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MY175000A - Epoxy resin, epoxy resin composition and cured product - Google Patents

Epoxy resin, epoxy resin composition and cured product

Info

Publication number
MY175000A
MY175000A MYPI2014703662A MYPI2014703662A MY175000A MY 175000 A MY175000 A MY 175000A MY PI2014703662 A MYPI2014703662 A MY PI2014703662A MY PI2014703662 A MYPI2014703662 A MY PI2014703662A MY 175000 A MY175000 A MY 175000A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
cured product
carbon atoms
formula
Prior art date
Application number
MYPI2014703662A
Inventor
Masataka Nakanishi
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of MY175000A publication Critical patent/MY175000A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Medicinal Preparation (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Provided are an epoxy resin containing, as a main component, a compound represented by the following formula (1) in a content of from 70 to 95% (in terms ofan area? according to the gel permeation chromatography); and a curable epoxy resin composition containing the epoxy resin and a curing agent or a curing catalyst. (1 ) (In the formula, each of plurally existent Rs independently represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having from 1 to 6 carbon atoms.)
MYPI2014703662A 2012-06-07 2013-06-06 Epoxy resin, epoxy resin composition and cured product MY175000A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012129407 2012-06-07
PCT/JP2013/065755 WO2013183735A1 (en) 2012-06-07 2013-06-06 Epoxy resin, epoxy resin composition and cured product

Publications (1)

Publication Number Publication Date
MY175000A true MY175000A (en) 2020-06-01

Family

ID=49712122

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014703662A MY175000A (en) 2012-06-07 2013-06-06 Epoxy resin, epoxy resin composition and cured product

Country Status (7)

Country Link
JP (2) JP6366504B2 (en)
KR (1) KR101952321B1 (en)
CN (1) CN104470965B9 (en)
MY (1) MY175000A (en)
SG (1) SG11201408157QA (en)
TW (1) TWI579313B (en)
WO (1) WO2013183735A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101952321B1 (en) * 2012-06-07 2019-02-26 닛뽄 가야쿠 가부시키가이샤 Epoxy resin, epoxy resin composition and cured product
KR102327347B1 (en) 2014-08-22 2021-11-16 닛뽄 가야쿠 가부시키가이샤 Epoxy(meth)acrylate compound, resin composition containing the same and cured product thereof, color filter and display device
WO2016031643A1 (en) * 2014-08-26 2016-03-03 日本化薬株式会社 Reactive polyester compound and active energy ray-curable resin composition using same
CN105542127B (en) * 2014-10-22 2020-04-10 味之素株式会社 Resin composition
JP6428147B2 (en) * 2014-10-22 2018-11-28 味の素株式会社 Resin composition
EP3272782B1 (en) * 2015-03-18 2023-03-22 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
JP2017071706A (en) * 2015-10-08 2017-04-13 日本化薬株式会社 Epoxy resin composition, curable resin composition and cured product thereof
CN108291008B (en) * 2016-03-28 2022-05-03 积水化学工业株式会社 Resin composition and multilayer substrate
US20200181391A1 (en) * 2016-09-26 2020-06-11 Sabic Global Technologies B.V. High heat and high toughness epoxy compositions, articles, and uses thereof
JP2020026439A (en) * 2016-12-22 2020-02-20 日本化薬株式会社 Epoxy resin, epoxy resin composition and cured article
JP7185519B2 (en) * 2017-12-25 2022-12-07 太陽インキ製造株式会社 Thermosetting resin filler, cured product thereof, and multilayer printed wiring board
CN109401707B (en) * 2018-11-01 2020-12-08 烟台信友新材料有限公司 Single-component high-temperature-resistant impact-resistant flame-retardant structural adhesive and preparation method thereof
CN111154376A (en) * 2020-01-16 2020-05-15 宁波宁静新材料科技有限公司 Ag/BNNSs nano material modified epoxy resin composite coating

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH496021A (en) * 1966-03-10 1970-09-15 Ciba Geigy Preparation of polyglycidyl ethers
JPS4512131B1 (en) * 1967-03-10 1970-05-02
JPH01108218A (en) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd Purification of epoxy resin
JPH01108217A (en) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd Epoxy resin purification method
JP2556366B2 (en) * 1988-11-25 1996-11-20 日本化薬株式会社 High-purity epoxy resin and method for producing the same
JPH0892231A (en) * 1994-09-22 1996-04-09 Mitsui Toatsu Chem Inc Spirobiindan diglycidyl ether and its production
JP2000007757A (en) * 1998-04-22 2000-01-11 Asahi Chiba Kk New epoxy resin
JP2002114835A (en) * 2000-10-06 2002-04-16 Asahi Denka Kogyo Kk Curing agent composition for epoxy resin and coating composition
JP2004099744A (en) * 2002-09-10 2004-04-02 Mitsui Chemicals Inc Method for purifying epoxy resin
WO2004069893A1 (en) * 2003-02-03 2004-08-19 Nippon Steel Chemical Co., Ltd. Epoxy resin, process for producing the same, epoxy resin composition containing the same, and cured object
TWI300083B (en) * 2003-04-25 2008-08-21 Mitsui Chemicals Inc Epoxy resin and its usage
JP2005154719A (en) 2003-04-25 2005-06-16 Mitsui Chemicals Inc Epoxy resin composition and its application
JP2007063565A (en) * 2006-10-17 2007-03-15 Sumitomo Bakelite Co Ltd Resin paste for semiconductor and semiconductor device
EP2143718B1 (en) * 2007-05-08 2012-11-21 Mitsubishi Gas Chemical Company, Inc. Process for producing tetraglycidylamino compound
JP5153000B2 (en) * 2009-04-01 2013-02-27 新日鉄住金化学株式会社 Epoxy resin, production method thereof, epoxy resin composition and cured product
KR102021455B1 (en) * 2011-05-31 2019-09-16 코닝 인코포레이티드 Precision Glass Roll Forming Process And Apparatus
KR101952321B1 (en) * 2012-06-07 2019-02-26 닛뽄 가야쿠 가부시키가이샤 Epoxy resin, epoxy resin composition and cured product

Also Published As

Publication number Publication date
CN104470965B (en) 2017-04-12
JP2018009177A (en) 2018-01-18
TW201412805A (en) 2014-04-01
KR101952321B1 (en) 2019-02-26
CN104470965A (en) 2015-03-25
JP6366504B2 (en) 2018-08-01
TWI579313B (en) 2017-04-21
SG11201408157QA (en) 2015-01-29
CN104470965B9 (en) 2019-01-01
KR20150031232A (en) 2015-03-23
WO2013183735A1 (en) 2013-12-12
JPWO2013183735A1 (en) 2016-02-01

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