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GB1494394A - Selective electroplating of gold onto composite surfaces - Google Patents

Selective electroplating of gold onto composite surfaces

Info

Publication number
GB1494394A
GB1494394A GB709175A GB709175A GB1494394A GB 1494394 A GB1494394 A GB 1494394A GB 709175 A GB709175 A GB 709175A GB 709175 A GB709175 A GB 709175A GB 1494394 A GB1494394 A GB 1494394A
Authority
GB
United Kingdom
Prior art keywords
plating
gold
feb
regions
optionally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB709175A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443624A external-priority patent/US3926747A/en
Priority claimed from US443625A external-priority patent/US3873428A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1494394A publication Critical patent/GB1494394A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1494394 Selective gold electro-plating WESTERN ELECTRIC CO Inc 19 Feb 1975 [19 Feb 1974(2)] 7091/75 Heading C7B [Also in Division H1] A composite surface comprising regions of Ti and regions of Pt, Pd and/or Au is selectively gold electro-plated on the latter by controlling the cathodic potential of the surface below that at which gold deposition occurs on the Ti, by which is meant less than 50000 Au nucleation sites per cm<SP>2</SP> on the Ti. Conventional baths are used, with optionally 20 ppb to 2 ppm of Pb present. Details of plating onset potentials for Pd, Pt and Au in relation to Ti are given, and control may be effected via a calomel electrode and potentiostat, although two-electrode systems are possible. The potential may be increased stepwise or continuously during plating. The Ti may be a layer on a conventional semi-conductor substrate, e.g. based on Si, and bear a printed circuit pattern of the Pt, Pd and/or Au. It may optionally be protected with a photo-resist during plating.
GB709175A 1974-02-19 1975-02-19 Selective electroplating of gold onto composite surfaces Expired GB1494394A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating

Publications (1)

Publication Number Publication Date
GB1494394A true GB1494394A (en) 1977-12-07

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
GB709175A Expired GB1494394A (en) 1974-02-19 1975-02-19 Selective electroplating of gold onto composite surfaces

Country Status (7)

Country Link
JP (1) JPS5440056B2 (en)
DE (1) DE2506990C3 (en)
FR (1) FR2261352B1 (en)
GB (1) GB1494394A (en)
IT (1) IT1031886B (en)
NL (1) NL160034C (en)
SE (1) SE446751B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1533837A1 (en) * 1997-03-10 2005-05-25 Asahi Kasei Kabushiki Kaisha Selective electroplating method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (en) * 1992-08-07 1996-10-24 Sel Alcatel Ag Method for electrically conductive connection using flip-chip technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1533837A1 (en) * 1997-03-10 2005-05-25 Asahi Kasei Kabushiki Kaisha Selective electroplating method

Also Published As

Publication number Publication date
NL160034B (en) 1979-04-17
DE2506990A1 (en) 1975-08-28
SE446751B (en) 1986-10-06
DE2506990B2 (en) 1979-01-25
NL7501908A (en) 1975-08-21
NL160034C (en) 1979-09-17
SE7501777L (en) 1975-08-20
IT1031886B (en) 1979-05-10
JPS5440056B2 (en) 1979-12-01
JPS50124841A (en) 1975-10-01
DE2506990C3 (en) 1979-09-13
FR2261352A1 (en) 1975-09-12
FR2261352B1 (en) 1978-04-21

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee