IL259245B - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- IL259245B IL259245B IL259245A IL25924518A IL259245B IL 259245 B IL259245 B IL 259245B IL 259245 A IL259245 A IL 259245A IL 25924518 A IL25924518 A IL 25924518A IL 259245 B IL259245 B IL 259245B
- Authority
- IL
- Israel
- Prior art keywords
- conductive paste
- paste
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016048687A JP6103404B1 (en) | 2016-03-11 | 2016-03-11 | Conductive paste |
| PCT/JP2016/079306 WO2017154251A1 (en) | 2016-03-11 | 2016-10-03 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL259245B true IL259245B (en) | 2019-02-28 |
Family
ID=59366048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL259245A IL259245B (en) | 2016-03-11 | 2018-05-09 | Conductive paste |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6103404B1 (en) |
| CN (1) | CN108140447B (en) |
| IL (1) | IL259245B (en) |
| WO (1) | WO2017154251A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230141912A (en) * | 2017-06-19 | 2023-10-10 | 다이요 잉키 세이조 가부시키가이샤 | Electroconductive composition, conductor using same, and layered structure |
| EP3626785B1 (en) * | 2018-09-20 | 2021-07-07 | Heraeus Deutschland GmbH & Co KG | Metal paste and its use for joining components |
| KR20210105405A (en) * | 2018-12-26 | 2021-08-26 | 쇼에이 가가쿠 가부시키가이샤 | silver paste |
| JP7070923B2 (en) * | 2019-06-24 | 2022-05-18 | 尾池工業株式会社 | Pastes for flexible electronic components, cured films for flexible electronic components, and flexible electronic components |
| JP7337677B2 (en) * | 2019-12-06 | 2023-09-04 | 福田金属箔粉工業株式会社 | Flame-retardant conductive paste and method for producing flame-retardant conductive paste |
| CN116793891B (en) * | 2023-08-21 | 2023-11-14 | 中铁九局集团第五工程有限公司 | Method for testing specific surface area of aggregate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2783000B2 (en) * | 1991-08-08 | 1998-08-06 | 日立エーアイシー株式会社 | Tantalum solid electrolytic capacitor |
| JP2000007824A (en) * | 1998-06-22 | 2000-01-11 | Jsr Corp | Electroconductive composition and transfer film for forming electrode |
| JP3558593B2 (en) * | 2000-11-24 | 2004-08-25 | 京都エレックス株式会社 | Heat-curable conductive paste composition |
| JP5297344B2 (en) * | 2009-11-04 | 2013-09-25 | 京都エレックス株式会社 | Heat curable conductive paste composition |
| US20130319496A1 (en) * | 2012-06-01 | 2013-12-05 | Heraeus Precious Metals North America Conshohocken Llc | Low-metal content electroconductive paste composition |
| JP6243135B2 (en) * | 2013-04-23 | 2017-12-06 | 京都エレックス株式会社 | Heat curable conductive paste composition |
| JP2016089038A (en) * | 2014-11-05 | 2016-05-23 | 京セラケミカル株式会社 | Conductive adhesive for electronic component and capacitor |
-
2016
- 2016-03-11 JP JP2016048687A patent/JP6103404B1/en active Active
- 2016-10-03 WO PCT/JP2016/079306 patent/WO2017154251A1/en active Application Filing
- 2016-10-03 CN CN201680061900.4A patent/CN108140447B/en active Active
-
2018
- 2018-05-09 IL IL259245A patent/IL259245B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| JP6103404B1 (en) | 2017-03-29 |
| CN108140447B (en) | 2019-03-22 |
| CN108140447A (en) | 2018-06-08 |
| JP2017162776A (en) | 2017-09-14 |
| WO2017154251A1 (en) | 2017-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed |