KR980005773A - 세정처리제 - Google Patents
세정처리제 Download PDFInfo
- Publication number
- KR980005773A KR980005773A KR1019970023398A KR19970023398A KR980005773A KR 980005773 A KR980005773 A KR 980005773A KR 1019970023398 A KR1019970023398 A KR 1019970023398A KR 19970023398 A KR19970023398 A KR 19970023398A KR 980005773 A KR980005773 A KR 980005773A
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- cleaning agent
- agent according
- group
- ions
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16535396 | 1996-06-05 | ||
JP96-165353 | 1996-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR980005773A true KR980005773A (ko) | 1998-03-30 |
KR100322392B1 KR100322392B1 (ko) | 2002-03-08 |
Family
ID=15810758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970023398A KR100322392B1 (ko) | 1996-06-05 | 1997-06-05 | 세정처리제 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6143705A (ko) |
EP (1) | EP0812011B1 (ko) |
KR (1) | KR100322392B1 (ko) |
DE (1) | DE69733102T2 (ko) |
TW (1) | TW416987B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100381355B1 (ko) * | 1997-11-28 | 2003-08-19 | 엔이씨 일렉트로닉스 코포레이션 | 기판의세정방법 |
KR100825844B1 (ko) * | 2000-09-05 | 2008-04-28 | 와코 쥰야꾸 고교 가부시키가이샤 | Ti계 막용 에칭제 및 에칭 방법 |
Families Citing this family (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6755989B2 (en) | 1997-01-09 | 2004-06-29 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
JP2001508239A (ja) * | 1997-01-09 | 2001-06-19 | アドバンスド ケミカル システムズ インターナショナル,インコーポレイテッド | 水性フッ化アンモニウムおよびアミンを用いた、半導体ウエハ洗浄組成物および方法 |
US6896826B2 (en) | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
TW387936B (en) * | 1997-08-12 | 2000-04-21 | Kanto Kagaku | Washing solution |
US5977041A (en) * | 1997-09-23 | 1999-11-02 | Olin Microelectronic Chemicals | Aqueous rinsing composition |
US6479443B1 (en) | 1997-10-21 | 2002-11-12 | Lam Research Corporation | Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film |
US6165956A (en) * | 1997-10-21 | 2000-12-26 | Lam Research Corporation | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
US6303551B1 (en) | 1997-10-21 | 2001-10-16 | Lam Research Corporation | Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film |
US6593282B1 (en) | 1997-10-21 | 2003-07-15 | Lam Research Corporation | Cleaning solutions for semiconductor substrates after polishing of copper film |
DE19758533B4 (de) * | 1997-12-04 | 2005-09-29 | Micronas Gmbh | Verfahren zum Strukturieren einer Oberflächenschicht |
US6231677B1 (en) * | 1998-02-27 | 2001-05-15 | Kanto Kagaku Kabushiki Kaisha | Photoresist stripping liquid composition |
KR100532380B1 (ko) * | 1998-05-12 | 2006-01-27 | 삼성전자주식회사 | 반도체장치의 세정방법 |
JP3003684B1 (ja) * | 1998-09-07 | 2000-01-31 | 日本電気株式会社 | 基板洗浄方法および基板洗浄液 |
JP3279532B2 (ja) * | 1998-11-06 | 2002-04-30 | 日本電気株式会社 | 半導体装置の製造方法 |
NZ512506A (en) * | 1998-12-04 | 2004-01-30 | Farrow System Ltd | Method for removing surface coatings |
JP4224652B2 (ja) * | 1999-03-08 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離液およびそれを用いたレジストの剥離方法 |
US6358847B1 (en) | 1999-03-31 | 2002-03-19 | Lam Research Corporation | Method for enabling conventional wire bonding to copper-based bond pad features |
JP4516176B2 (ja) * | 1999-04-20 | 2010-08-04 | 関東化学株式会社 | 電子材料用基板洗浄液 |
US6562726B1 (en) * | 1999-06-29 | 2003-05-13 | Micron Technology, Inc. | Acid blend for removing etch residue |
US6395693B1 (en) | 1999-09-27 | 2002-05-28 | Cabot Microelectronics Corporation | Cleaning solution for semiconductor surfaces following chemical-mechanical polishing |
US6537381B1 (en) | 1999-09-29 | 2003-03-25 | Lam Research Corporation | Method for cleaning and treating a semiconductor wafer after chemical mechanical polishing |
US6194366B1 (en) * | 1999-11-16 | 2001-02-27 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
US6592433B2 (en) * | 1999-12-31 | 2003-07-15 | Intel Corporation | Method for defect reduction |
JP3645144B2 (ja) * | 2000-02-24 | 2005-05-11 | Necエレクトロニクス株式会社 | 半導体装置の製造方法 |
CN1267972C (zh) * | 2000-03-21 | 2006-08-02 | 和光纯药工业株式会社 | 半导体基板洗涤剂和洗涤方法 |
US6486108B1 (en) * | 2000-05-31 | 2002-11-26 | Micron Technology, Inc. | Cleaning composition useful in semiconductor integrated circuit fabrication |
DE60115909T2 (de) | 2000-06-16 | 2006-09-07 | Kao Corp. | Reinigungsmittelzusammensetzung |
DE60044470D1 (de) * | 2000-06-23 | 2010-07-08 | Fujitsu Ltd | Verfahren zur herstellung eines halbleiterelement |
US6762132B1 (en) * | 2000-08-31 | 2004-07-13 | Micron Technology, Inc. | Compositions for dissolution of low-K dielectric films, and methods of use |
JP2002114993A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄剤及び洗浄方法 |
JP2002113431A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄方法 |
US6627550B2 (en) | 2001-03-27 | 2003-09-30 | Micron Technology, Inc. | Post-planarization clean-up |
US6627546B2 (en) * | 2001-06-29 | 2003-09-30 | Ashland Inc. | Process for removing contaminant from a surface and composition useful therefor |
US6705926B2 (en) * | 2001-10-24 | 2004-03-16 | Cabot Microelectronics Corporation | Boron-containing polishing system and method |
EP1335016A1 (en) * | 2002-02-06 | 2003-08-13 | Shipley Company LLC | Cleaning composition |
TWI339680B (en) * | 2002-02-19 | 2011-04-01 | Kanto Kagaku | Washing liquid composition for semiconductor substrate |
KR100997180B1 (ko) * | 2002-04-25 | 2010-11-29 | 아치 스페셜티 케미칼즈, 인코포레이티드 | 에치 잔여물질을 제거하기 위한 비-부식성 세척 조성물 |
JP4221191B2 (ja) * | 2002-05-16 | 2009-02-12 | 関東化学株式会社 | Cmp後洗浄液組成物 |
JP2005535784A (ja) * | 2002-08-19 | 2005-11-24 | 伊默克化學科技股▲ふん▼有限公司 | 清浄液 |
US20060025320A1 (en) * | 2002-11-05 | 2006-02-02 | Marc Borner | Seminconductor surface treatment and mixture used therein |
WO2004042811A1 (ja) * | 2002-11-08 | 2004-05-21 | Wako Pure Chemical Industries, Ltd. | 洗浄液及びそれを用いた洗浄方法 |
JP4355785B2 (ja) * | 2002-11-26 | 2009-11-04 | 光 小林 | 半導体装置製造用基板の製造方法および半導体装置の製造方法 |
JP4375991B2 (ja) * | 2003-04-09 | 2009-12-02 | 関東化学株式会社 | 半導体基板洗浄液組成物 |
US7188630B2 (en) * | 2003-05-07 | 2007-03-13 | Freescale Semiconductor, Inc. | Method to passivate conductive surfaces during semiconductor processing |
US7737097B2 (en) | 2003-06-27 | 2010-06-15 | Lam Research Corporation | Method for removing contamination from a substrate and for making a cleaning solution |
US7913703B1 (en) | 2003-06-27 | 2011-03-29 | Lam Research Corporation | Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate |
US20040261823A1 (en) * | 2003-06-27 | 2004-12-30 | Lam Research Corporation | Method and apparatus for removing a target layer from a substrate using reactive gases |
US8316866B2 (en) * | 2003-06-27 | 2012-11-27 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US8522801B2 (en) * | 2003-06-27 | 2013-09-03 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US7799141B2 (en) * | 2003-06-27 | 2010-09-21 | Lam Research Corporation | Method and system for using a two-phases substrate cleaning compound |
US7648584B2 (en) * | 2003-06-27 | 2010-01-19 | Lam Research Corporation | Method and apparatus for removing contamination from substrate |
TWI362415B (en) | 2003-10-27 | 2012-04-21 | Wako Pure Chem Ind Ltd | Novel detergent and method for cleaning |
CN1875325B (zh) * | 2003-10-29 | 2011-01-26 | 马林克罗特贝克公司 | 含有金属卤化物腐蚀抑制剂的碱性后等离子体蚀刻/灰化残余物去除剂和光致抗蚀剂剥离组合物 |
US7416370B2 (en) * | 2005-06-15 | 2008-08-26 | Lam Research Corporation | Method and apparatus for transporting a substrate using non-Newtonian fluid |
US8522799B2 (en) * | 2005-12-30 | 2013-09-03 | Lam Research Corporation | Apparatus and system for cleaning a substrate |
US7862662B2 (en) * | 2005-12-30 | 2011-01-04 | Lam Research Corporation | Method and material for cleaning a substrate |
US8323420B2 (en) | 2005-06-30 | 2012-12-04 | Lam Research Corporation | Method for removing material from semiconductor wafer and apparatus for performing the same |
US7568490B2 (en) * | 2003-12-23 | 2009-08-04 | Lam Research Corporation | Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids |
US8043441B2 (en) | 2005-06-15 | 2011-10-25 | Lam Research Corporation | Method and apparatus for cleaning a substrate using non-Newtonian fluids |
EP1717344A4 (en) * | 2004-01-23 | 2008-08-20 | Ebara Corp | PROCESS FOR PROCESSING A SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING DEVICE |
CN1918698B (zh) * | 2004-02-09 | 2010-04-07 | 三菱化学株式会社 | 半导体装置用基板的洗涤液及洗涤方法 |
KR100606187B1 (ko) * | 2004-07-14 | 2006-08-01 | 테크노세미켐 주식회사 | 반도체 기판 세정용 조성물, 이를 이용한 반도체 기판세정방법 및 반도체 장치 제조 방법 |
US7922823B2 (en) * | 2005-01-27 | 2011-04-12 | Advanced Technology Materials, Inc. | Compositions for processing of semiconductor substrates |
US7923423B2 (en) * | 2005-01-27 | 2011-04-12 | Advanced Technology Materials, Inc. | Compositions for processing of semiconductor substrates |
CN101171551B (zh) * | 2005-05-06 | 2012-12-26 | 安万托特性材料股份有限公司 | 用于清除蚀刻后和灰化的光致抗蚀剂残余物及大部分光致抗蚀剂的组合物 |
US7939482B2 (en) * | 2005-05-25 | 2011-05-10 | Freescale Semiconductor, Inc. | Cleaning solution for a semiconductor wafer |
SG154438A1 (en) * | 2005-12-30 | 2009-08-28 | Lam Res Corp | Cleaning compound and method and system for using the cleaning compound |
TW200734448A (en) * | 2006-02-03 | 2007-09-16 | Advanced Tech Materials | Low pH post-CMP residue removal composition and method of use |
WO2008023214A1 (en) * | 2006-08-23 | 2008-02-28 | Freescale Semiconductor, Inc. | Rinse formulation for use in the manufacture of an integrated circuit |
US20080076688A1 (en) * | 2006-09-21 | 2008-03-27 | Barnes Jeffrey A | Copper passivating post-chemical mechanical polishing cleaning composition and method of use |
US8685909B2 (en) * | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
EP2082024A4 (en) * | 2006-09-25 | 2010-11-17 | Advanced Tech Materials | COMPOSITIONS AND METHODS FOR REMOVING A PHOTORESISTANT AGENT FOR RECYCLING A SILICON GALETTE |
US20080148595A1 (en) * | 2006-12-20 | 2008-06-26 | Lam Research Corporation | Method and apparatus for drying substrates using a surface tensions reducing gas |
US7897213B2 (en) * | 2007-02-08 | 2011-03-01 | Lam Research Corporation | Methods for contained chemical surface treatment |
JP2010535422A (ja) * | 2007-08-02 | 2010-11-18 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | マイクロ電子デバイスから残渣を除去するための非フッ化物含有組成物 |
DE102007058829A1 (de) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Textur- und Reinigungsmedium zur Oberflächenbehandlung von Wafern und dessen Verwendung |
US8084406B2 (en) * | 2007-12-14 | 2011-12-27 | Lam Research Corporation | Apparatus for particle removal by single-phase and two-phase media |
US8404626B2 (en) * | 2007-12-21 | 2013-03-26 | Lam Research Corporation | Post-deposition cleaning methods and formulations for substrates with cap layers |
US9048088B2 (en) * | 2008-03-28 | 2015-06-02 | Lam Research Corporation | Processes and solutions for substrate cleaning and electroless deposition |
US9074170B2 (en) | 2008-10-21 | 2015-07-07 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
US8431516B2 (en) | 2009-10-24 | 2013-04-30 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
US8148311B2 (en) | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
US8148310B2 (en) * | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
US7947130B2 (en) | 2009-10-24 | 2011-05-24 | Wai Mun Lee | Troika acid semiconductor cleaning compositions and methods of use |
JP6066552B2 (ja) | 2011-12-06 | 2017-01-25 | 関東化學株式会社 | 電子デバイス用洗浄液組成物 |
KR101997950B1 (ko) | 2012-02-17 | 2019-07-08 | 미쯔비시 케미컬 주식회사 | 반도체 디바이스용 세정액 및 반도체 디바이스용 기판의 세정 방법 |
WO2013162020A1 (ja) | 2012-04-27 | 2013-10-31 | 和光純薬工業株式会社 | 半導体基板用洗浄剤および半導体基板表面の処理方法 |
KR101799946B1 (ko) | 2014-11-18 | 2017-11-22 | 삼성에스디아이 주식회사 | 유기막 연마 후 세정조성물 및 이를 이용한 세정방법 |
FR3046062B1 (fr) * | 2015-12-23 | 2018-02-16 | L'oreal | Procede d'extraction d'ions metalliques des fibres keratiniques par application repetee d'une composition acide |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2970044A (en) * | 1957-12-30 | 1961-01-31 | Ibm | Solution and process for etching indium dots |
US3290174A (en) * | 1961-10-09 | 1966-12-06 | Rohr Corp | Two-stage process for derusting and protecting the surfaces of ferrous materials |
NL149551B (nl) * | 1964-08-04 | 1976-05-17 | Dow Chemical Co | Werkwijze voor het reinigen en passiveren van ijzerhoudende metaaloppervlakken, waarop metallisch koper is afgezet. |
FR1603558A (en) * | 1968-12-18 | 1971-05-03 | Cleaning heating surfaces with complexing agent soln | |
GB1571438A (en) * | 1977-03-15 | 1980-07-16 | Colgate Palmolive Co | Cleaning compositions |
US4215005A (en) * | 1978-01-30 | 1980-07-29 | Allied Chemical Corporation | Organic stripping compositions and method for using same |
US4217234A (en) * | 1978-02-16 | 1980-08-12 | Werner Krisp | Denture cleansing tablet and method of manufacturing the same |
US4209418A (en) * | 1978-07-18 | 1980-06-24 | Union Carbide Corporation | Gelatin benzimidazole blends as inhibitors for carboxylic acids |
US4264418A (en) * | 1978-09-19 | 1981-04-28 | Kilene Corp. | Method for detersifying and oxide coating removal |
US4164477A (en) * | 1978-10-02 | 1979-08-14 | Chem-X3, Inc. | Fungicidal detergent composition |
US4239567A (en) * | 1978-10-16 | 1980-12-16 | Western Electric Company, Inc. | Removably holding planar articles for polishing operations |
SU1070210A1 (ru) * | 1981-09-17 | 1984-01-30 | Предприятие П/Я А-3562 | Раствор дл размерного травлени железа |
US4395304A (en) * | 1982-05-11 | 1983-07-26 | Rca Corporation | Selective etching of phosphosilicate glass |
US4610728A (en) * | 1982-10-19 | 1986-09-09 | Ram Natesh | Method and composition for dissolving deposits of magnetite |
SU1153226A1 (ru) * | 1982-12-23 | 1985-04-30 | Московский Ордена Ленина И Ордена Октябрьской Революции Энергетический Институт | Композици дл отмывки отложений с поверхностей нагрева котлов и парогенераторов |
US4452643A (en) * | 1983-01-12 | 1984-06-05 | Halliburton Company | Method of removing copper and copper oxide from a ferrous metal surface |
US4587043A (en) * | 1983-06-07 | 1986-05-06 | Westinghouse Electric Corp. | Decontamination of metal surfaces in nuclear power reactors |
US4529450A (en) * | 1983-10-18 | 1985-07-16 | The United States Of America As Represented By The Secretary Of The Navy | Metal oxide remover and method of using |
US4626324A (en) * | 1984-04-30 | 1986-12-02 | Allied Corporation | Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards |
US5318717A (en) * | 1984-12-28 | 1994-06-07 | Alcon Laboratories, Inc. | Use of nonionic surfactant to enhance the cleaning effect of pancreatin on contact lenses |
US4623399A (en) * | 1985-02-04 | 1986-11-18 | Dowell Schlumberger Incorporated | Solvent for removing iron oxide deposits |
JPS61231188A (ja) * | 1985-04-04 | 1986-10-15 | Nippon Paint Co Ltd | アルミニウム表面洗浄剤の管理方法 |
JP2504978B2 (ja) | 1987-01-27 | 1996-06-05 | 株式会社リコー | トナ−担持体 |
US4802990A (en) * | 1987-07-30 | 1989-02-07 | Inskeep Jr Eugene L | Solution and method for dissolving minerals |
JPS6448302A (en) * | 1987-08-18 | 1989-02-22 | Matsushita Electric Ind Co Ltd | Floating type illumination device |
US4845125A (en) * | 1987-11-10 | 1989-07-04 | Indianapolis Center For Advanced Research, Inc. | Chemolytic EDTA-citric acid composition for dissolution of calculi |
US5039441A (en) * | 1988-02-10 | 1991-08-13 | Colgate-Palmolive Company | Safe acidic hard surface cleaner |
US4992212A (en) * | 1988-10-18 | 1991-02-12 | Lever Brothers Company, Division Of Conopco, Inc. | Alkaline light duty liquid detergents that are non-staining to aluminum |
JPH03161585A (ja) * | 1989-08-30 | 1991-07-11 | Hakutou Kagaku Kk | 古紙脱墨工程におけるシリカ系スケール防止剤及び防止方法 |
JP2940058B2 (ja) * | 1990-03-05 | 1999-08-25 | 栗田工業株式会社 | 抄紙機の脱水部用デポジット防止方法 |
DE69231971T2 (de) * | 1991-01-24 | 2002-04-04 | Purex Co., Ltd. | Lösungen zur Oberflächenbehandlung von Halbleitern |
