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MX2015008249A - Composicion de adhesivo termicamente conductora, electricamente conductor. - Google Patents

Composicion de adhesivo termicamente conductora, electricamente conductor.

Info

Publication number
MX2015008249A
MX2015008249A MX2015008249A MX2015008249A MX2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A
Authority
MX
Mexico
Prior art keywords
conductive
electrically
thermally
adhesive composition
conductive adhesive
Prior art date
Application number
MX2015008249A
Other languages
English (en)
Inventor
Irifune Akira
Ichikawa Natsuko
Harada Miyuki
Furusho Rikia
Okuda Akihiko
Ochi Mitsukazu
Kondo Takeshi
Original Assignee
Univ Kansai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Kansai filed Critical Univ Kansai
Publication of MX2015008249A publication Critical patent/MX2015008249A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Inorganic Chemistry (AREA)

Abstract

Se proporciona una composición de adhesivo térmicamente conductora, eléctricamente conductora, que tiene una alta conductividad térmica y la conductividad eléctrica consistente para su uso como un material de matriz de unión. Una composición adhesiva térmicamente conductora, eléctricamente conductora, que incluye: - (A) una carga eléctricamente conductora, - (B) una resina epoxi, y - (C) un agente de curado, la carga eléctricamente conductora (A) siendo un polvo fino de plata submicrométrica, y el contenido del polvo fino de plata con un 75 a 94% en masa de la cantidad total de la composición de adhesivo térmicamente conductora, eléctricamente conductora, - el contenido de la resina epoxi (B) es de 5 a 20% en masa de la cantidad total de la composición de adhesivo térmicamente conductora, eléctricamente conductora, - el agente de curado (C) es un compuesto de Fórmula (I), (II), o (III), y el contenido del compuesto que es de 0.4 a 2.4 equivalentes molares en términos de equivalente de hidrógeno activo, con relación a 1 equivalente molar de epoxi grupos en la resina epoxi (B) , y - durante el curado por calor y antes de que la carga eléctricamente conductora (A) comienza a sinterizar, la composición de adhesivo térmicamente conductora, eléctricamente conductor está en un estado no curado o un estado semi-curado: (ver Fórmula) (en la que X es -SO2-, -CH2-, o -O-, y R1 a R4 son independientemente un átomo de hidrógeno o un grupo alquilo inferior) (ver Fórmula) (en la que X es -SO2-, -CH2-, o -O-, y R5 a R8 son independientemente un átomo de hidrógeno o un grupo alquilo inferior), y (ver Fórmula) (en la que X es -SO2-, -CH2-, o -O-, y R9 a R12 son independientemente un átomo de hidrógeno o un grupo alquilo inferior).
MX2015008249A 2012-12-27 2013-12-25 Composicion de adhesivo termicamente conductora, electricamente conductor. MX2015008249A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012284866A JP5642147B2 (ja) 2012-12-27 2012-12-27 熱伝導性導電性接着剤組成物
PCT/JP2013/084552 WO2014104046A1 (ja) 2012-12-27 2013-12-25 熱伝導性導電性接着剤組成物

Publications (1)

Publication Number Publication Date
MX2015008249A true MX2015008249A (es) 2016-09-19

Family

ID=51021126

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015008249A MX2015008249A (es) 2012-12-27 2013-12-25 Composicion de adhesivo termicamente conductora, electricamente conductor.

Country Status (11)

Country Link
US (1) US20150344749A1 (es)
EP (1) EP2940093B1 (es)
JP (1) JP5642147B2 (es)
KR (1) KR101775255B1 (es)
CN (1) CN104968746B (es)
MX (1) MX2015008249A (es)
MY (1) MY172479A (es)
PH (1) PH12015501480B1 (es)
SG (1) SG11201504998SA (es)
TW (1) TWI510595B (es)
WO (1) WO2014104046A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6062974B2 (ja) * 2014-02-24 2017-01-18 三ツ星ベルト株式会社 導電性組成物
JP5806760B1 (ja) * 2014-05-29 2015-11-10 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP6396189B2 (ja) * 2014-11-27 2018-09-26 日東電工株式会社 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法
CN107207835B (zh) * 2015-01-19 2020-04-17 京瓷株式会社 导电性树脂组合物以及半导体装置
JP6091019B2 (ja) * 2015-02-02 2017-03-08 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP6164256B2 (ja) * 2015-07-08 2017-07-19 住友ベークライト株式会社 熱伝導性組成物、半導体装置、半導体装置の製造方法、および放熱板の接着方法
KR102305794B1 (ko) 2016-05-26 2021-09-28 가부시키가이샤 오사카소다 도전성 접착체
WO2018003704A1 (ja) * 2016-06-27 2018-01-04 株式会社スリーボンド 熱硬化型導電性接着剤
US11505692B2 (en) * 2016-09-02 2022-11-22 Threebond Co., Ltd. (Meth) acrylic resin composition and electroconductive adhesive using the same
JP6859799B2 (ja) * 2017-03-29 2021-04-14 三菱マテリアル株式会社 ペースト状銀粉組成物、接合体の製造方法および銀膜の製造方法
WO2018225773A1 (ja) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
US20210174984A1 (en) * 2017-11-13 2021-06-10 Nitto Denko Corporation Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet
CN109837050A (zh) * 2019-03-15 2019-06-04 苏州凡络新材料科技有限公司 一种低温固化型导电胶黏剂及其制备方法
RU2730319C1 (ru) * 2019-08-26 2020-08-21 Акционерное общество "Государственный космический научно-производственный центр им. М.В. Хруничева" Клеевая композиция на основе эпоксидной смолы
CN110885655B (zh) * 2019-12-13 2021-09-03 苏州凡络新材料科技有限公司 一种表面绝缘型电磁屏蔽胶黏剂及其制备方法
EP4122888A4 (en) * 2020-03-16 2024-04-24 Mitsubishi Materials Corporation ANORGANIC FILLER POWDER, THERMOCONDUCTIVE POLYMER COMPOSITION AND METHOD FOR MANUFACTURING INORGANIC FILLER POWDER
CN115011294B (zh) * 2022-06-07 2023-02-10 道尔化成电子材料(上海)有限公司 一种芯片封装用烧结型纳米银导电胶及其制备方法
KR102827064B1 (ko) * 2023-03-27 2025-06-30 한국전자기술연구원 그래핀 소재를 포함하는 고내열 에폭시 접착 조성물 및 제조방법

