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PT3187560T - Composição adesiva eletricamente condutora - Google Patents

Composição adesiva eletricamente condutora

Info

Publication number
PT3187560T
PT3187560T PT158370056T PT15837005T PT3187560T PT 3187560 T PT3187560 T PT 3187560T PT 158370056 T PT158370056 T PT 158370056T PT 15837005 T PT15837005 T PT 15837005T PT 3187560 T PT3187560 T PT 3187560T
Authority
PT
Portugal
Prior art keywords
electrically conductive
adhesive composition
conductive adhesive
composition
electrically
Prior art date
Application number
PT158370056T
Other languages
English (en)
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PT3187560T publication Critical patent/PT3187560T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09J179/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
PT158370056T 2014-08-29 2015-08-10 Composição adesiva eletricamente condutora PT3187560T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014175974 2014-08-29

Publications (1)

Publication Number Publication Date
PT3187560T true PT3187560T (pt) 2024-04-11

Family

ID=55399449

Family Applications (1)

Application Number Title Priority Date Filing Date
PT158370056T PT3187560T (pt) 2014-08-29 2015-08-10 Composição adesiva eletricamente condutora

Country Status (10)

Country Link
US (1) US10563096B2 (pt)
EP (1) EP3187560B1 (pt)
JP (1) JP6391597B2 (pt)
KR (1) KR101952004B1 (pt)
CN (2) CN106574164A (pt)
MY (1) MY194517A (pt)
PH (1) PH12017500372B1 (pt)
PT (1) PT3187560T (pt)
SG (1) SG11201606128QA (pt)
WO (1) WO2016031552A1 (pt)

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US20180026003A1 (en) * 2015-04-16 2018-01-25 Furukawa Electric Co., Ltd. Electrically conductive adhesive film and dicing die bonding film
CN108028090B (zh) * 2016-01-25 2020-11-13 积水化学工业株式会社 导电材料及连接结构体
JP6899069B2 (ja) * 2016-06-27 2021-07-07 株式会社スリーボンド 熱硬化型導電性接着剤
JP6428716B2 (ja) * 2016-07-12 2018-11-28 千住金属工業株式会社 導電性接着剤、接合体および継手
WO2018013342A1 (en) * 2016-07-15 2018-01-18 E. I. Du Pont De Nemours And Company Electrically conductive adhesives
WO2018087858A1 (ja) * 2016-11-10 2018-05-17 京セラ株式会社 半導体接着用樹脂組成物、半導体接着用シート及びそれを用いた半導体装置
TWI633639B (zh) * 2016-11-15 2018-08-21 致伸科技股份有限公司 具有發光功能的指紋辨識模組及其製造方法
US20200063008A1 (en) * 2016-12-09 2020-02-27 Hitachi Chemical Company, Ltd. Composition, adhesive, sintered body, joined body, and method of producing joined body
WO2018105125A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
WO2018105127A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 接合体の製造方法、遷移的液相焼結用組成物、焼結体及び接合体
JP7352353B2 (ja) * 2017-06-01 2023-09-28 積水化学工業株式会社 導電材料及び接続構造体
JP7189209B2 (ja) * 2017-06-12 2022-12-13 オルメット・サーキッツ・インコーポレイテッド 良好な可使時間及び熱伝導性を有する金属製接着性組成物、それの製造方法及び使用
JP6660921B2 (ja) * 2017-09-14 2020-03-11 株式会社タムラ製作所 電子基板の製造方法
DE102017216878A1 (de) * 2017-09-25 2019-03-28 Robert Bosch Gmbh Verfahren zum Herstellen eines Klebstoffs und einer Klebung, insbesondere in Form einer Kleberschicht innerhalb einer Batteriezelle
CN108749244B (zh) * 2018-06-07 2020-07-14 浙江欣麟新材料技术有限公司 一种光学高柔性导电玻璃膜及其制备方法
WO2020017048A1 (ja) * 2018-07-20 2020-01-23 日立化成株式会社 組成物、接合材料、焼結体、接合体及び接合体の製造方法
WO2020035906A1 (ja) 2018-08-14 2020-02-20 日立化成株式会社 接着剤組成物及び半導体装置の製造方法
KR102403288B1 (ko) * 2018-12-04 2022-05-30 후루카와 덴키 고교 가부시키가이샤 리플로 대응 다이싱 테이프
JP7230554B2 (ja) * 2019-02-08 2023-03-01 株式会社レゾナック 接着剤組成物、接着フィルム、接着シート、並びに半導体装置及びその製造方法
WO2021010171A1 (ja) * 2019-07-16 2021-01-21 古河電気工業株式会社 接合フィルム、ウエハ加工用テープ、接合体の製造方法、接合体および貼合体
US12006447B2 (en) * 2020-01-17 2024-06-11 Soltrium Advanced Materials Technology, Ltd Epoxy conductive paste and preparation method and application thereof
KR102584580B1 (ko) * 2020-09-09 2023-10-05 한국전자통신연구원 도전 접착제용 조성물, 이의 경화물을 포함하는 반도체 패키지, 및 이를 이용한 반도체 패키지의 제조 방법
US20220077099A1 (en) * 2020-09-09 2022-03-10 Electronics And Telecommunications Research Institute Composition for conductive adhesive, semiconductor package comprising cured product thereof, and method of manufacturing semiconductor package using the same
KR102449786B1 (ko) * 2021-03-09 2022-09-29 성균관대학교산학협력단 무전해 도금 처리된 pcb 배선의 부식 방지 첨가제
JP2023045632A (ja) 2021-09-22 2023-04-03 株式会社デンソー 接合構造体

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WO2012102077A1 (ja) 2011-01-27 2012-08-02 日立化成工業株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
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JP5975167B2 (ja) * 2013-02-21 2016-08-23 株式会社村田製作所 硬化剤、該硬化剤を含む熱硬化性樹脂組成物、それを用いた接合方法、および熱硬化性樹脂の硬化温度の制御方法

Also Published As

Publication number Publication date
CN113214757A (zh) 2021-08-06
PH12017500372B1 (en) 2019-11-13
CN106574164A (zh) 2017-04-19
KR20170005431A (ko) 2017-01-13
WO2016031552A1 (ja) 2016-03-03
MY194517A (en) 2022-11-30
PH12017500372A1 (en) 2017-07-17
EP3187560A4 (en) 2018-03-07
JPWO2016031552A1 (ja) 2017-04-27
EP3187560A1 (en) 2017-07-05
JP6391597B2 (ja) 2018-09-19
US10563096B2 (en) 2020-02-18
KR101952004B1 (ko) 2019-02-25
EP3187560B1 (en) 2024-01-17
US20170152410A1 (en) 2017-06-01
SG11201606128QA (en) 2016-09-29

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