TW263531B (ko) * | 1992-03-11 | 1995-11-21 | Mitsubishi Gas Chemical Co | |
NZ248582A (en) * | 1992-09-24 | 1995-02-24 | Colgate Palmolive Co | Acidic, thickened cleaner containing dicarboxylic acids and aminoalkylene phosphonic acid for cleaning lime scale from acid-resistant or zirconium white enamel hard surfaces |
US5288332A (en) * | 1993-02-05 | 1994-02-22 | Honeywell Inc. | A process for removing corrosive by-products from a circuit assembly |
US5389194A (en) * | 1993-02-05 | 1995-02-14 | Lsi Logic Corporation | Methods of cleaning semiconductor substrates after polishing |
US5635104A (en) * | 1993-06-24 | 1997-06-03 | The Procter & Gamble Company | Bleaching solutions and method utilizing selected bleach activators effective at low perhydroxyl concentrations |
JPH07286172A (ja) * | 1994-04-20 | 1995-10-31 | Asahi Glass Co Ltd | エッチング液およびエッチング方法 |
US5466389A (en) * | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
US5498293A (en) * | 1994-06-23 | 1996-03-12 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
US5637151A (en) * | 1994-06-27 | 1997-06-10 | Siemens Components, Inc. | Method for reducing metal contamination of silicon wafers during semiconductor manufacturing |
DE19525521B4 (de) * | 1994-07-15 | 2007-04-26 | Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont | Verfahren zum Reinigen von Substraten |
US5460802A (en) * | 1994-07-18 | 1995-10-24 | Minnesota Mining And Manufacturing Company | Oral disinfectant for companion animals |
US5635167A (en) * | 1994-12-28 | 1997-06-03 | L'avante Garde, Inc. | Removal of minerals from human hair and animal keratin fibers |
US5662769A (en) * | 1995-02-21 | 1997-09-02 | Advanced Micro Devices, Inc. | Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning |
KR100429440B1 (ko) * | 1995-07-27 | 2004-07-15 | 미쓰비시 가가꾸 가부시키가이샤 | 기체의표면처리방법및그에사용되는표면처리조성물 |
EP0784336A3 (en) * | 1995-12-15 | 1998-05-13 | Texas Instruments Incorporated | Improvements in or relating to the fabrication and processing of semiconductor devices |
-
1997
- 1997-05-21 TW TW086106782A patent/TW416987B/zh not_active IP Right Cessation
- 1997-06-03 DE DE69733102T patent/DE69733102T2/de not_active Expired - Lifetime
- 1997-06-03 EP EP97108877A patent/EP0812011B1/en not_active Expired - Lifetime
- 1997-06-04 US US08/868,891 patent/US6143705A/en not_active Expired - Lifetime
- 1997-06-05 KR KR1019970023398A patent/KR100322392B1/ko not_active IP Right Cessation
-
2000
- 2000-09-11 US US09/658,926 patent/US6514921B1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100381355B1 (ko) * | 1997-11-28 | 2003-08-19 | 엔이씨 일렉트로닉스 코포레이션 | 기판의세정방법 |
KR100825844B1 (ko) * | 2000-09-05 | 2008-04-28 | 와코 쥰야꾸 고교 가부시키가이샤 | Ti계 막용 에칭제 및 에칭 방법 |
Also Published As
Publication number | Publication date |
---|---|
US6143705A (en) | 2000-11-07 |
DE69733102T2 (de) | 2006-03-02 |
KR100322392B1 (ko) | 2002-03-08 |
EP0812011A3 (en) | 1998-05-13 |
US6514921B1 (en) | 2003-02-04 |
TW416987B (en) | 2001-01-01 |
EP0812011A2 (en) | 1997-12-10 |
DE69733102D1 (de) | 2005-06-02 |
EP0812011B1 (en) | 2005-04-27 |
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