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
US4557860A (en) * 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
JPH0196278A (ja) * 1987-10-08 1989-04-14 Toray Ind Inc 接着剤
EP0431891A1 (en) * 1989-12-06 1991-06-12 Teijin Limited Epoxy compounds, production processes thereof and cured product of the epoxy compound
DE4012061A1 (de) * 1990-04-10 1991-10-17 Mittweida Ing Hochschule Loesungsmittelfreie isotrope leit- und klebepaste mit eingelagerten elektrisch leitfaehigen partikeln
JPH06322350A (ja) 1993-03-17 1994-11-22 Fujitsu Ltd 導電性接着剤及びその製造方法並びに半導体チップの接着方法
US5891367A (en) * 1998-02-23 1999-04-06 General Motors Corporation Conductive epoxy adhesive
JP4355044B2 (ja) * 1999-02-19 2009-10-28 大日本印刷株式会社 硬化性導電ペースト
JP3826104B2 (ja) * 2003-03-17 2006-09-27 株式会社ルネサステクノロジ 無溶剤型液状銀ペースト組成物及びそれを用いた半導体装置
JP2004359830A (ja) * 2003-06-05 2004-12-24 Kyocera Chemical Corp 導電性接着剤組成物
TWI304835B (en) * 2003-06-10 2009-01-01 Hitachi Chemical Co Ltd Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device
JP4790208B2 (ja) * 2003-06-24 2011-10-12 中国塗料株式会社 エポキシ樹脂組成物、該組成物から形成された防食皮膜、および該防食皮膜で被覆された防食皮膜付き基材、並びに基材の防食方法
TW200520640A (en) * 2003-09-10 2005-06-16 Nippon Kayaku Kk Sheet for flexible printed circuit board and method for manufacture thereof
JP4984385B2 (ja) * 2004-10-18 2012-07-25 Ｄｉｃ株式会社 エポキシ樹脂組成物およびその硬化物
US20070007198A1 (en) * 2005-07-07 2007-01-11 Loran Balvanz Method and apparatus for producing dried distiller's grain
JP2008186590A (ja) 2007-01-26 2008-08-14 Teijin Ltd 高熱伝導性導電性組成物、導電性ペースト、導電性接着剤
JP5204454B2 (ja) 2007-10-02 2013-06-05 積水化学工業株式会社 接着剤
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
CN104194454B (zh) * 2009-02-16 2019-01-08 塞特克技术公司 用于热固性复合材料的雷击及电磁干扰屏蔽的共固化导电表面膜
JP5611537B2 (ja) * 2009-04-28 2014-10-22 日立化成株式会社 導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置
CN101805574A (zh) * 2010-03-11 2010-08-18 复旦大学 采用表面活化处理的银填料的烧结型导电胶及其制备方法
CN102870455B (zh) * 2010-04-29 2016-06-01 交互数字专利控股公司 使用个人无线装置进行网络测试
JP5543879B2 (ja) * 2010-09-02 2014-07-09 旭化成イーマテリアルズ株式会社 エポキシ樹脂用硬化剤組成物及び一液性エポキシ樹脂組成物
WO2012059974A1 (ja) * 2010-11-01 2012-05-10 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
KR101374365B1 (ko) * 2010-12-27 2014-03-17 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
TW201245364A (en) * 2011-01-28 2012-11-16 Hitachi Chemical Co Ltd Adhesive composition and semiconductor device using same
JP5652617B2 (ja) * 2011-04-27 2015-01-14 大日本印刷株式会社 熱硬化型粘接着剤組成物、粘接着シート、及び粘接着シートの製造方法
CN102408856A (zh) * 2011-08-09 2012-04-11 烟台德邦电子材料有限公司 一种用于led封装的导电胶及其制备方法
JP6081231B2 (ja) * 2012-03-05 2017-02-15 ナミックス株式会社 熱伝導性ペースト及びその使用
CN102634312A (zh) * 2012-03-27 2012-08-15 烟台德邦电子材料有限公司 一种用于led封装的镀银粉末导电胶及其制备方法

Also Published As

Publication number Publication date
US20150344749A1 (en) 2015-12-03
CN104968746A (zh) 2015-10-07
TW201435041A (zh) 2014-09-16
TWI510595B (zh) 2015-12-01
KR20150108844A (ko) 2015-09-30
WO2014104046A1 (ja) 2014-07-03
PH12015501480B1 (en) 2019-05-24
KR101775255B1 (ko) 2017-09-05
SG11201504998SA (en) 2015-07-30
JP2014125596A (ja) 2014-07-07
EP2940093B1 (en) 2017-11-22
EP2940093A4 (en) 2016-08-03
PH12015501480A1 (en) 2015-09-21
CN104968746B (zh) 2017-09-19
EP2940093A1 (en) 2015-11-04
JP5642147B2 (ja) 2014-12-17
MY172479A (en) 2019-11-26

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