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KR970070156A - 실리콘 다이 부착용 접착제, 반도체 장치의 제조방법 및 반도체 장치 - Google Patents

실리콘 다이 부착용 접착제, 반도체 장치의 제조방법 및 반도체 장치 Download PDF

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KR970070156A
KR970070156A KR1019970014902A KR19970014902A KR970070156A KR 970070156 A KR970070156 A KR 970070156A KR 1019970014902 A KR1019970014902 A KR 1019970014902A KR 19970014902 A KR19970014902 A KR 19970014902A KR 970070156 A KR970070156 A KR 970070156A
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silicon
bonded
composition
weight
parts
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KR1019970014902A
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오사무 미타니
가즈미 나카요시
리카코 다자와
가쓰토시 미네
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다나베 에이이치
다우 코닝 도레이 실리콘 캄파니, 리미티드
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Publication of KR970070156A publication Critical patent/KR970070156A/ko

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Abstract

본 발명은 실리콘 다이 부착용 접착제로서 유용한 실록산 조성물에 관한 것이다. 당해 조성물은 고 에너지 복사로의 노출에 의해 유도되는 아크릴 작용성 오가노폴리실록산의 유리 라디칼 반응 및 알케닐 작용성 오가노폴리실록산과 실리콘 결합된 수소 작용성 오가노폴리실록산과의 하이드로실릴화 반응 둘 다를 통해 경화된다.
또한, 본 발명은 반도체 칩을 기판 위에 패키지 속에 반도체 칩과 기판 사이 또는 반도체 칩과 패키지 사이에 당해 조성물을 삽입시켜 적재한 다음, 당해 조성물을 고 에너지 복사에 노출시켜 아크릴 작용성 그룹의 유리 라디칼 반응을 유도하고 이어서 하이드로실리화 반응으로 경화시킴으로써 제조하는 방법에 관한 것이다.
본 발명은 또한 위의 방법으로 제조된 반도체 장치에 관한 것이다.

Description

실리콘 다이 부착용 접착제, 반도체 장치의 제조방법 및 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 분자동 평균 2개 이상의 화학식 (1)의 실리콘 결합된 아크릴 작용성 그룹을 갖는, 아크릴 작용성 그룹 함유 오가노폴리실록산(a) 5내지 95중량%와 분자당 평균 2개 이상의 실리콘 결합되 알케닐 그룹을 갖는, 알케닐 함유 오가노폴리실록산(b) 95 내지 5중량%를 포함하는 오가노폴리실록산 혼합물(A) 100중량부, 분자당 평균 2개 이상의 실리콘 결합된 수소를 갖고 성분(b) 중의 실리콘 결합된 알케닐 1몰당 당해 성분으로부터의 실리콘 결합된 수소가 0.5 내지 20몰 제공되는 양의 실리콘 결합된 수소원자 함유 오가노폴리실록산(B), 감광제(C) 0.01 내지 10중량부 및 경화성 조성물 백만부당 백금 금속을 0.01 내지 1,000중량부 제공하며 경화성 실록산 조성물을 경화시키는 백금 촉매(D)를 포함하는, 실리콘 다이 부착용 접착제로서 사용하기 위한 실록산 조성물[당해 실록산 조성물은 고에너지 복사로의 노출에 의해 유도되는 아크릴 작용성 오가노폴리실록산의 유리 라디칼 반응 및 알케닐 작용성 오가노폴리실록산과 실리콘 결합된 수소 작용성 오가노폴리실록산과의 하이드로실릴화 반응 둘 다를 통해 경화된다].
    상기 화학식 (1)에서, R1및 R2는 수소원자 또는 1가 탄화수소 그룹이고, R3은 C1-C102가 탄화수소 그룹이다.
  2. 분자량 평균 2개 이상의 실리콘 결합된 알케닐 그룹을 갖는 알케닐 함유 오가노폴리실록산(A') 100중량부, 분자당 평균 2개 이상의 실리콘 결합된 수소원자를 갖고 성분(A') 중의 실리콘 결합된 알케닐 1몰당 당해성분으로부터 실리콘 결합된 수소가 0.5 내지 20몰 제공되는 양의 실리콘 결합된 수소원자 함유 오가노폴리실록산(B'), 감광제(C) 0.01 내지 10중량부 및 경화성 조성물 백만부당 백금 금속을 0.01 내지 1,000중량부 제공하며 경화성 실록산 조성물을 경화시키는 백금 촉매(D)를 포함하는 실리콘 다이 부착용 접착제로서 사용하기 위한 실록산 조성물[당해 실록산 조성물은 고에너지 복사로의 노출에 의해 유도되는 아크릴 작용성 오가노폴리실록산의 유리 라디칼 반응 및 알케닐 작용성 오가노폴리실록산과 실리콘 결합된 수소 작용성 오가노폴리실록산과의 하이드로실릴화 반응 둘 다를 통해 경화되고, 성분(A') 및 성분(B')로부터 선택되는 하나 이상의 성분은 화학식 (1)의 실리콘 결하된 아크릴 작용성 그룹을 평균 2개 이상 갖는다].
    상기 화학식에서 (1)에서, R1및 R2는 수소원자 또는 1가 탄화수소 그룹이고, R3은 C1-C102가 탄화수소 그룹이다.
  3. 반도체 칩, 기판 및 반도체 칩을 기판에 결합시키는 제1항 또는 제2항의 실록산 조성물을 포함하는 반도체 장치.
  4. 반도체 칩을 제공하는 단계, 기판을 제공하는 단계, 제1항 또는 제2항에 따르는 실록산 조성물을 사용하여 반도체 칩을 기판에 결합시키는 단계, 조성물을 고에너지 복사에 노출시켜 아크릴 작용성 오가노폴리실록산의 아크릴 작용성 그룹의 유리 라디칼 반응을 유도하는 단계 및 조성물을 하이드로실릴화 반응시켜 경화시키는 단계를 포함하여, 반도체 장치를 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970014902A 1996-04-19 1997-04-19 실리콘 다이 부착용 접착제, 반도체 장치의 제조방법 및 반도체 장치 KR970070156A (ko)

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