[go: up one dir, main page]

SE446751B - Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade - Google Patents

Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade

Info

Publication number
SE446751B
SE446751B SE7501777A SE7501777A SE446751B SE 446751 B SE446751 B SE 446751B SE 7501777 A SE7501777 A SE 7501777A SE 7501777 A SE7501777 A SE 7501777A SE 446751 B SE446751 B SE 446751B
Authority
SE
Sweden
Prior art keywords
electropleting
selective
procedure
precious metal
metal area
Prior art date
Application number
SE7501777A
Other languages
English (en)
Swedish (sv)
Other versions
SE7501777L (xx
Inventor
K R Newby
E D Winters
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443624A external-priority patent/US3926747A/en
Priority claimed from US443625A external-priority patent/US3873428A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7501777L publication Critical patent/SE7501777L/xx
Publication of SE446751B publication Critical patent/SE446751B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/243Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7501777A 1974-02-19 1975-02-18 Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade SE446751B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating

Publications (2)

Publication Number Publication Date
SE7501777L SE7501777L (xx) 1975-08-20
SE446751B true SE446751B (sv) 1986-10-06

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7501777A SE446751B (sv) 1974-02-19 1975-02-18 Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade

Country Status (7)

Country Link
JP (1) JPS5440056B2 (xx)
DE (1) DE2506990C3 (xx)
FR (1) FR2261352B1 (xx)
GB (1) GB1494394A (xx)
IT (1) IT1031886B (xx)
NL (1) NL160034C (xx)
SE (1) SE446751B (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik
KR20000076081A (ko) * 1997-03-10 2000-12-26 야마모토 카즈모토 반도체 장치의 배선 형성 방법 및 반도체 장치

Also Published As

Publication number Publication date
NL160034B (nl) 1979-04-17
GB1494394A (en) 1977-12-07
DE2506990A1 (de) 1975-08-28
DE2506990B2 (de) 1979-01-25
NL7501908A (nl) 1975-08-21
NL160034C (nl) 1979-09-17
SE7501777L (xx) 1975-08-20
IT1031886B (it) 1979-05-10
JPS5440056B2 (xx) 1979-12-01
JPS50124841A (xx) 1975-10-01
DE2506990C3 (de) 1979-09-13
FR2261352A1 (xx) 1975-09-12
FR2261352B1 (xx) 1978-04-21

Similar Documents

Publication Publication Date Title
BE844537A (nl) Voorgevormd bovenstopelement van een ritssluiting en inrichting en werkwijze van vervaardiging ervan
SE400575B (sv) Bad for betning av koppar och dess legeringar
SE425049B (sv) Amalgamerbart silverlegeringspulver
SE7506621L (sv) Kvarterner silverlegering
NO142945C (no) Anordning for fremstilling av stoepestykker av metall
IT1032963B (it) Leghe per saldatura a base d oro
DK260475A (da) 2-phenyl-indol-derivater og fremgangsmade til fremstilling deraf
SE7500966L (sv) Koboltbaserad legering
BR7507328A (pt) Ligas dentais de ouro isentas de cobre
HK28779A (en) Gold diffusion process and shaped metal articles
SE446751B (sv) Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade
DK288375A (da) Prostansyrederivater og fremgangsmade til fremstilling deraf
SE7511132L (sv) Kopparlegering och behandling derav
AT333067B (de) Schmuckstuck
DK518175A (da) Fenylpyridylaminderivater og fremgangsmade til fremstilling deraf
IT1054437B (it) Calzamaglia e procedimento per la sua fabbricazione
DK439875A (da) Siliciumorganiske forbindelser og fremgangsmade til disses fremstilling
SE406430B (sv) Lodlegering
DK271275A (da) Diflurosteroider og fremgangsmade til fremstilling deraf
SU502967A1 (ru) Сплав на основе свинца
IT1106857B (it) Filo pre saldatura animato e procedimento per la sua fabbricazione
SU495364A1 (ru) Способ выплавки лигатуры на основе никел
SU470534A1 (ru) Способ производства агломерата
BE826840A (fr) Bijou
SU502957A1 (ru) Способ выплавки лигатуры

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 7501777-2

Effective date: 19870914

Format of ref document f/p: F