SE7501777L - - Google Patents
Info
- Publication number
- SE7501777L SE7501777L SE7501777A SE7501777A SE7501777L SE 7501777 L SE7501777 L SE 7501777L SE 7501777 A SE7501777 A SE 7501777A SE 7501777 A SE7501777 A SE 7501777A SE 7501777 L SE7501777 L SE 7501777L
- Authority
- SE
- Sweden
- Prior art keywords
- plating
- feb
- regions
- optionally
- gold
- Prior art date
Links
- 239000010931 gold Substances 0.000 abstract 7
- 229910052737 gold Inorganic materials 0.000 abstract 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 229910052763 palladium Inorganic materials 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 3
- 229910052697 platinum Inorganic materials 0.000 abstract 3
- 229940075397 calomel Drugs 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical compound Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 230000006911 nucleation Effects 0.000 abstract 1
- 238000010899 nucleation Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US443624A US3926747A (en) | 1974-02-19 | 1974-02-19 | Selective electrodeposition of gold on electronic devices |
US443625A US3873428A (en) | 1974-02-19 | 1974-02-19 | Preferential gold electroplating |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7501777L true SE7501777L (it) | 1975-08-20 |
SE446751B SE446751B (sv) | 1986-10-06 |
Family
ID=27033593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7501777A SE446751B (sv) | 1974-02-19 | 1975-02-18 | Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5440056B2 (it) |
DE (1) | DE2506990C3 (it) |
FR (1) | FR2261352B1 (it) |
GB (1) | GB1494394A (it) |
IT (1) | IT1031886B (it) |
NL (1) | NL160034C (it) |
SE (1) | SE446751B (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4226167C2 (de) * | 1992-08-07 | 1996-10-24 | Sel Alcatel Ag | Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik |
KR20000076081A (ko) * | 1997-03-10 | 2000-12-26 | 야마모토 카즈모토 | 반도체 장치의 배선 형성 방법 및 반도체 장치 |
-
1975
- 1975-02-18 NL NL7501908A patent/NL160034C/xx not_active IP Right Cessation
- 1975-02-18 SE SE7501777A patent/SE446751B/xx not_active IP Right Cessation
- 1975-02-19 JP JP2080875A patent/JPS5440056B2/ja not_active Expired
- 1975-02-19 DE DE19752506990 patent/DE2506990C3/de not_active Expired
- 1975-02-19 IT IT2045275A patent/IT1031886B/it active
- 1975-02-19 GB GB709175A patent/GB1494394A/en not_active Expired
- 1975-02-19 FR FR7505153A patent/FR2261352B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL160034B (nl) | 1979-04-17 |
GB1494394A (en) | 1977-12-07 |
DE2506990A1 (de) | 1975-08-28 |
SE446751B (sv) | 1986-10-06 |
DE2506990B2 (de) | 1979-01-25 |
NL7501908A (nl) | 1975-08-21 |
NL160034C (nl) | 1979-09-17 |
IT1031886B (it) | 1979-05-10 |
JPS5440056B2 (it) | 1979-12-01 |
JPS50124841A (it) | 1975-10-01 |
DE2506990C3 (de) | 1979-09-13 |
FR2261352A1 (it) | 1975-09-12 |
FR2261352B1 (it) | 1978-04-21 |
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Legal Events
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NUG | Patent has lapsed |
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