en) *	1995-06-07	1997-03-11	Bourns, Inc.	Surface mount device with compensation for thermal expansion effects
US8033838B2 (en)	1996-02-21	2011-10-11	Formfactor, Inc.	Microelectronic contact structure
US5994152A (en)	1996-02-21	1999-11-30	Formfactor, Inc.	Fabricating interconnects and tips using sacrificial substrates
US5883789A (en) *	1997-09-19	1999-03-16	United Technologies Corporation	Method of mounting a PC board to a hybrid
US6339534B1 (en) *	1999-11-05	2002-01-15	International Business Machines Corporation	Compliant leads for area array surface mounted components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3588618A (en) *	1970-03-02	1971-06-28	Raychem Corp	Unsoldering method and apparatus using heat-recoverable materials
US4377316A (en) *	1981-02-27	1983-03-22	International Business Machines Corporation	High density interconnection means for chip carriers
JPS57155758A (en) *	1981-03-23	1982-09-25	Hitachi Ltd	Semiconductor device

1984
- 1984-07-24 JP JP15340384A patent/JPS6132490A/ja active Granted
1985
- 1985-07-22 CA CA000487257A patent/CA1233910A/en not_active Expired
- 1985-07-22 US US06/757,308 patent/US4703393A/en not_active Expired - Lifetime
- 1985-07-23 BR BR8503495A patent/BR8503495A/pt not_active IP Right Cessation
- 1985-07-23 DE DE8585401518T patent/DE3582091D1/de not_active Expired - Lifetime
- 1985-07-23 AU AU45255/85A patent/AU565047B2/en not_active Ceased
- 1985-07-23 ES ES545480A patent/ES8609873A1/es not_active Expired
- 1985-07-23 EP EP85401518A patent/EP0169788B1/de not_active Expired - Lifetime
- 1985-07-24 KR KR1019850005293A patent/KR910000996B1/ko not_active IP Right Cessation

Also Published As

Publication number	Publication date
ES545480A0 (es)	1986-09-01
AU565047B2 (en)	1987-09-03
EP0169788B1 (de)	1991-03-13
JPS6132490A (ja)	1986-02-15
CA1233910A (en)	1988-03-08
EP0169788A3 (en)	1987-11-04
AU4525585A (en)	1986-01-30
EP0169788A2 (de)	1986-01-29
BR8503495A (pt)	1986-04-15
KR910000996B1 (ko)	1991-02-19
KR860001681A (ko)	1986-03-20
ES8609873A1 (es)	1986-09-01
US4703393A (en)	1987-10-27
JPH0256838B2 (de)	1990-12-03

Publication	Publication Date	Title
DE3582091D1 (de)	1991-04-18	Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern.
DE3583629D1 (de)	1991-09-05	Integrierte schaltung mit einer schmelzsicherungsschaltung.
DE3778969D1 (de)	1992-06-17	Gehaeuse fuer elektronische ausruestung.
DE3672521D1 (de)	1990-08-16	Thermische verbindung fuer eine mit elektronischen komponenten bestueckte schaltungsplatte.
DE3580096D1 (de)	1990-11-15	Ruecksetzschaltung fuer mikroprozessoren.
DE3870365D1 (de)	1992-05-27	Gehaeuse fuer elektronische schaltung.
DE3481107D1 (de)	1990-02-22	Elektronische schaltungsanordnung.
DE3577968D1 (de)	1990-06-28	Gedruckte schaltung mit einer schaltungsanordnung fuer ein rundfunkempfangsgeraet.
DE3482369D1 (de)	1990-06-28	Stauraum fuer elektronische geraete.
FI850868A0 (fi)	1985-03-04	Elektroniskt stroe-system.
FI854293L (fi)	1986-05-03	Elektronisk tidsinstaelld taendhatt.
DE3682911D1 (de)	1992-01-30	Verbinderzusammenbau fuer ein flaches paneel.
DE3583965D1 (de)	1991-10-10	Elektronische kopiertafel.
DE58907795D1 (de)	1994-07-07	Baugruppe mit einer Leiterplatte.
DE3677884D1 (de)	1991-04-11	Kuehlungsanordnung fuer elektronische bauelemente.
DE3763504D1 (de)	1990-08-09	Kuehlungssystem fuer elektronische bauelemente.
DE3880065D1 (de)	1993-05-13	Automatische montagevorrichtung fuer elektronische bauteile.
DE3585187D1 (de)	1992-02-27	Elektronische drucktafel.
DE3581854D1 (de)	1991-04-04	Elektronische speiseschaltung fuer fernsprechsysteme.
DE3584040D1 (de)	1991-10-17	Elektronische kopiertafel.
DE3684206D1 (de)	1992-04-16	Elektronische umwandlungsschaltung.
DE3689149D1 (de)	1993-11-11	Integrierte schaltungspackungen für oberflächenmontierung mit löttragenden leitern.
DE3675313D1 (de)	1990-12-06	Elektronische sicherung.
DE3583886D1 (de)	1991-10-02	Integrierte schaltung mit einer eingangsschutzanordnung.
NL193232B (nl)	1998-11-02	Elektronisch samenstel.

Legal Events

Date	Code	Title	Description
1992-04-09	8364	No opposition during term of opposition
1995-07-13	8339	Ceased/non-payment of the annual fee